Chip test lower cover assembly and chip test device

Abstract

The utility model provides a chip test lower cover assembly and a chip test device, the lower cover assembly comprises a lower cover heat conduction fixing frame, a test plate and a backing plate which are stacked in sequence, the lower cover assembly also comprises a lower cover heater and a needle seat assembly used for placing a chip, the lower cover heat conduction fixing frame is provided with a first accommodating cavity and a second accommodating cavity which are arranged adjacently, the needle seat assembly is arranged in the first containing cavity, the lower cover heater is arranged in the second containing cavity, and the lower cover heater is arranged on the side face of the needle seat assembly. According to the chip test lower cover assembly and the chip test device provided by the utility model, the lower cover heat conduction fixing frame is arranged to transmit heat, so that the lower cover heater can be arranged on the side surface of the probe seat assembly, thereby reducing the thickness of the lower cover assembly, further reducing the length of the probe, reducing the cost of the probe, and prolonging the service life of the probe.

Description

Technical Field

[0001] The utility model belongs to the technical field of chip testing, and more specifically, relates to a chip testing lower cover assembly and a chip testing device. Background Art

[0002] When a CMOS Image Sensor (CIS chip for short) is being tested, the test module needs to be maintained at a predetermined temperature. Therefore, a heating module is usually provided in the test device to keep it at the test temperature. In the lower cover assembly of the test device, the heating element has a hollow middle, and a heating resistance wire is placed inside it. By placing the heating element under the chip to be tested, the chip is provided with the temperature to be measured. However, this heating device will increase the overall thickness of the chip testing device, resulting in an increase in the length of the probe used for chip testing, increasing costs and making the probe prone to damage. Summary of the Utility Model

[0003] The purpose of the embodiment of the utility model is to provide a chip testing lower cover assembly and a chip testing device, so as to solve the technical problems in the prior art that the chip testing device has a large thickness, resulting in a long probe, high cost, and easy damage.

[0004] To achieve the above purpose, the technical solution adopted by the utility model is: to provide a chip testing lower cover assembly, which includes a lower cover heat conduction fixing frame, a test board, and a backing plate that are sequentially stacked, and also includes a lower cover heater and a socket component for placing the chip. The lower cover heat conduction fixing frame has a first accommodation cavity and a second accommodation cavity that are adjacent to each other. The socket component is arranged in the first accommodation cavity, the lower cover heater is arranged in the second accommodation cavity, and the lower cover heater is arranged on the side of the socket component.

[0005] In the above solution, the chip testing lower cover assembly includes a lower cover heat conduction fixing frame, a test board, and a backing plate that are sequentially stacked. The socket component and the lower cover heater are both arranged on the lower cover heat conduction fixing frame. When the lower cover heater works, the heat generated by it is transmitted to the socket component and the chip thereon through the lower cover heat conduction fixing frame, so as to keep the chip at a predetermined temperature for chip testing. By setting the lower cover heat conduction fixing frame to transfer heat, the lower cover heater can be arranged on the side of the socket component, thereby reducing the thickness of the lower cover assembly, further reducing the length of the probe, reducing the cost of the probe, and extending the service life of the probe.

[0006] Optionally, the second accommodation cavity has a first installation opening for the disassembly and assembly of the lower cover heater. The lower cover heater is fixed to the second accommodation cavity through a first fixing block, and at least part of the first fixing block is located at the first installation opening and presses the lower cover heater.

[0007] In the above solution, the lower cover heater is fixed to the second accommodation cavity through the first fixing block, which can prevent the lower cover heater from slipping out of the second accommodation cavity and prevent scalding the operator. When it is necessary to remove or replace the lower cover heater, the first fixing block can be removed or slid, and then the lower cover heater can be taken out. In this way, the disassembly and assembly of the lower cover heater are convenient.

[0008] Optionally, the first fixing block is fixed to the lower cover heat conduction fixing frame through a first fastener. A first connection hole is provided on the lower cover heat conduction fixing frame, and a first waist-shaped hole is provided on the first fixing block. The first fastener passes through the first waist-shaped hole and is connected to the first connection hole.

[0009] In the above solution, by providing a waist-shaped hole on the first fixing block, after the first fastener is loosened, the first fixing block can be moved to not block the first installation opening, and it is not necessary to remove the first fastener and the first fixing block, which can prevent the loss of the first fastener and the first fixing block.

[0010] Optionally, the number of the needle seat assemblies is multiple, and they are arranged in sequence along the length direction of the lower cover heat conduction fixing frame. The needle seat assemblies and the lower cover heater are arranged in sequence along the width direction of the lower cover heat conduction fixing frame.

[0011] In the above solution, by arranging the needle seat assemblies and the lower cover heater in sequence along the width direction of the lower cover heat conduction fixing frame, the space on the side of the needle seat assembly in the width direction is fully utilized, and it is not necessary to arrange the heater at the bottom of the needle seat assembly.

[0012] The present utility model further provides a chip testing device, which includes the above-mentioned chip testing lower cover assembly, and further includes an upper cover assembly for cooperating with the lower cover assembly to press the chip.

[0013] In the above solution, the cover assembly includes a lower cover heat conduction fixing frame, a test board and a backing plate which are sequentially stacked. The needle seat assemblies and the lower cover heater are both arranged on the lower cover heat conduction fixing frame. When the lower cover heater works, the heat generated by it is transmitted to the needle seat assembly and the chip thereon through the lower cover heat conduction fixing frame, so that the chip can be maintained at a predetermined temperature for testing the chip. By providing the lower cover heat conduction fixing frame to transfer heat, the lower cover heater can be arranged on the side of the needle seat assembly, thereby reducing the thickness of the lower cover assembly, further reducing the length of the probe, reducing the cost of the probe, and extending the service life of the probe.

[0014] Optionally, the upper cover assembly includes an upper cover heat-conducting fixing frame, an upper cover heater, and a second fixing block connected to the upper cover heat-conducting fixing frame. The upper cover heat-conducting fixing frame has a third accommodating cavity for accommodating the upper cover heater. The third accommodating cavity has a second installation opening for the disassembly and assembly of the upper cover heater. The second fixing block is used to fix the upper cover heater in the third accommodating cavity.

[0015] In the above solution, when the upper cover heater is working, it generates heat, and the heat is transferred to the entire upper cover assembly through the upper cover heat-conducting fixing frame, so that the chip test is carried out at a predetermined temperature. Under the fixing action of the second fixing block, the upper cover heater will not slide down and scald the operator, and the disassembly and assembly of the upper cover heater can be realized by moving or removing the second fixing block, and the disassembly and assembly of the upper cover heater are convenient.

[0016] Optionally, at least a part of the upper cover heater is located outside the upper cover heat-conducting fixing frame. The number of the second fixing blocks is multiple, and the multiple second fixing blocks jointly clamp the exposed part of the upper cover heater.

[0017] In the above solution, by clamping and fixing the upper cover heater with multiple second fixing blocks, the installation of the upper cover heater can be made more stable.

[0018] Optionally, the second fixing block is fixed to the upper cover heat-conducting fixing frame through a second fastener. The upper cover heat-conducting fixing frame is provided with a second connection hole, and the second fixing block is provided with a second waist-shaped hole. The second fastener passes through the second waist-shaped hole and is connected to the second connection hole.

[0019] In the above solution, by providing a second waist-shaped hole in the second fixing block, after the second fastener is loosened, the second fixing block can move away from the upper cover heater, and it is not necessary to remove the second fastener and the second fixing block, which can prevent the loss of the second fastener and the second fixing block.

[0020] Optionally, the cross-section of the upper cover heater is circular, and the side of the second fixing block close to the upper cover heater is arc-shaped. The arc-shaped side of the second fixing block abuts against the outer peripheral surface of the upper cover heater.

[0021] In the above solution, the upper cover heater is rod-shaped and inserted into the inside of the upper cover heat-conducting fixing frame, and its exposed part is also rod-shaped. The arc-shaped side of the second fixing block abuts against the outer peripheral surface of the upper cover heater, so that the abutting contact between the second fixing block and the upper cover heater can be surface contact, and the clamping of the upper cover heater is more stable.

[0022] Optionally, the upper cover assembly further includes a lens fixing frame, a lens body, and a first heat insulation plate. The lens fixing frame, the first heat insulation plate, and the upper cover heat conduction fixing frame are sequentially stacked. The lens body is installed in the lens fixing frame. A terminal fixing bracket is fixed on the outside of the lens fixing frame. The upper cover heater is electrically connected to the heating terminal row through a cable, and the heating terminal row is fixed on the terminal fixing bracket.

[0023] In the above solution, through the arrangement of the first heat insulation plate, the heat transfer to the lens fixing frame and the lens body can be reduced, so as not to affect the normal operation of the lens body. Description of the Drawings

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0025] Figure 1 It is a three-dimensional structure diagram of the chip test lower cover assembly provided by the embodiment of the present invention;

[0026] Figure 2 It is an exploded structure diagram of the chip test lower cover assembly provided by the embodiment of the present invention;

[0027] Figure 3 It is a three-dimensional structure diagram of the lower cover heat conduction fixing frame provided by the embodiment of the present invention;

[0028] Figure 4 It is a three-dimensional structure diagram of the chip test device provided by the embodiment of the present invention;

[0029] Figure 5 It is a three-dimensional structure diagram of the upper cover assembly provided by the embodiment of the present invention;

[0030] Figure 6 It is an exploded structure diagram of the upper cover assembly provided by the embodiment of the present invention;

[0031] Figure 7 It is a three-dimensional structure diagram of the upper cover heat conduction fixing frame provided by the embodiment of the present invention;

[0032] Figure 8 It is a cross-sectional view of the upper cover assembly provided by the embodiment of the present invention.

[0033] Among them, the reference numerals in the drawings are as follows:

[0034] 10 - Lower cover assembly; 11 - Lower cover heat - conducting fixing frame; 111 - First accommodation cavity; 112 - Second accommodation cavity; 113 - First connection hole; 12 - Test board; 13 - Pad; 14 - Pin base assembly; 15 - Lower cover heater; 16 - First fixing block; 161 - First waist - shaped hole; 17 - First positioning pin; 18 - Positioning block; 181 - Positioning hole;

[0035] 20 - Upper cover assembly; 21 - Upper cover heat - conducting fixing frame; 211 - Third accommodation cavity; 212 - Second connection hole; 22 - First heat - insulating board; 23 - Lens fixing frame; 24 - Second heat - insulating board; 25 - Upper cover heater; 26 - Second fixing block; 261 - Second waist - shaped hole; 27 - Second fastener; 281 - Heating terminal row; 282 - Terminal fixing bracket; 283 - Upper cover temperature sensor; 291 - Lens body; 292 - Filter; 293 - Second positioning pin; 294 - Third positioning pin; 30 - Light source assembly. Detailed implementation mode

[0036] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present utility model clearer and more understandable, the present utility model will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0037] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0038] It should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation to the present utility model.

[0039] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, "a plurality of" means two or more unless otherwise specifically defined.

[0040] When the CIS chip is being tested, the test module needs to be maintained at a predetermined temperature. Therefore, a heating module is usually provided in its test device to enable it to maintain the test temperature. In the lower cover assembly of the test device, the heating element has a hollow middle, and a heating resistance wire is placed inside it. By placing the heating element under the chip to be tested, the chip is provided with the temperature to be measured. However, this heating device will increase the overall thickness of the chip test device, resulting in an increase in the length of the probe used for chip testing, increasing the cost and making the probe prone to damage.

[0041] Now, the chip test lower cover assembly 10 provided by the embodiments of the present invention will be described.

[0042] Please refer to Figures 1 to 3 , the chip test lower cover assembly 10 includes a lower cover heat conduction fixing frame 11, a test board 12, and a backing plate 13 that are sequentially stacked, and also includes a lower cover heater 15 and a socket assembly 14.

[0043] The lower cover heat conduction fixing frame 11 is the main support and installation structure of the lower cover assembly 10. The lower cover heat conduction fixing frame 11 has good heat conduction performance and is made of heat-conducting material. The lower cover heat conduction fixing frame 11 has a first accommodation cavity 111 and a second accommodation cavity 112 that are adjacent to each other, and are respectively used to accommodate the socket assembly 14 and the lower cover heat conduction fixing frame 11. Among them, the first accommodation cavity 111 can be an accommodation cavity with one side open, or an accommodation cavity with two sides open, or an accommodation cavity with three sides open. As long as it can form a structure for installing the socket assembly 14, it can be called the first accommodation cavity 111. The second accommodation cavity 112 can be an accommodation cavity with one side open, or an accommodation cavity with two sides open, or an accommodation cavity with three sides open. As long as it can form a structure for installing the lower cover heater 15, it can be called the second accommodation cavity 112.

[0044] The socket assembly 14 is arranged in the first accommodation cavity 111. Probes for contacting the chip are arranged on the socket assembly 14. When the chip is placed on the socket assembly 14, the chip is in contact and conduction with the probes, and the probes are in mutual conduction with the test board 12, so that the chip is in conduction with the test board 12, and then the chip can be tested.

[0045] The lower cover heater 15 is disposed within the second accommodation cavity 112. The lower cover heater 15 is a heating component that can generate heat and raise the temperature. Specifically, when the lower cover heater 15 operates, its temperature rises, and the heat generated is transferred to the pin base assembly 14 and the chip through the lower cover heat-conducting fixing frame 11, keeping the chip at a predetermined temperature. The stacking direction of the lower cover heat-conducting fixing frame 11, the test board 12, and the backing plate 13 is the thickness direction of the test board 12, and any direction perpendicular to the thickness direction of the test board 12 can be referred to as the horizontal direction. The lower cover heater 15 is disposed on the side of the pin base assembly 14. It can be understood that the lower cover heater 15 and the pin base assembly 14 are adjacently disposed in the horizontal direction. Therefore, the thickness of the lower cover assembly 10 is relatively small.

[0046] The test board 12 has a test circuit, and the probe is electrically connected to the test circuit. When the chip is placed on the pin base assembly 14 and contacts the probe, the chip can be tested.

[0047] The backing plate 13 is disposed on the side of the test board 12 facing away from the lower cover heat-conducting fixing frame 11. The backing plate 13 is used to protect the test board 12, enabling the lower cover assembly 10 to be conveniently mounted to other structures.

[0048] The chip test lower cover assembly 10 in the above embodiment includes the lower cover heat-conducting fixing frame 11, the test board 12, and the backing plate 13 that are stacked in sequence. The pin base assembly 14 and the lower cover heater 15 are both disposed on the lower cover heat-conducting fixing frame 11. When the lower cover heater 15 operates, the heat generated by it is transferred to the pin base assembly 14 and the chip thereon through the lower cover heat-conducting fixing frame 11, so that the chip is maintained at a predetermined temperature for chip testing. By providing the lower cover heat-conducting fixing frame 11 to transfer heat, the lower cover heater 15 can be disposed on the side of the pin base assembly 14, thereby reducing the thickness of the lower cover assembly 10, further reducing the length of the probe, lowering the cost of the probe, and extending the service life of the probe.

[0049] In some embodiments of the present invention, the lower cover heat-conducting fixing frame 11 can be made of materials with better heat-conducting properties such as metal materials and graphite materials.

[0050] In some embodiments of the present invention, the cross-section of the lower cover heater 15 is square. Correspondingly, the cross-section of the second accommodation cavity 112 is also square. The cross-sectional shapes of the lower cover heater 15 and the second accommodation cavity 112 are adapted to each other. The lower cover heater 15 can also be of other shapes.

[0051] In some embodiments of the present invention, the lower cover heater 15 can be a heating wire or the like.

[0052] In some embodiments of the present utility model, the lower cover heater 15 is connected and conducted to the temperature controller through a cable. A lower cover temperature sensor may also be provided inside the lower cover assembly 10, and the lower cover temperature sensor is also connected and conducted to the temperature controller. When the lower cover temperature sensor detects that the temperature is too high or too low, it transmits the detection signal to the temperature controller, and the temperature controller controls the start / stop or working time of the lower cover heater 15 according to the detection signal.

[0053] In some embodiments of the present utility model, please refer to Figure 2 and Figure 3 , the second accommodation cavity 112 has a first installation opening for the disassembly and assembly of the lower cover heater 15. The lower cover heater 15 is fixed to the second accommodation cavity 112 through a first fixing block 16. At least part of the first fixing block 16 is located at the first installation opening and presses the lower cover heater 15. One side of the second accommodation cavity 112 has a first installation opening, and the lower cover heater 15 can be inserted into and withdrawn from the first installation opening. Part of the first fixing block 16 faces the first installation opening, so the lower cover heater 15 can be blocked to prevent it from sliding out of the second accommodation cavity 112. When it is necessary to take out the lower cover heater 15, the first fixing block 16 is removed, or the first fixing block 16 is slid so that the first fixing block 16 is not facing the first installation opening, and then the lower cover heater 15 is withdrawn. The disassembly, assembly and replacement of the lower cover heater 15 are very convenient.

[0054] The lower cover heater 15 is fixed to the second accommodation cavity 112 through the first fixing block 16, which can prevent the lower cover heater 15 from sliding out of the second accommodation cavity 112 and prevent scalding the operator. When it is necessary to take out or replace the lower cover heater 15, the first fixing block 16 can be removed or slid, and then the lower cover heater 15 can be taken out. In this way, the disassembly and assembly of the lower cover heater 15 are convenient.

[0055] In some embodiments of the present utility model, please refer to Figures 1 to 3 , the first fixing block 16 is fixed to the lower cover heat-conducting fixing frame 11 through a first fastener. A first connection hole 113 is provided on the lower cover heat-conducting fixing frame 11, and a first waist-shaped hole 161 is provided on the first fixing block 16. The first fastener passes through the first waist-shaped hole 161 and is connected to the first connection hole 113. The first fixing block 16 is fixed to the lower cover heat-conducting fixing frame 11 and is located near the first installation opening. When the lower cover heater 15 is fixedly arranged, the first fastener locks the first fixing block 16, and the first fixing block 16 blocks the lower cover heater 15. At least part of the first fixing block 16 blocks at the first installation opening. When the lower cover heater 15 needs to be disassembled, the first fastener is loosened, and the first fixing block 16 can change the placement angle or placement position of the first fixing block 16 by rotating or moving, so that the first fixing block 16 is not facing the first installation opening, and then the lower cover heater 15 can be freely pulled out.

[0056] By providing a kidney-shaped hole in the first fixing block 16, after the first fastener is loosened, the first fixing block 16 can be moved to a position where it does not block the first mounting opening, eliminating the need to remove the first fastener and the first fixing block 16, thus preventing the loss of the first fastener and the first fixing block 16.

[0057] In other embodiments, a round hole is provided in the first fixing block 16, and the first fastener passes through the round hole and is connected to the first connection hole 113.

[0058] In some embodiments of the present utility model, please refer to Figure 1 and Figure 2 , the number of the needle seat assemblies 14 is multiple, enabling the lower cover assembly 10 to detect multiple chips at one time. Correspondingly, the number of the lower cover heaters 15 is the same as that of the needle seat assemblies 14, and the needle seat assemblies 14 and the lower cover heaters 15 are arranged in one-to-one correspondence, so that each lower cover heater 15 can heat the corresponding needle seat assembly 14.

[0059] In some embodiments of the present utility model, please refer to Figure 1 and Figure 2 , the number of the needle seat assemblies 14 is multiple and they are arranged in sequence along the length direction of the lower cover heat-conducting fixing frame 11. The needle seat assemblies 14 and the lower cover heaters 15 are arranged in sequence along the width direction of the lower cover heat-conducting fixing frame 11. The number of the needle seat assemblies 14 can be designed according to the length of the lower cover heat-conducting fixing frame 11, making full use of the space of the lower cover heat-conducting fixing frame 11 to test multiple chips at one time. The lower cover heaters 15 are arranged at the edges in the width direction of the lower cover heat-conducting fixing frame 11, making full use of the space on the side of the needle seat assemblies 14.

[0060] By arranging the needle seat assemblies 14 and the lower cover heaters 15 in sequence along the width direction of the lower cover heat-conducting fixing frame 11, the space on the side in the width direction of the needle seat assemblies 14 is fully utilized, eliminating the need to arrange the heaters at the bottom of the needle seat assemblies 14.

[0061] In some embodiments, the needle seat assemblies 14 and the lower cover heaters 15 are arranged in one-to-one correspondence, and the number of the needle seat assemblies 14 is the same as that of the lower cover heaters 15.

[0062] In some embodiments, the number of the needle seat assemblies 14 is greater than that of the lower cover heaters 15, and at least one lower cover heater 15 covers the corresponding ranges of multiple needle seat assemblies 14.

[0063] In some embodiments, the number of the needle seat assemblies 14 is less than that of the lower cover heaters 15, and at least two lower cover heaters 15 heat one needle seat assembly 14.

[0064] In some embodiments of the present utility model, please refer to Figure 2, the lower cover assembly 10 further includes a first positioning pin 17. The first positioning pin 17 sequentially passes through the lower cover heat-conducting fixing frame 11, the test board 12, and the backing plate 13, so as to realize the mutual positioning of the three. Among them, the number of the first positioning pins 17 can be multiple, and they are respectively arranged at different positions of the backing plate 13.

[0065] In some embodiments of the present invention, please refer to Figure 1 and Figure 2 , the lower cover assembly 10 further includes a lower cover positioning block 18. The lower cover positioning block 18 is fixed to the side of the lower cover heat-conducting fixing frame 11 facing away from the test board 12. The lower cover positioning block 18 is used to cooperate with the upper cover assembly 20 to realize the mutual positioning of the upper cover assembly 20 and the lower cover assembly 10.

[0066] Optionally, a positioning hole 181 is formed in the lower cover positioning block 18, and the upper cover assembly 20 correspondingly has a third positioning pin 294. The mutual positioning of the upper cover assembly 20 and the lower cover assembly 10 is realized through the cooperation of the positioning hole 181 and the third positioning pin 294.

[0067] Please refer to Figure 4 , the present invention further provides a chip testing device. The chip testing device includes the chip testing device in any of the above embodiments. The chip testing device further includes an upper cover assembly 20. The upper cover assembly 20 is used to cooperate with the lower cover assembly 10 to press the chip tightly, so that the chip is in stable contact with the probes on the lower cover assembly 10, and the detection of the chip is realized.

[0068] The chip testing device provided by the present invention adopts the above-mentioned chip testing lower cover assembly 10. The lower cover assembly 10 includes a lower cover heat-conducting fixing frame 11, a test board 12, and a backing plate 13 which are sequentially stacked. The pin base assembly 14 and the lower cover heater 15 are both arranged on the lower cover heat-conducting fixing frame 11. When the lower cover heater 15 works, the heat generated by it is transmitted to the pin base assembly 14 and the chip thereon through the lower cover heat-conducting fixing frame 11, so as to keep the chip at a predetermined temperature for testing the chip. By arranging the lower cover heat-conducting fixing frame 11 to transfer heat, the lower cover heater 15 can be arranged on the side of the pin base assembly 14, thereby reducing the thickness of the lower cover assembly 10, further reducing the length of the probe, reducing the cost of the probe, and prolonging the service life of the probe.

[0069] In some embodiments of the present invention, please refer to Figure 5 and Figure 6, the upper cover assembly 20 includes an upper cover heat-conducting fixing frame 21, an upper cover heater 25, and a second fixing block 26 connected to the upper cover heat-conducting fixing frame 21. The upper cover heat-conducting fixing frame 21 has a third accommodating cavity 211 for accommodating the upper cover heater 25. The third accommodating cavity 211 has a second installation opening for the disassembly and assembly of the upper cover heater 25. The second fixing block 26 is used to fix the upper cover heater 25 in the third accommodating cavity 211. Under the limiting action of the second fixing block 26, the upper cover heater 25 is fixed in the third accommodating cavity 211, and the upper cover heater 25 will not slip off the upper cover heat-conducting fixing frame 21, preventing it from scalding the operator. When it is necessary to replace or remove the upper cover heater 25, move the second fixing block 26 to release the restriction on the upper cover heater 25, so that the upper cover heater 25 can be withdrawn from the second installation opening.

[0070] When the upper cover heater 25 is working, it generates heat, and the heat is transferred to the entire upper cover assembly 20 through the upper cover heat-conducting fixing frame 21, enabling the chip test to be carried out at a predetermined temperature. Under the fixing action of the second fixing block 26, the upper cover heater 25 will not slip and scald the operator, and the disassembly and assembly of the upper cover heater 25 can be realized by moving or removing the second fixing block 26, and the disassembly and assembly of the upper cover heater 25 are convenient.

[0071] In some embodiments, at least a part of the second fixing block 26 blocks the second installation opening, and the second fixing block 26 can be pressed and fixed in the third accommodating cavity 211.

[0072] In some embodiments, the upper cover heat-conducting fixing frame 21 can be made of materials with better heat-conducting performance such as metal materials and graphite materials.

[0073] In some embodiments, the upper cover heater 25 can be a heating wire or the like.

[0074] In some embodiments, please refer to Figures 5 to 7 , at least a part of the upper cover heater 25 is located outside the upper cover heat-conducting fixing frame 21. The number of the second fixing blocks 26 is multiple, and the multiple second fixing blocks 26 jointly clamp the exposed part of the upper cover heater 25. A part of the upper cover heater 25 is located in the third accommodating cavity 211, and a part is exposed. The exposed part is clamped and fixed by the multiple second fixing blocks 26. When it is necessary to disassemble the upper cover heater 25, first move the second fixing block 26 away from the upper cover heater 25 to release the restriction on the upper cover heater 25, so that the upper cover heater 25 can be disassembled. The multiple second fixing blocks 26 are arranged around the upper cover heater 25, and each second fixing block 26 abuts against the upper cover heater 25 to realize the clamping of the upper cover heater 25.

[0075] By clamping and fixing the upper cover heater 25 with multiple second fixing blocks 26, the installation of the upper cover heater 25 can be made more stable.

[0076] In some embodiments, the number of the second fixing blocks 26 is two, and the two second fixing blocks 26 are respectively arranged on opposite sides of the upper cover heater 25. The number of the second fixing blocks 26 can also be three, four, etc.

[0077] In some embodiments of the present utility model, please refer to Figures 5 to 7 , the second fixing block 26 is fixed to the upper cover heat conduction fixing frame 21 through a second fastener 27. The upper cover heat conduction fixing frame 21 is provided with a second connection hole 212, and the second fixing block 26 is provided with a second waist-shaped hole 261. The second fastener 27 passes through the second waist-shaped hole 261 and is connected to the second connection hole 212. When the upper cover heater 25 is in a fixed state, the second fastener 27 is tightly connected to the upper cover heat conduction fixing frame 21, and the second fixing block 26 abuts against the upper cover heater 25. When the upper cover heater 25 needs to be disassembled and assembled, the second fastener 27 is loosened, and the second fixing block 26 is moved along the length direction of the second waist-shaped hole 261, so that the second fixing block 26 is far away from the upper cover heater 25, and the upper cover heater 25 can be drawn out from the third accommodating cavity 211.

[0078] By providing the second waist-shaped hole 261 on the second fixing block 26, after the second fastener 27 is loosened, the second fixing block 26 can be moved away from the upper cover heater 25, and it is not necessary to remove the second fastener 27 and the second fixing block 26, which can prevent the loss of the second fastener 27 and the second fixing block 26.

[0079] In some embodiments of the present utility model, please refer to Figures 5 to 7 , the cross section of the upper cover heater 25 is circular, and the side of the second fixing block 26 close to the upper cover heater 25 is arc-shaped. The arc-shaped side of the second fixing block 26 abuts against the outer peripheral surface of the upper cover heater 25. The upper cover heater 25 is rod-shaped and is inserted into the inside of the upper cover heat conduction fixing frame 21, and its exposed part is also rod-shaped. The arc-shaped side of the second fixing block 26 abuts against the outer peripheral surface of the upper cover heater 25, so that the abutting contact between the second fixing block 26 and the upper cover heater 25 is surface contact, and the clamping of the upper cover heater 25 is more stable.

[0080] In some embodiments, the arc-shaped side of the second fixing block 26 is adapted to the upper cover heater 25, and their diameters are close to or the same as each other.

[0081] In some embodiments of the present utility model, please refer to Figures 5 to 8, the upper cover assembly 20 further includes a lens fixing frame 23, a lens body 291, and a first heat insulation plate 22. The lens fixing frame 23, the first heat insulation plate 22, and the upper cover heat conduction fixing frame 21 are stacked in sequence. The lens body 291 is installed in the lens fixing frame 23. A terminal fixing bracket 282 is fixed to the outside of the lens fixing frame 23. The upper cover heater 25 is electrically connected to the heating terminal row 281 through a cable, and the heating terminal row 281 is fixed to the terminal fixing bracket 282. The first heat insulation plate 22 is disposed between the lens fixing frame 23 and the upper cover heat conduction fixing frame 21, which can reduce the heat transfer from the upper cover heat conduction fixing frame 21 to the lens fixing frame 23 and prevent the lens body 291 from overheating. After the heating terminal row 281 is plugged into the connector to be energized, the upper cover heater 25 correspondingly operates to generate heat. When replacing the upper cover heater 25, the heating terminal row 281 can be disassembled and assembled according to requirements.

[0082] Through the arrangement of the first heat insulation plate 22, the heat transfer to the lens fixing frame 23 and the lens body 291 can be reduced, so as not to affect the normal operation of the lens body 291.

[0083] Among them, the function of the lens body 291 is to assist the camera in focusing and realize the observation and photographing of the chip.

[0084] In some embodiments, the lens body 291 has an external thread, and a threaded hole is formed in the lens fixing frame 23. The lens body 291 is fixed in the lens fixing frame 23 by threaded connection.

[0085] In some embodiments, please refer to Figure 6 and Figure 8 , the upper cover assembly 20 further includes a filter 292, and the filter 292 is disposed on the side of the lens body 291 close to the lower surface of the upper cover assembly 20.

[0086] In some embodiments, please refer to Figure 5 and Figure 6 , the upper cover assembly 20 further includes an upper cover temperature sensor 283, and the upper cover temperature sensor 283 is used to detect the temperature of the upper cover assembly 20. The upper cover temperature sensor 283 is electrically connected to the heating terminal row 281 through a cable. The upper cover temperature sensor 283 can be in interference fit in the upper cover heat conduction fixing frame 21. When the upper cover temperature sensor 283 detects that the temperature is too high or too low, it transmits the detection signal to the control center, and the control center controls the start and stop or working time of the lower cover heater 15 according to the detection signal.

[0087] In some embodiments, please refer to Figure 4 , the chip testing device further includes a light source assembly 30, and the light source assembly 30 at least includes a light source body, and the light source body can emit light to provide sufficient light for the photographing of the chip.

[0088] In some embodiments, please refer toFigure 5 and Figure 6 The upper cover assembly 20 further includes a second heat insulation plate 24. The second heat insulation plate 24 is disposed on a side of the upper cover heat conduction fixing frame 21 away from the first heat insulation plate 22. That is to say, the second heat insulation plate 24 is disposed on the top side of the upper cover assembly 20. In this way, the heat transfer from the upper cover assembly 20 to the light source assembly 30 can be reduced.

[0089] In some embodiments, please refer to Figure 6 , the upper cover assembly 20 further includes a second positioning pin 293. The second positioning pin 293 sequentially passes through the lens fixing frame 23, the first heat insulation plate 22, and the upper cover heat conduction fixing frame 21, so as to achieve the mutual positioning of the three. Among them, the number of the second positioning pins 293 can be multiple, and they are respectively disposed at different positions of the upper cover heat conduction fixing frame 21.

[0090] In some embodiments, please refer to Figure 6 , the upper cover heat conduction fixing frame 21 is provided with a third positioning pin 294, and a positioning hole 181 is formed in the lower cover positioning block 18. The mutual positioning of the upper cover assembly 20 and the lower cover assembly 10 is achieved through the cooperation of the positioning hole 181 and the third positioning pin 294.

[0091] The above are only the preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A chip test lower cover assembly, characterized in that: It includes a lower cover heat-conducting fixing frame, a test plate and a pad which are stacked in sequence, and also includes a lower cover heater and a needle seat assembly for placing a chip. The lower cover heat-conducting fixing frame has a first accommodating cavity and a second accommodating cavity which are adjacently arranged. The needle seat assembly is arranged in the first accommodating cavity, the lower cover heater is arranged in the second accommodating cavity, and the lower cover heater is arranged on the side of the needle seat assembly.

2. The chip testing lower cover assembly according to claim 1, characterized in that: The second accommodating cavity has a first installation opening for the lower cover heater to be disassembled and assembled. The lower cover heater is fixed to the second accommodating cavity by a first fixing block. At least a portion of the first fixing block is located at the first installation opening and presses the lower cover heater.

3. The chip testing lower cover assembly according to claim 2, characterized in that: The first fixing block is fixed to the lower cover heat-conducting fixing frame by a first fastener. The lower cover heat-conducting fixing frame is provided with a first connecting hole. The first fixing block is provided with a first waist-shaped hole. The first fastener passes through the first waist-shaped hole and is connected to the first connecting hole.

4. The chip test lower cover assembly according to any one of claims 1 to 3, characterized in that: There are multiple needle seat assemblies, which are sequentially arranged along the length direction of the lower cover heat conduction fixing frame, and the needle seat assemblies and the lower cover heater are sequentially arranged along the width direction of the lower cover heat conduction fixing frame.

5. A chip testing device, characterized in that: The chip testing lower cover assembly comprises the chip testing lower cover assembly as claimed in any one of claims 1 to 4, and further comprises an upper cover assembly for cooperating with the lower cover assembly to press the chip.

6. The chip testing device according to claim 5, characterized in that: The upper cover assembly includes an upper cover heat-conductive fixing frame, an upper cover heater, and a second fixing block connected to the upper cover heat-conductive fixing frame, the upper cover heat-conductive fixing frame has a third accommodating cavity for accommodating the upper cover heater, the third accommodating cavity has a second installation opening for disassembly and assembly of the upper cover heater, and the second fixing block is used to fix the upper cover heater in the third accommodating cavity.

7. The chip testing device according to claim 6, wherein: The upper cover heater is at least partially located outside the upper cover heat-conducting fixing frame, and there are multiple second fixing blocks, which together clamp the exposed portion of the upper cover heater.

8. The chip testing device according to claim 7, characterized in that: The second fixing block is fixed to the upper cover heat-conducting fixing frame by a second fastener. The upper cover heat-conducting fixing frame is provided with a second connecting hole. The second fixing block is provided with a second waist-shaped hole. The second fastener passes through the second waist-shaped hole and is connected to the second connecting hole.

9. The chip testing device according to claim 7, wherein: The cross section of the upper cover heater is circular, the side of the second fixing block close to the upper cover heater is arc-shaped, and the arc-shaped side of the second fixing block abuts against the outer peripheral surface of the upper cover heater.

10. The chip testing device according to claim 6, wherein: The upper cover assembly also includes a lens fixing frame, a lens body and a first heat insulation plate. The lens fixing frame, the first heat insulation plate and the upper cover heat-conducting fixing frame are stacked in sequence. The lens body is installed on the lens fixing frame. A terminal fixing frame is fixed to the outside of the lens fixing frame. The upper cover heater is connected to the heating terminal row through a cable, and the heating terminal row is fixed to the terminal fixing frame.

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