Heat dissipation system and lighting equipment

Abstract

The utility model relates to a heat dissipation system and a lighting device. The heat dissipation system comprises a first circulation loop, a heat exchange assembly and a second circulation loop. The first circulation loop comprises a mounting shell, a first heat conduction piece and a first pipeline. The mounting shell is used for mounting the light source module. And flow channels are formed in the mounting shell and the first heat conduction piece. The flow channel of the installation shell communicates with the flow channel of the first heat conduction piece through a first pipeline. A first fluid medium is arranged in the first circulation loop. The heat exchange assembly is used for refrigerating the first fluid medium in the flow channel of the first heat conduction piece through the first heat conduction piece. The second circulation loop is used for receiving heat generated by the heat exchange assembly in the refrigeration process and dissipating the heat. The cooling system is high in cooling efficiency on heat emitted by the light source module, and normal work of the lighting device is guaranteed.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation, and in particular, to a heat dissipation system and a lighting device. Background Art

[0002] With the booming development of the current electronics industry, the power consumption of various electronics industry products is getting larger and larger. For example, in the photography lamp industry, the thermal power consumption and power density of photography lamps also increase accordingly. For products with high power consumption and high power density, the temperature difference between the surface temperature and the internal temperature caused by their internal resistance is relatively large. Related technologies use a fan combined with a heat pipe, etc. to dissipate heat from products with high power consumption and high power density, that is, air-cooled heat dissipation, and the heat dissipation effect is limited. Summary of the Utility Model

[0003] Embodiments of the present application provide a heat dissipation system and a lighting device, which improve the heat dissipation efficiency of the heat dissipation system to at least partially solve the above technical problems.

[0004] To achieve the above object, according to the first aspect of the present application, there is provided a heat dissipation system, including:

[0005] A first circulation loop, including an installation housing, a first heat conducting member, and a first pipeline. The installation housing is used for installing a light source module. Flow channels are provided inside the installation housing and the first heat conducting member. The flow channel of the installation housing is communicated with the flow channel of the first heat conducting member through the first pipeline. There is a first fluid medium in the first circulation loop;

[0006] A heat exchange assembly, configured to refrigerate the first fluid medium in the flow channel of the first heat conducting member through the first heat conducting member; and

[0007] A second circulation loop, configured to receive the heat generated during the refrigeration process of the heat exchange assembly and dissipate the heat.

[0008] Optionally, the second circulation loop includes a second heat conducting member, a heat dissipation device, and a second pipeline. Flow channels are provided inside the second heat conducting member and the heat dissipation device. The flow channel of the second heat conducting member is communicated with the flow channel of the heat dissipation device through the second pipeline. There is a second fluid medium in the second circulation loop;

[0009] The heat generated during the refrigeration process of the heat exchange assembly is conducted to the second fluid medium in the flow channel of the second heat conducting member through the second heat conducting member, and is dissipated after flowing into the heat dissipation device through the second fluid medium via the second pipeline.

[0010] Optionally, the heat exchange component includes a thermoelectric cooler disposed between the first heat conducting member and the second heat conducting member. The thermoelectric cooler has a cooling surface and a heat dissipation surface. The cooling surface faces the first heat conducting member, and the heat dissipation surface faces the second heat conducting member.

[0011] Optionally, the first heat conducting member includes a first heat conducting plate, and the second heat conducting member includes a second heat conducting plate. The first heat conducting plate and the second heat conducting plate are disposed opposite to each other, and the thermoelectric cooler is disposed between the first heat conducting plate and the second heat conducting plate.

[0012] Optionally, the first heat conducting plate has a first surface facing the second heat conducting plate, and the second heat conducting plate has a second surface facing the first heat conducting plate. The area of the first surface is the same as the area of the second surface.

[0013] Optionally, a plurality of the thermoelectric coolers are laid between the first heat conducting plate and the second heat conducting plate.

[0014] Optionally, the installation housing has a first interface and a second interface. The flow channel of the installation housing is disposed between the first interface and the second interface; the first heat conducting member has a third interface and a fourth interface. The flow channel of the first heat conducting member is disposed between the third interface and the fourth interface; the first pipeline includes a first conduit and a second conduit. The first conduit is disposed between the first interface and the third interface, and the second conduit is disposed between the second interface and the fourth interface; and / or,

[0015] The second heat conducting member has a fifth interface and a sixth interface. The flow channel of the second heat conducting member is disposed between the fifth interface and the sixth interface; the heat dissipation device has a seventh interface and an eighth interface. The flow channel of the heat dissipation device is disposed between the seventh interface and the eighth interface; the second pipeline includes a third conduit and a fourth conduit. The third conduit is disposed between the sixth interface and the seventh interface, and the fourth conduit is disposed between the fifth interface and the eighth interface.

[0016] Optionally, the heat dissipation system includes a first driving pump. The first driving pump is connected in series between the second heat conducting member and the heat dissipation device through the second pipeline. The first driving pump is configured to drive the second fluid medium to flow between the second heat conducting member and the heat dissipation device.

[0017] Optionally, the heat dissipation system further includes a second driving pump. The second driving pump is connected in series between the installation housing and the first heat conducting member through the first pipeline. The second driving pump is configured to drive the first fluid medium to flow between the installation housing and the first heat conducting member.

[0018] According to a second aspect of the present application, there is provided a lighting device, which includes the heat dissipation system of any one of the above and a light source module.

[0019] In the heat dissipation system and the lighting device of some embodiments of the present application, different from the prior art, the heat dissipation system provided by the present application includes a first circulation loop and a second circulation loop. The first circulation loop includes a mounting housing, a first heat conducting member, and a first pipeline. The mounting housing is used for mounting the light source module. Flow channels are provided inside the mounting housing and the first heat conducting member. The flow channel of the mounting housing is communicated with the flow channel of the first heat conducting member through the first pipeline. There is a first fluid medium in the first circulation loop. The heat exchange assembly is used to cool the first fluid medium in the flow channel of the first heat conducting member through the first heat conducting member. The second circulation loop is used to receive the heat generated during the refrigeration process of the heat exchange assembly and dissipate the heat. With such a setting, the heat generated by the light source module as a heat source with a high power density is conducted to the first fluid medium in the first circulation loop through the mounting housing, realizing the conversion from a heat source with a high power density to a heat source with a low power density, so that the first fluid medium as a heat source with a low power density meets the usage conditions of the heat exchange assembly. And, after the first fluid medium in the flow channel of the mounting housing flows into the flow channel of the first heat conducting member through the first pipeline, the heat exchange assembly cools the first fluid medium through the first heat conducting member, which can lower the lower limit of the temperature of the first fluid medium. The first fluid medium with a reduced temperature flows back to the mounting housing through the first pipeline, thereby improving the heat dissipation efficiency of the first fluid medium for the heat emitted by the light source module. In addition, the heat during the refrigeration process of the heat exchange assembly is dissipated through the second circulation loop, forming a stable heat dissipation system. Therefore, the heat dissipation system provided by the present application has a relatively high heat dissipation efficiency for the heat emitted by the light source module, ensuring the normal operation of the lighting device. Description of the Drawings

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0021] Figure 1 It is a three-dimensional structural schematic diagram of the lighting device provided by the embodiment of the present application;

[0022] Figure 2 It is an exploded structural schematic diagram of the lighting device provided by the embodiment of the present application.

[0023] Description of the reference numerals:

[0024] 100, lighting device;

[0025] 1. Heat dissipation system;

[0026] 11. First circulation loop;

[0027] 111. Installation housing; 111A. First interface; 111B. Second interface; 111C. Installation surface;

[0028] 112. First heat conducting member; 112A. Third interface; 112B. Fourth interface; 1121. First heat conducting plate; 1121A. First surface; 1122. First connecting pipe; 1123. Second connecting pipe

[0029] 113. First pipeline; 1131. First conduit; 1132. Second conduit;

[0030] 114. Second driving pump;

[0031] 12. Second circulation loop;

[0032] 121. Second heat conducting member; 121A. Fifth interface; 121B. Sixth interface; 1211. Second heat conducting plate; 1211A. Second surface; 1212. Third connecting pipe; 1213. Fourth connecting pipe;

[0033] 122. Heat dissipation device; 122A. Seventh interface; 122B. Eighth interface;

[0034] 123. Second pipeline; 1231. Third conduit; 1232. Fourth conduit;

[0035] 124. First driving pump;

[0036] 125. Fan assembly;

[0037] 13. Heat exchange component; 131. Semiconductor refrigeration chip; 131A. Refrigerating surface; 131B. Heat dissipating surface;

[0038] 2. Light source module. Specific embodiments

[0039] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present application.

[0040] According to the first aspect of the present application, with reference to Figure 1 and Figure 2 as shown, the present application provides a heat dissipation system 1, and the heat dissipation system 1 includes a first circulation loop 11, a heat exchange component 13, and a second circulation loop 12.

[0041] As Figure 1 shown, the first circulation loop 11 includes a mounting housing 111, a first heat conducting member 112, and a first pipeline 113. The mounting housing 111 is used to mount the light source module 2. Flow channels (not shown in the figure, the same below) are provided inside the mounting housing 111 and the first heat conducting member 112. The flow channel of the mounting housing 111 is communicated with the flow channel of the first heat conducting member 112 through the first pipeline 113. There is a first fluid medium (not shown in the figure, the same below) in the first circulation loop 11. The heat exchange assembly 13 is used to cool the first fluid medium in the flow channel of the first heat conducting member 112 through the first heat conducting member 112. The second circulation loop 12 is used to receive the heat generated during the refrigeration process of the heat exchange assembly 13 and dissipate the heat.

[0042] In the heat dissipation system 1 provided by the present application, the heat generated by the light source module 2 as a heat source with high power density is conducted to the first fluid medium in the first circulation loop 11 through the mounting housing 111, realizing the conversion from a heat source with high power density to a heat source with low power density, so that the first fluid medium as a heat source with low power density can meet the use conditions of the heat exchange assembly 13. Moreover, after the first fluid medium in the flow channel of the mounting housing 111 flows into the flow channel of the first heat conducting member 112 through the first pipeline 113, the heat exchange assembly 13 cools the first fluid medium through the first heat conducting member 112, which can lower the lower limit of the temperature of the first fluid medium. The first fluid medium with reduced temperature flows back to the mounting housing 111 through the first pipeline 113, thereby improving the heat dissipation efficiency of the first fluid medium for the heat emitted by the light source module 2. In addition, the heat during the refrigeration process of the heat exchange assembly 13 is dissipated through the second circulation loop 12, forming a stable heat dissipation system 1. Therefore, the heat dissipation system 1 provided by the present application has a relatively high heat dissipation efficiency for the heat emitted by the light source module 2.

[0043] The light source module 2 can be a lamp. In some embodiments, the light source module 2 can specifically be a COB (Chip On Board) light source. A COB light source is a component that directly attaches LED chips to a highly reflective surface metal substrate. When the COB light source is in use, since a large amount of heat will be generated, it is necessary to dissipate the heat.

[0044] As Figure 1 and Figure 2 shown, the mounting housing 111 has a mounting surface 111C for mounting the light source module 2. The light source module 2 is fixed on the mounting surface 111C. The light source module 2 can be fixed on the mounting surface 111C by means of gluing, welding, or detachable connection. The detachable connection can be achieved by screws, bolts, or studs, etc.

[0045] In some embodiments, the mounting housing 111 may include a heat-conducting material. In this way, the heat generated by the light source module 2 as a heat source with a high power density can be more effectively conducted through the mounting housing 111 to the first fluid medium in the flow channel of the mounting housing 111, and the conversion from a heat source with a high power density to a heat source with a low power density can be more effectively achieved. In some embodiments, the heat-conducting material includes, but is not limited to, at least one of copper and aluminum.

[0046] In some embodiments, the mounting housing 111 may be a plate-shaped housing. In this way, it is convenient to fix the light source module 2 on the mounting housing 111, and the contact area between the light source module 2 and the mounting housing 111 is larger, so that the heat generated by the light source module 2 as a heat source with a high power density can be more effectively conducted through the mounting housing 111 to the first fluid medium in the flow channel of the mounting housing 111.

[0047] In some embodiments, the mounting housing 111 has a first interface 111A and a second interface 111B. The first interface 111A and the second interface 111B are respectively located at opposite ends of the mounting housing 111, and may be respectively located on opposite sides of the mounting surface 111C. The flow channel of the mounting housing 111 is provided between the first interface 111A and the second interface 111B. In this way, the first fluid medium can flow into the flow channel of the mounting housing 111 from one of the first interface 111A and the second interface 111B, and flow out from the other of the first interface 111A and the second interface 111B. The flowing first fluid medium can take away the heat generated by the light source module 2. Exemplarily, the first fluid medium flows into the flow channel of the mounting housing 111 from the second interface 111B and flows out of the flow channel of the mounting housing 111 from the first interface 111A.

[0048] The first heat-conducting member 112 functions to conduct heat. In some embodiments, the first heat-conducting member 112 includes a heat-conducting material. In this way, the heat carried by the first fluid medium in the flow channel of the first heat-conducting member 112 can be better conducted out through the first heat-conducting member 112 to dissipate the heat carried by the first fluid medium.

[0049] In some embodiments, the first heat-conducting member 112 includes a first heat-conducting plate. In this way, the heat-conducting area of the first heat-conducting plate is larger, improving its heat-conducting efficiency. In some embodiments, the first heat-conducting plate may include two mutually attached heat-conducting sub-plates, and the space between the two heat-conducting sub-plates defines the flow channel of the first heat-conducting plate. In other embodiments, the first heat-conducting plate may be an integrally formed plate-shaped structure with a hollow interior.

[0050] In some embodiments, the first heat conducting member 112 has a third interface 112A and a fourth interface 112B, and the flow channel of the first heat conducting member 112 is disposed between the third interface 112A and the fourth interface 112B. Thus, the first fluid medium with a relatively high temperature flowing out of the mounting housing 111 flows into the flow channel of the first heat conducting member 112 through one of the third interface 112A and the fourth interface 112B via the first pipeline 113. After dissipating heat through the first heat conducting member 112 in the flow channel of the first heat conducting member 112, the first fluid medium with a relatively low temperature flows back into the flow channel of the mounting housing 111 through the other of the third interface 112A and the fourth interface 112B. Therefore, while the temperature of the first fluid medium decreases, the circulating flow of the first fluid medium is achieved.

[0051] Exemplarily, the first fluid medium flows into the flow channel of the first heat conducting member 112 through the third interface 112A and flows out through the fourth interface 112B.

[0052] In some embodiments, the third interface 112A and the fourth interface 112B may be respectively located at two ends of the first heat conducting member 112.

[0053] In some embodiments, the first heat conducting member 112 may further include a first connecting pipe 1122 and a second connecting pipe 1123 protruding from the first heat conducting plate 1121. One end of the first connecting pipe 1122 is connected to the first heat conducting plate 1121, and the other end of the first connecting pipe 1122 is the third interface 112A. One end of the second connecting pipe 1123 is connected to the first heat conducting plate 1121, and the other end of the second connecting pipe 1123 is the fourth interface 112B.

[0054] In some embodiments, the first pipeline 113 includes a first conduit 1131 and a second conduit 1132. The first conduit 1131 is disposed between the first interface 111A and the third interface 112A. The second conduit 1132 is disposed between the second interface 111B and the fourth interface 112B. Thus, the mounting housing 111 and the first heat conducting member 112 are connected in series through the first pipeline 113, and the first fluid medium can circulate in the first circulation loop 11.

[0055] In some embodiments, any one of the first conduit 1131 and the second conduit 1132 may be a section of conduit or multiple sections of conduit that are detachably connected. In some embodiments, the first conduit 1131 and the second conduit 1132 may be flexible conduits.

[0056] In some embodiments, the heat dissipation system 1 further includes a second driving pump 114. The second driving pump 114 is connected in series between the installation housing 111 and the first heat conducting member 112 through the first pipeline 113. The second driving pump 114 is configured to drive the first fluid medium to flow between the installation housing 111 and the first heat conducting member 112. Thus, the flow rate of the first fluid medium flowing between the installation housing 111 and the first heat conducting member 112 is increased, and the heat dissipation efficiency of the first fluid medium is improved. Exemplarily, the second driving pump 114 is connected in series on the first conduit 1131.

[0057] In some embodiments, the second circulation loop 12 includes a second heat conducting member 121, a heat dissipation device 122, and a second pipeline 123. Flow channels (not shown in the figure, the same below) are provided inside the second heat conducting member 121 and the heat dissipation device 122. The flow channel of the second heat conducting member 121 and the flow channel of the heat dissipation device 122 are connected through the second pipeline 123. There is a second fluid medium (not shown in the figure, the same below) in the second circulation loop 12. The heat generated by the heat exchange assembly 13 during the refrigeration process is conducted to the second fluid medium in the flow channel of the second heat conducting member 121 through the second heat conducting member 121, and is dissipated after flowing into the heat dissipation device 122 through the second fluid medium. Thus, the heat generated by the heat exchange assembly 13 during the refrigeration process is dissipated through the second circulation loop 12, so that the heat dissipation system 1 can dissipate heat stably.

[0058] The second heat conducting member 121 functions as a heat conductor. In some embodiments, the second heat conducting member 121 includes a heat conducting material. Thus, the heat generated by the heat exchange assembly 13 during the refrigeration process is better conducted to the second heat conducting member 121, and the second heat conducting member 121 then conducts the heat to the second fluid medium in the flow channel of the second heat conducting member 121. After the second fluid medium in the flow channel of the second heat conducting member 121 flows into the flow channel of the heat dissipation device 122 through the second pipeline 123, the heat carried by the second fluid medium is dissipated.

[0059] In some embodiments, the second heat conducting member 121 includes a second heat conducting plate 1211. Thus, the heat conducting area of the second heat conducting plate 1211 is larger, and its heat conducting efficiency is improved. The heat generated by the heat exchange assembly 13 can be conducted to the second fluid medium in the flow channel of the second heat conducting plate 1211 more quickly.

[0060] In some embodiments, the second heat conducting plate 1211 may include two mutually attached heat conducting sub - plates, and the space between the two heat conducting sub - plates defines the flow channel of the second heat conducting plate 1211. In other embodiments, the second heat conducting plate 1211 may be an integrally formed plate - like structure with a hollow interior.

[0061] In some embodiments, the first heat conducting plate 1121 and the second heat conducting plate 1211 are disposed opposite to each other. In this way, the distance for heat conduction between the first circulation loop 11 and the second circulation loop 12 is shortened, and the heat dissipation efficiency of the heat dissipation system 1 is improved.

[0062] In some embodiments, the first heat conducting plate 1121 has a first surface 1121A facing the second heat conducting plate 1211. The second heat conducting plate 1211 has a second surface 1211A facing the first heat conducting plate 1121. The first surface 1121A and the second surface 1211A are disposed opposite to each other. The area of the first surface 1121A is the same as the area of the second surface 1211A. In this way, the rate at which the heat exchange component 13 cools the first fluid medium through the first surface 1121A is matched with the rate at which the heat exchange component 13 heats the second fluid medium through the second surface 1211A, and heat can be exchanged more smoothly.

[0063] In some embodiments, the areas of the first surface 1121A and the second surface 1211A are larger than the area of the mounting surface 111C. In this way, the heat dissipation efficiency of the heat dissipation system 1 is improved.

[0064] In some embodiments, the second heat conducting member 121 has a fifth interface 121A and a sixth interface 121B. The flow channel of the second heat conducting member 121 is disposed between the fifth interface 121A and the sixth interface 121B. With this arrangement, after the second fluid medium in the flow channel of the second heat conducting member 121 receives the heat from the heat exchange component 13, it flows out from one of the fifth interface 121A and the sixth interface 121B at a higher temperature, and the second fluid medium with a lower temperature flowing out from the heat dissipation device 122 flows into the flow channel of the second heat conducting member 121 from the other of the fifth interface 121A and the sixth interface 121B. Exemplarily, the second fluid medium with a higher temperature after absorbing the heat of the heat exchange component flows out from the sixth interface 121B, and the second fluid medium with a lower temperature flowing out from the heat dissipation device 122 flows into the flow channel of the second heat conducting member 121 from the fifth interface 121A.

[0065] In some embodiments, the fifth interface 121A and the sixth interface 121B are respectively located at opposite ends of the second heat conducting plate 1211.

[0066] In some embodiments, the second heat conducting member 121 further includes a third connecting pipe 1212 and a fourth connecting pipe 1213 protruding from the second heat conducting plate 1211. One end of the third connecting pipe 1212 is connected to the second heat conducting plate 1211, and the other end of the third connecting pipe 1212 is the sixth interface 121B. One end of the fourth connecting pipe 1213 is connected to the second heat conducting plate 1211, and the other end of the fourth connecting pipe 1213 is the fifth interface 121A.

[0067] In some embodiments, the heat dissipation device 122 has a seventh interface 122A and an eighth interface 122B. The flow channel of the heat dissipation device 122 is disposed between the seventh interface 122A and the eighth interface 122B. Thus, the relatively high-temperature second fluid medium flowing out of the second heat conducting member 121 flows into the flow channel of the heat dissipation device 122 through one of the seventh interface 122A and the eighth interface 122B. When passing through the flow channel of the heat dissipation device 122, heat is dissipated, so that the relatively low-temperature second fluid medium flows out of the heat dissipation device 122.

[0068] Exemplarily, the relatively high-temperature second fluid medium flowing out of the second heat conducting member 121 flows in through the seventh interface 122A, and the relatively low-temperature second fluid medium flows out through the eighth interface 122B.

[0069] In some embodiments, the heat dissipation device 122 may be an existing device for heat dissipation, such as a water-cooled radiator.

[0070] As Figure 2 shown, in some embodiments, the heat dissipation system 1 further includes a fan assembly 125 located on one side of the heat dissipation device 122. The fan assembly 125 blows air to the flow channel of the heat dissipation device 122 to diffuse the heat carried by the second fluid medium in the flow channel of the heat dissipation device 122 into the atmosphere. The fan assembly 125 may be a fixed-frequency fan or a variable-frequency fan. In some embodiments, the number of the fan assemblies 125 may be multiple, such as four or more, so as to enable the heat dissipation device 122 to dissipate heat quickly.

[0071] In some embodiments, the second pipeline 123 includes a third conduit 1231 and a fourth conduit 1232. The third conduit 1231 is disposed between the sixth interface 121B and the seventh interface 122A. The fourth conduit 1232 is disposed between the fifth interface 121A and the eighth interface 122B. Thus, the heat dissipation device 122 and the second heat conducting member 121 are connected in series through the second pipeline 123, and the second fluid medium can circulate in the second circulation loop 12.

[0072] In some embodiments, the third conduit 1231 and the fourth conduit 1232 may be flexible conduits.

[0073] In some embodiments, the heat dissipation system 1 includes a first driving pump 124. The first driving pump 124 is connected in series between the second heat conducting member 121 and the heat dissipation device 122 through the second pipeline 123. The first driving pump 124 is configured to drive the second fluid medium to flow between the second heat conducting member 121 and the heat dissipation device 122. Thus, the first driving pump 124 increases the flow rate of the second fluid medium between the second heat conducting member 121 and the heat dissipation device 122 and improves the heat dissipation efficiency of the second fluid medium. Exemplarily, the first driving pump 124 is connected in series on the third conduit 1231.

[0074] In some embodiments, either the first driving pump 124 or the second driving pump 114 can be a constant-frequency or variable-frequency water pump. A constant-frequency water pump is a water pump with a fixed frequency and rotational speed. It usually uses a power supply of 50 Hz or 60 Hz. The motor speed is generally a two-pole motor with a speed of 2850 - 2900 r / min, or a four-pole motor with a speed of 1450 - 1500 r / min. Using a constant-frequency water pump for either the first driving pump 124 or the second driving pump 114 has a simple function, relatively low manufacturing cost, and low later maintenance cost, which can reduce the cost of the circulation loop. Of course, in other embodiments, either the first driving pump 124 or the second driving pump 114 can also use a variable-frequency water pump.

[0075] In some embodiments, the heat exchange assembly 13 includes a thermoelectric cooler (TEC) 131. The thermoelectric cooler 131 is disposed between the first heat conducting member 112 and the second heat conducting member 121. The thermoelectric cooler 131 has a refrigerating surface 131A and a heat dissipating surface 131B that are oppositely arranged. The refrigerating surface 131A faces the first heat conducting member 112. The heat dissipating surface 131B faces the second heat conducting member 121. With this arrangement, the thermoelectric cooler 131 can reduce the temperature of the first fluid medium in the flow channel of the first heat conducting member 112 below room temperature through the first heat conducting member 112, and improve the heat dissipation efficiency of the first fluid medium for the heat emitted by the light source module 2.

[0076] The thermoelectric cooler 131 usually consists of multiple thermocouple pairs, and each thermocouple pair is formed by alternating N-type and P-type semiconductors. These thermocouple pairs are connected by wires. When current passes through the thermocouple pair composed of N-type and P-type semiconductors, a temperature difference will be generated between the two poles, thereby achieving the effect of heat absorption (refrigeration) at one end and heat dissipation at the other end.

[0077] It should be noted that existing heat dissipation systems such as water-cooling heat dissipation devices in the prior art cannot reduce the temperature of the fluid medium below room temperature and cannot meet the heat dissipation requirements of high-power-density heat sources. However, in some embodiments of the present application, the high-power-density heat source is converted into a low-power-density heat source through the first circulation loop 11, so that the low-power-density heat source meets the usage conditions of the thermoelectric cooler 131. Moreover, the thermoelectric cooler 131 can reduce the temperature of the first fluid medium in the flow channel of the first heat conducting member 112 below room temperature, and improve the heat dissipation efficiency of the first fluid medium for the heat emitted by the light source module 2.

[0078] Such as Figure 1 and Figure 2As shown, in some embodiments, a plurality of thermoelectric coolers 131 are disposed between the first heat conducting plate 1121 and the second heat conducting plate 1211. Thus, the plurality of thermoelectric coolers 131 refrigerate to more quickly reduce the temperature of the first fluid medium in the first heat conducting plate 1121 below room temperature.

[0079] It should be noted that the number of the thermoelectric coolers 131 can be adjusted according to the power density of the light source module 2. The sizes of the first heat conducting plate 1121 and the second heat conducting plate 1211 can be adjusted according to the number of the thermoelectric coolers 131.

[0080] In some embodiments, the thickness of the thermoelectric cooler 131 can be 3 millimeters to 6 millimeters. Thus, while ensuring the heat exchange effect of the thermoelectric cooler 131, the thickness of the thermoelectric cooler 131 is prevented from being too thick.

[0081] In some embodiments, the thermoelectric cooler 131 is fixed between the first heat conducting plate 1121 and the second heat conducting plate 1211. The fixing method can be bonding, welding or detachable connection. The detachable connection can be achieved by screws, bolts or studs, etc.

[0082] In some embodiments, the refrigerating surface 131A of the thermoelectric cooler 131 can be directly in contact with the first surface 1121A of the first heat conducting plate 1121. In some other embodiments, a heat conducting layer (not shown in the figure) can be provided between the refrigerating surface 131A of the thermoelectric cooler 131 and the first heat conducting plate 1121.

[0083] In some embodiments, the heat dissipating surface 131B of the thermoelectric cooler 131 can be directly in contact with the second surface 1211A of the second heat conducting plate 1211. In some other embodiments, a heat conducting layer (not shown in the figure) can be provided between the heat dissipating surface 131B of the thermoelectric cooler 131 and the second heat conducting plate 1211.

[0084] In some embodiments, the second fluid medium can be the same as the first fluid medium. Thus, the types of the fluid media of the heat dissipation system 1 are reduced, and the manufacturing cost of the heat dissipation system 1 is lowered.

[0085] In some other embodiments, the second fluid medium can be different from the first fluid medium. Thus, the respective requirements of the first circulation loop 11 and the second circulation loop 12 can be met.

[0086] In some embodiments, either the first fluid medium or the second fluid medium can include an organic coolant or water. The organic coolant can include, but is not limited to, alcohol coolants such as ethanol.

[0087] The working mode of the above heat dissipation system 1 is as follows:

[0088] The heat generated by the light source module 2 is transferred to the mounting housing 111 and taken away by the first fluid medium to the first heat conducting member 112. The heat exchange assembly 13 mounted on the first heat conducting member 112 operates to lower the temperature of the first fluid medium below room temperature, and then the first fluid medium flows back to the mounting housing 111 to form a cycle. The heat generated during the refrigeration process by the heat exchange assembly 13 is taken by the second fluid medium in the second heat conducting member 121 to the heat dissipation device 122 for cooling, and then circulates back to the second heat conducting member 121 to form a cycle.

[0089] In some embodiments, the heat dissipation system 1 may include a plurality of first circulation loops 11. The temperature of the first fluid medium in the plurality of first circulation loops 11 is lowered below room temperature by the heat exchange assembly 13, and then the heat is conducted to a second circulation loop 12 through the heat exchange assembly 13 and dissipated.

[0090] According to a second aspect of the present application, with reference to Figure 1 and Figure 2 as shown, the present application further provides an illumination device 100. The illumination device 100 includes the heat dissipation system 1 of any of the above embodiments. The light source module 2 is mounted on the mounting housing 111 of the heat dissipation system 1.

[0091] In summary, different from the prior art, the heat dissipation system and the illumination device provided by the present application include a first circulation loop and a second circulation loop, that is, a dual circulation loop. The first circulation loop includes a mounting housing, a first heat conducting member, and a first pipeline. The mounting housing is used to mount the light source module. Flow channels are provided inside the mounting housing and the first heat conducting member. The flow channel of the mounting housing is communicated with the flow channel of the first heat conducting member through the first pipeline. There is a first fluid medium in the first circulation loop. The heat exchange assembly is used to refrigerate the first fluid medium in the flow channel of the first heat conducting member through the first heat conducting member. The second circulation loop is used to receive the heat generated during the refrigeration process by the heat exchange assembly and dissipate the heat. With such a setting, the heat generated by the light source module as a heat source with a high power density is conducted through the mounting housing to the first fluid medium in the first circulation loop, realizing the conversion from a heat source with a high power density to a heat source with a low power density, so that the first fluid medium as a heat source with a low power density meets the usage conditions of the heat exchange assembly. Moreover, after the first fluid medium in the flow channel of the mounting housing flows into the flow channel of the first heat conducting member through the first pipeline, the heat exchange assembly refrigerates the first fluid medium through the first heat conducting member, which can lower the lower limit of the temperature of the first fluid medium. The first fluid medium with a lowered temperature flows back to the mounting housing through the first pipeline, thereby improving the heat dissipation efficiency of the first fluid medium for the heat emitted by the light source module. In addition, the heat during the refrigeration process by the heat exchange assembly is dissipated through the second circulation loop, forming a stable heat dissipation system. Therefore, the heat dissipation system provided by the present application has a relatively high heat dissipation efficiency for the heat emitted by the light source module, ensuring the normal operation of the illumination device.

[0092] In the description of the present application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more features. In the description of the present application, "a plurality of" means two or more unless otherwise specifically defined.

[0093] In the above embodiments, the descriptions of the respective embodiments have their own emphases. For parts not detailed in a certain embodiment, reference may be made to the relevant descriptions of other embodiments.

[0094] The embodiments, implementation manners and related technical features of the present application can be combined and replaced with each other without conflict.

[0095] The above are only the preferred embodiments of the present application and do not impose any formal restrictions on the present application. However, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application still fall within the scope of the technical solution of the present application.

Claims

1. A heat dissipation system (1), characterized in that: include: A first circulation loop (11), comprising a mounting shell (111), a first heat-conducting member (112) and a first pipeline (113); the mounting shell (111) is used to mount a light source module (2); flow channels are provided inside the mounting shell (111) and the first heat-conducting member (112); the flow channel of the mounting shell (111) is connected to the flow channel of the first heat-conducting member (112) via the first pipeline (113); and a first fluid medium is contained in the first circulation loop (11); A heat exchange component (13) for cooling a first fluid medium in a flow channel of the first heat conducting member (112) through the first heat conducting member (112); as well as The second circulation loop (12) is used to receive the heat generated by the heat exchange component (13) during the refrigeration process and dissipate the heat.

2. The heat dissipation system (1) according to claim 1, characterized in that: The second circulation loop (12) comprises a second heat-conducting member (121), a heat dissipation device (122) and a second pipeline (123); flow channels are provided inside the second heat-conducting member (121) and the heat dissipation device (122); the flow channel of the second heat-conducting member (121) and the flow channel of the heat dissipation device (122) are connected via the second pipeline (123); and a second fluid medium is contained in the second circulation loop (12); The heat generated by the heat exchange component (13) during the refrigeration process is conducted to the second fluid medium in the flow channel of the second heat conduction component (121) through the second heat conduction component (121), and then flows into the heat dissipation device (122) through the second fluid medium and then dissipated.

3. The heat dissipation system (1) according to claim 2, characterized in that: The heat exchange component (13) comprises a semiconductor refrigeration plate (131), wherein the semiconductor refrigeration plate (131) is arranged between the first heat conducting member (112) and the second heat conducting member (121), and the semiconductor refrigeration plate (131) has a cooling surface (131A) and a heat dissipation surface (131B), wherein the cooling surface (131A) is arranged facing the first heat conducting member (112), and the heat dissipation surface (131B) is arranged facing the second heat conducting member (121).

4. The heat dissipation system (1) according to claim 3, characterized in that: The first heat-conducting member (112) comprises a first heat-conducting plate (1121), the second heat-conducting member (121) comprises a second heat-conducting plate (1211), the first heat-conducting plate (1121) and the second heat-conducting plate (1211) are arranged opposite to each other, and the semiconductor cooling plate (131) is arranged between the first heat-conducting plate (1121) and the second heat-conducting plate (1211).

5. The heat dissipation system (1) according to claim 4, characterized in that: The first heat conducting plate (1121) has a first surface (1121A), and the first surface (1121A) faces the second heat conducting plate (1211); the second heat conducting plate (1211) has a second surface (1211A), and the second surface (1211A) faces the first heat conducting plate (1121); wherein the area of ​​the first surface (1121A) is the same as the area of ​​the second surface (1211A).

6. The heat dissipation system (1) according to claim 4, characterized in that: The plurality of semiconductor refrigeration sheets (131) are laid between the first heat conducting plate (1121) and the second heat conducting plate (1211).

7. The heat dissipation system (1) according to claim 2, characterized in that: The installation shell (111) has a first interface (111A) and a second interface (111B), and the flow channel of the installation shell (111) is arranged between the first interface (111A) and the second interface (111B); the first heat-conducting member (112) has a third interface (112A) and a fourth interface (112B), and the flow channel of the first heat-conducting member (112) is arranged between the third interface (112A) and the fourth interface (112B); the first pipeline (113) includes a first conduit (1131) and a second conduit (1132), the first conduit (1131) is arranged between the first interface (111A) and the third interface (112A), and the second conduit (1132) is arranged between the second interface (111B) and the fourth interface (112B); and / or, The second heat-conducting member (121) has a fifth interface (121A) and a sixth interface (121B), and the flow channel of the second heat-conducting member (121) is arranged between the fifth interface (121A) and the sixth interface (121B); the heat dissipating device (122) has a seventh interface (122A) and an eighth interface (122B), and the flow channel of the heat dissipating device (122) is arranged between the seventh interface (122A) and the eighth interface (122B); the second pipeline (123) comprises a third conduit (1231) and a fourth conduit (1232), and the third conduit (1231) is arranged between the sixth interface (121B) and the seventh interface (122A), and the fourth conduit (1232) is arranged between the fifth interface (121A) and the eighth interface (122B).

8. The heat dissipation system (1) according to claim 2, characterized in that: The heat dissipation system (1) further comprises a first driving pump (124), wherein the first driving pump (124) is connected in series between the second heat-conducting member (121) and the heat dissipation device (122) via the second pipeline (123), and the first driving pump (124) is used for driving the second fluid medium to flow between the second heat-conducting member (121) and the heat dissipation device (122).

9. The heat dissipation system (1) according to claim 1, characterized in that: The heat dissipation system (1) further comprises a second driving pump (114), wherein the second driving pump (114) is connected in series between the mounting shell (111) and the first heat-conducting member (112) via the first pipeline (113), and the second driving pump (114) is used to drive the first fluid medium to flow between the mounting shell (111) and the first heat-conducting member (112).

10. A lighting device (100), characterized in that: It comprises the heat dissipation system (1) and the light source module (2) according to any one of claims 1 to 9.

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