Circuit board with multilayer ceramic structure

Abstract

The utility model discloses a circuit board with a multilayer ceramic structure, which relates to the field of circuit boards and comprises a circuit board body, a plurality of layers of ceramic substrates are arranged in the circuit board body and stacked from bottom to top, a conductive circuit layer is etched above each ceramic substrate, and the conductive circuit layer is arranged on the circuit board body. A plurality of bonding pads are connected above the top conductive circuit layer, a heat-conducting glue layer is coated below each ceramic substrate, an insulating reinforcing layer is arranged below each heat-conducting glue layer, and glass fiber reinforced epoxy resin is filled in each insulating reinforcing layer, so that the heat-conducting glue layers and the conductive circuit layers can be insulated; the heat dissipation layer is arranged below the bottom insulation reinforcing layer, and the heat conduction channel is connected with the heat conduction glue layer and the heat dissipation layer, so that heat on each layer of ceramic substrate can be quickly concentrated to the heat dissipation layer below, and the heat is dissipated through the heat dissipation fins; and the heat dissipation efficiency of the circuit board body is improved.

Description

Technical Field

[0001] The utility model belongs to the field of circuit boards, and particularly relates to a circuit board with a multi-layer ceramic structure. Background Art

[0002] A ceramic circuit board, also known as a ceramic circuit board, a ceramic substrate or a ceramic copper clad laminate, is a PCB board that is formed by covering a copper foil on a ceramic substrate, drilling holes, etching circuits and surface treatment, and has the same electrical interconnection and good electrical performance as a circuit board. The basis of a ceramic circuit board is a ceramic substrate, which is usually made of high thermal conductivity and high insulation ceramic materials such as alumina, aluminum nitride, and silicon carbide. These ceramic materials have excellent physical and chemical properties. Due to its excellent heat dissipation, high insulation and high frequency performance, ceramic circuit boards are widely used in many fields of civil and industrial products, such as electronics, transportation tracks, aerospace products, etc.

[0003] However, due to the chemical bond properties and crystal structure of ceramic materials, it is brittle, resulting in low tensile strength, poor plasticity and toughness. As the size of electronic products becomes smaller and smaller, the stacking density of circuit boards is also higher, which puts forward higher requirements for the heat dissipation performance and self-resistance of circuit boards. Therefore, a circuit board with a multi-layer ceramic structure is proposed to solve the above problems. Summary of the Utility Model

[0004] To solve the above technical problems, a circuit board with a multi-layer ceramic structure is provided, and this technical solution solves the problem of difficult heat dissipation in the stacking of multi-layer circuit boards.

[0005] A circuit board with a multi-layer ceramic structure includes a circuit board body. A multi-layer ceramic substrate is arranged inside the circuit board body, and the ceramic substrates are stacked from bottom to top. A conductive circuit layer is etched above each ceramic substrate. A plurality of pads are connected above the top conductive circuit layer. A heat-conducting glue layer is coated below each ceramic substrate, and an insulating reinforcement layer for improving the resistance of the circuit board is arranged below the heat-conducting glue layer. A solder mask layer is coated above the top conductive circuit layer, and a heat dissipation layer is arranged below the bottom insulating reinforcement layer.

[0006] Preferably, a plurality of heat sinks are fixedly connected below the heat dissipation layer, and the heat sinks are arranged evenly.

[0007] Preferably, a plurality of metal vias are opened in the middle of the conductive circuit layer, and the metal vias pass through the ceramic substrate, the heat-conducting glue layer and the insulating reinforcement layer and extend to the next conductive circuit layer and are connected to the circuit inside it.

[0008] Preferably, a plurality of heat conduction paths are connected to the middle of the heat conductive adhesive layer. The heat conduction paths are connected to each heat conductive adhesive layer and extend to the surface of the heat dissipation layer below. The outer wall of the heat conduction path is coated with epoxy resin.

[0009] Preferably, a plurality of heat sinks are fixedly connected below the heat dissipation layer, and the heat sinks are arranged evenly.

[0010] Preferably, a plurality of mounting holes are provided at the edge of the circuit board body. The mounting holes penetrate the circuit board body in the vertical direction, and insulating gaskets are provided at the lower ends of the mounting holes.

[0011] Preferably, the inside of the insulation strengthening layer is filled with glass fiber reinforced epoxy resin.

[0012] Preferably, the inner wall and the outer wall of the metal via are coated with epoxy resin.

[0013] The beneficial effects of the present utility model compared with the prior art are as follows:

[0014] 1. An insulation strengthening layer is provided between every two ceramic substrates. The inside of the insulation strengthening layer is filled with glass fiber reinforced epoxy resin. Glass fiber can increase the mechanical strength of epoxy resin, which can not only insulate between the heat conductive adhesive layer and the conductive circuit layer, but also improve the impact resistance and durability of the circuit board body.

[0015] 2. A heat conductive adhesive layer is provided below each ceramic substrate. Each heat conductive adhesive layer is connected through a heat conduction path, and the heat conduction path is connected to the heat dissipation layer below the circuit board body, so that the heat on each ceramic substrate can be quickly concentrated on the heat dissipation layer below. The heat dissipation layer dissipates the heat through the heat sinks provided below. By providing insulating gaskets, there is a gap between the heat sinks and the installation wall, and the heat can be quickly taken away by an external heat dissipation fan, improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic structural diagram of the present utility model.

[0017] The reference numerals in the figure are:

[0018] 1. Circuit board body; 11. Ceramic substrate; 12. Conductive circuit layer; 121. Solder pad; 13. Solder mask layer; 14. Heat conductive adhesive layer; 15. Insulation strengthening layer; 2. Heat dissipation layer; 21. Heat sink; 3. Metal via; 4. Heat conduction path; 5. Mounting hole; 51. Insulating gasket. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0019] The following description is used to disclose the present utility model so that those skilled in the art can implement the present utility model. The preferred embodiments in the following description are only examples, and those skilled in the art can think of other obvious variations.

[0020] A circuit board with a multi-layer ceramic structure includes a circuit board body 1. Inside the circuit board body 1, there are multiple ceramic substrates 11 stacked from bottom to top. A conductive circuit layer 12 is etched above each ceramic substrate 11. The conductive circuit layer 12 and other electronic components together form a complete circuit. Above the top conductive circuit layer 12, there are several pads 121 connected. Below each ceramic substrate 11, there is a heat-conducting adhesive layer 14. The heat-conducting adhesive layer 14 sends the heat on the ceramic substrate 11 to the outside of the circuit board body 1 through the heat-conducting adhesive, reducing the temperature inside the circuit board body 1 and avoiding damage to the circuit board body 1 caused by high temperature. Below the heat-conducting adhesive layer 14, there is an insulating reinforcement layer 15 for improving the resistance of the circuit board. The inside of the insulating reinforcement layer 15 is filled with glass fiber-reinforced epoxy resin, which can improve the impact resistance of the circuit board body 1 and insulate between the heat-conducting adhesive layer 14 and the conductive circuit layer 12. Above the top conductive circuit layer 12, there is a solder mask layer 13. The solder mask layer 13 protects the conductive circuit layer 12 below, ensuring that the solder only adheres to the pads 121 during the soldering process and does not accidentally contact other areas of the conductive circuit layer 12, thus avoiding short circuits or poor soldering phenomena. Below the bottom insulating reinforcement layer 15, there is a heat dissipation layer 2. Below the heat dissipation layer 2, there are several heat sinks 21 fixedly connected, and the heat sinks 21 are arranged evenly.

[0021] Among them, multiple metal vias 3 are opened in the middle of the conductive circuit layer 12. The metal vias 3 pass through the ceramic substrate 11, the heat-conducting adhesive layer 14, and the insulating reinforcement layer 15 and extend to the next conductive circuit layer 12 and are connected to the circuit inside it. The inner wall and outer wall of the metal via 3 are coated with epoxy resin. The metal vias 3 connect the multiple conductive circuit layers 12 into a whole and insulate from other layers. In the middle of the heat-conducting adhesive layer 14, there are multiple heat-conducting paths 4 connected. The heat-conducting paths 4 are connected to each heat-conducting adhesive layer 14 and extend to the surface of the heat dissipation layer 2 below. The outer wall of the heat-conducting path 4 is coated with epoxy resin for insulation treatment between layers. The heat-conducting paths 4 are connected to the heat dissipation layer 2 below the circuit board body 1, which can quickly concentrate the heat on each ceramic substrate 11 to the heat dissipation layer 2 below. The heat dissipation layer 2 dissipates the heat through the heat sinks 21 arranged below, improving the heat dissipation capacity of the circuit board body 1. Multiple mounting holes 5 are opened at the edge of the circuit board body 1. The mounting holes 5 penetrate the circuit board body 1 in the vertical direction. At the lower end of each mounting hole 5, there is an insulating gasket 51. By setting the insulating gasket 51, there is a certain gap between the heat sink 21 and the mounting wall, and natural heat dissipation or ventilation heat dissipation using a heat dissipation fan can be carried out, improving the heat dissipation efficiency.

[0022] The working principle of the present utility model: The impact resistance of the circuit board body 1 is improved by arranging an insulating reinforcement layer 15 between two ceramic substrates 11, and the heat inside the circuit board body 1 is conducted out and radiated to the outside by using the heat-conducting adhesive layer 14, the heat-conducting path 4 and the heat dissipation layer 2. A heat sink 21 is provided below the heat dissipation layer 2, which can improve the heat dissipation efficiency. It not only improves the heat dissipation efficiency of the circuit board body 1, but also enhances its resistance.

[0023] The above shows and describes the basic principle, main features and advantages of the present utility model. Those skilled in the art should understand that the present utility model is not limited by the above embodiments. What is described in the above embodiments and the specification is only the principle of the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and these changes and improvements all fall within the scope of the present utility model claimed. The scope of protection required by the present utility model is defined by the appended claims and their equivalents.

Claims

1. A circuit board with a multi-layer ceramic structure, characterized in that: It includes a circuit board body (1), and a multi-layer ceramic substrate (11) is arranged inside the circuit board body (1). The ceramic substrates (11) are stacked from bottom to top, and a conductive circuit layer (12) is etched above each ceramic substrate (11). A plurality of pads (121) are connected above the top conductive circuit layer (12). A heat-conducting adhesive layer (14) is coated below each ceramic substrate (11), and an insulating strengthening layer (15) for improving the resistance of the circuit board is arranged below the heat-conducting adhesive layer (14). A solder mask layer (13) is coated above the top conductive circuit layer (12), and a heat dissipation layer (2) is arranged below the bottom insulating strengthening layer (15).

2. The circuit board with a multi-layer ceramic structure according to claim 1, characterized in that: A plurality of heat sinks (21) are fixedly connected below the heat dissipation layer (2), and the heat sinks (21) are arranged evenly.

3. A circuit board with a multi-layer ceramic structure according to claim 1, characterized in that: A plurality of metal vias (3) are formed in the middle of the conductive circuit layer (12), and the metal vias (3) pass through the ceramic substrate (11), the heat-conducting adhesive layer (14) and the insulating strengthening layer (15) and extend to the next conductive circuit layer (12) and are connected to the circuit inside it.

4. The circuit board with a multi-layer ceramic structure according to claim 1, characterized in that: A plurality of heat-conducting paths (4) are connected in the middle of the heat-conducting adhesive layer (14), and the heat-conducting paths (4) are connected to each heat-conducting adhesive layer (14) and extend to the surface of the heat dissipation layer (2) below. The outer wall of the heat-conducting path (4) is coated with epoxy resin.

5. A circuit board with a multi-layer ceramic structure according to claim 1, characterized in that: A plurality of heat sinks (21) are fixedly connected below the heat dissipation layer (2), and the heat sinks (21) are arranged evenly.

6. The circuit board with a multi-layer ceramic structure according to claim 1, characterized in that: A plurality of mounting holes (5) are formed at the edge of the circuit board body (1), the mounting holes (5) penetrate the circuit board body (1) in the vertical direction, and insulating gaskets (51) are arranged at the lower ends of the mounting holes (5).

7. A circuit board with a multi-layer ceramic structure according to claim 1, characterized in that: The insulating strengthening layer (15) is filled with glass fiber reinforced epoxy resin.

8. A circuit board with a multi-layer ceramic structure according to claim 3, characterized in that: The inner wall and the outer wall of the metal via (3) are coated with epoxy resin.

Images