Integrated base station
By integrating the digital-to-analog conversion unit with the power amplifier module of the RF signal processing layer and sharing the same layer with the filter unit, the problem of excessive number of blind plug connectors in a multi-channel integrated base station is solved, and equipment design and production are simplified, reliability and communication performance are improved, and cost reduction is achieved.
Patent Information
- Application Number
- CN202421749999.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-23
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2034-07-23
AI Technical Summary
In the case of multi-channel conditions, the transmission of RF signals requires a large number of blind plug-ins, resulting in high cost, difficult to ensure accuracy and degradation of RF performance.
By separating the digital-to-analog conversion unit from the baseband unit, integrating it with the power amplifier module of the RF signal processing layer, and sharing the same layer with the filtering unit, digital signals are only transmitted between the baseband layer and the RF signal processing layer, reducing the number of connectors.
It reduces the difficulty of connecting between the baseband layer and the RF signal processing layer, reduces the number of blind plug-ins, simplifies equipment design and production, improves equipment reliability and communication performance, and reduces costs.
Smart Images
Figure CN222916205U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of communications, and more particularly, to an integrated base station. Background Art
[0002] At present, in the design of integrated base stations, the baseband digital part is usually integrated with the radio frequency signal amplification and passive devices on the same equipment layer. In some solutions, the baseband layer is located on the first layer of the equipment, while the radio frequency amplification and passive devices share the second layer. In some designs, an antenna layer is even added on top of these two layers stacked. In such a design, control signals and radio frequency signals need to be transmitted between the baseband layer and the radio frequency amplification part. The transmission of radio frequency signals is usually achieved through cables or blind-mate connectors.
[0003] When using cables for radio frequency connection between the baseband and the radio frequency amplification part, especially in multi-channel base stations, the cable layout becomes complex and the complexity of the production process increases. Therefore, multi-channel base stations tend to use blind-mate connectors to transmit radio frequency signals. However, using blind-mate radio frequency connectors also has some disadvantages. First, the cost of such connectors is relatively high, and as the number of connectors used in a single channel increases (3 to 4 connectors are required for each channel), the overall cost increases significantly. Second, as the number of device channels increases, the number of required connectors also increases, which not only increases the cost but also makes it difficult to ensure the accuracy of blind mating. To achieve the required blind-mating accuracy, the performance of the connectors may need to be sacrificed, which in turn may lead to a decline in the radio frequency performance of the device. Summary of the Utility Model
[0004] The utility model provides an integrated base station to solve the problems raised in the above background art.
[0005] An integrated base station includes a baseband layer and a radio frequency signal processing layer. The baseband layer includes a baseband unit and a power supply unit. The radio frequency signal processing layer includes a digital-to-analog conversion unit, a power amplifier unit, and a filtering unit. The baseband unit is connected to the digital-to-analog conversion unit through a connector, and the digital-to-analog conversion unit and the power amplifier unit are integrated on the same PCB board.
[0006] Further, the filtering unit is interconnected with the power amplifier unit through a radio frequency cable.
[0007] Further, the baseband unit and the power supply unit are interconnected through a connector.
[0008] Further, the filtering unit is an independent cavity filter or a cavity filter integrated with the chassis.
[0009] Further, a primary positioning structure is provided between the baseband layer and the radio frequency signal processing layer.
[0010] Furthermore, secondary positioning structures are provided on both sides of the connector.
[0011] Furthermore, a maintenance window is provided on one side of the baseband layer. Inside the maintenance window, there are optical ports, network ports, power interfaces, and debugging interfaces, which facilitate the commissioning and maintenance of the device.
[0012] Furthermore, a sealing strip is provided between the maintenance window and the baseband layer.
[0013] The present utility model proposes a new solution. By separating the digital-to-analog conversion unit from the baseband unit, integrating it with the power amplifier module in the radio frequency signal processing layer, and sharing one layer with the filtering unit. In this way, only digital signals need to be transmitted between the baseband layer and the radio frequency signal processing layer, greatly reducing the connection difficulty between the two layers. It is especially suitable for multi-channel integrated base stations, reducing a large number of blind plug connectors, simplifying the design and production of the device, ensuring the communication performance of the device while improving the reliability of the device and reducing the device cost. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 FIG. is a schematic diagram of the stacking structure of the integrated base station in the embodiment;
[0015] Figure 2 FIG. is a schematic diagram of the structure of the baseband layer of the integrated base station in the embodiment;
[0016] Figure 3 FIG. is a schematic diagram of the structure of the radio frequency signal processing layer of the integrated base station in the embodiment;
[0017] Figure 4 FIG. is a schematic diagram of the overall structure of the integrated base station in the embodiment.
[0018] In the figure, 1 is the baseband layer; 11 is the baseband unit; 12 is the power supply unit; 2 is the radio frequency signal processing layer; 21 is the power amplifier unit; 22 is the digital-to-analog conversion unit; 23 is the filtering unit; 3 is the connector; 4 is the plug. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0019] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.
[0020] In the embodiments of the present application, an integrated base station is provided, as Figures 1 - 4As shown in the figure, it includes: a baseband layer 1 and a radio frequency signal processing layer 2 connected in a stacked manner. The baseband layer 1 includes a baseband unit 11 and a power supply unit 12. The radio frequency signal processing layer 2 includes a digital-to-analog conversion unit 22, a power amplifier unit 21, and a filtering unit 23. The baseband unit 11 is connected to the digital-to-analog conversion unit 22 through a high-speed connector 3 for transmitting power, control signals, and data. The digital-to-analog conversion unit 22 and the power amplifier unit 21 are integrated on the same PCB board. The filtering unit 23 is interconnected with the power amplifier unit 21 through a radio frequency cable.
[0021] With this solution, the digital-to-analog conversion unit 22 is separated from the baseband unit 11, integrated with the power amplifier module of the radio frequency signal processing layer 2, and shares a layer with the filtering unit 23. In this way, only digital signals need to be transmitted between the baseband layer 1 and the radio frequency signal processing layer 2, and it is only necessary to connect the baseband unit 11 and the digital-to-analog conversion unit 22 through the high-speed connector 3, which greatly reduces the connection difficulty between the two layers, improves the reliability of the device, and reduces the cost of the device. Moreover, in this layout, the baseband layer can achieve multiplexing under different frequency band requirements.
[0022] The filtering unit 23 is an independent cavity filter or a cavity filter integrated with the chassis. The baseband unit 11 and the power supply unit 12 are interconnected through a connector 4. The power amplifier unit 21 and the power supply unit 12 can be connected through a high-speed connector or through a cable. A primary positioning structure is provided between the baseband layer 1 and the radio frequency signal processing layer 2, and secondary positioning structures are provided on both sides of the high-speed connector 3. The two-level positioning structure ensures that the high-speed connector 3 of the baseband layer 1 and the radio frequency signal processing layer 2 can be safely and reliably connected when stacked. The positioning structure can be composed of a positioning pin and a positioning hole, or other structures that those skilled in the art can think of without creative labor. The radio frequency signal processing layer 2 is also provided with a radio frequency connector 3, which can output radio frequency signals to an external antenna.
[0023] A maintenance window is provided on one side of the baseband layer 1 to facilitate the commissioning and maintenance of the device. There are optical ports, network ports, power supply interfaces, and debugging interfaces in the maintenance window. A sealing strip is provided between the maintenance window and the baseband layer 1.
[0024] Although the present invention has been described in detail by referring to the accompanying drawings and in combination with the preferred embodiments, the present invention is not limited thereto. Without departing from the spirit and essence of the present invention, those of ordinary skill in the art can make various equivalent modifications or substitutions to the embodiments of the present invention, and these modifications or substitutions should all be within the scope covered by the present invention.
Claims
1. An integrated base station, characterized in that: It includes a baseband layer and a radio frequency signal processing layer that are stacked and connected, the baseband layer includes a baseband unit and a power supply unit, the radio frequency signal processing layer includes a digital-to-analog conversion unit, a power amplifier unit and a filter unit, the baseband unit is connected to the digital-to-analog conversion unit via a connector, and the digital-to-analog conversion unit and the power amplifier unit are integrated on the same PCB board.
2. The integrated base station according to claim 1, characterized in that: The filter unit and the power amplifier unit are interconnected via a radio frequency cable.
3. The integrated base station according to claim 1, characterized in that: The baseband unit and the power supply unit are interconnected via a connector.
4. The integrated base station according to claim 1 or 2, characterized in that: The filter unit is an independent cavity filter or a cavity filter integrated with a chassis.
5. The integrated base station according to claim 1, characterized in that: A primary positioning structure is provided between the baseband layer and the radio frequency signal processing layer, and a secondary positioning structure is provided on both sides of the connector.
6. The integrated base station according to claim 5, characterized in that: The primary positioning structure and the secondary positioning structure are both composed of positioning pins and positioning holes.
7. The integrated base station according to claim 1, characterized in that: The radio frequency signal processing layer is also provided with a radio frequency connector.
8. The integrated base station according to claim 1, characterized in that: A maintenance window is provided on one side of the baseband layer, and an optical port, a network port, a power supply port and a debugging port are arranged in the maintenance window.
9. The integrated base station according to claim 8, characterized in that: A sealing strip is provided between the maintenance window and the base tape layer.