Micro-LED display module and display screen

Abstract

The utility model discloses a Micro-LED display module and a display screen, and relates to the technical field of display. The problem that an existing adhesive film is integrally cured to the surface of a display unit, and maintenance is very difficult when a dead lamp occurs is solved. The module comprises a circuit carrier plate, an epoxy glue layer and a film layer, the circuit carrier plate is divided into a light-emitting surface and a driving surface, the driving surface is welded with an integrated circuit used for driving a circuit, and the light-emitting surface is welded with a Micro-LED light-emitting chip; the Micro-LED light emitting chip is covered with an epoxy glue layer, and the epoxy glue layer is covered on the Micro-LED light emitting chip; the film layer covers the epoxy glue layer; the film layer comprises a PET layer, a carbon black layer, a bonding layer and an optical dissociation layer; the surface of the PET layer is uniformly coated with the carbon black layer, and the surface of the carbon black layer is coated with the adhesion layer; the optical dissociation layer is discretely coated on the surface of the bonding layer. The Mirco-LED integrated packaging structure is applied to the field of Mirco-LED integrated packaging.

Description

Technical Field

[0001] The utility model relates to the field of display technology, in particular to a Mirco-LED display module. Background Art

[0002] The integrated packaging Mirco-LED display technology is gradually maturing, and the market has higher and higher requirements for the appearance and display characteristics of Mirco-LED display screens. The current common technology is to first cure a layer of epoxy glue on the surface of the circuit board of the inherent Mirco-LED chip and then apply a film on the surface of the epoxy glue. The characteristic of this method is simple structure, but due to the low strength of the film application process, the surface film is prone to edge warping and corner lifting during the later splicing process. Another method is to use a film adhesive method, the characteristic of which is that the glue and the film are integrally encapsulated, glue is coated on the film, and the film adhesive is integrally pressed onto the surface of the circuit board with Mirco-LED light-emitting chips. The advantage of this method is high strength, and the integrated packaging is more suitable for mass production. However, since the film adhesive is integrally cured on the surface of the display unit, it is very difficult to repair when there is a dead lamp problem. Since the film adhesive needs to have high strength and high temperature resistance, PET material is usually used. When using this method to pick out the defective point, its surface cannot be restored, and the bonding strength between the film adhesive and the light-emitting chip is very high, and it cannot be torn off as a whole. The dead lamp repair cannot remove its trace, and the repair trace affects the appearance of the display screen. Content of the Utility Model

[0003] Aiming at the problem that when the existing film adhesive is integrally cured on the surface of the display unit, it is very difficult to repair when there is a dead lamp problem. Since the film adhesive needs to have high strength and high temperature resistance, PET material is usually used. When using this method to pick out the defective point, its surface cannot be restored, the utility model provides a Mirco-LED display module, and the module includes:

[0004] A circuit carrier board, an epoxy glue layer and a film layer;

[0005] The circuit carrier board is divided into a light-emitting surface and a driving surface. The driving surface is welded with an integrated circuit for driving the circuit, and the light-emitting surface is welded with Mirco-LED light-emitting chips;

[0006] An epoxy glue layer is covered on the Mirco-LED light-emitting chips;

[0007] The film layer is covered on the epoxy glue layer;

[0008] The film layer includes: a PET layer, a carbon black layer, an adhesive layer and an optical dissociation layer;

[0009] The carbon black layer is evenly coated on the surface of the PET layer, and the adhesive layer is coated on the surface of the carbon black layer; the optical dissociation layer is discretely coated on the surface of the adhesive layer.

[0010] Further, a preferred embodiment is also proposed, wherein the thickness of the epoxy adhesive layer is 0.1 mm - 0.3 mm.

[0011] Further, a preferred embodiment is also proposed, wherein the PET layer is a polyester film with a thickness of 0.03 mm - 0.05 mm.

[0012] Further, a preferred embodiment is also proposed, wherein the adhesive layer is a thermosetting glue with a thickness of 30 μm - 70 μm.

[0013] Further, a preferred embodiment is also proposed, wherein the adhesive layer is a thermosetting glue, and the optical dissociation layer is an anti-adhesive film formed by photocrosslinking curing of polysilane. The coating area of the optical dissociation layer accounts for 40% - 70% of the total area.

[0014] Further, a preferred embodiment is also proposed, wherein the adhesive layer is a thermosetting glue, and the optical dissociation layer has a regular hexagon structure.

[0015] Based on the same inventive concept, the present invention also provides a Mirco-LED display screen, which includes a box body and the Mirco-LED display module described in any one of the above, and the display module is installed on the box body.

[0016] The beneficial effects of the present utility model are as follows:

[0017] In a Mirco-LED display module proposed by the present utility model, the circuit carrier board is designed to be divided into a light-emitting surface and a driving surface. This separation enables more flexible handling during the repair process of the light-emitting surface (the surface of the Mirco-LED chip). The epoxy adhesive layer is applied to the surface of the Mirco-LED light-emitting chip to ensure its stability and protection during use. The PET layer, as a base material, provides the necessary physical support and structural stability. The carbon black layer is evenly coated on the surface of the PET layer, providing certain anti-reflection and protection functions. The adhesive layer covers the carbon black layer and is used to fix the optical dissociation layer. The optical dissociation layer is discretely coated on the surface of the adhesive layer. The discrete coating of the optical dissociation layer allows the entire film layer to be relatively easily peeled off during repair. This design enables the entire film layer to be more conveniently removed when a Mirco-LED dead light or other repair requirements are found, without damaging its surface or the bonding strength between the adhesive film and the Mirco-LED chip. Compared with the traditional one-piece encapsulation of the adhesive film, the use of the optical dissociation layer can significantly reduce the traces after repair because the entire film layer can be removed and replaced relatively intact.

[0018] Further, the epoxy adhesive layer effectively protects the Mirco-LED light-emitting chip, while the film layer provides additional physical protection and anti-reflection functions, enhancing the durability and stability of the overall module.

[0019] Through the above design, the utility model effectively solves the problem of difficult maintenance in the traditional integrated encapsulation method of the adhesive film. It provides a structured method that allows for more convenient maintenance and replacement when needed, without sacrificing the appearance and performance requirements of the Mirco-LED display module. Description of the Drawings

[0020] Figure 1 Schematic diagram of the display carrier board according to Embodiment 1;

[0021] Figure 2 Schematic diagram of a Mirco-LED display module according to Embodiment 1;

[0022] Figure 3 Schematic diagram of the optical dissociation layer according to Embodiment 6;

[0023] In the figure, 1 is the circuit carrier board 1, 2 is the epoxy adhesive layer, 3 is the optical dissociation layer, 4 is the adhesive layer, 5 is the carbon black layer, 6 is the PET layer, 11 is the light-emitting surface, and 12 is the driving surface. Detailed Embodiments

[0024] To make the objectives, technical solutions, and advantages of the embodiments of the utility model clearer, the technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the utility model. Apparently, the described embodiments are some but not all of the embodiments of the utility model. Usually, the components of the embodiments of the utility model described and illustrated herein can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the utility model provided in the drawings is not intended to limit the scope of the claimed utility model, but merely represents the selected embodiments of the utility model. Based on the embodiments of the utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the protection scope of the utility model.

[0025] In the description of the utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the utility model product is usually placed during use. It is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the utility model. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and cannot be understood as indicating or implying relative importance.

[0026] Example embodiments will now be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be construed as limited to the examples set forth herein; rather, these example embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. The drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus their repeated description will be omitted.

[0027] Embodiment 1. A Mirco-LED display module described in this embodiment, the module includes:

[0028] A circuit carrier board 1, an epoxy adhesive layer 2, and a film layer;

[0029] The circuit carrier board 1 is divided into a light-emitting surface 11 and a driving surface 12. An integrated circuit for driving the circuit is soldered on the driving surface 12, and a Mirco-LED light-emitting chip is soldered on the light-emitting surface 11;

[0030] The epoxy adhesive layer 2 is covered on the Mirco-LED light-emitting chip;

[0031] The film layer is covered on the epoxy adhesive layer;

[0032] The film layer includes: a PET layer 6, a carbon black layer 5, an adhesive layer 4, and an optical dissociation layer 3;

[0033] The carbon black layer 5 is uniformly coated on the surface of the PET layer 6, and the adhesive layer 4 is coated on the surface of the carbon black layer 5; the optical dissociation layer 3 is discretely coated on the surface of the adhesive layer.

[0034] In this embodiment, the circuit carrier board is designed to be divided into a light-emitting surface and a driving surface. This separation allows for more flexible handling during the repair process on the light-emitting surface (the surface of the Mirco-LED chip). The epoxy adhesive layer is applied to the surface of the Mirco-LED light-emitting chip to ensure its stability and protection during use. The PET layer serves as the base material, providing the necessary physical support and structural stability. The carbon black layer is uniformly coated on the surface of the PET layer, providing certain anti-reflection and protection functions. The adhesive layer covers the carbon black layer and is used to fix the optical dissociation layer. The optical dissociation layer is discretely coated on the surface of the adhesive layer. The discrete coating of the optical dissociation layer allows for relatively easy peeling of the entire film layer during repair. This design enables the entire film layer to be more conveniently removed when a Mirco-LED dead light or other repair needs are found, without damaging its surface or the bonding strength between the adhesive film and the Mirco-LED chip. Compared with the traditional one-piece encapsulation of the adhesive film, the use of the optical dissociation layer can significantly reduce the traces after repair because the entire film layer can be removed and replaced relatively intact.

[0035] Furthermore, the epoxy adhesive layer effectively protects the Mirco-LED light-emitting chips, while the film layer provides additional physical protection and anti-reflection functions, enhancing the durability and stability of the overall module.

[0036] Through the above design, the display module proposed in this embodiment effectively solves the problem of difficult maintenance in the traditional integrated encapsulation method of glue film. It provides a structured method that allows for more convenient maintenance and replacement when needed, without sacrificing the appearance and performance requirements of the Mirco-LED display module.

[0037] Embodiment 2: This embodiment further limits a Mirco-LED display module described in Embodiment 1, and the thickness of the epoxy adhesive layer 2 is 0.1 mm - 0.3 mm.

[0038] In actual production and preparation, since the chip height is 0.05 - 0.08, setting the thickness of the epoxy adhesive layer to 0.1 mm - 0.3 mm plays a protective role for the chip. It should be noted that the epoxy layer is flat, which is beneficial for the subsequent film bonding.

[0039] Embodiment 3: This embodiment further limits a Mirco-LED display module described in Embodiment 1, and the PET layer 6 is a polyester film with a thickness of 0.03 mm - 0.05 mm.

[0040] In this embodiment, the PET layer plays a protective role on the surface. PET has relatively high hardness and is heat-resistant. In this embodiment, the PET layer is the carrier film, and the adhesive layer and the UV dissociation layer are both coated on the PET layer.

[0041] Embodiment 4: This embodiment further limits a Mirco-LED display module described in Embodiment 1, and the adhesive layer 4 is a thermosetting glue with a thickness of 30 um - 70 um.

[0042] In this embodiment, the thermosetting glue is used as the adhesive layer, and its thickness is controlled between 30 um and 70 um. The adhesive layer thickness within this range is relatively thin, making it easier to operate when maintenance is required. The thinner glue layer can be more easily heated and removed, enabling the quick and effective disassembly and reassembly of the Mirco-LED display module.

[0043] The design of the thin glue layer ensures that unnecessary heat or pressure effects are not exerted on the surrounding components and materials during the maintenance process. This optimization greatly simplifies the repair operation, reduces the risk of surrounding damage that may be caused by maintenance, and at the same time ensures the stability and reliability of the Mirco-LED display module after maintenance.

[0044] Although the glue layer is thin, it can still provide the necessary structural support and stability to maintain the structural integrity of the Mirco-LED display module during use and repair. This design not only helps to maintain the display quality but also reduces potential optical or mechanical problems caused by deformation or excessive thickness of the glue layer.

[0045] Embodiment 5: This embodiment further limits a Mirco-LED display module described in Embodiment 1. The optical dissociation layer 3 is an anti-adhesive film with low surface energy formed after the photocrosslinking curing of polysilane. Generally, it is an organosilicon acrylate oligomer with a polysiloxane main chain and acrylic groups at the end as photosensitive functional groups. The polysiloxane chain segment endows low surface properties, while the acrylic groups have photocuring properties. After adding a photoinitiator and irradiating with UV light, it rapidly polymerizes and crosslinks to obtain the optical dissociation layer. The coating area of the optical dissociation layer accounts for 40%-70% of the total area.

[0046] The coating area of the optical dissociation layer accounts for 40% to 70% of the total bonding area. This design can be more easily controlled and processed when repair is needed. After irradiation, the optical dissociation layer can make the glue lose its viscosity, so that the Mirco-LED display module can be easily separated and reassembled without damaging or affecting the surrounding components and materials.

[0047] Embodiment 6: This embodiment further limits a Mirco-LED display module described in Embodiment 1. The bonding layer is a thermosetting glue, and the optical dissociation layer 3 is a regular hexagon structure. The thermosetting glue is a modified polyolefin resin, and the solvents include methylcyclohexane, cyclohexane, and mineral oil. It generates adhesion at high temperatures.

[0048] Embodiment 7: An easily repairable Mirco-LED display screen described in this embodiment includes a box body and the Mirco-LED display module described in any one of Embodiments 1 to 6, and the display module is installed on the box body.

[0049] Embodiment 8: This embodiment provides a specific example for a Mirco-LED display module described in Embodiment 1 and is also used to explain Embodiments 2 to 6. Specifically:

[0050] An easily repairable Mirco-LED display module is divided into three parts: a circuit carrier board, an epoxy glue layer, and a film layer.

[0051] The circuit carrier board is divided into a light-emitting surface and a driving surface. Among them, an integrated circuit for driving the circuit is soldered on the driving surface, and a Mirco-LED light-emitting chip is soldered on the light-emitting surface. The epoxy adhesive layer is a liquid-cured epoxy resin. Through a fixed ratio, the liquid glue is cured by heating and has a certain hardness. Diffusion powder is added to the epoxy layer so that it has certain optical properties after curing. The epoxy layer is liquid-cured on the circuit board with a thickness of 0.1 mm - 0.3 mm. The addition ratio of the diffusion powder is 3‰ - 3% of the total weight of the mixed glue.

[0052] The film layer is divided into 4 layers, namely PET / carbon black / adhesive layer / optical dissociation layer. The PET is a high-temperature resistant polyester film with a thickness of 0.03 mm - 0.05 mm. The carbon black is evenly coated on the surface of the PET layer. By adjusting the thickness and the density of the carbon black, it has a light transmittance effect of 30% - 50%.

[0053] The adhesive layer is a heat-cured glue, which has a certain adhesive property at a temperature of 100°C - 150°C. It is evenly coated on the surface of the carbon black layer and has a certain thickness, with a thickness of 30 μm - 70 μm.

[0054] The optical dissociation layer will lose its adhesiveness after being irradiated by UV light. The optical dissociation layer is discretely coated on the surface of the adhesive layer, and the coated area accounts for 40% - 70% of the total area.

[0055] The feature of the present utility model is that when the liquid epoxy resin is cured, the epoxy resin adheres to both the adhesive layer and the dissociation layer at the same time. The liquid-cured adhesive strength is large. However, since the dissociation layer is discretely distributed in the adhesive layer, when irradiated by UV light, the viscosity of the dissociation layer decreases, so that the film layer can be torn off under a certain strength.

[0056] In practical applications, the specific processing method of the Mirco-LED display module described in this embodiment is as follows:

[0057] Step 1: Take the circuit carrier board with the driving surface soldered and the Mirco-LED chip soldered, and place it on the surface of a heatable mold.

[0058] Step 2: Adsorb the prepared film layer on the surface of the mold, with the PET layer adsorbed on its surface and the optical dissociation layer facing outward.

[0059] Step 3: Hoist the mold with the adsorbed film layer directly above the heatable mold.

[0060] Step 4: Inject the liquid epoxy resin with the completed ratio onto the surface of the circuit board that has been placed on the surface of the heatable mold.

[0061] Step 5: Press the adsorption mold of the adsorption film layer downward to make the liquid epoxy fully contact with the circuit board and the film layer. The mold can be heated to increase the temperature to solidify the liquid epoxy resin. After solidification, the epoxy resin is bonded to the circuit board, and the film layer is bonded to the surface of the epoxy layer.

[0062] In practical applications, the film layer may also be PET / optical dissociation / carbon black / adhesive layer. The advantage of this method is that when repair is required, the PET layer can be more easily torn off by irradiation with light. However, this method will reduce the bonding strength between PET and carbon black, and the problem of film warping may still exist during the application process.

[0063] In actual production, the higher bonding strength of liquid epoxy curing will bond the film layer with high strength. Since the dissociation layer in this embodiment is not fully coated on the bonding layer, the bonding strength of the film layer will weaken when optically dissociated and can be removed by a method. Therefore, this embodiment is compatible with the strength of the adhesive film and has the advantage of film replacement to meet the requirements of seamless repair of the display module.

[0064] Although the present application has been described with reference to several typical embodiments, it should be understood that the terms used are illustrative and exemplary, rather than restrictive. Since the present application can be implemented in a variety of forms without departing from the spirit or essence of the embodiments, it should be understood that the above-mentioned embodiments are not limited to any of the foregoing details, but should be widely interpreted within the spirit and scope defined by the attached claims, so all changes and modifications falling within the scope of the claims or their equivalents should be covered by the attached claims.

Claims

1. A Mirco-LED display module, characterized in that, The module includes: a circuit carrier board (1), an epoxy adhesive layer (2), and a film layer; The circuit carrier board (1) is divided into a light-emitting surface (11) and a driving surface (12). An integrated circuit for driving the circuit is soldered on the driving surface (12), and a Mirco-LED light-emitting chip is soldered on the light-emitting surface (11); The epoxy adhesive layer (2) is covered on the Mirco-LED light-emitting chip; The film layer is covered on the epoxy adhesive layer; The film layer includes: a PET layer (6), a carbon black layer (5), an adhesive layer (4), and an optical dissociation layer (3); The carbon black layer (5) is uniformly coated on the surface of the PET layer (6), and the adhesive layer (4) is coated on the surface of the carbon black layer (5); the optical dissociation layer (3) is discretely coated on the surface of the adhesive layer.

2. The Mirco-LED display module according to claim 1, wherein The thickness of the epoxy adhesive layer (2) is 0.1 mm - 0.3 mm.

3. A Mirco-LED display module according to claim 1, characterized in that, The PET layer (6) is a polyester film with a thickness of 0.03 mm - 0.05 mm.

4. A Mirco-LED display module according to claim 1, characterized in that, The adhesive layer (4) is a thermosetting glue with a thickness of 30 μm - 70 μm.

5. A Mirco-LED display module according to claim 1, wherein, The adhesive layer is a thermosetting glue, and the optical dissociation layer (3) is an anti-adhesive film formed after the photochemical crosslinking curing of polysilane. The coating area of the optical dissociation layer accounts for 40% - 70% of the total area.

6. The Mirco-LED display module according to claim 1, wherein, The adhesive layer is a thermosetting glue, and the optical dissociation layer (3) has a regular hexagon structure.

7. A Mirco-LED display screen, characterized in that The display screen includes a box body and the Mirco-LED display module according to any one of claims 1 to 6, and the display module is installed on the box body.

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