Wireless distributed multipoint anchor rod stress device

Abstract

The utility model discloses a wireless distributed multi-point anchor rod stress device, relates to the technical field of coal mine tunnel surrounding rock support, and solves the problems that the existing wired anchor rod monitoring technology is complex in wiring, measuring points are easy to damage, and the wireless anchor rod monitoring is poor in detection effect. Comprising a man-machine terminal, a collector end and an anchor rod sensor end, the man-machine terminal is in wireless transmission with the collector end, and the collector end collects signals collected by the anchor rod sensor end, stores the signals and uploads the signals to the man-machine terminal; according to the utility model, the strain sensor is axially arranged in the slot in the anchor rod sensor end rod body, and the working condition parameters acquired by the anchor rod sensor end are wirelessly transmitted to the man-machine terminal in real time through the acquisition end, so that the data acquisition is accurate, the real-time performance is strong, and the laying is simple and efficient.

Description

Technical Field

[0001] The utility model belongs to the technical field of surrounding rock support in coal mine roadways, and relates to a wireless distributed multi-point bolt stress device. Background Technique

[0002] A mine bolt is a tool used for supporting the surrounding rock of mine roadways and underground projects. It reinforces the surrounding rock of the roadway together, enabling the surrounding rock to support itself, and can ensure the stability of the surrounding rock of mine roadways and underground projects. Now bolts are not only used in mines but also in engineering technologies to reinforce the main bodies of slopes, tunnels, and dams. As a tensile member deep into the stratum, one end of the bolt is connected to the engineering structure, and the other end penetrates deep into the stratum to play a role in supporting the surrounding rock. The whole bolt is divided into a free section and an anchorage section. The free section refers to the area that transmits the tension at the bolt head to the anchor body, and its function is to apply prestress to the bolt.

[0003] Bolt support realizes active support by utilizing the self-strength of the surrounding rock. However, with the stress, deformation, delamination, and fragmentation of the surrounding rock, the bolt anchoring force also shows a changing process of growth, stability, attenuation, and loss. Therefore, by continuously and dynamically monitoring the working condition parameters such as the axial force, bending force, tensile deformation, bending deformation, and stress incoming direction of the bolt body in the surrounding rock, the stability and safety of the surrounding rock support can be evaluated. Currently, there are various shapes of coal mine roadways in China, such as trapezoidal, arched, rectangular, circular, and oval shapes, etc. With the popularization and application of the full-length and extended anchoring technologies, since the external end bolt dynamometer cannot measure the true stress of the fully anchored and extended bolts, it is impossible to accurately grasp the direction and magnitude of the internal pressure change of the roadway surrounding rock. For the stress analysis of the bolts on the roadway roof (or two sides), bolt (cable) stress sensors are used to monitor the single axial stress data of the bolts. Because the bolt (cable) stress sensors cannot continuously and dynamically monitor the working condition parameters such as the axial force, bending force, tensile deformation, bending deformation, and stress incoming direction of the bolt body in the surrounding rock, there is a lack of a more comprehensive guiding basis for evaluating the stability and safety of the surrounding rock support.

[0004] Most of the existing bolt stress monitoring devices are wired. The wired multi-point bolt stress device needs to connect each monitoring point together one by one with a cable bus, and the cable bus supplies power and communicates with the equipment at each measuring point uniformly. Therefore, a large number of cables are required, the cable laying workload is large, the processes are numerous, and the overall construction efficiency is relatively low, especially in the long-distance monitoring system underground. The multi-point bolt stress device is installed in the roadway tunneling / mining working face, and there are large mechanical equipment working in the roadway. Therefore, the cable bus of the wired multi-point bolt stress device is easily damaged by large mechanical equipment in the roadway. At the same time, after the bus of a single measuring point is damaged, it may affect the power supply or communication stability of the entire bus. At the same time, there are also some wireless bolts at present. Although a large number of wiring is avoided, since the mine pressure not only includes the conventional surrounding rock stress monitoring, but also includes the instantaneous rock burst monitoring of the surrounding rock, the mine rock burst is irregular and instantaneous. To accurately capture the data of the mine rock burst, the response speed and real-time performance requirements for the sensor data acquisition are very high, but the existing wireless bolts are difficult to achieve this, the collected data is inaccurate, and the response speed and timeliness are poor. Summary of the Invention

[0005] The technical problem to be solved by the present invention is that the existing wired bolt monitoring technology has complex wiring, the measuring points are easily damaged, and the wireless bolt monitoring has poor detection effect.

[0006] The present invention solves the above technical problems through the following technical solutions:

[0007] A wireless distributed multi-point bolt stress device includes a human-machine terminal, a collector end, and a bolt sensor end. The human-machine terminal performs wireless transmission with the collector end. The collector end collects the signals collected by the bolt sensor end, stores them, and uploads them to the human-machine terminal;

[0008] The collector end includes: a first MCU module, a storage module, a Bluetooth module, a 433 wireless communication module, and a first 485 communication module. The bolt sensor end includes a second MCU module, a second 485 communication module, and an AD module. The first MCU module is connected to the storage module, the Bluetooth module, the 433 wireless communication module, the first 485 communication module, and the second MCU module of the anchor. The first 485 communication module is also connected to the second 485 communication module of the bolt sensor. The second MCU module is also connected to the second 485 communication module and the AD module;

[0009] A plurality of strain sensors are further arranged in the bolt body of the bolt sensor end.

[0010] The utility model includes a human-machine terminal, a collector terminal, and an anchor rod sensor terminal. Among them, the anchor rod sensor terminal retains the function of measuring the axial force of the original external end anchor rod stress sensor through the anchor rod stress device. At the same time, taking the anchor rod as a carrier, strain sensors are mounted at 12 different positions axially in the rod body by grooving. The 12 strain sensors inside the rod body are divided into 6 groups, and each group of strain sensors is respectively mounted at opposite positions on the upper and lower layers inside the rod body. Each strain sensor can independently collect stress data, and can detect working condition parameters such as the axial force, bending force, tensile deformation, bending deformation, and stress incoming direction of the rod body. The detection accuracy is high, the response speed is fast, the data of mine rock bursts can be accurately captured, and the working condition parameters collected by the anchor rod sensor terminal are stored in real time through the collection end and wirelessly transmitted to the human-machine terminal, avoiding complex wiring laying and having strong real-time performance.

[0011] Further, 12 strain sensors are mounted at 12 different positions axially in the rod body of the anchor rod sensor terminal. The 12 strain sensors inside the rod body are divided into 6 groups, and each group of strain sensors is respectively mounted at opposite positions on the upper and lower layers inside the rod body.

[0012] Further, the first MCU module includes a single-chip microcomputer U10. The 51st - 56th pins of the single-chip microcomputer U10 are connected to the storage module. The 46th - 48th pins of the single-chip microcomputer U10 are connected to the Bluetooth module. The 77th, 81st, 82nd, 92nd, and 93rd pins of the single-chip microcomputer U10 are connected to the 433 wireless communication module. The 70th, 86th, and 87th pins of the single-chip microcomputer U10 are connected to the first 485 communication module. The 72nd and 76th pins of the single-chip microcomputer U10 are connected to the second MCU module of the anchor rod sensor.

[0013] Further, the storage module includes a single-chip microcomputer U2. The 7th pin of the single-chip microcomputer U2 is connected to the 51st pin of the single-chip microcomputer U10. The 16th pin of the single-chip microcomputer U2 is connected to the 52nd pin of the single-chip microcomputer U10. The 8th pin of the single-chip microcomputer U2 is connected to the 53rd pin of the single-chip microcomputer U10. The 15th pin of the single-chip microcomputer U2 is connected to the 54th pin of the single-chip microcomputer U10. The 1st pin of the single-chip microcomputer U2 is connected to the 55th pin of the single-chip microcomputer U10. The 3rd pin of the single-chip microcomputer U2 is connected to the 56th pin of the single-chip microcomputer U10.

[0014] Further, the Bluetooth module includes a single-chip microcomputer U8. The 1st pin of the single-chip microcomputer U8 is connected to the 48th pin of the single-chip microcomputer U10. The 2nd pin of the single-chip microcomputer U8 is connected to the 47th pin of the single-chip microcomputer U10. The 3rd pin of the single-chip microcomputer U8 is connected to the 46th pin of the single-chip microcomputer U10.

[0015] Further, the 433 wireless communication module includes a single-chip microcomputer U11. The 3rd pin of the single-chip microcomputer U11 is connected to the 82nd pin of the single-chip microcomputer U10, the 4th pin of the single-chip microcomputer U11 is connected to the 92nd pin of the single-chip microcomputer U10, the 5th pin of the single-chip microcomputer U11 is connected to the 93rd pin of the single-chip microcomputer U10, the 6th pin of the single-chip microcomputer U11 is connected to the 81st pin of the single-chip microcomputer U10, and the 7th pin of the single-chip microcomputer U11 is connected to the 77th pin of the single-chip microcomputer U10.

[0016] Further, the first 485 communication module includes a single-chip microcomputer U3. The 1st pin of the single-chip microcomputer U3 is connected to the 87th pin of the single-chip microcomputer U10. The 2nd and 3rd pins of the single-chip microcomputer U3 are connected together and then connected to the 70th pin of the single-chip microcomputer U10. The 4th pin of the single-chip microcomputer U3 is connected to the 86th pin of the single-chip microcomputer U10. The 6th pin of the single-chip microcomputer U3 is connected to the second 485 communication module, and the 7th pin of the single-chip microcomputer U3 is also connected to the second 485 communication module.

[0017] Further, the second MCU module includes a single-chip microcomputer U20. The 25th and 26th pins of the single-chip microcomputer U20 are connected to the AD module. The 29th, 30th, and 31st pins of the single-chip microcomputer U20 are connected to the second 485 communication module. The 34th pin of the single-chip microcomputer U20 is connected to the 72nd pin of the single-chip microcomputer U10. The 37th pin of the single-chip microcomputer U20 is connected to the 76th pin of the single-chip microcomputer U20.

[0018] Further, the second 485 communication module includes a single-chip microcomputer U1. The 1st pin of the single-chip microcomputer U1 is connected to the 31st pin of the single-chip microcomputer U20. The 2nd and 3rd pins of the single-chip microcomputer U1 are connected together and then connected to the 29th pin of the single-chip microcomputer U20. The 4th pin of the single-chip microcomputer U1 is connected to the 30th pin of the single-chip microcomputer U20. The 6th pin of the single-chip microcomputer U1 is connected to the 6th pin of the single-chip microcomputer U3, and the 7th pin of the single-chip microcomputer U1 is connected to the 7th pin of the single-chip microcomputer U3.

[0019] Further, the AD module includes a single-chip microcomputer U21. The 11th pin of the single-chip microcomputer U21 is connected to the 26th pin of the single-chip microcomputer U20, and the 12th pin of the single-chip microcomputer U21 is connected to the 25th pin of the single-chip microcomputer U20.

[0020] The advantages of the present utility model are as follows:

[0021] The utility model includes a human-machine terminal, a collector terminal, and an anchor rod sensor terminal. Among them, the anchor rod sensor terminal retains the function of the original external end anchor rod stress sensor to measure the axial force through the anchor rod stress device. At the same time, taking the anchor rod as a carrier, grooves are opened axially at 12 different positions inside the rod body, and strain sensors are mounted. The 12 strain sensors inside the rod body are divided into 6 groups, and each group of strain sensors is respectively pasted at opposite positions on the upper and lower layers inside the rod body. Each strain sensor independently collects stress data, and can detect working condition parameters such as the axial force, bending force, tensile deformation, bending deformation, and stress incoming direction of the rod body. The detection accuracy is high, the response speed is fast, the data of mine rock bursts can be accurately captured, and the working condition parameters collected by the anchor rod sensor terminal are stored in real time through the collection end and wirelessly transmitted to the human-machine terminal, avoiding complex wiring laying and having strong real-time performance. Description of the Drawings

[0022] Figure 1 is an overall schematic diagram of a wireless distributed multi-point anchor rod stress device according to Embodiment 1 of the utility model;

[0023] Figure 2 is a structural diagram of the anchor rod sensor terminal of a wireless distributed multi-point anchor rod stress device according to Embodiment 1 of the utility model;

[0024] Figure 3 is a circuit diagram of the first MCU module of a wireless distributed multi-point anchor rod stress device according to Embodiment 1 of the utility model;

[0025] Figure 4 is a circuit diagram of the storage module of a wireless distributed multi-point anchor rod stress device according to Embodiment 1 of the utility model;

[0026] Figure 5 is a circuit diagram of the Bluetooth module of a wireless distributed multi-point anchor rod stress device according to Embodiment 1 of the utility model;

[0027] Figure 6 is a circuit diagram of the 433 wireless communication module of a wireless distributed multi-point anchor rod stress device according to Embodiment 1 of the utility model;

[0028] Figure 7 is a circuit diagram of the first 485 communication module of a wireless distributed multi-point anchor rod stress device according to Embodiment 1 of the utility model;

[0029] Figure 8 is a circuit diagram of the second MCU module of a wireless distributed multi-point anchor rod stress device according to Embodiment 1 of the utility model;

[0030] Figure 9 is a circuit diagram of the second 485 communication module of a wireless distributed multi-point anchor rod stress device according to Embodiment 1 of the utility model;

[0031] Figure 10 This is the AD module circuit diagram of a wireless distributed multi-point bolt stress device according to Embodiment 1 of the present utility model. Detailed implementation manners

[0032] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts shall fall within the protection scope of the present utility model.

[0033] The technical solutions of the present utility model will be further described below in conjunction with the accompanying drawings of the specification and specific embodiments:

[0034] Embodiment 1

[0035] As Figure 1 shown, this is the schematic diagram of the main structure connection of a wireless distributed multi-point bolt stress device according to Embodiment 1 of the present utility model, including a human-machine terminal, a collector end, and a bolt sensor end. The human-machine terminal performs wireless transmission with the collector end. The collector end collects the signals collected by the bolt sensor end, stores them, and uploads them to the human-machine terminal. The bolt sensor monitors working condition parameters such as axial force, bending force, tensile deformation, bending deformation, and stress incoming direction in real time, providing an important basis for the analysis of the pressure coming in the coal mine roadway and safe support.

[0036] See Figure 2, is the structural diagram of the anchor sensor end of a wireless distributed multi - point bolt stress device according to Embodiment 1 of the present utility model; it includes an anchor body 1, a protective cover 2, a stress - receiving body 3, a set screw 4, a gasket 5, a first O - ring 6, a second O - ring 7, a main board 8, a resistive strain gauge 9, a connector 10, a strain gauge 11, and a connecting plate 12; the anchor body 1 is a cylindrical sensing rod body. There are 12 strain sensors mounted at different positions axially in a groove inside the middle section of the anchor body 1. Each group of strain sensors collects stress data by a separate micro - circuit board. According to the strain sensors, working condition parameters such as the axial force, bending force, tensile deformation, bending deformation, and stress incoming direction of the rod body can be detected; the 12 strain sensors inside the rod body are divided into 6 groups, and each group of strain sensors is respectively installed at opposite positions in the upper and lower layers inside the rod body; among them, the strain sensor is composed of a strain gauge 11 and a connecting plate 12, and the strain gauge 11 is installed on the anchor body 1 through the connecting plate 12; the tail end of the anchor body 1 is embedded in an anchor seat formed by the set screw 4 and the stress - receiving body 3. The set screw 4 is used to fix the anchor, and the stress - receiving body 3 further receives force for stability; there is also a resistive strain gauge 9 around the stress - receiving body 3, and the magnitude of the pre - tightening force is fed back according to the force condition of the resistive strain gauge 9; a gasket 5 is also installed on the head of the set screw 4; the stress - receiving body 3 is covered with a protective cover 2, and the protective cover 2 is connected to the stress - receiving body 3 through the first O - ring 6 and the second O - ring 7; a circular main board 8 is installed inside the protective cover 2 for setting up the circuit of the anchor sensor end; a connector 10 is installed on the protective cover 2, and the collector end and the anchor sensor end can be connected through the connector 10 for data interaction.

[0037] The installation method of the anchor sensor end in this embodiment is as follows: Use a drilling machine to drill a round hole with a diameter of 22 mm inside the coal mine roadway rock formation, then insert the anchor body 1 and the anchor grouting agent into the hole until the gasket 5 fits the rock formation surface, and then use a torque wrench to turn the set screw 4 until the pre - tightening force reaches a certain value.

[0038] At present, the wireless bolt monitoring equipment in this field only monitors the interaction forces within the rock formation, and cannot accurately measure the mutual axial forces between the interior of the rock formation and the surface of the rock mass. However, the bolt sensor end in this embodiment retains the function of the original external end bolt (cable) stress sensor to measure the axial force. At the same time, taking the bolt as the carrier, strain sensors are mounted at different axial positions in the rod body (grooved) to sense the force and deformation of the bolt under the action of the surrounding rock. It is a full-digital wireless sensor that combines two stress monitoring methods. Its rod body is inserted into the inner layer of the rock formation to monitor the stress changes in the inner layer of the rock mass. At the same time, the end structure can be fixed on the surface of the rock mass. Through the rod body of the bolt inserted into the inner part of the rock formation, the axial stresses between the surface and the inner layer of the rock mass can be monitored in real time. By installing one sensor device at the same rock mass position, two stress data can be monitored simultaneously, avoiding the acquisition error of stress data by using two sensors separately, and providing reliable data for the evaluation of the rock mass support working condition.

[0039] Preferably, the implementation object of this embodiment can also be a coal seam or other supportable geological strata.

[0040] The collector end includes: a first MCU module, a storage module, a Bluetooth module, a 433 wireless communication module, and a first 485 communication module; the first MCU module is connected to the storage module, the Bluetooth module, the 433 wireless communication module, the first 485 communication module, and the second MCU module of the bolt sensor. The first 485 communication module is also connected to the second 485 communication module of the bolt sensor.

[0041] See Figure 3, which is the circuit diagram of the first MCU module of a wireless distributed multi-point bolt stress device according to Embodiment 1 of the present invention. The first MCU module includes a single-chip microcomputer U10, a capacitor C29, a capacitor C30, a capacitor C31, a capacitor 32, a resistor R42, a crystal oscillator Y1, and a crystal oscillator Y2. The 51st - 56th pins of the single-chip microcomputer U10 are connected to the storage module, the 46th - 48th pins of the single-chip microcomputer U10 are connected to the Bluetooth module, the 77th, 81st, 82nd, 92nd, and 93rd pins of the single-chip microcomputer U10 are connected to the 433 wireless communication module, the 70th, 86th, and 87th pins of the single-chip microcomputer U10 are connected to the first 485 communication module, the 72nd and 76th pins of the single-chip microcomputer U10 are connected to the second MCU module of the bolt sensor, the 8th pin of the single-chip microcomputer U10 is connected to one end of the capacitor C31 and one end of the crystal oscillator Y2, the other end of the crystal oscillator Y2 is connected to one end of the capacitor C32 and the 9th pin of the single-chip microcomputer U10, and the other end of the capacitor C32 is connected to the other end of the capacitor C31 and grounded together; the 12th pin of the single-chip microcomputer U10 is connected to one end of the crystal oscillator Y1, one end of the resistor R42, and one end of the capacitor C29, the 13th pin of the single-chip microcomputer U10 is connected to the other end of the crystal oscillator Y1, the other end of the resistor R42, and one end of the capacitor C30, and the other end of the capacitor C29 is connected to the other end of the capacitor C30 and grounded together. The model of the single-chip microcomputer U10 is STM32L475VCT6. STM32L475VCT6 is a low-power single-chip microcomputer, and the low-power single-chip microcomputer can ensure that the overall power consumption of the multi-parameter sensor in the working state is not high. For example, it can also work normally for a long time when powered by a battery on-site.

[0042] See Figure 4 , which is the circuit diagram of the storage module of a wireless distributed multi-point bolt stress device according to Embodiment 1 of the present invention; the storage module includes a single-chip microcomputer U2, a capacitor C49, a resistor R77, a resistor R36, and a resistor R37; the 7th pin of the single-chip microcomputer U2 is connected to the 51st pin of the single-chip microcomputer U10, the 16th pin of the single-chip microcomputer U2 is connected to the 52nd pin of the single-chip microcomputer U10, the 8th pin of the single-chip microcomputer U2 is connected to the 53rd pin of the single-chip microcomputer U10, the 15th pin of the single-chip microcomputer U2 is connected to the 54th pin of the single-chip microcomputer U10, the 1st pin of the single-chip microcomputer U2 is connected to the 55th pin of the single-chip microcomputer U10, the 3rd pin of the single-chip microcomputer U2 is connected to the 56th pin of the single-chip microcomputer U10 and one end of the resistor R37, the 2nd pin of the single-chip microcomputer U2 is connected to one end of the capacitor C49, the other end of the resistor R37, and one end of the resistor R77, the other end of the capacitor C49 is grounded, the other end of the resistor R77 is connected to the power supply, the 9th pin of the single-chip microcomputer U2 is connected to one end of the resistor R36, the other end of the resistor R36 is connected to the power supply, and the 10th pin of the single-chip microcomputer U2 is grounded. The specific model of the single-chip microcomputer U2 is W25Q256JVFIQ, which is used for storing historical data.

[0043] See Figure 5 , which is the circuit diagram of the Bluetooth module of a wireless distributed multi-point bolt stress device according to Embodiment 1 of the present utility model; the Bluetooth module includes a single-chip microcomputer U8, a resistor R26, a resistor R27, and a resistor R38; the first pin of the single-chip microcomputer U8 is connected in series with the resistor R26 to the 48th pin of the single-chip microcomputer U10, the second pin of the single-chip microcomputer U8 is connected in series with the resistor R27 to the 47th pin of the single-chip microcomputer U10, the third pin of the single-chip microcomputer U8 is connected in series with the resistor R38 to the 46th pin of the single-chip microcomputer U10, the sixth pin of the single-chip microcomputer U10 is connected to the power supply, and the seventh pin of the single-chip microcomputer U10 is grounded; the model of the single-chip microcomputer U10 is ZX-D30.

[0044] See Figure 6 , which is the circuit diagram of the 433 wireless communication module of a wireless distributed multi-point bolt stress device according to Embodiment 1 of the present utility model. The 433 wireless communication module includes a single-chip microcomputer U11, a resistor R28, a resistor R30, a resistor R31, a resistor R10, and a resistor R11; the first pin of the single-chip microcomputer U11 is grounded, the second pin of the single-chip microcomputer U11 is connected to the power supply, the third pin of the single-chip microcomputer U11 is connected in series with the resistor R28 to the 82nd pin of the single-chip microcomputer U10, the fourth pin of the single-chip microcomputer U11 is connected in series with the resistor R11 to the 92nd pin of the single-chip microcomputer U10, the fifth pin of the single-chip microcomputer U11 is connected in series with the resistor R10 to the 93rd pin of the single-chip microcomputer U10, the sixth pin of the single-chip microcomputer U11 is connected in series with the resistor R11 to the 81st pin of the single-chip microcomputer U10, and the seventh pin of the single-chip microcomputer U11 is connected in series with the resistor R11 to the 77th pin of the single-chip microcomputer U10; the specific model of the single-chip microcomputer U11 is BM200N, and the resistors R28, R30, R31, R10, and R11 are all zero-ohm resistors.

[0045] See Figure 7, which is the circuit diagram of the first 485 communication module of a wireless distributed multi-point bolt stress device according to Embodiment 1 of the present utility model. The first 485 communication module includes a single-chip microcomputer U3, resistors R17, R18, R19, R20, R21, R48, R49, R50, a capacitor C12, a DIP switch P8, TVS diodes D1, D2, and D12. The first pin of the single-chip microcomputer U3 is connected in series with the resistor R17 to the 87th pin of the single-chip microcomputer U10. The second and third pins of the single-chip microcomputer U3 are connected together and connected in series with the resistor R18 to the 70th pin of the single-chip microcomputer U10. The fourth pin of the single-chip microcomputer U3 is connected in series with the resistor R19 to the 86th pin of the single-chip microcomputer U10. The fifth pin of the single-chip microcomputer U3 is grounded. The sixth pin of the single-chip microcomputer U3 is connected to one end of the resistor R21 and one end of the resistor R49. The other end of the resistor R21 is connected to the second pin of the DIP switch P8. The other end of the resistor R49 is connected to one end of the resistor R20, one end of the TVS diode D1, and one end of the TVS diode D12 and is connected to the second 485 communication module of the bolt sensor. The other end of the resistor R20 is connected to electricity. The other end of the TVS diode D1 is grounded. The seventh pin of the single-chip microcomputer U3 is connected to the first pin of the DIP switch P8 and one end of the resistor R50. The other end of the resistor R50 is connected to one end of the resistor R48, the other end of the TVS diode D12, and one end of the TVS diode D2 and is connected to the second 485 communication module of the bolt sensor. The other end of the resistor R48 is grounded. The other end of the TVS diode D2 is grounded. The eighth pin of the single-chip microcomputer U3 is connected to the power supply and one end of the capacitor C12. The other end of the capacitor C12 is grounded. The model of the DIP switch P8 is DSIC01LSGET. The models of the TVS diodes D1, D2, and D12 are all BS0080MS.

[0046] The bolt sensor end includes a second MCU module, a second 485 communication module, and an AD module. The second MCU module is connected to the 72nd and 76th pins of the single-chip microcomputer U10 of the first MCU module, the second 485 communication module, and the AD module. The second 485 communication module is also connected to the 6th and 7th pins of the single-chip microcomputer U3 of the first 485 communication module.

[0047] See Figure 8, which is the circuit diagram of the second MCU module of a wireless distributed multi-point bolt stress device according to Embodiment 1 of the present utility model. The second MCU module includes a single-chip microcomputer U20 and a resistor R35; the 25th and 26th pins of the single-chip microcomputer U20 are connected to the AD module, the 29th, 30th, and 31st pins of the single-chip microcomputer U20 are connected to the second 485 communication module, the 34th pin of the single-chip microcomputer U20 is connected to the 72nd pin of the single-chip microcomputer U10, the 37th pin of the single-chip microcomputer U20 is connected to the 76th pin of the single-chip microcomputer U20, and the 44th pin of the single-chip microcomputer U20 is connected in series with the resistor R35 to ground; the specific model of the single-chip microcomputer U20 is STM32F030C8T6.

[0048] See Figure 9 , which is the circuit diagram of the second 485 communication module of a wireless distributed multi-point bolt stress device according to Embodiment 1 of the present utility model; the second 485 communication module includes a single-chip microcomputer U1, a capacitor C1, a resistor R4, a resistor R8, a resistor R44, and an electrostatic protection diode D14; the 1st pin of the single-chip microcomputer U1 is connected to the 31st pin of the single-chip microcomputer U20, the 2nd pin and the 3rd pin of the single-chip microcomputer U1 are connected together and connected to the 29th pin of the single-chip microcomputer U20, the 4th pin of the single-chip microcomputer U1 is connected to the 30th pin of the single-chip microcomputer U20, the 5th pin of the single-chip microcomputer U1 is grounded, the 6th pin of the single-chip microcomputer U1 is connected to one end of the resistor R4, one end of the resistor R44, and the 1st pin of the electrostatic protection diode D14 and is connected to the line where the 6th pin of the single-chip microcomputer U3 of the first 485 communication module is located, the other end of the resistor R44 is powered on, the 7th pin of the single-chip microcomputer U1 is connected to the other end of the resistor R4, one end of the resistor R8, and the 2nd pin of the electrostatic protection diode D14 and is connected to the line where the 7th pin of the single-chip microcomputer U3 of the first 485 communication module is located, the other end of the resistor R8 is grounded, the 3rd pin of the electrostatic protection diode D14 is grounded, the 8th pin of the single-chip microcomputer U1 is connected to the power supply and one end of the capacitor C1, and the other end of the capacitor C1 is grounded; the specific model of the single-chip microcomputer U1 is MAX3485CSA, and the specific model of the electrostatic protection diode D14 is CDSOT23-SM712.

[0049] See Figure 10, which is the circuit diagram of the AD module of a wireless distributed multi-point bolt stress device according to Embodiment 1 of the present utility model. The AD module includes a single-chip microcomputer U21, a resistor R1, a resistor R2, a resistor R3, a resistor R22, a resistor R23, a resistor R24, a capacitor C2, a capacitor C3, a capacitor C4, and a capacitor C5. The first pin of the single-chip microcomputer U21 is connected to one end of the resistor R3, the third pin of the single-chip microcomputer U21, and one end of the capacitor C2. The other end of the resistor R3 is connected to electricity. The fourth pin and the fifth pin of the single-chip microcomputer U21 are connected together and are connected to the other end of the capacitor C2 and one end of the capacitor C3 and grounded. The sixth pin of the single-chip microcomputer U21 is connected to the other end of the capacitor C3. The seventh pin of the single-chip microcomputer U21 is connected to one end of the resistor R1, one end of the capacitor C4, and one end of the resistor R23. The other end of the resistor R1 is connected to VOUT-. The eighth pin of the single-chip microcomputer U21 is connected to one end of the resistor R2, the other end of the capacitor C4, and one end of the resistor R22. The other end of the resistor R2 is connected to VOUT+. The ninth pin of the single-chip microcomputer U21 is connected to the other end of the resistor R23. The tenth pin of the single-chip microcomputer U21 is connected to the other end of the resistor R22. The eleventh pin of the single-chip microcomputer U21 is connected to the 26th pin of the single-chip microcomputer U20 and one end of the resistor R24. The other end of the resistor R24 is connected to electricity. The twelfth pin of the single-chip microcomputer U21 is connected to the 25th pin of the single-chip microcomputer U20. The fourteenth pin and the fifteenth pin of the single-chip microcomputer U21 are connected together and grounded. The sixteenth pin of the single-chip microcomputer U21 is connected to the power supply and one end of the capacitor C5. The other end of the capacitor C5 is grounded. The specific model of the single-chip microcomputer U21 is HX711, which has a 24-bit high-precision data conversion function.

[0050] Working method:

[0051] In the end rod body of the bolt sensor, 12 strain sensors are axially arranged in grooves at different positions. The 12 strain sensors inside the rod body are divided into 6 groups. Each group of strain sensors is respectively attached to the opposite positions of the upper and lower layers inside the rod body. Each strain sensor collects stress data by a separate micro circuit board. According to the 6 groups of strain sensors, the working condition parameters such as the axial force, bending force, tensile deformation, bending deformation, and stress incoming direction of the rod body can be detected. The detected working condition parameters are collected, processed, and transmitted to the second MCU module through the AD module. The second MCU module transmits data to the acquisition end through the second 485 communication module, and transmits the working condition parameters collected at the bolt sensor end to the acquisition end. The first 485 communication module at the acquisition end collects the parameter signals transmitted from the bolt sensor end and exchanges data with the first MCU module. The first MCU module further stores the collected working condition parameters through the storage module, and transmits the working condition parameters to the human-machine terminal in real time through the Bluetooth module and the 433 wireless communication module, realizing continuous dynamic monitoring and support of the surrounding rock.

[0052] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wireless distributed multi-point anchor stress device, characterized in that: It includes a human-machine terminal, a collector end, and an anchor sensor end. The human-machine terminal and the collector end perform wireless transmission. The collector end collects the signals collected by the anchor sensor end and stores and uploads them to the human-machine terminal. The collector end includes: a first MCU module, a storage module, a Bluetooth module, a 433 wireless communication module, and a first 485 communication module, and the anchor sensor end includes a second MCU module, a second 485 communication module, and an AD module; the first MCU module is connected to the storage module, the Bluetooth module, the 433 wireless communication module, the first 485 communication module, and the second MCU module of the anchor, the first 485 communication module is also connected to the second 485 communication module of the anchor sensor, and the second MCU module is also connected to the second 485 communication module and the AD module; A plurality of strain sensors are also arranged in the end rod body of the anchor rod sensor.

2. A wireless distributed multi-point anchor stress device according to claim 1, characterized in that: The anchor rod sensor end has 12 strain sensors mounted at different positions axially arranged in the slots in the rod body. The 12 strain sensors inside the rod body are divided into 6 groups, and each group of strain sensors is respectively mounted at relative positions of the upper and lower layers inside the rod body.

3. A wireless distributed multi-point anchor stress device according to claim 1, characterized in that: The first MCU module includes a single-chip computer U10, wherein pins 51-56 of the single-chip computer U10 are connected to the storage module, pins 46-48 of the single-chip computer U10 are connected to the Bluetooth module, pins 77, 81, 82, 92, and 93 of the single-chip computer U10 are connected to the 433 wireless communication module, pins 70, 86, and 87 of the single-chip computer U10 are connected to the first 485 communication module, and pins 72 and 76 of the single-chip computer U10 are connected to the second MCU module of the anchor sensor.

4. A wireless distributed multi-point anchor stress device according to claim 3, characterized in that: The storage module includes a single-chip microcomputer U2, wherein the 7th pin of the single-chip microcomputer U2 is connected to the 51st pin of the single-chip microcomputer U10, the 16th pin of the single-chip microcomputer U2 is connected to the 52nd pin of the single-chip microcomputer U10, the 8th pin of the single-chip microcomputer U2 is connected to the 53rd pin of the single-chip microcomputer U10, the 15th pin of the single-chip microcomputer U2 is connected to the 54th pin of the single-chip microcomputer U10, the 1st pin of the single-chip microcomputer U2 is connected to the 55th pin of the single-chip microcomputer U10, and the 3rd pin of the single-chip microcomputer U2 is connected to the 56th pin of the single-chip microcomputer U10.

5. A wireless distributed multi-point anchor stress device according to claim 3, characterized in that: The Bluetooth module includes a single-chip microcomputer U8, wherein the first pin of the single-chip microcomputer U8 is connected to the 48th pin of the single-chip microcomputer U10, the second pin of the single-chip microcomputer U8 is connected to the 47th pin of the single-chip microcomputer U10, and the third pin of the single-chip microcomputer U8 is connected to the 46th pin of the single-chip microcomputer U10.

6. A wireless distributed multi-point anchor stress device according to claim 3, characterized in that: The 433 wireless communication module includes a single-chip microcomputer U11, wherein the 3rd pin of the single-chip microcomputer U11 is connected to the 82nd pin of the single-chip microcomputer U10, the 4th pin of the single-chip microcomputer U11 is connected to the 92nd pin of the single-chip microcomputer U10, the 5th pin of the single-chip microcomputer U11 is connected to the 93rd pin of the single-chip microcomputer U10, the 6th pin of the single-chip microcomputer U11 is connected to the 81st pin of the single-chip microcomputer U10, and the 7th pin of the single-chip microcomputer U11 is connected to the 77th pin of the single-chip microcomputer U10.

7. A wireless distributed multi-point anchor stress device according to claim 3, characterized in that: The first 485 communication module includes a single-chip microcomputer U3, wherein the first pin of the single-chip microcomputer U3 is connected to the 87th pin of the single-chip microcomputer U10, the second pin and the third pin of the single-chip microcomputer U3 are connected together to the 70th pin of the single-chip microcomputer U10, the fourth pin of the single-chip microcomputer U3 is connected to the 86th pin of the single-chip microcomputer U10, the sixth pin of the single-chip microcomputer U3 is connected to the second 485 communication module, and the seventh pin of the single-chip microcomputer U3 is also connected to the second 485 communication module.

8. A wireless distributed multi-point anchor stress device according to claim 3, characterized in that: The second MCU module includes a single-chip microcomputer U20, wherein the 25th and 26th pins of the single-chip microcomputer U20 are connected to the AD module, the 29th, 30th and 31st pins of the single-chip microcomputer U20 are connected to the second 485 communication module, the 34th pin of the single-chip microcomputer U20 is connected to the 72nd pin of the single-chip microcomputer U10, and the 37th pin of the single-chip microcomputer U20 is connected to the 76th pin of the single-chip microcomputer U20.

9. A wireless distributed multi-point anchor stress device according to claim 8, characterized in that: The second 485 communication module includes a single-chip microcomputer U1, wherein the first pin of the single-chip microcomputer U1 is connected to the 31st pin of the single-chip microcomputer U20, the second pin and the third pin of the single-chip microcomputer U1 are connected together to the 29th pin of the single-chip microcomputer U20, the fourth pin of the single-chip microcomputer U1 is connected to the 30th pin of the single-chip microcomputer U20, the sixth pin of the single-chip microcomputer U1 is connected to the sixth pin of the single-chip microcomputer U3, and the seventh pin of the single-chip microcomputer U1 is connected to the seventh pin of the single-chip microcomputer U3.

10. A wireless distributed multi-point anchor stress device according to claim 8, characterized in that: The AD module includes a single-chip microcomputer U21, wherein the 11th pin of the single-chip microcomputer U21 is connected to the 26th pin of the single-chip microcomputer U20, and the 12th pin of the single-chip microcomputer U21 is connected to the 25th pin of the single-chip microcomputer U20.

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