PCB structure for communication system
By setting a cavity in the PCB structure of the communication system and metalizing it on the side wall of the cavity, the problem of high high-frequency signal loss is solved, and lower signal transmission loss and higher transmission performance are achieved.
Patent Information
- Application Number
- CN202422077139.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-26
- Publication Date
- 2025-07-08
- Estimated Expiration
- 2034-08-26
AI Technical Summary
In the existing communication systems, the signal loss of high-frequency wireless signals is relatively high, and there is still room for improvement in the dielectric loss and conductor loss of existing substrate designs.
A multi-plate stacking structure is adopted, a cavity is set in the inner signal layer and metallized on the side wall surface of the cavity to form a metal shielding layer, and the signal propagates through the air inside the cavity to reduce transmission distance and losses.
The transmission loss of high-frequency signals is significantly reduced, especially in the frequency range of 115 to 155GHz, and the signal loss is reduced by 5 times, improving signal transmission performance.
Smart Images
Figure CN223080207U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of PCB, and particularly relates to a PCB structure for a communication system. Background Art
[0002] In vehicle-mounted radars and the upcoming 6G mobile network systems, communication signals all require higher bandwidths, which drives the demand for high-frequency wireless signals. Among them, the D band with a working frequency between 110 - 170 GHz has attracted much attention. The application of high-frequency wireless signals also poses higher requirements on the system complexity and signal attenuation performance of the PCB structure. The substrates used in existing communication and radar systems adopt substrate integrated design and planar wire technology. Their signal losses include dielectric loss of the dielectric and conductor loss of the conductor, and there is still room for improvement in signal loss performance. Summary of the Utility Model
[0003] In order to overcome the deficiencies of the prior art, the purpose of the utility model is to provide a PCB structure for a communication system, which can further reduce the signal loss of the PCB structure, improve the signal transmission performance of the PCB structure, and enhance the transmission performance of the PCB structure for high-frequency signals.
[0004] To solve the above problems, the technical solution adopted by the utility model is as follows: A PCB structure for a communication system is stacked by multiple arbitrarily interconnected substrates. Among them, cavities are arranged in the inner layer signal layer, and the side wall surfaces of the cavities are metallized.
[0005] Compared with the prior art, the beneficial effect of the utility model lies in: By arranging cavities in the inner layer signal layer, the transmission length of signals in the substrate is reduced. Since the dielectric constant of the PCB substrate is basically above 2, while the dielectric constant of air is only 1. By arranging cavities in the inner layer signal layer, the signals are transmitted through the air inside the cavities, reducing the transmission distance of the signals in the substrate, thereby reducing the signal loss during signal propagation. The inner wall surface of the cavity is metallized, which can form a metal shielding layer to prevent the signals transmitted through the cavity from leaking outwards, further reducing the signal loss.
[0006] For the above PCB structure, the cavity is a rectangular cavity.
[0007] For the above PCB structure, the cavity penetrates through the stacked structure formed by multiple stacked substrates.
[0008] The following further elaborates the utility model in detail with reference to the attached drawings and specific embodiments. Description of the Drawings
[0009] Figure 1 It is a cross-sectional view of the PCB structure of the embodiment of the utility model.
[0010] Description of the attached drawing reference numerals:
[0011] 100 Substrate, 200 Cavity, 210 Metallization layer. Specific implementation mode
[0012] The embodiments of the present utility model will be described in detail below, with reference to Figure 1 , the embodiments of the present utility model provide a PCB structure for a communication system, including a stacked structure formed by arbitrarily interconnecting and stacking multiple substrates 100, wherein a cavity 200 is provided in the internal signal layer, and the inner wall surface of the cavity 200 is metallized to form a metallization layer 210. For the PCB structure of the embodiment of the present utility model, compared with the prior art solutions of arranging internal metallized vias or parallel planar conductors in the signal layer, since the dielectric constant of air is lower than that of solid dielectrics such as the substrate 100, the signal loss of transmitting signals through the cavity 200 is lower. At the same time, the side wall of the cavity 200 is metallized to form a metallization layer 210 covering the side wall of the cavity 200, which can form a shielding layer for the cavity 200 to prevent the signals transmitted through the cavity 200 from leaking outwards, further reducing the signal loss. The PCB structure of the embodiment of the present utility model has been tested. Under the same conditions, compared with the integrated design of the substrate 100 and the planar conductor technology, for signals in the frequency range of 115 to 155 GHz, the signal loss is only 0.07 to 0.08 dB / mm, which is 5 times lower than the signal loss value of the known integrated waveguide of the substrate with planar conductors or an array of metallized vias provided on the interposer.
[0013] It can be understood that the specific structure of the cavity 200 can be designed according to actual needs, with reference to Figure 1 , in this embodiment, the cavity 200 is a rectangular cavity, and the cavity 200 penetrates the stacked structure formed by stacking the substrates 100. The cavity 200 can be opened after the substrates 100 are stacked and laminated, so as to facilitate the formation of the cavity 200 and the implementation of the metallization process on the inner wall surface, reducing the manufacturing difficulty of the PCB structure.
[0014] It should be noted that in the description of the present utility model, if there is any reference to the description of directions, such as the directions or position relationships indicated by up, down, front, back, left, right, etc., they are all based on the directions or position relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed or operated in a specific direction, and should not be construed as a limitation to the present utility model.
[0015] In the description of the present utility model, the meaning of "a number of" is one or more, the meaning of "a plurality of" is two or more, and understandings such as "greater than", "less than", "exceeding", etc. do not include the corresponding number, while understandings such as "above", "below", "within", etc. include the corresponding number. If there is a description of "first" or "second", etc., it is only for the purpose of distinguishing technical features and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.
[0016] In the description of the present utility model, unless otherwise clearly defined, terms such as "arrangement", "installation", "connection", etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present utility model in combination with the specific content of the technical solution.
[0017] The above embodiments are only the preferred embodiments of the present utility model and cannot be used to limit the scope of protection of the present utility model. Any non-substantial changes and substitutions made by those skilled in the art based on the present utility model fall within the scope of protection required by the present utility model.
Claims
1. A PCB structure for a communication system, characterized in that, It is formed by stacking multiple arbitrarily interconnected substrates (100), and cavities (200) are provided in the inner signal layers, and the side wall surfaces of the cavities (200) are metallized.
2. The PCB structure of the communication system according to claim 1, wherein, The cavity (200) is a rectangular cavity (200).
3. The PCB structure of the communication system according to claim 1, characterized in that, The cavity (200) penetrates through the stacked structure formed by stacking multiple substrates (100).