Electronic device and damping member
By setting shock absorbers with internal curved surfaces and shock-absorbing space on the speakers, the resonance problem of speakers in the laptop is solved, the shock absorption effect is improved, and the audio and video playback quality is improved.
Patent Information
- Application Number
- CN202422261241.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-09-12
- Filing Date
- 2024-09-14
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-09-14
AI Technical Summary
When the speakers of existing laptops operate in a limited space, they are prone to resonance with the case and keyboard, causing noise to affect the audio and video playback effect, and the shock absorption effect of existing shock absorbers is insufficient.
The shock absorber with an inner curved surface and shock-absorbing space is used to absorb the vibration of the speaker through the inner curved surface and shock-absorbing space, including vibration in the vertical and horizontal directions, to prevent the speaker from resonating with the housing.
Effectively absorb vibration during the speaker operation, avoid resonant noise, and improve the audio and video playback effect.
Smart Images

Figure CN223092362U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to an electronic device and a shock absorber, in particular to an electronic device and a shock absorber with a shock-absorbing space. Background Art
[0002] In recent years, the application of notebook computers has become more and more popular. With the continuous progress and development of technology, in addition to its own computing and processing capabilities, notebook computers can also provide various application functions through other peripheral devices or built-in electronic components. Among them, in the case that modern people pay more and more attention to audio-visual effects, the speaker is an important device indispensable in notebook computers.
[0003] Speakers are usually built into notebook computers to increase the convenience of carrying. At present, notebook computers are gradually moving towards a thin, light, short and small design. When the speaker operates in the limited space of the notebook computer, if the speaker is not effectively shock-absorbed, resonance will occur between the speaker and the casing and keyboard of the notebook computer, generating noise and affecting the audio-visual playback effect. Generally speaking, manufacturers will install shock absorbers on the speakers to shock-absorb the speakers. However, the current shock absorbers still have insufficient shock-absorbing effect on the speakers. Therefore, how to improve the shock-absorbing effect of the shock absorber on the speaker is one of the problems that R & D personnel should solve. Summary of the Utility Model
[0004] The utility model aims to provide an electronic device and a shock absorber for improving the shock-absorbing effect of the shock absorber on the speaker.
[0005] An electronic device disclosed in an embodiment of the utility model includes a housing, a speaker and at least one shock absorber. The housing has at least two assembly bumps and defines an accommodation space. The at least two assembly bumps are opposite to each other and are located in the accommodation space. The speaker is located in the accommodation space and includes a vibration body part and at least one assembly part. The at least one assembly part is connected to the vibration body part. The at least one shock absorber includes two shock-absorbing parts and a connecting part. The two shock-absorbing parts are respectively connected to opposite ends of the connecting part, and each has an inner arc surface. The inner arc surfaces define a shock-absorbing space. The connecting part is installed on the at least one assembly part. The two shock-absorbing parts are respectively assembled on the at least two assembly bumps, and the at least two assembly bumps are respectively at least partially located in the two shock-absorbing spaces, so that the vibration body part is separated from the housing.
[0006] A shock absorber disclosed in another embodiment of the utility model includes two shock-absorbing parts and a connecting part. The two shock-absorbing parts are used for assembling on an electronic device, and each has an inner arc surface. The inner arc surfaces define a shock-absorbing space. The two shock-absorbing spaces are used for accommodating at least part of the electronic device. Opposite ends of the connecting part are respectively connected to the two shock-absorbing parts and are used for installing on the speaker, so that the speaker is separated from the two electronic devices.
[0007] The electronic device and the shock absorber according to the above embodiments. In this embodiment, since a shock absorption space is formed through the inner arc surface in the shock absorption part, the shock absorber can further absorb the vibration generated by the speaker during operation. Therefore, the shock absorption effect of the shock absorber on the speaker can be improved. In this way, it is possible to prevent the speaker from resonating with the housing during operation and causing the keyboard to generate noise, thereby affecting the playback effect of audio and video.
[0008] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principle of the present invention, and provide a further explanation for the protection scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0009] Figure 1 A three-dimensional schematic diagram of the electronic device according to the first embodiment of the present invention.
[0010] Figure 2 is Figure 1 exploded schematic diagram of the electronic device.
[0011] Figure 3 is Figure 1 top view schematic diagram of the shock absorber of the electronic device.
[0012] Figure 4 is Figure 1 cross-sectional view schematic diagram of the shock absorber of the electronic device.
[0013] Figure 5 is Figure 1 cross-sectional view schematic diagram of the electronic device.
[0014] Figure 6 A three-dimensional cross-sectional view schematic diagram of the electronic device according to the second embodiment of the present invention.
[0015] Figure 7 is Figure 6 top view schematic diagram of the shock absorber of the electronic device.
[0016]
DESCRIPTION OF THE REFERENCE NUMERALS
[0017] 10, 10A: Electronic device
[0018] 11: Housing
[0019] 111, 111A: First housing
[0020] 1111, 1111A: Assembly bump
[0021] 1112: Abutting convex part
[0022] 11121: Abutting bump
[0023] 112, 112A: Second housing
[0024] 1121, 1121A: Assembly bump
[0025] 1122: Abutting projection
[0026] 11221: Abutting bump
[0027] 1123A: Positioning post
[0028] 12: Speaker
[0029] 121: Vibration body part
[0030] 122: Assembly part
[0031] 13, 13A: Shock absorber
[0032] 131: Shock absorption part
[0033] 1311: Inner flat surface
[0034] 1312: Inner arc surface
[0035] 1313: Outer flat surface
[0036] 1314: Assembly hole
[0037] 1315: Outer arc surface
[0038] 132, 132A: Connection part
[0039] 1321: Connecting channel
[0040] 1322: Arc-shaped cavity
[0041] H1, H2: Height
[0042] R: Diameter
[0043] S1: Accommodating space
[0044] S2: Shock absorption space
[0045] T: Thickness
[0046] W1, W2: Width Detailed implementation manners
[0047] Please refer to Figures 1 to 5 . Figure 1 It is a three-dimensional schematic diagram of the electronic device according to the first embodiment of the present utility model. Figure 2 It is Figure 1 the exploded schematic diagram of the electronic device. Figure 3 It is Figure 1 the top view schematic diagram of the shock absorber of the electronic device. Figure 4 It is Figure 1Cross-sectional schematic diagram of an electronic device. Figure 5 is Figure 1 Cross-sectional schematic diagram of an electronic device.
[0048] The electronic device 10 of this embodiment is, for example, a notebook computer or a handheld game console, but is not limited thereto. The electronic device 10 includes a housing 11, a speaker 12, and a plurality of shock-absorbing members 13. The housing 11 includes a first housing body 111 and a second housing body 112. The first housing body 111 is, for example, a keyboard housing, that is, the C part of a notebook computer. The second housing body 112 is, for example, a bottom case, that is, the D part of a notebook computer. The first housing body 111 and the second housing body 112 are connected and enclose an accommodation space S1. The first housing body 111 and the second housing body 112 each have a plurality of assembly bumps 1111, 1121. These assembly bumps 1111 of the first housing body 111 and these assembly bumps 1121 of the second housing body 112 are respectively opposite to each other and are located in the accommodation space S1. Among them, these assembly bumps 1111, 1121 are, for example, solid bumps.
[0049] The speaker 12 is located in the accommodation space S1 and includes a vibration body part 121 and a plurality of assembly parts 122. These assembly parts 122 are connected to the vibration body part 121. These shock-absorbing members 13 are made of a flexible material such as rubber or silica gel, for example. Each shock-absorbing member 13 includes two shock-absorbing parts 131 and a connecting part 132. Each shock-absorbing part 131 is approximately spherical, for example. By providing a shock-absorbing part 131 that is approximately spherical, the vibration in the vertical direction generated by the speaker 12 can be absorbed.
[0050] Each of the two shock-absorbing parts 131 has two inner flat surfaces 1311, an inner arc surface 1312, two outer flat surfaces 1313, and an assembly hole 1314. The opposite sides of the inner arc surface 1312 are respectively connected to and face the two inner flat surfaces 1311. The two inner flat surfaces 1311 and the inner arc surface 1312 together enclose a shock-absorbing space S2. The two outer flat surfaces 1313 respectively face away from the two inner flat surfaces 1311. The assembly hole 1314 penetrates from one of the two outer flat surfaces 1313 to the opposite inner flat surface 1311.
[0051] The opposite ends of the connecting part 132 are respectively connected to the sides of the two shock-absorbing parts 131 away from the assembly hole 1314, and the connecting part 132 is installed on the assembly part 122. The two shock-absorbing parts 131 are respectively assembled to the assembly bumps 1111, 1121 through the two assembly holes 1314, and the assembly bumps 1111, 1121 are respectively at least partially located in the two shock-absorbing spaces S2, so that the vibration body part 121 is separated from the housing 11. Among them, the two assembly holes 1314 and the assembly bumps 1111, 1121 are, for example, 0-to-0 designed. The so-called 0-to-0 design means that the sizes of the two assembly holes 1314 and the assembly bumps 1111, 1121 are substantially the same. The so-called substantially the same means equal or close.
[0052] The connecting portion 132 has a connecting channel 1321. The two damping spaces S2 communicate with each other through the connecting channel 1321, and the width of the two damping spaces S2 is, for example, greater than the width of the connecting channel 1321. By providing the two damping spaces S2 and the connecting channel 1321, the vibration in the horizontal direction generated by the speaker 12 can be absorbed.
[0053] In this embodiment, since the damping space S2 is formed in the damping portion 131 by the two inner flat surfaces 1311 and the inner arc surface 1312, the damping member 13 can further absorb the vibration generated by the speaker 12 during operation. In this way, it is possible to prevent the speaker 12 from resonating with the housing 11 and generating noise during operation, thereby affecting the audio-visual playback effect.
[0054] Furthermore, in the damping member 13, by providing a damping portion 131 approximated to a spherical shape, the vibration in the vertical direction generated by the speaker 12 can be absorbed, and by providing the two damping spaces S2 and the connecting channel 1321, the vibration in the horizontal direction generated by the speaker 12 can be absorbed. In this way, the damping effect of the damping member 13 on the speaker 12 can be improved.
[0055] In this embodiment, the first housing 111 and the second housing 112 may further respectively have a plurality of abutting convex portions 1112, 1122, and each of the abutting convex portions 1112, 1122 includes a plurality of abutting convex blocks 11121, 11221. These abutting convex blocks 11121, 11221 respectively surround these assembling convex blocks 1111, 1121. Specifically, these abutting convex blocks 11121, 11221 are, for example, respectively arranged at intervals along the circumferences of these assembling convex blocks 1111, 1121. For example, these abutting convex blocks 11121, 11221 are arranged in a cross shape. The two damping portions 131 respectively abut against these abutting convex blocks 11121, 11221.
[0056] In this embodiment, the thickness T of each damping member 13 is, for example, less than or equal to 0.5 mm, and the Shore hardness of each damping member 13 is, for example, less than or equal to 30 degrees, but not limited thereto. In other embodiments, the thickness of each damping member may also be, for example, greater than or equal to 0.3 mm and less than or equal to 0.5 mm, and the Shore hardness of each damping member may also be, for example, less than or equal to 20 degrees. In this way, the damping effect of these damping portions 131 can be further improved.
[0057] In this embodiment, the width W1 of each damping portion 131 is, for example, 8 mm, and the height H1 of each damping portion 131 is, for example, 3 mm. In addition, the width W2 of the connecting portion 132 is, for example, 5.2 mm, and the height H2 of the connecting portion 132 is, for example, 1 mm.
[0058] In this embodiment, each shock-absorbing portion 131 further has an outer arc surface 1315. The two outer flat surfaces 1313 are respectively connected to the two opposite sides of the outer arc surface 1315. The outer arc surface 1315 faces away from the inner arc surface 1312. The ratio of the radius of curvature of the outer arc surface 1315 to the height H1 of the shock-absorbing portion 131 is, for example, greater than or equal to 2 / 5 and less than or equal to 1, but is not limited thereto. In other embodiments, the ratio of the radius of curvature of the outer arc surface to the distance between the two outer flat surfaces may also be, for example, greater than or equal to 1 / 2 and less than or equal to 2 / 3. Specifically, the radius of curvature of the outer arc surface 1315 in this embodiment is, for example, greater than or equal to 1 mm and less than or equal to 5 mm. In this way, the shock-absorbing effect of these shock-absorbing portions 131 can be further improved.
[0059] In this embodiment, the diameter R of the connecting channel 1321 is, for example, greater than or equal to 1 mm and less than or equal to 2 mm, that is, the width of the connecting channel 1321 is, for example, greater than or equal to 1 mm and less than or equal to 2 mm, but is not limited thereto. In other embodiments, the diameter of the connecting channel may also be, for example, greater than or equal to 1.5 mm and less than or equal to 2 mm.
[0060] In this embodiment, the number of the assembly bumps 1111 and 1121 on the first housing 111, the number of the assembly bumps 1111 and 1121 on the second housing 112, and the number of the shock-absorbing members 13 are all plural, but are not limited thereto. In other embodiments, the number of the assembly bumps on the first housing, the number of the assembly bumps on the second housing 112, and the number of the shock-absorbing members may also be only single.
[0061] In this embodiment, the outer housing 11 is provided with abutting convex portions 1112 and 1122 for the shock-absorbing portion 131 to abut against, but is not limited thereto. In other embodiments, the outer housing may not be provided with the abutting convex portions, so that the shock-absorbing portion directly abuts against the outer housing.
[0062] In this embodiment, the number of the abutting bumps 11121 and 11221 is plural, and these abutting bumps 11121 and 11221 are arranged in a cross shape, but are not limited thereto. In other embodiments, these abutting bumps may also be, for example, arranged in a star shape or in other shapes, or the number of the abutting bumps may also be only single and, for example, arranged in a ring shape.
[0063] In this embodiment, the connecting portion 132 only has the connecting channel 1321, but is not limited thereto. In other embodiments, please refer to Figure 6 and Figure 7 . Figure 6 is a schematic perspective sectional view of an electronic device according to the second embodiment of the present invention. Figure 7 is Figure 6 a schematic top view of a shock-absorbing member of an electronic device.
[0064] The electronic device 10A of the present embodiment is similar to the electronic device 10 of the first embodiment, and therefore the differences between the present embodiment and the first embodiment will be described below, and the similarities will not be repeated. In the electronic device 10A of the present embodiment, the first shell 111A and the second shell 112A are not provided with abutment protrusions, and the assembly protrusion 1111A of the first shell 111A is, for example, groove-shaped. In addition, the second shell 112A further includes a positioning column 1123A. The positioning column 1123A protrudes from the assembly protrusion 1121A and extends from one of the two shock absorbing spaces S2 of the shock absorbing member 13A toward the first shell 111A through the connecting channel 1321 to the other of the two shock absorbing spaces S2.
[0065] The connecting portion 132A of the shock absorbing member 13A further has a plurality of arc-shaped cavities 1322. These arc-shaped cavities 1322 surround the connecting passage 1321. The two shock absorbing spaces S2 are connected through the connecting passage 1321 and these arc-shaped cavities 1322. The width of each arc-shaped cavity 1322, for example, decreases from one end of the arc-shaped cavity 1322 to the other end of the arc-shaped cavity 1322 and is tangent to the connecting passage 1321, and the decreasing direction of the width of each arc-shaped cavity 1322 is, for example, the same. By further providing the arc-shaped cavity 1322, the vibration in the horizontal direction generated by the speaker 12 as described in the first embodiment can be further absorbed.
[0066] According to the electronic device and the shock absorbing member of the above-mentioned embodiment, in this embodiment, since the shock absorbing space is formed in the shock absorbing part by the two inner planes and the inner arc surface, the shock absorbing member can further absorb the vibration generated by the speaker during operation. In this way, the speaker can be prevented from resonating with the housing during operation and emitting noise, thereby affecting the audio and video playback effect.
[0067] Furthermore, in the shock absorbing member, by providing a shock absorbing portion that is approximately spherical, the vibration generated by the speaker in the vertical direction can be absorbed, and by providing two shock absorbing spaces and a connecting channel, the vibration generated by the speaker in the horizontal direction can be absorbed. In this way, the shock absorbing effect of the shock absorbing member on the speaker can be improved.
Claims
1. An electronic device, characterized in that, Comprising: A housing having at least two assembly bumps and surrounding an accommodation space, the at least two assembly bumps being opposite to each other and located in the accommodation space; A speaker located in the accommodation space and including a vibration body part and at least one assembly part, the at least one assembly part being connected to the vibration body part; And At least one shock-absorbing member including two shock-absorbing parts and a connecting part, each of the two shock-absorbing parts having an inner arc surface, the inner arc surface surrounding a shock-absorbing space, opposite ends of the connecting part being respectively connected to the two shock-absorbing parts, the connecting part being mounted on the at least one assembly part, the two shock-absorbing parts being respectively assembled on the at least two assembly bumps, and the at least two assembly bumps being respectively at least partially located in the two shock-absorbing spaces so that the vibration body part is separated from the housing.
2. The electronic device according to claim 1, wherein Each of the two shock-absorbing parts has two inner planes, the two inner planes being respectively connected to and facing opposite sides of the inner arc surface, and the two inner planes and the inner arc surface jointly surround the shock-absorbing space.
3. The electronic device according to claim 1, wherein The housing further has at least one abutting convex part, the at least one abutting convex part including a plurality of abutting convex blocks, the plurality of abutting convex blocks respectively surrounding the at least two assembly bumps, and the two shock-absorbing parts respectively abutting against the plurality of abutting convex blocks.
4. The electronic device according to claim 1, characterized in that, The connecting part has a connecting channel, the two shock-absorbing spaces being communicated through the connecting channel, and the width of the two shock-absorbing spaces being greater than the width of the connecting channel.
5. The electronic device according to claim 4, wherein The connecting part further has a plurality of arc-shaped cavities, the plurality of arc-shaped cavities jointly surrounding the connecting channel therein, the two shock-absorbing spaces being communicated through the connecting channel and the plurality of arc-shaped cavities, the width of each of the plurality of arc-shaped cavities decreasing from one end of the arc-shaped cavity to the other end of the arc-shaped cavity, and the width decreasing directions of each of the plurality of arc-shaped cavities being the same.
6. The electronic device according to claim 4, wherein, The diameter of the connecting channel is greater than or equal to 1 mm and less than or equal to 2 mm.
7. The electronic device according to claim 1, wherein Each of the two shock-absorbing parts has an outer arc surface, the outer arc surface facing away from the inner arc surface, and the ratio of the radius of curvature of the outer arc surface to the height of the shock-absorbing part being greater than or equal to 2 / 5 and less than or equal to 1.
8. The electronic device according to claim 1, wherein The thickness of the at least one shock-absorbing member is less than or equal to 0.5 mm.
9. The electronic device according to claim 1, wherein The Shore hardness of the at least one shock-absorbing member is less than or equal to 30 degrees.
10. A shock-absorbing member for being disposed on a speaker of an electronic device, characterized in that, The shock-absorbing member comprises: Two shock-absorbing parts for assembling on the electronic device and each having an inner arc surface, the inner arc surface surrounding a shock-absorbing space, the two shock-absorbing spaces being used for accommodating at least part of the electronic device; And A connecting part, opposite ends of the connecting part being respectively connected to the two shock-absorbing parts and being used for mounting on the speaker so that the speaker is separated from the two electronic devices.