Ultrathin dustproof clean lamp

Abstract

The utility model relates to the technical field of illumination, in particular to an ultrathin dustproof clean lamp which comprises a main body, a high-quality LED chip is arranged on the side face of the main body, and a fastening assembly is arranged in the main body. The light guide coefficient of the nanometer diffusion light guide plate is as high as 90%, high light extraction rate, pure light color and no dazzle light and dark space of the clean lamp are guaranteed, the heat dissipation aluminum frame is subjected to anodic oxidation treatment, heat dissipation can be achieved, meanwhile, the heat dissipation aluminum frame has the characteristics of rust prevention and fading prevention, the lamp can be durable, and the service life of the lamp is prolonged. The interior and the exterior of the sealing design are tightly combined, an integrated sealing structure is adopted, dust and mosquitoes are prevented from entering the lamp, the lamp is clean and transparent, the clean lamp can meet the specified illumination requirement of an illumination space and meet the clean standard of a clean room, the selected materials are light and thin, and the cost can be saved.

Description

Technical Field

[0001] The utility model relates to the technical field of lighting, in particular to an ultra-thin dust-proof and clean lamp. Background Technique

[0002] Clean lamps are mainly used in environments with high cleanliness requirements. Their design and manufacture can ensure that when the lamps are used in a clean environment, they will not pollute the air and can provide lighting at the same time. While providing lighting, clean lamps can also generate a large amount of negative ions. These negative ions can eliminate smoke and odors in the air, and kill germs and viruses, improving the indoor air quality. In the production processes such as food processing, biopharmaceuticals, and microelectronic circuits, there are often special requirements for the production environment. Lamps used in clean rooms need to have a dust-proof level of IP40 or above to ensure the cleanliness requirements. The lamps themselves should have good sealing performance to prevent dust from accumulating inside the lamps and prevent light leakage at the same time.

[0003] At present, the outer shells of clean lamps on the market are poorly sturdy and do not have a heat dissipation function. Some of the selected outer shell materials will also emit odors, seriously affecting the indoor air quality. The light guide plate has a low duct coefficient, low light output ratio, poor light color purity, and there are glare and dark areas. And none of the clean lamps achieve dust-proofing. Only after the lamps are installed, glue is applied to the lamps to achieve the effect of sealing and dust-proofing, and the internal sealing cannot be guaranteed. Therefore, an ultra-thin dust-proof and clean lamp is needed to improve the above problems. Content of the Utility Model

[0004] In order to solve the problems of the clean lamps on the market at present, that is, the outer shells are poorly sturdy and do not have a heat dissipation function. Some of the selected outer shell materials will also emit odors, seriously affecting the indoor air quality. The light guide plate has a low duct coefficient, low light output ratio, poor light color purity, and there are glare and dark areas. And none of the clean lamps achieve dust-proofing. Only after the lamps are installed, glue is applied to the lamps to achieve the effect of sealing and dust-proofing, and the internal sealing cannot be guaranteed. The purpose of the present utility model is to provide an ultra-thin dust-proof and clean lamp to solve the problems raised in the above background technique.

[0005] To achieve the above purpose, the present utility model provides the following technical solutions:

[0006] An ultra-thin dust-proof and clean lamp, including a main body. A high-quality LED chip is arranged on the side of the main body, and a fastening component is arranged inside the main body;

[0007] The main body includes a heat dissipation aluminum frame. An optical mask is fixedly connected to the side of the heat dissipation aluminum frame. A reflective paper is fixedly connected to the side of the optical mask. A nano diffusion light guide plate is fixedly connected to the side of the reflective paper;

[0008] The high-quality LED chip includes a sapphire substrate base, with an N-electrode wafer fixedly connected to the side of the sapphire substrate base, a P-electrode wafer fixedly connected to the side of the N-electrode wafer, and a buffer layer fixedly connected to the side of the P-electrode wafer.

[0009] As a preferred solution of the present utility model, a transparent protective layer is fixedly connected to the side of the buffer layer, and an N-electrode body and ITO are fixedly connected to the side of the transparent protective layer.

[0010] As a preferred solution of the present utility model, a current collector layer is fixedly connected to the side of the buffer layer, and a P-electrode body is fixedly connected to the side of the current collector layer.

[0011] As a preferred solution of the present utility model, a cable is fixedly connected to the side of the sapphire substrate base, and a first clamp and a second clamp are provided on the side of the heat dissipation aluminum frame.

[0012] As a preferred solution of the present utility model, three first clamps are provided, two second clamps are provided, and the cable is arranged inside the first clamp and the second clamp.

[0013] As a preferred solution of the present utility model, the fastening assembly includes a screw, four screws are provided, and concealed mounting holes are formed inside the heat dissipation aluminum frame.

[0014] As a preferred solution of the present utility model, a concealed threaded flat head is fixedly connected to the side of the screw, and four concealed threaded flat heads are provided.

[0015] As a preferred solution of the present utility model, a hidden insulating plug is provided on the side of the concealed threaded flat head, and four hidden insulating plugs are provided.

[0016] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0017] 1. In the present utility model, by using a nano diffusion light guide plate with a light guide coefficient as high as 90%, it ensures that the clean lamp has a high light output rate, pure light color, no glare and no dark areas. The heat dissipation aluminum frame is anodized, which not only can dissipate heat, but also makes the heat dissipation aluminum frame have the characteristics of rust prevention and color fastness prevention, and can be durable for a long time. The sealed design is closely combined inside and outside, with an integrated sealed structure, avoiding dust and mosquitoes from entering, being clean and transparent. This clean lamp can not only meet the illumination requirements specified in the lighting space, but also meet the cleanliness standards of the clean room, while saving energy as much as possible, and can achieve safe and reliable control.

[0018] 2. In this utility model, by using high-quality LED chips, the purposes of power saving, durability, high brightness, soft and non-glare light, comfortable light, and restoration of true light color can be achieved. The size of high-quality LED chips can be made smaller, the optics are easier to match, the heat dissipation function is improved, the lifespan of the chips is improved, the anti-static ability is improved, which can lay a foundation for the subsequent development of packaging technology. High-quality LED chips also have the characteristics of energy conservation, high electro-optical conversion efficiency, long lifespan, and are safe and reliable to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a schematic diagram of the overall structure of this utility model;

[0020] Figure 2 is a schematic diagram of the exploded structure of this utility model;

[0021] Figure 3 is a schematic diagram of the structure of the high-quality LED chip of this utility model;

[0022] Figure 4 is a schematic diagram of the structure of the fixed cable assembly of this utility model;

[0023] Figure 5 is a schematic diagram of the structure of the fastening assembly of this utility model.

[0024] In the figure: 1, main body; 101, heat dissipation aluminum frame; 102, optical mask; 103, reflective paper; 104, nano diffusion light guide plate; 2, high-quality LED chip; 201, sapphire substrate base; 202, N electrode wafer; 203, P electrode wafer; 204, buffer layer; 205, collector layer; 206, P electrode body; 207, N electrode body; 208, ITO; 209, transparent protective layer; 210, cable; 211, first clamp; 212, second clamp; 3, fastening assembly; 301, screw; 302, concealed threaded flat head; 303, hidden insulating plug. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0025] Next, the technical solutions in the embodiments of this utility model will be clearly and completely described in conjunction with the embodiments of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, rather than all the embodiments. Based on the embodiments in this utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of this utility model.

[0026] Embodiment: Please refer to Figures 1 - 5 An ultra-thin dust-proof and clean lamp shown, including a main body 1, a high-quality LED chip 2 is arranged on the side of the main body 1, and a fastening assembly 3 is arranged inside the main body 1;

[0027] In this embodiment, referring to Figure 1 , Figure 2 , Figure 3 and Figure 4 as shown, the main body 1 includes a heat-dissipating aluminum frame 101. An optical mask 102 is fixedly connected to the side surface of the heat-dissipating aluminum frame 101. A reflective paper 103 is fixedly connected to the side surface of the optical mask 102. A nano-diffusion light guide plate 104 is fixedly connected to the side surface of the reflective paper 103. The high-quality LED chip 2 includes a sapphire substrate base 201. An N-electrode wafer 202 is fixedly connected to the side surface of the sapphire substrate base 201. A P-electrode wafer 203 is fixedly connected to the side surface of the N-electrode wafer 202. A buffer layer 204 is fixedly connected to the side surface of the P-electrode wafer 203. By using the nano-diffusion light guide plate 104 with a light guide coefficient as high as 90%, it ensures that the clean lamp has a high light output rate, pure light color, no glare, and no dark areas. The heat-dissipating aluminum frame 101 is anodized, which not only dissipates heat but also makes the heat-dissipating aluminum frame 101 have the characteristics of rust prevention and color fading prevention, and can be durable for a long time. The sealed design is tightly combined inside and outside, with an integrated sealed structure, avoiding dust and mosquitoes from entering, being clean and transparent. This clean lamp can not only meet the illumination requirements specified for the lighting space but also reach the cleanliness standards of the clean room, while saving energy as much as possible and being able to achieve safe and reliable control.

[0028] Among them, a transparent protective layer 209 is fixedly connected to the side surface of the buffer layer 204. An N-electrode body 207 and ITO 208 are fixedly connected to the side surface of the transparent protective layer 209. A current-collecting layer 205 is fixedly connected to the side surface of the buffer layer 204. A P-electrode body 206 is fixedly connected to the side surface of the current-collecting layer 205. A cable 210 is fixedly connected to the side surface of the sapphire substrate base 201. First clamps 211 and second clamps 212 are arranged on the side surface of the heat-dissipating aluminum frame 101. There are three first clamps 211 and two second clamps 212. The cable 210 is arranged inside the first clamps 211 and the second clamps 212. By using the high-quality LED chip 2, the purposes of power saving, durability, high brightness, soft and non-glare light, comfortable light, and restoring the true light color can be achieved. The size of the high-quality LED chip 2 can be made smaller, and the optics are easier to match. The improvement of the heat dissipation function has improved the lifespan of the chip. The improvement of the antistatic ability can lay a foundation for the development of subsequent packaging processes. The high-quality LED chip 2 also has the characteristics of energy conservation, high electro-optical conversion efficiency, long lifespan, and is safe and reliable to use.

[0029] In this embodiment, referring to Figure 1 and Figure 5As shown, the fastening assembly 3 includes four screw rods 301. Concealed mounting holes are provided inside the heat dissipation aluminum frame 101. A concealed threaded flat head 302 is fixedly connected to the side of the screw rod 301. There are four concealed threaded flat heads 302. A hidden insulating plug 303 is provided on the side of the concealed threaded flat head 302. There are four hidden insulating plugs 303. The concealed threaded flat head (302) and the screw rod (301) are more convenient for adsorption installation. The hidden insulating plug 303 is generally composed of a silica gel sleeve and an epoxy matrix. The exposed concealed threaded flat head 302 is sealed through the insulating structure formed by silica gel and epoxy resin.

[0030] In this solution, when the high-quality LED chip 2 of an ultra-thin dust-proof and clean lamp is in use, the entire wafer is encapsulated by epoxy resin. For the P-electrode wafer 203, holes dominate inside the high-quality LED chip 2. The other is the N-electrode wafer 202, where electrons mainly exist on this side. However, when these two wafers are connected, a P-N junction is formed between them. When current acts on this wafer through a wire, electrons will be pushed to the P region. In the P region, electrons recombine with holes and then emit energy in the form of photons. This is the principle of the LED lamp emitting light. And this clean lamp has no dark corners, an upgraded large surface screen, one lamp is bright enough, the area is increased, there is no dead angle of illumination, no auxiliary lighting is required, and it has a three-proof fully sealed design, preventing mosquitoes, fog, dust, and water. At the same time, it can not only meet the illuminance requirements specified for the lighting space but also meet the cleanliness standards of the clean room, while saving energy as much as possible and enabling safe and reliable control.

[0031] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An ultra-thin dustproof clean light, comprising a main body (1), characterized in that: A high-quality LED chip (2) is arranged on the side of the main body (1), and a fastening component (3) is arranged inside the main body (1); The main body (1) comprises a heat dissipation aluminum frame (101), the side of the heat dissipation aluminum frame (101) is fixedly connected to an optical mask (102), the side of the optical mask (102) is fixedly connected to a reflective paper (103), and the side of the reflective paper (103) is fixedly connected to a nano-diffusing light guide plate (104); The high-quality LED chip (2) comprises a sapphire substrate base (201), an N-electrode wafer (202) being fixedly connected to a side surface of the sapphire substrate base (201), a P-electrode wafer (203) being fixedly connected to a side surface of the N-electrode wafer (202), and a buffer layer (204) being fixedly connected to a side surface of the P-electrode wafer (203).

2. The ultra-thin dustproof clean lamp according to claim 1, characterized in that: A transparent protective layer (209) is fixedly connected to the side surface of the buffer layer (204), and an N electrode body (207) and ITO (208) are fixedly connected to the side surface of the transparent protective layer (209).

3. The ultra-thin dustproof clean lamp according to claim 1, characterized in that: A collector layer (205) is fixedly connected to the side surface of the buffer layer (204), and a P electrode body (206) is fixedly connected to the side surface of the collector layer (205).

4. The ultra-thin dustproof clean lamp according to claim 1, characterized in that: A cable (210) is fixedly connected to a side surface of the sapphire substrate base (201), and a first clamp (211) and a second clamp (212) are provided on a side surface of the heat dissipation aluminum frame (101).

5. The ultra-thin dustproof clean lamp according to claim 4, characterized in that: Three first clamps (211) are provided, two second clamps (212) are provided, and the cable (210) is arranged inside the first clamps (211) and the second clamps (212).

6. The ultra-thin dustproof clean lamp according to claim 1, characterized in that: The fastening assembly (3) comprises a screw rod (301), four of which are provided, and a concealed mounting hole is provided inside the heat dissipating aluminum frame (101).

7. The ultra-thin dustproof clean lamp according to claim 6, characterized in that: A concealed threaded flat head (302) is fixedly connected to the side surface of the screw rod (301), and four concealed threaded flat heads (302) are provided.

8. The ultra-thin dustproof clean lamp according to claim 7, characterized in that: A hidden insulating plug (303) is provided on the side of the concealed threaded flat head (302), and four of the hidden insulating plugs (303) are provided.

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