Matching structure of semiconductor product packaging frame and push-pull force test tool

Abstract

The utility model discloses a matching structure of a packaging semiconductor product frame and a push-pull force test tool, which comprises an operation table, the operation table is rotatably connected with a test platform through a rotating disc, and the test platform is provided with a flat groove for placing and moving a frame group. A pressing block is arranged above the middle section of the flat groove on the test platform; a convex edge is arranged on the inner wall of one side of the middle section of the flat groove, and a plurality of concave parts are formed in the convex edge at equal intervals; when the frame group is placed in the flat groove, the first frame plate is horizontally placed in the flat groove, the second frame plate is placed on the test platform on one side of the exterior of the flat groove, and the corner raising structure on the D-pole connecting plate is placed in the inner concave part, so that the overall limiting of the frame is realized. Stable fixation of the product in the testing process is ensured, testing errors caused by poor jigs are avoided, and the testing precision is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging and testing, in particular to a matching structure between a semiconductor product packaging frame and a push-pull force testing tooling. Background Art

[0002] After the semiconductor Wire Bond process is completed, performing tensile tests and thrust tests are key steps to evaluate the welding quality. However, when traditional test fixtures fix TO247 packaged products, inaccurate test results are often caused by design defects, which affect the quality judgment of products and the direction of process improvement.

[0003] Traditional test fixture tooling can only press the TO247 packaged product in the up and down direction, and it is unstable and prone to displacement during tests such as tensile tests, which easily causes bad test errors and needs to be improved. Summary of the Utility Model

[0004] The technical problem to be solved by the utility model is: in order to overcome the deficiencies in the prior art, a matching structure between a semiconductor product packaging frame and a push-pull force testing tooling is provided.

[0005] The technical solution adopted by the utility model to solve its technical problem is: a matching structure between a semiconductor product packaging frame and a push-pull force testing tooling, including an operating table, on which a test platform is rotationally connected through a rotating disk. A flat groove for placing and moving a frame group is arranged on the test platform, and a pressing block is arranged above the middle section of the flat groove on the test platform.

[0006] A convex edge is arranged on one inner wall of the middle section of the flat groove, and a plurality of concave parts are equidistantly arranged on the convex edge.

[0007] The two side edges of the opening of the concave part are in arc transition.

[0008] The frame group includes several individual frames connected end to end. Each frame includes a first frame plate welded with a chip and a second frame plate connected to the first frame plate. The second frame plate includes a D-pole connecting plate connected to the first frame plate, and a G-pole connecting plate and an S-pole connecting plate are respectively arranged on the left and right sides of the D-pole connecting plate. The connection part between the D-pole connecting plate and the first frame plate is a corner upward structure, so that the second frame plate is higher than the first frame plate when placed flat.

[0009] When the frame group is placed in the flat groove, the first frame plate is placed flat in the flat groove, the second frame plate is placed on the test platform on one side outside the flat groove, and the corner upward structure on the D-pole connecting plate is placed in the concave part to realize the overall limit of the frame.

[0010] Furthermore, at the end of the G - pole connecting plate and the S - pole connecting plate of the present utility model where they contact the convex edge, there is a connecting block for abutting against the corner surface of the convex edge.

[0011] By adopting the above - mentioned technical solution, when the frame is placed in the flat groove, not only can it be pressed tightly by the pressing mechanism above, but also through the limiting cooperation between the corner - rising structure and the concave part, and the mutual cooperation structure between the connecting block and the corner surface of the convex edge, the overall frame is more stable during the test.

[0012] Furthermore, a test window is provided on the pressing block of the present utility model, which is convenient for the test mechanism above to work.

[0013] Furthermore, the connecting block of the present utility model is set as an arc - shaped structure that caters to the corner surface.

[0014] By adopting the above - mentioned technical solution, it is convenient to cooperate with the corner surface of the convex edge, can abut against it when being pressed tightly, and does not affect the operator to move the frame body.

[0015] The beneficial effects of the present utility model are as follows: According to the structural characteristics of the semiconductor packaging frame itself, by optimizing the fixture design, a test platform is designed with a limiting structure and a sliding groove, ensuring the stable fixation of the product during the test, avoiding test errors caused by poor fixtures, improving the test accuracy, and ensuring the authenticity and reliability of the tensile test and thrust test results. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings described below are only some embodiments recorded in the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0017] Figure 1 is a structural schematic diagram of the present utility model;

[0018] Figure 2 is a structural schematic diagram showing the convex edge in the flat groove;

[0019] Figure 3 is a structural schematic diagram showing a single frame.

[0020] Reference numerals in the figures: 1. Operating table, 2. Rotating disk, 3. Test platform, 4. Frame group, 5. Flat groove, 6. Pressing block, 7. Convex edge, 8. Concave part, 9. First frame plate, 10. Second frame plate, 11. Corner - rising structure, 12. Connecting block, 13. Test window. Detailed implementation mode

[0021] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0022] As Figures 1 to 3 shown, a matching structure between a semiconductor product packaging frame and a push-pull force test tooling includes an operating table 1. A test platform 3 is rotatably connected to the operating table 1 through a rotating disk 2. A flat groove 5 for placing and moving a frame group 4 is provided on the test platform 3. A pressing block 6 is arranged above the middle section of the flat groove 5 on the test platform 3;

[0023] A convex edge 7 is arranged on one inner wall of the middle section of the flat groove 5. A plurality of concave parts 8 are equidistantly arranged on the convex edge 7; the two side edges of the opening of the concave part are in arc transition;

[0024] The frame group 4 includes a plurality of individual frames connected end to end. The frame includes a first frame plate 9 welded with a chip and a second frame plate 10 connected to the first frame plate 9. The second frame plate 10 includes a D-pole connecting plate connected to the first frame plate 9. A G-pole connecting plate and an S-pole connecting plate are respectively arranged on the left and right sides of the D-pole connecting plate; the connection part between the D-pole connecting plate and the first frame plate 9 is a corner upward structure 11, so that the second frame plate 10 is higher than the first frame plate 9 when placed flat;

[0025] When the frame group 4 is placed in the flat groove 5, the first frame plate 9 is placed flat in the flat groove 5, the second frame plate 10 is placed on the test platform 3 on one side outside the flat groove 5, and the corner upward structure 11 on the D-pole connecting plate is placed in the concave part 8 to realize the overall limit of the frame;

[0026] Wherein, connection blocks 12 for abutting against the corner surface of the convex edge are arranged at the ends of the G-pole connecting plate and the S-pole connecting plate in contact with the convex edge 7; a test window 13 is arranged on the pressing block 6.

[0027] The connection block 12 is arranged as an arc structure to fit the corner surface; it is convenient to cooperate with the corner surface of the convex edge, can abut when pressed, and does not affect the operator to move the frame body.

[0028] When the frame to be tested in the present utility model is placed in the flat groove, not only can it be pressed tightly from above by the pressing mechanism, but also through the limiting cooperation between the corner upward structure and the concave part, and the mutual cooperation structure between the connecting block and the corner surface of the convex edge, the overall frame is more stable during testing. When the frame body needs to be moved, just slightly loosen the pressing block, hold the frame group and slightly lift one side, so that the corner upward structure disengages from the concave part, and then the front-back movement can be realized, which is very convenient.

[0029] The above is only the preferred specific embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution and the inventive concept of the present utility model, makes equivalent substitutions or changes, and all should be covered within the protection scope of the present utility model.

Claims

1. A matching structure of a semiconductor product packaging frame and a push-pull force testing tool, characterized in that: The invention comprises an operating table (1), wherein the operating table (1) is rotatably connected to a test platform (3) via a rotating disk (2), the test platform (3) is provided with a flat groove (5) for placing and moving a frame group (4), and a pressing block (6) is provided on the test platform (3) above the middle section of the flat groove (5); A convex edge (7) is provided on the inner wall of one side of the middle section of the flat groove (5), and a plurality of concave portions (8) are provided on the convex edge (7) at equal intervals; The frame group (4) comprises a plurality of separate frames connected end to end, the frame comprising a first frame plate (9) with a chip welded thereon and a second frame plate (10) connected to the first frame plate (9), the second frame plate (10) comprising a D-pole connecting plate connected to the first frame plate (9), a G-pole connecting plate and an S-pole connecting plate being arranged on the left and right sides of the D-pole connecting plate respectively; the connection between the D-pole connecting plate and the first frame plate (9) is a corner upturned structure (11), so that the second frame plate (10) is higher than the first frame plate (9) when laid flat; When the frame group (4) is placed in the flat groove (5), the first frame plate (9) is placed flat in the flat groove (5), the second frame plate (10) is placed on the test platform (3) on the outer side of the flat groove (5), and the corner upward structure (11) on the D-pole connecting plate is placed in the inner recess (8) to achieve the overall positioning of the frame.

2. The matching structure of the packaged semiconductor product frame and the push-pull force testing tool as claimed in claim 1, characterized in that: The ends of the G-pole connecting plate and the S-pole connecting plate at the locations where they contact the convex edge (7) are provided with connecting blocks (12) for abutting against the corner surfaces of the convex edge (7).

3. The matching structure of the packaged semiconductor product frame and the push-pull force testing tool as claimed in claim 1, characterized in that: The pressing block (6) is provided with a test window (13).

4. The matching structure of the packaged semiconductor product frame and the push-pull force testing tool as claimed in claim 2, characterized in that: The connecting block (12) is configured to conform to the arc-shaped structure of the corner surface.

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