Heat dissipation structure of ignition module small-power tube of automobile ignition coil

Abstract

The utility model discloses a radiating structure of an ignition module small-power tube of an automobile ignition coil, which is characterized in that a pan head lead mounting groove and a small-power tube mounting groove are fixedly arranged on a radiating fin; a first solder paste layer is arranged in a first concave area between a corner part and a convex part of the radiating fin; a spiral disc of the pan head lead is embedded into the first solder paste layer and is electrically connected with the first concave area through reflow soldering; a second solder paste layer is arranged in a second concave area in the middle of the cooling fin, and the back face of the small-power tube is mounted in the second solder paste layer and electrically connected with the second concave area through reflow soldering. Manual welding can be improved and replaced by reflow welding, manual welding operation procedures are effectively reduced, and therefore production efficiency is improved. And meanwhile, the production reliability and the heat dissipation efficiency are improved, so that the product quality is ensured.

Description

Technical Field

[0001] The utility model relates to the field of automotive ignition coils, in particular to a heat sink for a power transistor of an ignition module. Background Art

[0002] In the prior art, in order to dissipate heat from the power transistor of the ignition module of an automotive ignition coil, a low-power transistor is manually soldered to a heat sink. Since each pin of the low-power transistor needs to be connected to the ignition module, however, the C pole of the low-power transistor cannot be directly connected to the negative pole of the ignition coil, and a transition wire needs to be manually soldered for connection. Such operation requires multiple manual soldering operations, which is troublesome and has low manual soldering efficiency, resulting in low production efficiency; moreover, manual soldering is greatly affected by human factors. For example, inaccurate control of the soldering iron temperature is likely to damage electronic components; inaccurate control of the amount of solder used for manual soldering at the connection between the power transistor and the heat sink will form a large solder ball at the soldering point, and the heat generated by the power transistor is transferred to the heat sink at a slow rate, resulting in poor heat dissipation, thus affecting product quality. Summary of the Utility Model

[0003] In order to solve the above drawbacks, the technical problem to be solved by the utility model is to provide a heat dissipation structure for a low-power transistor of an ignition module of an automotive ignition coil, which can effectively reduce the manual soldering operation process, improve production efficiency, and ensure product quality. To solve the above technical problem, the technical solution adopted by the utility model is a heat dissipation structure for a low-power transistor of an ignition module of an automotive ignition coil, including a heat sink, a low-power transistor, and a pan-head lead; characterized in that, a pan-head lead installation groove and a low-power transistor installation groove are fixedly arranged on the heat sink:

[0004] A raised portion with a corner is arranged around the corner of the side wall of the heat sink. The first concave area between the corner and the raised portion is the pan-head lead installation groove. A first solder paste layer is arranged in the first concave area. The spiral disk of the pan-head lead is embedded in the first solder paste layer of the first concave area, and the spiral disk is electrically connected to the first concave area of the heat sink through reflow soldering;

[0005] A second concave area is arranged in the middle of the heat sink as the low-power transistor installation groove. A second solder paste layer is arranged in the second concave area. The back surface of the low-power transistor is mounted on the second solder paste layer of the second concave area, and the metal part on the back surface of the low-power transistor is electrically connected to the second concave area of the heat sink through reflow soldering.

[0006] The beneficial effects of the present utility model are as follows. By adopting the above structure, the manual soldering of small power tubes, transition wires (panhead leads) and heat sinks can be improved and replaced with reflow soldering, effectively reducing the manual soldering operation process and thus improving production efficiency. At the same time, the stable reflow temperature also improves the production reliability; moreover, the setting of the two concave areas avoids the problem of inaccurate tin amount control, improves the heat dissipation efficiency, solves the problem of poor heat dissipation of small power tubes, and thus ensures the product quality.

[0007] In one embodiment, two convex platforms connected at the corners are stamped on the heat sink, and the two convex platforms are arranged around the corner of the side wall of the heat sink to form the first concave area. It is convenient to process, has low cost, and has reliable electrical connection.

[0008] In one embodiment, three convex platforms in a triangular shape are stamped in the middle of the heat sink, and the area between the three convex platforms forms the second concave area. It is convenient to process, has low cost, and has reliable electrical connection.

[0009] In one embodiment, heat dissipation holes are provided at the corners of the side wall of the heat sink, and the first concave area is close to the heat dissipation holes.

[0010] Of course, it is not necessary for any product implementing the present utility model to achieve all the above-mentioned advantages simultaneously.

[0011] In the description of this specification, the descriptions referring to terms such as "one embodiment", "example", "specific example", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present utility model belongs. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0012] It should be understood that the orientation or positional relationships indicated by terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model.

[0013] In addition, the terms "first" and "second" are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0014] In the present utility model, unless otherwise clearly stipulated and defined, terms such as "installed", "connected", "joined", "fixed", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0015] In the present utility model, unless otherwise clearly stipulated and defined, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0016] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Schematic diagram of the overall structural principle of the embodiment;

[0018] Figure 2 Schematic diagram of the principle of the heat sink of the embodiment (front view);

[0019] Figure 3 Schematic diagram of the principle of the heat sink of the embodiment (top view);

[0020] Figure 4 Schematic diagram of the principle of the heat sink of the embodiment (top view, side wall unfolded structure);

[0021] Figure 5 Schematic diagram of the overall three-dimensional structure principle of the embodiment. Detailed implementation manners

[0022] See the appendix Figures 1-4 , which reflects a specific structure of the present invention. The heat dissipation structure of the small-power tube of the ignition module of the automotive ignition coil includes a heat sink 1, a small-power tube 2, and a pan-head lead 3; a pan-head lead installation groove and a small-power tube installation groove are fixedly arranged on the heat sink 1:

[0023] A raised portion with a corner is arranged around the corner of the side wall 101 of the heat sink 1. The first concave area 5 between the corner and the raised portion is the pan-head lead installation groove. In the example, two connected bosses 501 are stamped on the heat sink 1, and the two bosses 501 are arranged around the corner of the side wall 101 of the heat sink 1 to form the first concave area 5. A first solder paste layer (not shown in the figure) is arranged in the first concave area 5, and the spiral disk of the pan-head lead 3 is embedded in the first solder paste layer in the first concave area 5.

[0024] A second concave area 6 is arranged in the middle of the heat sink 1 as the small-power tube installation groove. In the example, three bosses 601 in a triangular shape are stamped in the middle of the heat sink 1, and the area between the three bosses 601 forms the second concave area 6. A second solder paste layer (not shown in the figure) is arranged in the second concave area 6, and the back surface of the small-power tube 2 is mounted on the second solder paste layer in the second concave area 6.

[0025] The heat sink 1 installed with components such as the pan-head lead 3 and the small-power tube 2 is sent into a well-known reflow soldering device. There is a heating circuit inside the reflow soldering device. After heating air or nitrogen to a high enough temperature, it is blown onto the heat sink 1 with the components already mounted, so that the solder paste melts and the components are bonded to the heat sink 1 to form an electrical connection. Specifically: the spiral disk of the pan-head lead 3 is electrically connected to the first concave area 5 of the heat sink through reflow soldering, and the back metal part of the small-power tube 2 is electrically connected to the second concave area 6 of the heat sink through reflow soldering. Since the back metal part of the small-power tube 2 and the C-pin 202 are an integral metal conductive structure, the C-pin 202 is electrically connected to the pan-head lead 3 through the metal heat sink 1, and the lead of the pan-head lead 3 and the G-pin 201, E-pin 203 can be conveniently connected to the ignition module correspondingly.

[0026] As can be seen from the above, the above structure can replace the manual soldering of the low-power transistor 2, the transition wire - the panhead lead 3 and the heat sink 1 with reflow soldering, so that the heat sink 1 with a very small size does not need to be manually soldered during installation, thus effectively reducing the manual soldering operation process and improving the production efficiency. At the same time, the stable reflow temperature also improves the production reliability. Moreover, the setting of the first concave area 5 and the second concave area 6 enables the operator to simply scrape a certain amount of solder paste into the area defined by the concave area, avoiding the problem of inaccurate control of the solder consumption, thus improving the heat dissipation efficiency, solving the problem of poor heat dissipation of the low-power transistor, and ensuring the product quality.

[0027] In the example, heat dissipation holes 4 are provided at the corners of the side wall 101 of the heat sink 1, and the first concave area 5 is close to the heat dissipation holes 4.

[0028] The embodiments of the present invention disclosed above are only used to help explain the present invention. The embodiments do not describe all the details in detail, nor do they limit the present invention to the specific embodiments described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and combines the drawings to specifically describe these embodiments in order to better explain the principle and practical application of the present invention, so that those skilled in the art can well understand and utilize the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present invention. Therefore, the present invention is only limited by the claims and their full scope and equivalents, and is not limited by the disclosed specific embodiments.

Claims

1. A heat dissipation structure of a low-power tube of an ignition module of an automobile ignition coil, comprising a heat sink, a low-power tube, and a pan head lead; characterized in that: The heat sink is fixed with a pan head lead installation slot and a small power tube installation slot: A raised portion of a corner is arranged around the corner of the side wall of the heat sink, a first concave area between the corner and the raised portion is the pan head lead installation groove, a first solder paste layer is arranged in the first concave area, a spiral disk of the pan head lead is embedded in the first solder paste layer in the first concave area, and the spiral disk is electrically connected to the first concave area of ​​the heat sink through reflow soldering; A second concave area is set in the middle of the heat sink as a low-power tube installation groove, a second solder paste layer is set in the second concave area, the back of the low-power tube is mounted in the second solder paste layer in the second concave area, and the metal part on the back of the small-power tube is electrically connected to the second concave area of ​​the heat sink through reflow soldering.

2. The heat dissipation structure of the low-power tube of the ignition module of the automobile ignition coil as claimed in claim 1, characterized in that: Two bosses connected at the corners are punched on the heat sink, and the two bosses are arranged around the corners of the side wall of the heat sink to form the first concave area.

3. The heat dissipation structure of the low-power tube of the ignition module of the automobile ignition coil as claimed in claim 1, characterized in that: Three T-shaped bosses are punched in the middle of the heat sink, and the area between the three bosses constitutes the second concave area.

4. The heat dissipation structure of the low-power tube of the ignition module of the automobile ignition coil according to any one of claims 1 to 3, characterized in that: A heat dissipation hole is arranged at a corner of the side wall of the heat sink, and the first concave area is close to the heat dissipation hole.

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