Electromagnetism-based substrate fixing device and 3D printing device
By adopting an electromagnetic-based substrate fixing device in the 3D printing device and using magnetic adsorption and release of the substrate, the problem of low substrate disassembly and assembly efficiency under the traditional tightening screw fixing method is solved, and a more efficient substrate disassembly and assembly and 3D printing process is achieved.
Patent Information
- Application Number
- CN202421901554.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-07
- Publication Date
- 2025-06-17
- Estimated Expiration
- 2034-08-07
AI Technical Summary
When 3D printing of non-metallic powder, the traditional method of tightening screws fixing the substrate leads to low disassembly and assembly efficiency, wasting time and labor costs.
Using an electromagnetic-based substrate fixing device, by providing wires in the suction cup housing and connecting them with the power controller, the substrate is absorbed and released by magnetic force to achieve rapid disassembly and assembly.
It improves the disassembly and assembly efficiency of the substrate, simplifies operations, reduces time and labor costs, and thus improves the overall working efficiency of 3D printing.
Smart Images

Figure CN222987577U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of 3D printing, and particularly relates to an electromagnetic-based substrate fixing device and a 3D printing device. Background Art
[0002] Currently, when 3D printing non-metallic powder, the substrate is generally fixed by set screws. This results in the need to disassemble and assemble multiple fastening screws each time the substrate is disassembled and assembled, which not only wastes time costs but also wastes labor costs. Therefore, how to improve the disassembly and assembly efficiency of the substrate is a problem that needs to be solved by those skilled in the art. Summary of the Utility Model
[0003] Embodiments of the utility model provide an electromagnetic-based substrate fixing device and a 3D printing device, aiming to improve the disassembly and assembly efficiency of the substrate during 3D printing.
[0004] Embodiments of the utility model provide an electromagnetic-based substrate fixing device for fixing a substrate, including:
[0005] A suction cup housing;
[0006] A wire, installed in the suction cup housing and connected to a power controller;
[0007] When installing the substrate, the wire is conducted through the power controller so that the wire generates a magnetic force and adsorbs the substrate; when disassembling the substrate, the wire is turned off through the power controller so that the magnetic force of the wire disappears and the substrate is removed.
[0008] Further, a slot is provided in the suction cup housing, and the wire is wound around the slot.
[0009] Further, a plurality of slots are provided, and the plurality of slots are evenly distributed in the suction cup housing, and each slot is wound with the wire.
[0010] Further, the slot wound with the wire is potted with an insulating material.
[0011] Further, the insulating material is epoxy resin.
[0012] Further, a plurality of positioning and mounting parts are provided at the top of the suction cup housing.
[0013] Further, the positioning and mounting part is a positioning pin.
[0014] Further, a sealing plate is further included, and the sealing plate covers the upper part of the suction cup housing.
[0015] Further, a heating plate is provided below the suction cup housing.
[0016] An embodiment of the present utility model further provides a 3D printing device, including the electromagnetic-based substrate fixing device described in any one of the above.
[0017] An embodiment of the present utility model provides an electromagnetic-based substrate fixing device and a 3D printing device. The substrate fixing device is used to fix a substrate and includes: a suction cup housing; a wire installed in the suction cup housing and connected to a power controller; when installing the substrate, the wire is conducted through the power controller so that the wire generates a magnetic force to adsorb the substrate; when disassembling the substrate, the wire is turned off through the power controller so that the magnetic force of the wire disappears and the substrate is removed. The substrate fixing device provided by the embodiment of the present utility model has a compact structure and simple operation, and can realize the disassembly and installation of the substrate only through the electromagnetic principle, which can greatly improve the disassembly and assembly efficiency of the substrate, thereby improving the overall working efficiency of 3D printing. Description of the Drawings
[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0019] Figure 1 It is a schematic structural diagram of an electromagnetic-based substrate fixing device provided by an embodiment of the present utility model.
[0020] Labels in the figure:
[0021] 1. Substrate;
[0022] 2. Suction cup housing; 21. Groove; 22. Positioning and installation part;
[0023] 3. Wire;
[0024] 4. Power controller;
[0025] 5. Sealing plate;
[0026] 6. Heating plate. Detailed Embodiments
[0027] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the drawings in the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts fall within the protection scope of the present utility model.
[0028] It should be understood that when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, wholes, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and / or their combinations.
[0029] It should also be understood that the terms used in this specification of the present utility model are merely for the purpose of describing specific embodiments and are not intended to limit the present utility model. As used in this specification of the present utility model and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include the plural forms.
[0030] It should be further understood that the term "and / or" used in this specification of the present utility model and the appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.
[0031] Please refer to the following Figure 1 , an embodiment of the present utility model provides an electromagnetic-based substrate fixing device for fixing a substrate 1, comprising:
[0032] a suction cup housing 2;
[0033] a wire 3, installed in the suction cup housing 2 and connected to a power controller 4;
[0034] When installing the substrate 1, the wire 3 is conducted through the power controller 4 so that the wire 3 generates a magnetic force and adsorbs the substrate 1; when disassembling the substrate 1, the wire 3 is turned off through the power controller 4 so that the magnetic force of the wire 3 disappears and the substrate 1 is removed.
[0035] In this embodiment, the substrate fixing device includes a suction cup housing 2 and a wire 3 installed in the suction cup housing 2, and the wire 3 is connected to a power controller 4, and the power controller 4 can be arranged outside the suction cup housing 2 for easy operation. When the substrate fixing device is working, by conducting the wire 3 through the power controller 4, the wire 3 can generate a magnetic field, so that the substrate 1 can be attracted by the magnetic force of the magnetic field, achieving the effect of fixedly installing the substrate 1. When it is necessary to disassemble the substrate 1, the current of the wire 3 can be cut off through the power controller 4 so that the magnetic field generated by the wire 3 disappears. At this time, there is no magnetic force that can attract the substrate 1, so that the substrate 1 can be easily disassembled.
[0036] The substrate fixing device provided in this embodiment has a compact structure and simple operation. It can realize the disassembly and installation of the substrate 1 only through the electromagnetic principle. Compared with traditional methods such as screw fixing, this embodiment can simply and efficiently complete the disassembly and assembly of the substrate 1, thereby greatly improving the disassembly and assembly efficiency of the substrate 1 and further improving the overall working efficiency of 3D printing.
[0037] In one embodiment, a slot 21 is provided in the suction cup housing 2, and the wire 3 is wound around the slot 21.
[0038] Specifically, a plurality of slots 21 are provided, and the plurality of slots 21 are evenly distributed in the suction cup housing 2, and the wire 3 is wound in each slot 21.
[0039] In this embodiment, the wire 3 is arranged by providing the slot 21 to make the overall device more compact and concise. Preferably, a plurality of slots 21 are provided to arrange more wires 3, so that the magnetic force generated by the wires 3 can meet the adsorption and fixing requirements for the substrate 1 and improve the stability of the installation of the substrate 1.
[0040] In some preferred embodiments, the slot 21 around which the wire 3 is wound is potted with an insulating material.
[0041] Specifically, the insulating material is epoxy resin.
[0042] In this embodiment, potting the slot 21 with an insulating material can improve the safety and durability of the substrate fixing device and avoid safety problems such as electric leakage when the wire 3 is energized. Specifically, epoxy resin is used as the insulating material to pot the slot 21. In actual application scenarios, epoxy potting adhesive has extremely high insulation performance, which is crucial for a device containing the wire 3. Poor insulation of the device may cause device damage or personal injury, and the insulation performance of epoxy potting adhesive can effectively prevent this situation. In addition, epoxy resin also has excellent heat resistance, enabling the device to maintain a stable working state in high or low temperature environments. The mechanical properties of epoxy potting adhesive can also effectively protect the device from physical damage, thereby increasing the product service life.
[0043] In one embodiment, a plurality of positioning and mounting portions 22 are provided at the top of the suction cup housing 2.
[0044] Specifically, the positioning and mounting portion 22 is a positioning pin.
[0045] In this embodiment, the installation efficiency of the substrate 1 is improved by setting the positioning and installation part 22, enabling the substrate 1 to be quickly installed on the suction cup housing 2. In actual application scenarios, a positioning pin is used as the positioning and installation part 22. The main function of the positioning pin is to restrict the degrees of freedom of an object and control the linear motion of the object in the three axial directions of X, Y, and Z and the rotational motion around X, Y, and Z to achieve the determination of the position in a two-dimensional space. Positioning pins are usually used in mechanical assembly to ensure the accurate alignment and positioning between various components. They are widely used in various mechanical equipment and devices, such as automobiles, machine tools, molds, etc., to improve the assembly accuracy and working efficiency. In addition, positioning pins can also be classified according to specific requirements, such as small positioning pins, fixed positioning pins, replaceable positioning pins, etc. Each type has its specific application scenarios and advantages. When using positioning pins, it is necessary to pay attention to selecting the appropriate type and specification to ensure that it can meet the assembly requirements and improve the stability and reliability of the overall mechanical system. At the same time, the material and manufacturing process of the positioning pin are also important factors affecting its performance and service life. The positioning pin described in this embodiment can specifically be a taper pin.
[0046] In one embodiment, it further includes a sealing plate 5, and the sealing plate 5 is covered above the suction cup housing 2.
[0047] In this embodiment, a sealing plate 5 is provided above the suction cup housing 2. The sealing plate 5 can be fixed to the suction cup housing 2 by screws, etc. After the sealing plate 5 is set, the substrate 1 will be installed on the sealing plate 5 during installation.
[0048] In one embodiment, a heating plate 6 is provided below the suction cup housing 2.
[0049] In this embodiment, a heating plate 6 is provided below the suction cup housing 2. The suction cup housing 2 can be fixed to the heating plate 6 by screws at the four corners. By setting the heating plate 6 in this embodiment, the printing quality in the 3D printing process can be improved, and it can also play a role in protecting the 3D printer. Specifically, the functions of the heating plate 6 include:
[0050] Preventing the printed object from warping: By providing uniform heat, the heating plate 6 can ensure that the plastic material remains stable during the printing process, thereby preventing the printed object from warping or deforming when cooling;
[0051] Improving the printing quality: A stable temperature helps the correct flow and layering of the plastic material, thereby producing a finer and stronger printed finished product;
[0052] Avoiding damage to the heating bottom plate: When a malfunction occurs in the 3D printer, the heating plate 6 can prevent damage to the bottom plate caused by sudden temperature changes or power outages;
[0053] Temperature control: The heating plate 6 is usually equipped with a temperature sensor, which can monitor and adjust the temperature in real time to ensure temperature stability during the printing process;
[0054] The above functions make the heating plate 6 an indispensable component in 3D printers, especially for complex printing tasks that require precise temperature control.
[0055] The embodiment of the present utility model also provides a 3D printing device, including the electromagnetic-based substrate fixing device as described above.
[0056] The various embodiments in the specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts among the embodiments can be referred to each other. For the system disclosed in the embodiments, since it corresponds to the method disclosed in the embodiments, the description is relatively simple. For the relevant parts, refer to the description in the method section. It should be noted that for those of ordinary skill in the art in this technical field, without departing from the principle of this application, several improvements and modifications can be made to this application, and these improvements and modifications also fall within the protection scope of the claims of this application.
[0057] It should also be noted that in this specification, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of another identical element in the process, method, article or device including the said element.
Claims
1. An electromagnetic-based substrate fixing device for fixing a substrate, characterized in that: include: Suction cup housing; A wire is installed in the suction cup housing and connected to a power controller; When installing the substrate, the power controller turns on the wire so that the wire generates magnetic force and adsorbs the substrate; when removing the substrate, the power controller turns off the wire so that the magnetic force of the wire disappears and the substrate is removed.
2. The electromagnetic substrate fixing device according to claim 1, characterized in that: A slot is arranged in the suction cup shell, and the wire is wound around the slot.
3. The electromagnetic-based substrate fixing device according to claim 2, characterized in that: There are a plurality of the slots, the plurality of the slots are evenly distributed in the suction cup housing, and the wire is wound in each of the slots.
4. The electromagnetic-based substrate fixing device according to claim 2 or 3, characterized in that: The slots around which the wires are wound are potted with insulating material.
5. The electromagnetic-based substrate fixing device according to claim 4, characterized in that: The insulating material is epoxy resin.
6. The electromagnetic-based substrate fixing device according to claim 1, characterized in that: A plurality of positioning and mounting parts are arranged on the top of the suction cup shell.
7. The electromagnetic-based substrate fixing device according to claim 6, characterized in that: The positioning installation portion is a positioning pin.
8. The electromagnetic-based substrate fixing device according to claim 1, characterized in that: It also includes a sealing plate, and the sealing plate cover is arranged above the suction cup shell.
9. The electromagnetic-based substrate fixing device according to claim 1, characterized in that: A heating plate is arranged below the suction cup housing.
10. A 3D printing device, characterized in that: It comprises the electromagnetic-based substrate fixing device as described in any one of claims 1 to 9.