RFID wafer tire temperature label

Abstract

The utility model discloses an RFID wafer tire temperature tag, which belongs to the technical field of RFID electronic tags and comprises an anode spring antenna, a cathode spring antenna and a wafer chip fixedly mounted between the anode spring antenna and the cathode spring antenna. The end portions, close to each other, of the positive electrode spring antenna and the negative electrode spring antenna are fixedly connected in a glued mode through insulation connecting glue, the wafer chip is fixedly installed on the insulation connecting glue, and the wafer chip is in lead bonding with the positive electrode spring antenna and the negative electrode spring antenna through leads. According to the utility model, the problems that in the prior art, the packaging material of the label chip part is too hard and is difficult to combine with the rubber material of the tire, so that the tire is easy to crack, the use safety is reduced, and the service life is prolonged are solved.

Description

Technical Field

[0001] The utility model belongs to the technical field of RFID electronic tags, and particularly relates to an RFID wafer tire temperature tag. Background Art

[0002] The tire market has broad prospects and increasing demands. Coupled with the new opportunities brought by the upgrade of the automotive industry, the informatization and intelligentization of vehicles have become an irreversible development trend.

[0003] Currently, along with the development trend of informatization and intelligentization, the upgrading of tires is accelerating, and more sensor devices are applied to tires, so that the use experience of tires has been greatly improved. Among them, in ensuring the safety of tire operation, the application of sensor devices to monitor the temperature of tires in real time has important application significance, which is conducive to users' more comprehensive and intuitive understanding of the real-time condition of tires to prevent safety accidents caused by tires.

[0004] In the prior art, such as a tire-implanted electronic tag and manufacturing process disclosed in the invention patent with the publication number of CN107729971A, the key components of its composition are a chip module and a spring antenna. The main function of the chip module is to record tire information, and the function of the spring antenna is to receive the electromagnetic wave signal emitted by the reader-writer to enable the chip module to obtain energy and transmit feedback information to the reader-writer. The volume of the chip module part in the above patent is too large. When the RFID electronic tag is embedded in the tire for use, because the encapsulation material of the chip module is relatively hard and not sufficiently combined with the tire material, the tire is prone to produce glue splitting, thus affecting the overall life of the tire and even endangering the safety of users.

[0005] Therefore, it is necessary to propose an RFID wafer tire temperature tag to solve the above problems. Summary of the Utility Model

[0006] In view of this, the purpose of the utility model is to provide an RFID wafer tire temperature tag, which is used to solve the problems in the prior art that the encapsulation material of the chip module is relatively hard, the volume of the chip module part is too large, resulting in insufficient combination with the tire material, making the tire prone to produce glue splitting, thus affecting the overall life of the tire and even endangering the safety of users.

[0007] To achieve the above purpose, the utility model provides the following technical solutions:

[0008] The present utility model provides an RFID wafer tire temperature tag, which includes a positive spring antenna, a negative spring antenna, and a wafer chip fixedly installed between the positive spring antenna and the negative spring antenna. The end portions of the positive spring antenna and the negative spring antenna that are close to each other are fixedly bonded by an insulating connection adhesive. The wafer chip is fixedly installed on the insulating connection adhesive, and the wafer chip is wire-bonded to the positive spring antenna and the negative spring antenna through leads.

[0009] Further, an installation groove matching with the wafer chip is provided on the insulating connection adhesive, and the wafer chip is installed in the installation groove.

[0010] Further, a notch penetrating through the positive spring antenna, the negative spring antenna, and the insulating connection adhesive is provided at the connection of the positive spring antenna, the negative spring antenna, and the insulating connection adhesive, and the notch is sealed by a sealing adhesive capable of covering the wafer chip. To protect the wafer chip and the leads, and to make the connection between the positive spring antenna, the negative spring antenna, and the insulating connection adhesive more firm in cooperation with the insulating connection adhesive.

[0011] Further, a positive bonding pad and a negative bonding pad are provided on the wafer chip. The positive bonding pad is wire-bonded to the positive spring antenna through a positive lead, and the negative bonding pad is wire-bonded to the negative spring antenna through a negative lead. The leads are made of a metal material, so that a path is formed by connecting the internal circuit of the wafer chip and the spring antenna.

[0012] Further, the positive spring antenna and the negative spring antenna are symmetrically arranged with respect to the central plane of the insulating connection adhesive.

[0013] Further, the positive spring antenna and the negative spring antenna are coaxially arranged.

[0014] Further, both the positive spring antenna and the negative spring antenna are made of alloy copper material.

[0015] Further, the insulating connection adhesive is made of a tire-like rubber material. The insulating connection adhesive has adhesiveness and can well adhere to the positive spring antenna and the negative spring antenna. The function of the insulating connection adhesive is to separate the positive spring antenna and the negative spring antenna, and to protect the wafer chip.

[0016] Further, the wire diameter of the positive spring antenna is 0.25 mm, the coil diameter is 1.2 mm, and the total length is 25 mm.

[0017] Further, the wire diameter of the negative spring antenna is 0.25 mm, the coil diameter is 1.2 mm, and the total length is 25 mm.

[0018] The beneficial effects of the present utility model are as follows:

[0019] 1. By improving the structure of the RFID wafer tire temperature tag, the present utility model solves the problems of the previously disclosed technology, such as the hard encapsulation material of the tag chip being difficult to combine with the rubber material of the tire, resulting in easy cracking of the tire, reducing its use safety and service life, etc.

[0020] 2. Relying on the temperature measurement function added by the wafer chip, on the basis of previously having the function of identifying the tire identity information, the present utility model adds the function of detecting the real-time temperature of the tire, achieving the effect of enriching the product uses.

[0021] Other advantages, objectives and features of the present utility model will be described in the subsequent specification, and to a certain extent, they are obvious to those skilled in the art, or those skilled in the art can obtain teachings from the practice of the present utility model. The objectives and other advantages of the present utility model can be achieved and obtained through the following specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to make the objectives, technical solutions and beneficial effects of the present utility model clearer, the present utility model provides the following drawings for illustration:

[0023] Figure 1 Schematic diagram of the installation of the wafer chip of the present utility model;

[0024] Figure 2 Side view of the installation of the wafer chip of the present utility model;

[0025] Figure 3 Cross-sectional view when the sealant is sealed of the present utility model;

[0026] Figure 4 Schematic diagram of the sealant sealing state of the present utility model;

[0027] Figure 5 Schematic diagram of the overall structure of the present utility model.

[0028] The marks in the drawings are as follows: positive spring antenna 1, positive lead 101, negative spring antenna 2, negative lead 201, wafer chip 3, insulating connection glue 4, notch 5, sealant 6. DETAILED DESCRIPTION OF THE EMBODIMENTS Embodiment

[0029] As Figures 1 - 5As shown in the figure, the present utility model provides an RFID wafer tire temperature tag, comprising: a positive spring antenna 1, a negative spring antenna 2, and a wafer chip 3 fixedly installed between the positive spring antenna 1 and the negative spring antenna 2. The positive spring antenna 1 and the negative spring antenna 2 are fixedly bonded by an insulating connection adhesive 4. The wafer chip 3 is fixedly installed on the insulating connection adhesive 4. The wafer chip 3 is wire-bonded to the positive spring antenna 1 and the negative spring antenna 2 through leads. Among them, at the connection of the positive spring antenna 1, the negative spring antenna 2, and the insulating connection adhesive 4, there is a notch 5 penetrating through the positive spring antenna 1, the negative spring antenna 2, and the insulating connection adhesive 4. The notch 5 is sealed by a sealant 6.

[0030] In this solution, the manufacturing process of the RFID wafer tire temperature tag is as follows: The end parts of the positive spring antenna 1 and the negative spring antenna 2 are respectively bonded and fixed to the insulating connection adhesive 4. Among them, the positive spring antenna 1 and the negative spring antenna 2 are made of alloy copper material. Use a precision fixing machine to assist in fixing the wafer chip 3 on the insulating connection adhesive 4. Then use a wire bonding machine to bond the positive bonding pad on the wafer chip 3 to the positive spring antenna 1 through a positive lead 101, and bond the negative bonding pad on the wafer chip 3 to the negative spring antenna 2 through a negative lead 201. Finally, apply glue at the notch 5 where the wafer chip 3, the positive spring antenna 1, the negative spring antenna 2, and the insulating connection adhesive 4 are located for sealing to form the sealant 6. Among them, the insulating connection adhesive 4 is provided with an installation groove (not shown in the figure) that cooperates with the wafer chip 3. The wafer chip 3 is installed in the installation groove to facilitate positioning of the wafer chip 3. After applying glue for sealing, the sealant 6 covers the wafer chip 3 and is bonded to the insulating connection adhesive 4, the positive spring antenna 1, and the negative spring antenna 2 as a whole, ensuring the stability of the wafer chip 3 inside the sealant 6.

[0031] The application process of this embodiment is as follows: Embed the completed RFID wafer tire temperature tag into the tire during the tire processing, generally before the tire vulcanization step. After obtaining the tire embedded with the RFID wafer temperature tag, in actual use, the real-time temperature of the tire can be read and written by installing a reader and a reading and writing antenna on the vehicle. Embodiment

[0032] Referring to Embodiment 1, the model of the wafer chip 3 can be changed accordingly according to actual needs. For example, if only the identification of the tire's identity information is required, the wafer chip 3 can be replaced with a general RFID chip.

[0033] The process technology of this Embodiment 2 can be carried out according to the method of Embodiment 1.

[0034] The application process of this Embodiment 2 can also be carried out with reference to the method of Embodiment 1. The difference is that according to actual needs, since it is not necessary to detect the temperature in real time and only the tire identity information needs to be identified, the reading and writing device may not be installed on the tool to achieve better economic benefits.

[0035] Finally, it should be noted that the above preferred embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail through the above preferred embodiments, those skilled in the art should understand that various changes can be made in form and details without departing from the scope defined by the claims of the present invention.

Claims

1. An RFID wafer tire temperature tag, characterized in that: It includes a positive spring antenna, a negative spring antenna, and a wafer chip fixedly installed between the positive spring antenna and the negative spring antenna. The ends of the positive spring antenna and the negative spring antenna that are close to each other are fixedly bonded by insulating connecting glue, and the wafer chip is fixedly installed on the insulating connecting glue. The wafer chip is wire-bonded to the positive spring antenna and the negative spring antenna through leads.

2. The RFID wafer tire temperature tag according to claim 1, characterized in that: The insulating connecting adhesive is provided with a mounting groove matched with the wafer chip, and the wafer chip is mounted in the mounting groove.

3. The RFID wafer tire temperature tag according to claim 1, characterized in that: A notch penetrating the positive spring antenna, the negative spring antenna and the insulating connecting adhesive is provided at the connection between the positive spring antenna, the negative spring antenna and the insulating connecting adhesive, and the notch is sealed by a sealant capable of covering the wafer chip.

4. The RFID wafer tire temperature tag according to claim 3, characterized in that: The wafer chip is provided with a positive electrode pressure welding block and a negative electrode pressure welding block. The positive electrode pressure welding block is bonded to the positive electrode spring antenna through a positive electrode lead wire, and the negative electrode pressure welding block is bonded to the negative electrode spring antenna through a negative electrode lead wire.

5. The RFID wafer tire temperature tag according to claim 1, characterized in that: The positive pole spring antenna and the negative pole spring antenna are symmetrically arranged with respect to the central plane of the insulating connecting glue.

6. The RFID wafer tire temperature tag according to claim 1, characterized in that: The positive spring antenna and the negative spring antenna are coaxially arranged.

7. The RFID wafer tire temperature tag according to claim 1, characterized in that: The positive pole spring antenna and the negative pole spring antenna are both made of alloy copper material.

8. The RFID wafer tire temperature tag according to claim 1, characterized in that: The insulating connecting adhesive is made of tire rubber-like material.

9. The RFID wafer tire temperature tag according to claim 1, characterized in that: The wire diameter of the positive spring antenna is 0.25 mm, the coil diameter is 1.2 mm, and the total length is 25 mm.

10. The RFID wafer tire temperature tag according to claim 1, characterized in that: The wire diameter of the negative pole spring antenna is 0.25 mm, the coil diameter is 1.2 mm, and the total length is 25 mm.

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