Fingerprint identification module structure and electronic equipment comprising same

Abstract

The utility model provides a fingerprint identification module structure and an electronic device comprising the same. The fingerprint identification module structure comprises a cover plate, a fingerprint identification chip, an FPC circuit board and a steel sheet reinforcement plate which are stacked from top to bottom. Wherein the periphery of the cover plate and the fingerprint identification chip comprises a metal outer frame, the metal outer frame is of a stepped circular structure and comprises a vertical plane circular structure and a horizontal plane circular structure, and the outer surface of the metal outer frame is of a frosted surface structure. And the particle specification of the frosted surface of the outer surface of the metal outer frame is 40 microns, 60 microns or 80 microns. The particle specification of the frosted surface of the outer surface of the metal outer frame comprises a single particle specification or a combination of a plurality of particle specifications. The vertical surface circle wraps the periphery of the cover plate and the fingerprint identification chip, and the top of the vertical surface circle is flush with the upper surface of the cover plate. After the outer surface of the metal outer frame used for supporting and wrapping the cover plate and the chip is frosted, the effect of reducing light reflection is achieved, and therefore damage of reflected light to glasses of a user is reduced. And compared with a smooth metal frame mirror surface, the mirror surface has the effect of reducing smudginess.

Description

Technical Field

[0001] The utility model relates to the technical field of fingerprint recognition, and more specifically, to a fingerprint recognition module structure and an electronic device including the same. Background Art

[0002] At present, components such as the chip and cover plate of the fingerprint module are placed within its metal outer frame. The outer surface of the conventional metal outer frame is mirror-finished, making the appearance look relatively smooth and eye-catching. However, for some fingerprint module components that often come into contact with the human eye, such as those in laptops, it will cause discomfort to the user's eyes due to the mirror light reflection, and at the same time, the mirror surface is more prone to dirt. Summary of the Utility Model

[0003] The purpose of the present utility model is to provide a fingerprint recognition module structure and an electronic device including the same, aiming to partially solve the above technical problems.

[0004] Specifically, the specific technical solution of the present utility model is as follows: On the one hand, a fingerprint recognition module structure is proposed, which includes a cover plate, a fingerprint recognition chip, an FPC circuit board, and a steel sheet reinforcement plate stacked from top to bottom; among them, the outer peripheries of the cover plate and the fingerprint recognition chip include a metal outer frame, and the metal outer frame is set as a stepped circular structure, including a vertical circular surface and a horizontal circular surface, and the outer surface of the metal outer frame is set as a matte surface structure.

[0005] As a preferred technical solution, the particle size of the matte surface of the outer surface of the metal outer frame is 40um, 60um, or 80um.

[0006] As a preferred technical solution, the particle size of the matte surface of the outer surface of the metal outer frame includes a single particle size or a combination of multiple particle sizes.

[0007] As a preferred technical solution, the vertical circular surface wraps the outer peripheries of the cover plate and the fingerprint recognition chip, and the top of the vertical circular surface is flush with the upper surface of the cover plate.

[0008] As a preferred technical solution, the horizontal circular surface is arranged on the FPC circuit board.

[0009] As a preferred technical solution, there is a conductive silver paste layer between the horizontal circular surface and the contact surface on the FPC circuit board.

[0010] As a preferred technical solution, the surface of the steel sheet reinforcement plate is set as a rough surface structure, and the roughness of the rough surface structure is Ra = 0.2 - 1.6um.

[0011] As a preferred technical solution, the thickness of the steel sheet reinforcement plate is 0.30 - 0.40mm.

[0012] As a preferred technical solution, the surface of the steel sheet reinforcement plate is provided with a regular texture structure, and the texture structure forms convex portions and concave portions.

[0013] On the other hand, an electronic device is proposed, which includes a fingerprint recognition module structure as described above. The electronic device using this fingerprint recognition module structure effectively reduces the problems of reflection and surface dirt.

[0014] The beneficial effects of the present utility model are as follows: For the fingerprint recognition module structure proposed by the present utility model, after the outer surface of the metal outer frame used to support and wrap the cover plate and the chip is subjected to matte treatment, it has the effect of reducing reflection, thereby reducing the harm of reflected light to the user's eyes. Compared with the smooth metal frame mirror surface, it has the effect of reducing dirt, such as fingerprint dirt. Description of the Drawings

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present utility model, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other relevant drawings can also be obtained based on these drawings.

[0016] Figure 1 It is a schematic structural diagram of a metal outer frame proposed for an embodiment of the present utility model;

[0017] Figure 2 It is a schematic side view structural diagram of a fingerprint recognition module structure proposed for an embodiment of the present utility model.

[0018] Description of the reference numerals in the drawings: Cover plate 1; Fingerprint recognition chip 2; Metal outer frame 3; Vertical plane circle 31; Horizontal plane circle 32; FPC circuit board 4; Conductive silver paste layer 5; Steel sheet reinforcement plate 6; Texture structure 61. Detailed Embodiments

[0019] Now, the exemplary embodiments will be described more comprehensively with reference to the drawings. However, the exemplary embodiments can be implemented in various forms and should not be construed as being limited to the examples set forth herein; rather, these embodiments are provided so that this application will be more comprehensive and complete, and the concept of the exemplary embodiments will be fully conveyed to those skilled in the art.

[0020] In addition, the described features, structures, or characteristics may be combined in one or more embodiments in any suitable manner. In the following description, numerous specific details are provided to give a thorough understanding of the embodiments of the present application. However, those skilled in the art will realize that the technical solutions of the present application may be practiced without one or more of the specific details, or other methods, components, devices, steps, etc. may be adopted. In other cases, well-known methods, devices, implementations, or operations are not shown or described in detail to avoid obscuring aspects of the present application.

[0021] The block diagrams shown in the drawings are merely functional entities and do not necessarily correspond to physically independent entities. That is, these functional entities may be implemented in software form, or implemented in one or more hardware modules or integrated circuits, or implemented in different networks and / or processor devices and / or microcontroller devices.

[0022] The flowcharts shown in the drawings are merely illustrative and do not necessarily include all the content and operations / steps, nor are they necessarily executed in the described order. For example, some operations / steps may be decomposed, while some operations / steps may be combined or partially combined, so the actual execution order may change according to the actual situation.

[0023] It should be noted that: "a plurality" mentioned in this article refers to two or more.

[0024] Embodiment

[0025] As Figures 1-2 shown, a fingerprint recognition module structure proposed in this embodiment includes a cover plate 1, a fingerprint recognition chip 2, an FPC circuit board 4, and a steel sheet reinforcement plate 6 stacked from top to bottom; wherein, the outer peripheries of the cover plate 1 and the fingerprint recognition chip 2 include a metal outer frame 3, and the metal outer frame 3 is set as a stepped circular structure, including a vertical circular surface 31 and a horizontal circular surface 32, and the outer surface of the metal outer frame 3 is set as a matte surface structure. After the outer surface of the metal outer frame 3 is matte-treated, it has the effect of reducing reflection, thereby reducing the harm of reflected light to the user's eyes. Compared with a smooth metal frame mirror surface, it has the effect of reducing dirt, such as fingerprint dirt. The use experience of the module structure is improved.

[0026] Preferably, the particle size of the matte surface of the outer surface of the metal outer frame 3 is 40um, 60um, or 80um. Further, the particle size of the matte surface of the outer surface of the metal outer frame 3 includes a single particle size or a combination of multiple particle sizes. That is, the matte surface particle size can be regular or irregular. The matte process that can be used for the matte surface treatment is mechanical matte or chemical matte. After the matte surface is treated, coating or spraying can be carried out according to actual needs.

[0027] Preferably, the vertical circular surface 31 wraps around the outer periphery of the cover plate 1 and the fingerprint recognition chip 2, and the top of the vertical circular surface 31 is flush with the upper surface of the cover plate 1. The horizontal circular surface 32 is provided on the FPC circuit board 4. Further, a conductive silver paste layer 5 is provided between the horizontal circular surface 32 and the contact surface on the FPC circuit board 4.

[0028] Preferably, the surface of the steel sheet reinforcement plate 6 is set to a rough surface structure, and the roughness of the rough surface structure is Ra = 0.2 - 1.6um. Increasing the surface roughness of the reinforcement plate increases the surface heat dissipation area, thereby improving its heat dissipation effect. At the same time, after increasing the surface roughness of the steel sheet reinforcement plate 6, the glue contact area is also increased, improving its glue bonding effect. This helps with the fitting and fixing to the entire electronic device.

[0029] Preferably, the thickness of the steel sheet reinforcement plate 6 is 0.30 - 0.40mm, achieving an effective support function.

[0030] Preferably, the surface of the steel sheet reinforcement plate 6 is set to a regular texture structure 6, and the texture structure 6 forms protrusions and depressions. The protrusions and depressions form a kind of slope design.

[0031] On the other hand, an electronic device is proposed, including a fingerprint recognition module structure as described above. The electronic device using this fingerprint recognition module structure can effectively reduce the problems of reflection and surface dirt.

[0032] The specific embodiments described above have further detailed the purpose, technical solutions, and beneficial effects of the present invention. It should be understood that the above are only specific embodiments of the present invention and are not used to limit the protection scope of the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A fingerprint recognition module structure, characterized in that: It includes a cover plate, a fingerprint recognition chip, an FPC circuit board and a steel sheet reinforcement plate stacked from top to bottom; wherein the outer periphery of the cover plate and the fingerprint recognition chip includes a metal outer frame, the metal outer frame is set as a stepped circular structure, including a vertical circular surface and a horizontal circular surface, and the outer surface of the metal outer frame is set as a frosted surface structure.

2. A fingerprint recognition module structure according to claim 1, characterized in that: The particle size of the frosted surface of the outer surface of the metal frame is 40um, 60um or 80um.

3. A fingerprint recognition module structure according to claim 2, characterized in that: The particle size of the frosted surface of the outer surface of the metal outer frame includes a single particle size or a combination of multiple particle sizes.

4. The fingerprint recognition module structure according to claim 1, characterized in that: The vertical circular surface wraps around the cover plate and the periphery of the fingerprint identification chip, and the top of the vertical circular surface is flush with the upper surface of the cover plate.

5. A fingerprint recognition module structure according to claim 4, characterized in that: The horizontal plane is circularly arranged on the FPC circuit board.

6. A fingerprint recognition module structure according to claim 5, characterized in that: A conductive silver paste layer is provided between the horizontal circular surface and the contact surface on the FPC circuit board.

7. A fingerprint recognition module structure according to any one of claims 1 to 6, characterized in that: The surface of the steel sheet reinforcement plate is set to a rough surface structure, and the roughness of the rough surface structure is Ra=0.2~1.6um.

8. The fingerprint recognition module structure according to claim 7, characterized in that: The thickness of the steel sheet reinforcement plate is 0.30-0.40 mm.

9. The fingerprint recognition module structure according to claim 6, characterized in that: The surface of the steel sheet reinforcement plate is set to a regular texture structure, and the texture structure forms protrusions and recesses.

10. An electronic device, characterized in that: It comprises a fingerprint recognition module structure as described in any one of claims 1 to 9.

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