Silicon wafer cleaning device

Abstract

The utility model relates to a silicon wafer cleaning device which comprises a cleaning tank, a spraying pipe, a nozzle and an adjusting mechanism, and the spraying pipe is rotatably arranged on the cleaning tank; the nozzle is arranged on the spraying pipe in the cleaning tank; the adjusting mechanism comprises a telescopic assembly, a first-stage connecting rod connected with the telescopic assembly and a second-stage connecting rod connected with the first-stage connecting rod, and the end, away from the first-stage connecting rod, of the second-stage connecting rod is connected with the spraying pipe. And the secondary connecting rod is vertical to the axis of the spraying pipe. The direction of the nozzle can be flexibly adjusted through the adjusting mechanism. When the size of a silicon wafer needing to be cleaned is changed and a proper washing angle is changed, the orientation of the nozzle can be conveniently and flexibly adjusted through the adjusting mechanism to adapt to the size change of the silicon wafer, and the cleaning quality and the cleaning efficiency are guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer cleaning, in particular to a silicon wafer cleaning device. Background Art

[0002] Silicon wafers are important materials for fabricating integrated circuits. By means of photolithography, ion implantation, etc. on silicon wafers, various semiconductor devices can be fabricated. After slicing silicon rods by wire cutting to make silicon wafers, it is necessary to clean the silicon wafers to remove chips, photoresist, etchant, etc. attached and remaining on the surface of the silicon wafers.

[0003] The silicon wafers just cut from the silicon rods will be stacked and adsorbed together, and the number of thin-sized silicon wafers is very large. The total surface area to be cleaned is very large, and it is necessary to wash with water flow at multiple angles along the gaps between the silicon wafers. However, after the size of the silicon wafers changes, the corresponding optimal washing angle will also change, and conventional cleaning equipment is difficult to adapt to the change of the angle. Summary of the Utility Model

[0004] Aiming at the above-mentioned disadvantages of the prior art, the purpose of the utility model is to provide a silicon wafer cleaning device to adapt to the washing work of silicon wafers of different sizes.

[0005] The technical solution of the utility model is as follows:

[0006] A silicon wafer cleaning device includes a cleaning tank, a spray pipe, nozzles and an adjusting mechanism. The spray pipe is rotatably arranged on the cleaning tank; the nozzles are arranged on the spray pipe in the cleaning tank; the adjusting mechanism includes a telescopic component, a first-level connecting rod connected to the telescopic component and a second-level connecting rod connected to the first-level connecting rod. One end of the second-level connecting rod far from the first-level connecting rod is connected to the spray pipe, and the second-level connecting rod is perpendicular to the axis of the spray pipe.

[0007] The beneficial technical effects of the utility model are as follows:

[0008] (1) In the silicon wafer cleaning device of the utility model, the spray pipe is connected with an adjusting mechanism, the nozzles are arranged on the spray pipe, and the adjusting mechanism drives the first-level connecting rod and the second-level connecting rod to move through the telescopic component, driving the spray pipe to rotate so as to change the orientation of the nozzles. When the size of the silicon wafers to be cleaned changes, resulting in a change in the appropriate washing angle, the orientation of the nozzles can be conveniently and flexibly adjusted through the adjusting mechanism to adapt to the change in the size of the silicon wafers, ensuring the cleaning quality and cleaning efficiency.

[0009] (2) Further, a retaining net is arranged at the bottom of the cleaning tank. While supporting the silicon wafers, the retaining net allows the cleaning medium and the impurities washed down to pass through, preventing them from accumulating at the bottom of the cleaning tank.

[0010] (3) Further, an inclined surface is arranged at the bottom of the cleaning tank, which is convenient for the cleaning medium and the impurities washed down to move and be discharged along the retaining net. Description of the Drawings

[0011] Figure 1 Shows a front view structural schematic diagram of the silicon wafer cleaning device of the present utility model.

[0012] Figure 2 Shows an internal structural schematic diagram of the silicon wafer cleaning device of the present utility model.

[0013] Reference signs in the drawings:

[0014] 1. Cleaning tank; 11. Inclined surface; 2. Spray pipe; 3. Nozzle; 4. Adjusting mechanism; 41. Telescopic assembly; 42. Telescopic rod; 43. Universal joint; 44. First-level connecting rod; 45. Second-level connecting rod; 46. Fixed seat; 47. Pipe sleeve; 5. Support rod; 6. Mesh. Detailed implementation manners

[0015] In order to make the objectives, features and advantages of the present utility model more obvious and understandable, please refer to the attached drawings. It should be noted that the structures, proportions, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those skilled in this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present utility model. Therefore, they do not have substantial technical significance. Any modification of the structure, change in the proportional relationship or adjustment of the size, without affecting the effects that the present utility model can produce and the objectives that can be achieved, should still fall within the scope covered by the technical content disclosed by the present utility model.

[0016] In the description of the present utility model, the defined terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation to the present utility model.

[0017] Figure 1 Shows a front view structural schematic diagram of the silicon wafer cleaning device of the present utility model. Figure 2 Shows an internal structural schematic diagram of the silicon wafer cleaning device of the present utility model. Please refer to Figure 1 and Figure 2, A silicon wafer cleaning device, including a cleaning tank 1, a spray pipe 2, a nozzle 3 and an adjusting mechanism 4. The spray pipe 2 is rotatably arranged on the cleaning tank 1, and a movable gasket (not shown in the figure) is arranged between the spray pipe 2 and the cleaning tank 1. The nozzle 3 is arranged on the spray pipe 2 in the cleaning tank 1. The adjusting mechanism 4 includes a telescopic component 41, a first-level connecting rod 44 connected to the telescopic component 41, and a second-level connecting rod 45 connected to the first-level connecting rod 44. One end of the second-level connecting rod 45 far from the first-level connecting rod 44 is connected to the spray pipe 2, and the second-level connecting rod 45 is perpendicular to the axis of the spray pipe 2. When the telescopic component 41 pushes or pulls back the first-level connecting rod 44 through the telescopic rod 42, the first-level connecting rod 44 drives the second-level connecting rod 45 to rotate around the spray pipe 2. When the size of the silicon wafer to be cleaned changes, resulting in a change in the appropriate flushing angle, through the adjusting mechanism 4, the orientation of the nozzle 3 can be conveniently and flexibly adjusted to adapt to the change in the size of the silicon wafer, ensuring the cleaning quality and cleaning efficiency.

[0018] The specific structures of the spray pipe 2 and the cleaning tank 1 are described as follows:

[0019] Please refer to Figure 1 and Figure 2 , There are multiple spray pipes 2, and multiple nozzles 3 are arranged in parallel on the same side of each spray pipe 2. Each of the multiple spray pipes 2 is connected with an independent adjusting mechanism 4, and the orientation of the nozzles 3 thereon can be independently controlled, making the orientation of the nozzles 3 more flexible and more practical. An inclined surface 11 is arranged at the bottom of the cleaning tank 1, which is convenient for the cleaning medium and the impurities washed down to move along the inclined surface 11 and be discharged along the retaining net 6. A retaining net 6 is arranged at the bottom of the cleaning tank 1. While supporting the silicon wafer, the retaining net 6 allows the cleaning medium and the impurities washed down to pass through, preventing them from accumulating at the bottom of the cleaning tank 1. Along the length direction of the cleaning tank 1, two support rods 5 are also arranged in the cleaning tank 1. When the silicon wafer is placed on the retaining net 6, the two support rods 5 respectively abut against the two opposite sides of the silicon wafer, enhancing the stability of the silicon wafer during cleaning.

[0020] The specific structure of the adjusting mechanism 4 is described as follows:

[0021] Please refer to Figure 1 and Figure 2 , The telescopic component 41 is a double-acting cylinder. The double-acting cylinder can provide output force in both the extending and retracting working stages, and can rotate the spray pipe 2 smoothly and accurately. At one end of the telescopic component 41 far from the spray pipe 2, another first-level connecting rod 44 and a second-level connecting rod 45 are symmetrically arranged. The second-level connecting rod 45 is vertically connected to the fixed seat 46. Through this symmetrically arranged structure, the stability of the telescopic component 41 during operation is enhanced. The first-level connecting rod 44 and the second-level connecting rod 45 are connected by a universal joint 43 to achieve the transmission of force and rotation between the first-level connecting rod 44 and the second-level connecting rod 45. A pipe sleeve 47 is arranged on the second-level connecting rod 45. When connecting the second-level connecting rod 45 and the spray pipe 2, it is only necessary to connect the pipe sleeve 47 and the spray pipe 2, simplifying the connection steps.

[0022] The specific working process of the present utility model is as follows:

[0023] When cleaning the silicon wafer, the operator first places the silicon wafer to be cleaned on the retaining net 6, and the support rod 5 abuts against both side edges of the retaining net 6. Then, the telescopic assembly 41 is driven, and the telescopic rod 42 of the telescopic assembly 41 extends or retracts. This telescopic movement is transmitted to the secondary connecting rod 45 through the primary connecting rod 44, driving the secondary connecting rod 45 to perform a rotary motion around the axis of the spray pipe 2. At the same time, the spray pipe 2 fixedly connected to the secondary connecting rod 45 by the pipe sleeve 47 drives the spray pipe 2 to rotate around its own axis, that is, adjusts the orientation of the nozzle 3 fixed on the spray pipe 2 until the nozzle 3 points to the preset position.

[0024] It can be seen that for the above silicon wafer cleaning device, when the size of the silicon wafer to be cleaned changes, resulting in a change in the appropriate flushing angle, through the adjustment mechanism 4, the orientation of the nozzle 3 can be conveniently and flexibly adjusted to adapt to the change in the size of the silicon wafer, ensuring the cleaning quality and cleaning efficiency.

[0025] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0026] The above embodiments only represent several implementation manners of the present utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several deformations and improvements can still be made, and these all belong to the protection scope of the present utility model. Therefore, the protection scope of the utility model patent shall be subject to the appended claims.

Claims

1. A silicon wafer cleaning device, characterized in that: Including cleaning tank, spray pipe, nozzle and adjustment mechanism, The spray pipe is rotatably arranged on the cleaning tank; The nozzle is arranged on the spray pipe in the cleaning tank; The adjustment mechanism includes a telescopic component, a primary connecting rod connected to the telescopic component and a secondary connecting rod connected to the primary connecting rod, one end of the secondary connecting rod away from the primary connecting rod is connected to the spray pipe, and the secondary connecting rod is perpendicular to the axis of the spray pipe.

2. The silicon wafer cleaning device according to claim 1, characterized in that: A plurality of spray pipes are provided, and a plurality of nozzles are arranged in parallel on the same side of each spray pipe.

3. The silicon wafer cleaning device according to claim 1, characterized in that: The telescopic assembly is a double-acting cylinder.

4. The silicon wafer cleaning device according to claim 1, characterized in that: Another primary connecting rod and a secondary connecting rod are symmetrically arranged at one end of the telescopic assembly away from the spray pipe, and the secondary connecting rod is vertically connected to the fixing seat.

5. The silicon wafer cleaning device according to claim 1, characterized in that: The bottom of the cleaning tank is provided with an inclined surface.

6. The silicon wafer cleaning device according to claim 1, characterized in that: A blocking net is arranged at the bottom of the cleaning tank.

7. The silicon wafer cleaning device according to claim 1, characterized in that: A support rod is also arranged in the cleaning tank along the length direction of the cleaning tank.

8. The silicon wafer cleaning device according to claim 1, characterized in that: The primary connecting rod and the secondary connecting rod are connected via a universal joint.

9. The silicon wafer cleaning device according to claim 1, characterized in that: The secondary connecting rod is provided with a pipe sleeve, and the pipe sleeve is connected to the spray pipe.

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