Display device

By relocating interface terminals to the backside of the circuit board, the LED chip density is increased, addressing interference issues and enhancing display resolution in display technologies.

CN223108482UActive Publication Date: 2025-07-15HISENSE VISUAL TECH CO LTD
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Patent Information

Application Number
CN202422330273.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-24
Publication Date
2025-07-15
Estimated Expiration
2034-09-24

AI Technical Summary

Technical Problem

In the display device, the arrangement density of the light emitting chip is limited by the spatial interference between the terminals and the circuit board, and it is difficult to further increase the number of settings, which affects the delicateness of the display screen.

Method used

By setting the insulating body of the terminal on the second side of the circuit board and passing the pin through the second side of the circuit board, space on the first side of the circuit board is reserved to provide more light emitting chips, and pins are bent to the electrical connection to improve stability and thin thickness.

Benefits of technology

The arrangement density of the light-emitting chips is improved, the spacing between chips is reduced, the backlight partitioning effect of the display device is improved, and the delicateness of the display screen and the thinner design of the device is realized.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a display device which comprises a display screen and a backlight module, the backlight module comprises a lamp panel and a wiring terminal, the lamp panel comprises a circuit board and a plurality of light-emitting chips, the light-emitting chips are arranged on the first side of the circuit board, the circuit board is provided with a wiring layer, the wiring layer is provided with a plurality of electric connecting parts, and the wiring terminal is arranged on the wiring layer. The plurality of electric connection parts are arranged and exposed out of the first side of the circuit board; and the wiring terminal comprises an insulating main body and a plurality of pins, the plurality of pins are arranged on the insulating main body, the plurality of pins are correspondingly connected to the plurality of electric connection parts, the pins are arranged on the circuit board in a penetrating manner, the pins are provided with wiring parts, the wiring parts and the insulating main body are mutually connected, and the wiring parts and the insulating main body are both located on the second side of the circuit board. According to the display device, the space, occupied by the wiring terminals, of the first side of the circuit board can be reduced, more light-emitting chips can be arranged on the first side of the circuit board, and then the arrangement density of the light-emitting chips can be improved.
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Description

Technical Field

[0001] This application relates to the field of display technologies, and particularly to a display device. Background Art

[0002] With the development of display technologies, users have increasingly higher requirements for the fineness of the pictures displayed by display devices. For a display device, at the same size, arranging more light-emitting chips (such as LED chips) in the backlight module can achieve more backlight zones, and the backlight zones determine the fineness of the displayed picture.

[0003] In the display devices of related technologies, usually by reducing the volume of the light-emitting chips, for example, using LED chips with a smaller volume than ordinary LED lamp beads as the light-emitting chips, so as to increase the number of arranged light-emitting chips to improve the fineness of the pictures displayed by the display device.

[0004] However, for a limited installation space, with the increase in the number of arranged light-emitting chips, the arrangement density of the light-emitting chips will also increase, and thus the distance between the light-emitting chips needs to be reduced. For a circuit board with a single-layer aluminum substrate, the light-emitting chips are easily interfered by other structures and it is difficult to continue increasing the number of arranged chips. For example, in the backlight module 20 as Figure 1 shown, as the number of light-emitting chips 211 increases, the wiring terminals 22 on the lamp board 21 for supplying power to or transmitting signals to the light-emitting chips 211 are likely to interfere with the nearby light-emitting chips 211, resulting in the inability to continue increasing the number of light-emitting chips 211 on the lamp board 21, and then restricting the improvement of the arrangement density of the light-emitting chips 211. Utility Model Content

[0005] Based on this, this application provides a display device to solve the technical problem of how to improve the arrangement density of light-emitting chips.

[0006] On the one hand, this application provides a display device, including:

[0007] A display screen;

[0008] A backlight module, arranged on the back of the display screen, the backlight module is used to provide a backlight source for the display screen so that the display screen can display images;

[0009] The backlight module includes a lamp board and wiring terminals;

[0010] The lamp board includes:

[0011] A circuit board, the circuit board has a first side and a second side arranged opposite to each other, the first side is the side of the circuit board facing the display screen, the circuit board has a wiring layer, and the wiring layer has a plurality of electrical connection parts, and a plurality of the electrical connection parts are exposed on the first side of the circuit board;

[0012] A light-emitting chip, which is disposed on the first side of the circuit board;

[0013] The wiring terminal includes an insulating body and a plurality of pins;

[0014] The plurality of pins are disposed on the insulating body, and the plurality of pins are correspondingly connected to the plurality of electrical connection portions;

[0015] The pin has a wiring portion for electrically connecting a power supply line or a signal line;

[0016] Wherein, the pin penetrates through the circuit board, the wiring portion and the insulating body are connected to each other, and both the wiring portion and the insulating body are located on the second side of the circuit board.

[0017] In the above display device, compared with the prior art, the wiring terminal is integrally disposed on the first side of the circuit board by connecting to the electrical connection portion exposed on the first side of the circuit board. In the display device of the present application, the pin is penetrated to the second side of the circuit board and the insulating body of the wiring terminal is disposed on the second side of the circuit board, so as to reserve the space occupied by the insulating body on the first side of the circuit board, so as to use this space to dispose the light-emitting chip, and then more light-emitting chips can be disposed on the first side of the circuit board, which is beneficial to improving the arrangement density of the light-emitting chips.

[0018] In one embodiment, the light-emitting chips include a plurality of them, and a partial structure of at least one light-emitting chip is located in the orthographic projection area of the insulating body on the first side of the circuit board.

[0019] The above technical solution has the following advantages or beneficial effects: A partial structure of at least one light-emitting chip is disposed in the orthographic projection area of the insulating body on the first side of the circuit board, so as to use the space reserved corresponding to the insulating body on the first side of the circuit board to dispose the light-emitting chip, and then the number of light-emitting chips disposed on the first side of the circuit board can be increased, so as to improve the arrangement density of the light-emitting chips.

[0020] In one embodiment, the plurality of light-emitting chips are arranged in a rectangular array, and the plurality of electrical connection portions are disposed between adjacent two columns or adjacent two rows of light-emitting chips.

[0021] The above technical solution has the following advantages or beneficial effects: Since only the part of the pin exposed from the first side of the circuit board occupies the setting space on the first side of the circuit board, and the insulating body of the terminal is arranged on the second side of the circuit board. Thus, when a plurality of electrical connection parts are arranged between adjacent two columns or adjacent two rows of light-emitting chips, the space vacated at the position corresponding to the insulating body on the first side of the circuit board can make the light-emitting chips on both sides of the electrical connection part be arranged more compactly, and then the arrangement density of the light-emitting chips is improved.

[0022] In one embodiment, the edge contour of the circuit board is rectangular, and a plurality of the electrical connection parts are arranged along one edge of the circuit board.

[0023] The above technical solution has the following advantages or beneficial effects: Since the terminal realizes power supply or signal transmission for the circuit board by connecting a power supply line or a signal line, thus arranging a plurality of electrical connection parts along one edge of the circuit board can enable the pins correspondingly connected to the electrical connection parts to adapt to the need of arranging the power supply line or the signal line at the edge of the corresponding circuit board.

[0024] In one embodiment, the insulating body is provided with a plurality of fixing parts, and the insulating body is fixed to the second side of the circuit board through the plurality of fixing parts.

[0025] The above technical solution has the following advantages or beneficial effects: The plurality of fixing parts are arranged on the second side of the circuit board, so that the setting space on the first side of the circuit board is not occupied, which is beneficial to arranging more light-emitting chips on the first side of the circuit board. Since the plurality of fixing parts can have a good fixing effect on the insulating body, the insulating body is prevented from loosening relative to the circuit board and affecting the connection stability between the pins on the insulating body and the electrical connection parts; Therefore, on the one hand, the plurality of fixing parts in this technical solution do not occupy the setting space on the first side of the circuit board, and on the other hand, they can improve the connection stability between the pins and the electrical connection parts, which is beneficial to improving the stability of the terminal for power supply or signal transmission to the circuit board.

[0026] In one embodiment, through holes are provided on the circuit board, and the through holes penetrate from the first side of the circuit board to the second side of the circuit board;

[0027] The pin includes a first part, a second part and a third part connected in sequence;

[0028] The first part is located on the first side of the circuit board, and the first part is connected to the electrical connection part;

[0029] The second part penetrates through the through hole;

[0030] The third part is located on the second side of the circuit board. The third part is connected to the insulating body, and the wiring part is located on the third part.

[0031] The above technical solution has the following advantages or beneficial effects: Since the circuit board is provided with a through hole, it is convenient to pass the second part of the pin through the through hole, so as to realize that the first part and the third part are respectively arranged on the first side and the second side of the circuit board, and the connection between the insulating body and the second part can improve the stability of the pin.

[0032] In one embodiment, the first part and / or the third part is bent relative to the second part.

[0033] The above technical solution has the following advantages or beneficial effects: When the first part is bent relative to the second part, the first part can be used to connect to an electrical connection part deviating from the second part. Under this structural setting, the first part fits flatly with the electrical connection part, which is beneficial to increasing the contact area between the pin and the electrical connection part and improving the connection stability between the two. The third part is bent relative to the second part, thereby reducing the distance from the wiring part located on the third part to the second side of the circuit board, and then reducing the setting thickness of the wiring terminal on the second side of the circuit board, which is beneficial to the insulating body of the wiring terminal being arranged flatly on the second side of the circuit board, thereby thinning the thickness of the backlight module so as to realize the thin design of the display device.

[0034] In one embodiment, the electrical connection part includes an annular pad arranged around the circumference of the through hole, and a partial structure of the first part is located in the surrounding space of the annular pad and is electrically connected to the annular pad.

[0035] The above technical solution has the following advantages or beneficial effects: Since the electrical connection part is an annular pad and the annular pad is arranged around the circumference of the through hole, after the first part passes through the through hole, the first part will penetrate into the middle of the annular pad. Therefore, only by injecting conductive glue or soldering tin into the middle of the annular pad, the first part can be electrically connected to the annular pad. This structure not only simplifies the connection operation, but also makes the first part of the pin not easy to loosen under the restraint of the annular pad, reducing the probability of electrical malfunction between the pin and the electrical connection part to ensure the stability of power supply or signal transmission.

[0036] On the other hand, a display device of the present application includes:

[0037] A display screen;

[0038] A backlight module, arranged on the back of the display screen, the backlight module is used to provide a backlight source for the display screen so that the display screen can display an image;

[0039] The backlight module includes:

[0040] A lamp board, the lamp board has a first surface and a second surface arranged opposite to each other, the first surface is the surface of the lamp board facing the display screen, the lamp board has a plurality of exposed electrical connection parts, and a plurality of the electrical connection parts are exposed on the first surface;

[0041] A wiring terminal, the wiring terminal includes a plurality of pins, and the pins include a lead-out part and a wiring part connected to each other;

[0042] The lead-out part is connected to the electrical connection part, and the wiring part is used for electrically connecting the wiring part of the power supply line or the signal line;

[0043] Wherein, the lead-out part is located on the first surface of the lamp board, and the wiring part is located on the second surface of the lamp board.

[0044] In the above display device, except for some structures of the wiring terminal of the backlight module that need to be exposed to be connected to the electrical connection parts on the lamp board, the other structures of the wiring terminal are set not to occupy the space on the first side of the lamp board, so as to reserve a space where a light-emitting chip can be set, so that more light-emitting chips can be set on the lamp board, which is beneficial to improving the arrangement density of the light-emitting chips.

[0045] In one embodiment, the lamp board includes a plurality of light-emitting chips, and a part of the structure of at least one light-emitting chip is located in a preset area, and the preset area is the orthographic projection area on the first surface of the lamp board of the structure of the wiring terminal located on the second surface of the lamp board.

[0046] The above technical solution has the following advantages or beneficial effects: Since the structure of the wiring terminal on the side opposite to the first surface will not interfere with the light-emitting chips arranged on the first surface, when a part of the structure of at least one light-emitting chip is set to fall into the preset area, the preset area can be used to increase the number of light-emitting chips arranged on the first surface, so as to improve the arrangement density of the light-emitting chips.

[0047] In one embodiment, the pin includes a penetrating part, the penetrating part is connected between the lead-out part and the wiring part, the penetrating part penetrates from the first surface of the lamp board to the second surface of the lamp board, and at least one of the lead-out part and the wiring part is bent relative to the penetrating part.

[0048] The above technical solution has the following advantages or beneficial effects: When the leading-out part is bent relative to the penetrating part, the leading-out part can extend towards the side where the electrical connection part is located. This setting is conducive to flatly attaching the leading-out part to the electrical connection part, increasing the electrical contact area and connection stability between the two. When the wiring part is bent relative to the penetrating part, based on the fact that the length of the pin exposed from the side of the light guide plate facing away from the first surface remains unchanged, the distance from the wiring part to the side of the light guide plate facing away from the first surface decreases, which is conducive to reducing the thickness of the backlight module at the position corresponding to the wiring terminal, so as to achieve thinning. Description of the Drawings

[0049] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following will briefly introduce the drawings required for use in the description of the embodiments or related technologies. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0050] Figure 1 Schematic three-dimensional structure diagram of the backlight module of a display device in related technologies.

[0051] Figure 2 Schematic three-dimensional structure diagram of the display device according to an embodiment of the present application.

[0052] Figure 3 Exploded structure diagram of the display device according to an embodiment of the present application.

[0053] Figure 4 Schematic three-dimensional structure diagram of the backlight module of the display device according to an embodiment of the present application.

[0054] Figure 5 Front view schematic diagram of the backlight module of the display device according to an embodiment of the present application. The dotted part in the figure shows the insulating body of the wiring terminal located on the second side of the circuit board and invisible on the first side of the circuit board.

[0055] Figure 6 For the present application Figure 5 Bottom view schematic diagram of the shown backlight module.

[0056] Figure 7 For the present application Figure 5 Left view schematic diagram of the shown backlight module.

[0057] Figure 8 Partial structure schematic diagram of the backlight module of the display device according to an embodiment of the present application.

[0058] Figure 9 Partial structure schematic diagram of the backlight module of the display device according to another embodiment of the present application.

[0059] Figure 10 The front view schematic diagram of the backlight module of the display device according to another embodiment of the present application.

[0060] Figure 11 The front view schematic diagram of the backlight module of the display device according to still another embodiment of the present application.

[0061] Figure 12 The partial structural schematic diagram of the backlight module of the display device according to another embodiment of the present application.

[0062] Figure 13 The partial structural schematic diagram of the backlight module of the display device according to still another embodiment of the present application.

[0063] Figure 14 The partial structural schematic diagram of the backlight module of the display device according to yet another embodiment of the present application.

[0064] Figure 15 The partial structural schematic diagram of the backlight module in the display device according to another embodiment of the present application.

[0065] Explanation of reference numerals:

[0066] 100, display device; 10, display screen; 20, backlight module; 21, lamp board; 21a, first surface; 211, light-emitting chip; 212, circuit board; 2121, wiring layer; 2122, electrical connection part; 2122a, annular pad; 2123, through hole; 22, terminal; 221, pin; 221a, wiring part; 221b, penetrating part; 221c, leading-out part; 222, insulating body; 223, fixing part. Detailed embodiments

[0067] In order to make the above objects, features, and advantages of the present application more obvious and understandable, the following will describe the detailed embodiments of the present application with reference to the accompanying drawings. Many specific details are set forth in the following description in order to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the essence of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0068] In the description of the present application, it should be understood that if there are terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., the orientation or positional relationship indicated by these terms is based on the orientation or positional relationship shown in the drawings. These are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0069] In addition, if there are terms such as "first" and "second", these terms are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the present application, if there is a term "plurality", the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0070] In the present application, unless otherwise clearly specified and limited, if there are terms such as "mounted", "connected", "connected to", "fixed", etc., these terms should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0071] In the present application, unless otherwise clearly specified and limited, if there is a description such as a first feature being "on" or "under" a second feature, the meaning may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0072] It should be noted that if an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there may be an intermediate element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. If present, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are only for the purpose of illustration and do not represent the only implementation.

[0073] Combined with Figure 2 As shown, the display device 100 provided in an embodiment of the present application, the display device 100 can be a device with a display function such as a television, a computer monitor, etc. The type of the display device 100 is not limited herein.

[0074] Combined with Figure 3 As shown, the display device 100 includes a display screen 1010 and a backlight module 20. The backlight module 20 is disposed on the back of the display screen 10. Herein, the back of the display screen 10 refers to the side of the display screen 10 facing away from its light-emitting surface. The backlight module 20 is used to provide a backlight source for the display screen 10 so that the display screen 10 can display an image.

[0075] Combined with Figure 4 and Figure 5 As shown, the backlight module 20 includes a lamp board 21 and a terminal block 22. The terminal block 22 is connected to the lamp board 21. The terminal block 22 is used to provide a port for accessing voltage or signal to the lamp board 21. For example, when the terminal block 22 is connected to a power supply line, the power source connected to the power supply line can supply power to the lamp board 21; correspondingly, when the terminal block 22 is connected to a signal line, the signal source connected to the signal line can transmit a signal to the lamp board 21 to adapt to controlling the luminous brightness or color of the lamp board 21.

[0076] The lamp board 21 includes a light-emitting chip 211 for emitting light. Understandably, the number of the light-emitting chips 211 is multiple so as to provide backlight in different areas on the back of the display screen 10 by using the multiple light-emitting chips 211. The lamp board 21 has a plurality of electrical connection parts 2122 for electrically leading out the multiple light-emitting chips 211. To meet the need for conveniently disposing the light-emitting chips 211 on the lamp board 21, the plurality of electrical connection parts 2122 and the light-emitting chips 211 are located on the same side of the lamp board 21. If the side where the light-emitting chips 211 are located is defined as the first side of the lamp board 21, the plurality of electrical connection parts 2122 are located on the first side of the lamp board 21.

[0077] Continue to refer to Figure 4 and Figure 5As shown, in the display device 100 according to the embodiment of the present application, except for some structures of the wiring terminal 22 that need to be exposed to be connected to the electrical connection part 2122 on the lamp board 21. Other structures of the wiring terminal 22 are arranged not to occupy the space on the first side of the lamp board 21, so as to reserve a space on the first side of the lamp board 21 where the light-emitting chips 211 can be arranged, so that more light-emitting chips 211 can be arranged on the lamp board 21, which is beneficial to improving the arrangement density of the light-emitting chips 211.

[0078] Combined with Figure 5 and Figure 6 As shown, the lamp board 21 includes a circuit board 212, and the circuit board 212 has a first side and a second side that face away from each other. A plurality of light-emitting chips 211 are arranged at intervals on the first side of the circuit board 212. It can be understood that the first side of the circuit board 212 faces the display screen 10. The circuit board 212 has a wiring layer 2121, and the wiring layer 2121 has a plurality of electrical connection parts 2122, and the plurality of electrical connection parts 2122 are arranged side by side and exposed on the first side of the circuit board 212.

[0079] Combined with Figures 5 to 7 As shown, the wiring terminal 22 has pins 221 and an insulating body 222. The number of the pins 221 is multiple, and the multiple pins 221 are arranged on the insulating body 222, and the multiple pins 221 are correspondingly connected to the multiple electrical connection parts 2122.

[0080] The pin 221 has a wiring part 221a, and the wiring part 221a is used for electrically connecting a power supply line or a signal line, so that the pin 221 can supply power to or transmit signals to the multiple light-emitting chips 211 through the wiring layer 2121. The wiring layer 2121 electrically connects the multiple light-emitting chips 211 on the circuit board 212 and serves as a voltage or signal access point in the form of the electrical connection part 2122. Therefore, only by correspondingly connecting the multiple pins 221 of the wiring terminal 22 to the multiple electrical connection parts 2122, power can be supplied to or signals can be transmitted to the multiple light-emitting chips 211.

[0081] The pin 221 penetrates through the circuit board 212, the wiring part 221a and the insulating body 222 are connected to each other, and both the wiring part 221a and the insulating body 222 are located on the second side of the circuit board 212.

[0082] In this embodiment, the insulating body 222 is connected to the second side of the circuit board 212, so as not to occupy the installation space on the first side of the circuit board 212. In this way, more space can be reserved on the first side of the circuit board 212 for arranging the light-emitting chips 211. Compared with the conventional technology in which the wiring terminal 22 is integrally arranged on the first side of the circuit board 212 to be connected to the electrical connection portion 2122 exposed on the first side of the circuit board 212, in the display device 100 according to the embodiment of the present application, the pin 221 is passed through to the second side of the circuit board 212 and the insulating body 222 of the wiring terminal 22 is arranged on the second side of the circuit board 212, so as to reserve the space occupied by the insulating body 222 on the first side of the circuit board 212, so as to use this space to arrange the light-emitting chips 211, and then more light-emitting chips 211 can be arranged on the first side of the circuit board 212, which is beneficial to improving the arrangement density of the light-emitting chips 211.

[0083] It should be noted that components such as inductors, capacitors or resistors with volumes smaller than that of the wiring terminal 22 can be arranged at the gap positions between the light-emitting chips 211 on the first side of the circuit board 212, so as to make full use of the gaps between the light-emitting chips 211 to arrange these components to meet the control requirements for the light-emitting chips 211 on the circuit board 212.

[0084] The material of the insulating body 222 can be configured as needed and is not limited herein. For example, in some embodiments, the material of the insulating body 222 is PE (Polyethylene), PC (Polycarbonate), PET (Polyethylene terephthalate), PVC (Polyvinyl chloride) or PP (Polypropylene), etc.

[0085] Refer to again Figure 5 As shown, in some embodiments, a part of the structure of at least one light-emitting chip 211 falls within the orthographic projection area of the insulating body 222 on the first side of the circuit board 212. In this way, a part of the structure of at least one light-emitting chip 211 and the insulating body 222 are located at opposite positions in the thickness direction of the circuit board 212, so as to use the space reserved at the position corresponding to the insulating body 222 on the first side of the circuit board 212 to arrange the light-emitting chips 211, and then the number of light-emitting chips 211 arranged on the first side of the circuit board 212 can be increased to improve the arrangement density of the light-emitting chips 211.

[0086] Continue to refer to Figure 5As shown, a plurality of light-emitting chips 211 may be arranged in a rectangular array, and a plurality of electrical connection portions 2122 are provided between adjacent two columns or adjacent two rows of light-emitting chips 211. Understandably, since a plurality of pins 221 of the wiring terminal 22 are connected to the plurality of electrical connection portions 2122, the connection positions of the plurality of pins 221 of the wiring terminal 22 with the circuit board 212 are also located between adjacent two columns or adjacent two rows of light-emitting chips 211.

[0087] Thus, in the embodiment of the present application, only the portion of the pin 221 exposed from the first side of the circuit board 212 will occupy the setting space on the first side of the circuit board 212, while the insulating body 222 of the wiring terminal 22 is arranged on the second side of the circuit board 212. In this way, the space vacated at the position corresponding to the insulating body 222 on the first side of the circuit board 212 can make the light-emitting chips 211 on both sides of the electrical connection portion 2122 be arranged more compactly, thereby realizing an increase in the arrangement density of the light-emitting chips 211.

[0088] In some embodiments, based on arranging the insulating body 222 of the wiring terminal 22 on the second side of the circuit board 212 to reduce the space occupation on the first side of the circuit board 212, the display device of the present application can reduce the distance between the light-emitting chips 211 to 13.5 mm, which is beneficial to improving the backlight zoning effect, and thus is beneficial to enhancing the fineness of the display screen of the display device.

[0089] In some embodiments, the wiring terminal 22 is not limited to being arranged in the middle area corresponding to the circuit board 212, and may also be arranged in the edge area of the circuit board 212.

[0090] For example, the edge contour of the circuit board 212 is rectangular, that is, the circuit board 212 includes four edges that are connected end to end to enclose a rectangle. Since the wiring terminal 22 supplies power to or transmits signals to the circuit board 212 by connecting a power supply line or a signal line, arranging a plurality of electrical connection portions 2122 along one side edge of the circuit board 212 can enable the pins 221 corresponding to the electrical connection portions 2122 to adapt to the need of arranging a power supply line or a signal line at the edge of the corresponding circuit board 212.

[0091] The setting position of the wiring terminal 22 on the circuit board 212 and the exposed position of the electrical connection portion 2122 from the first side of the circuit board 212 can be configured according to actual needs, and are not limited herein.

[0092] It should be noted that even if the electrical connection part 2122 is arranged along one side edge of the circuit board 212, since only multiple pins 221 of the terminal 22 are exposed from the first side of the circuit board 212 to meet the connection requirement with the electrical connection part 2122, and other structures of the terminal 22 such as the insulating body 222 are arranged on the second side of the circuit board 212, therefore, a space for arranging the light-emitting chip 211 is reserved at the position of the first side of the circuit board 212 corresponding to the insulating body 222, and then the effect of improving the arrangement density of the light-emitting chip 211 can also be achieved.

[0093] Combined with Figure 8 As shown, a plurality of through holes 2123 penetrating the first side and the second side of the circuit board 212 are formed on the circuit board 212, and the pin 221 has a penetrating part 221b penetrating through the through hole 2123. When installing the terminal 22 on the circuit board 212, the pin 221 can be penetrated from the second side of the circuit board 212 through the through hole 2123 to the first side of the circuit board 212. In this way, by using the method of the penetrating part 221b penetrating through the through hole 2123, the assembly efficiency of the pin 221 and the circuit board 212 is improved, and the pre-fixing of the pin 221 and the circuit board 212 is realized, so as to facilitate the connection of the pin 221 with the electrical connection part 2122 exposed on the first side of the circuit board 212.

[0094] It should be noted that the connection between the pin 221 and the electrical connection part 2122 can be welding or connected by conductive adhesive, as long as the pin 221 of the terminal 22 can be connected with the electrical connection part 2122 so as to connect the power supply line or signal line on the second side of the circuit board 212. The connection method between the pin 221 and the electrical connection part 2122 is not limited herein.

[0095] The wiring part 221a is bent relative to the penetrating part 221b to reduce the distance from the wiring part 221a to the second side of the circuit board 212, and then reduce the setting thickness of the terminal 22 on the second side of the circuit board 212, so as to facilitate the insulating body 222 of the terminal 22 to be arranged in a flat shape on the second side of the circuit board 212, thereby thinning the thickness of the backlight module 20 and realizing the thin design of the display device 100.

[0096] It should be noted that the connection position between the electrical connection part 2122 and the pin 221 can be at the through hole 2123. For example, combined with Figure 8 As shown, a part of the structure of the pin 221 is bent relative to the penetrating part 221b and connected to the electrical connection part 2122. This bending method of the pin 221 can make the pin 221 fit as flat as possible with the electrical connection part 2122, so as to increase the contact area between the pin 221 and the electrical connection part 2122 and improve the connection stability between the two.

[0097] In some embodiments, the connection position between the electrical connection portion 2122 and the pin 221 may also be located outside the through hole 2123.

[0098] For example, as shown in Figure 9 In some embodiments, the electrical connection portion 2122 includes an annular pad 2122a disposed around the circumferential side of the through hole 2123, and a partial structure of the pin 221 is located within the surrounding space of the annular pad 2122a and is electrically connected to the annular pad 2122a.

[0099] In this embodiment, since the electrical connection portion 2122 is the annular pad 2122a and the annular pad 2122a is disposed around the circumferential side of the through hole 2123, after the pin 221 passes through the through hole 2123, the pin 221 will penetrate into the middle of the annular pad 2122a. Therefore, only by injecting conductive adhesive or soldering at the middle of the annular pad 2122a, the pin 221 can be electrically connected to the annular pad 2122a. This structure not only simplifies the connection operation, but also the pin 221 is not easily loosened under the restraint of the annular pad 2122a, reducing the probability of electrical malfunction between the pin 221 and the electrical connection portion 2122 to ensure the stability of power supply or signal transmission.

[0100] As shown in Figure 10 In some embodiments, the insulating body 222 is provided with a plurality of fixing members 223, and the insulating body 222 is fixed to the second side of the circuit board 212 through the plurality of fixing members 223. The plurality of fixing members 223 are disposed on the second side of the circuit board 212, so as not to occupy the setting space on the first side of the circuit board 212, which is beneficial to arranging more light-emitting chips 211 on the first side of the circuit board 212.

[0101] In this embodiment, the plurality of fixing members 223 can provide a good fixing effect on the insulating body 222, thereby preventing the insulating body 222 from loosening relative to the circuit board 212 and affecting the connection stability between the pin 221 on the insulating body 222 and the electrical connection portion 2122. Therefore, in this embodiment, the structural arrangement of the plurality of fixing members 223, on the one hand, does not occupy the setting space on the first side of the circuit board 212, and on the other hand, can improve the connection stability between the pin 221 and the electrical connection portion 2122, which is beneficial to improving the stability of the connection terminal 22 for power supply or signal transmission to the circuit board 212.

[0102] It should be noted that there are various possible ways to fix the fixing member 223 to the second side of the circuit board 212. For example, in some embodiments, a plurality of fixing members 223 are fixed to the second side of the circuit board 212 by glue or solder. Fixing the fixing member 223 to the second side of the circuit board 212 by using glue or solder is not only firm, but also convenient to operate and easy to disassemble, thereby facilitating the quick replacement of the wiring terminal 22. The glue can be hot melt glue. In this way, when the wiring terminal 22 needs to be replaced, only the connection position between the fixing member 223 and the circuit board 212 needs to be heated to melt the hot melt glue, and the connection between the fixing member 223 and the circuit board 212 can be released. It should be noted here that in order to facilitate the connection between the fixing member 223 and the circuit board 212, a glue dispensing part or a welding part can be provided at the position of the circuit board 212 corresponding to the fixing member 223 on the second side.

[0103] It should be noted that based on the inventive concept of the present application, the structure of the display device 100 includes but is not limited to the structure of the above embodiments.

[0104] For example, as shown in Figure 11 FIG. 8, a display device 100 provided in another embodiment of the present application includes a lamp board 21 and a wiring terminal 22. The lamp board 21 includes a first surface 21a provided with a plurality of light-emitting chips 211. Understandably, the lamp board 21 has a second surface, and the second surface is disposed opposite to the first surface 21a. The lamp board 21 has a plurality of electrical connection portions 2122 exposed on the side where the first surface 21a is located. The wiring terminal 22 includes a plurality of pins 221 provided. The pins 221 have a lead-out portion 221c connected to the electrical connection portion 2122 and a wiring portion 221a for electrically connecting a power supply line or a signal line. The plurality of pins 221 are connected to the plurality of electrical connection portions 2122 through the corresponding lead-out portions 221c. The wiring portion 221a and the lead-out portion 221c are located on opposite sides of the lamp board 21.

[0105] Other parts of the wiring terminal 22 except the lead-out portion 221c for connecting the electrical connection portion 2122 do not occupy the space on the side where the first surface 21a is located, so as to reserve a space for arranging the light-emitting chips 211 on the side where the first surface 21a is located.

[0106] In this embodiment, except for the lead-out portion 221c used to connect the electrical connection portion 2122, other parts of the terminal 22 do not occupy the space on the side where the first surface 21a is located. Subsequently, while ensuring the connection requirement between the lead-out portion 221c and the electrical connection portion 2122, the occupation of the first surface 21a of the lamp board 21 by the terminal 22 can be minimized as much as possible. In this way, for the first surface 21a with a certain area, the terminal 22 can be changed from being entirely arranged on the first surface 21a in the related art to only partially arranged on the first surface 21a, so that the first surface 21a can provide more areas for arranging the light-emitting chips 211, which is beneficial to improving the arrangement density of the light-emitting chips 211.

[0107] It should be noted that the shape of the pin 221 is not limited herein. For example, in some embodiments, the pin 221 includes a first portion, a second portion, and a third portion connected in sequence. The first portion is located on the first side of the circuit board 212, and the first portion is connected to the electrical connection portion 2122. The second portion passes through the through hole 2123. The third portion is located on the second side of the circuit board 212, and the third portion is connected to the insulating body 222, and the wiring portion 221a is located on the third portion.

[0108] The above technical solution has the following advantages or beneficial effects: Since the circuit board 212 is provided with the through hole 2123, it is convenient to pass the second portion of the pin 221 through the through hole 2123, so as to realize that the first portion and the third portion are respectively arranged on the first side and the second side of the circuit board 212, and the connection between the insulating body 222 and the second portion can improve the stability of the pin 221.

[0109] In some embodiments, the first portion and / or the third portion is / are bent relative to the second portion.

[0110] Among them, when the first portion is bent relative to the second portion, the first portion can be used to connect to the electrical connection portion 2122 that deviates from the second portion. Under this structural setting, the first portion is flatly attached to the electrical connection portion 2122, which is beneficial to increasing the contact area between the pin 221 and the electrical connection portion 2122 and improving the connection stability between the two.

[0111] The third portion is bent relative to the second portion, thereby reducing the distance from the wiring portion 221a located on the third portion to the second side of the circuit board 212, and then reducing the setting thickness of the terminal 22 on the second side of the circuit board 212, which is beneficial to arranging the insulating body 222 of the terminal 22 in a flat shape on the second side of the circuit board 212, thereby thinning the thickness of the backlight module 20, so as to realize the thin design of the display device 100.

[0112] Understandably, in an embodiment where the pin 221 includes a wiring portion 221a, a penetrating portion 221b, and a lead-out portion 221c, the lead-out portion 221c is located in the first portion, the penetrating portion 221b constitutes the second portion, and the wiring portion 221a is located in the third portion.

[0113] Combined with Figure 12 As shown, a partial structure of at least one light-emitting chip 211 falls within a preset area, and the preset area is the orthographic projection area on the first surface 21a of the structure of the wiring terminal 22 on the side facing away from the first surface 21a. Since the structure of the wiring terminal 22 on the side facing away from the first surface 21a will not interfere with the light-emitting chip 211 provided on the first surface 21, when a partial structure of at least one light-emitting chip 211 is set to fall within the preset area, the preset area can be utilized to increase the number of light-emitting chips 211 provided on the first surface 21a, so as to improve the arrangement density of the light-emitting chips 211.

[0114] Continuing to refer to Figure 12 As shown, in some embodiments, the pin 221 has a penetrating portion 221b penetrating through the lamp board 21, and at least one of the lead-out portion 221c and the wiring portion 221a is bent relative to the penetrating portion 221b. Among them, when the lead-out portion 221c is bent relative to the penetrating portion 221b, the lead-out portion 221c can extend toward the side where the electrical connection portion 2122 is located. This setting is beneficial to flatly attach the lead-out portion 221c to the electrical connection portion 2122, increasing the electrical contact area and connection stability between the two. When the wiring portion 221a is bent relative to the penetrating portion 221b, based on the condition that the length of the pin 221 exposed from the side of the lamp board 21 facing away from the first surface 21a remains unchanged, the distance from the wiring portion 221a to the side of the lamp board 21 facing away from the first surface 21a is reduced, which is beneficial to thinning the thickness of the backlight module 20 at the position corresponding to the wiring terminal 22, so as to achieve thinning.

[0115] It should be noted that, as Figure 12 and Figure 13 shown, when both the lead-out portion 221c and the wiring portion 221a are bent relative to the penetrating portion 221b, the lead-out portion 221c and the wiring portion 221a can be bent in opposite directions. Combined with Figure 15 shown, the lead-out portion 221c and the wiring portion 221a can also be bent in the same direction. In some embodiments, as Figure 13 shown, the shape formed by bending the pin 221 of the lead-out portion 221c can be a "Z" shape. Combined with Figure 14 shown, the shape formed by bending the pin 221 of the lead-out portion 221c can be an "L" shape. Combined with Figure 15As shown, the pin 221 of the lead-out portion 221c may be bent into a shape of "匚". The shapes of the connection terminal 22 and the pin 221 are not limited here.

[0116] The pin 221 may be fixedly connected to the lamp board 21 through the insulating body 222. In some embodiments, the pin 221 may be directly integrally formed on the lamp board 21 when the lamp board 21 is manufactured, thereby simplifying the process of installing the terminal block 22.

[0117] See again Figure 11 As shown, in this embodiment, the plurality of light-emitting chips 211 may be arranged in a rectangular array, and the plurality of electrical connection portions 2122 are disposed between two adjacent columns or two adjacent rows of light-emitting chips 211. Since the plurality of pins 221 of the wiring terminal 22 are connected to the plurality of electrical connection portions 2122, the connection positions of the plurality of pins 221 of the wiring terminal 22 and the light board 21 are also located between two adjacent columns or two adjacent rows of light-emitting chips 211. It can be seen that in this embodiment of the present application, only the portion of the pins 221 exposed from the first surface 21a of the light board 21 will occupy the setting space of the first surface 21a of the light board 21, and the other structures of the wiring terminal 22 do not occupy the space on the side where the first surface 21a is located, so that when the plurality of electrical connection portions 2122 are disposed between two adjacent columns or two adjacent rows of light-emitting chips 211, the light-emitting chips 211 located on both sides of the electrical connection portions 2122 can be arranged more compactly, thereby achieving an increase in the arrangement density of the light-emitting chips 211. In some embodiments, based on the fact that, except for the lead-out portion 221c of the wiring terminal 22 for connecting the electrical connection portion 2122, other portions of the wiring terminal 22 do not occupy the space on the side where the first surface 21a of the light board 21 is located, thereby reducing the space occupied by the first surface 21a of the light board 21. The display device of the present application can reduce the spacing between the light-emitting chips 211 to 13.5 mm, so as to improve the backlight zoning effect, thereby helping to enhance the fineness of the display image of the display device.

[0118] In other embodiments, the edge profile of the light board 21 is rectangular, and the plurality of electrical connection parts 2122 are arranged along one side edge of the light board 21. Since the connection terminal 22 supplies power to the light board 21 or transmits signals by connecting the power supply line or the signal line, the plurality of electrical connection parts 2122 are arranged along one side edge of the light board 21, so that the pins 221 corresponding to the electrical connection parts 2122 can meet the need of arranging the power supply line or the signal line at the edge of the corresponding light board 21.

[0119] It should be noted that components such as inductors, capacitors or resistors with a volume smaller than that of the terminal 22 can be arranged at the gap positions between the light-emitting chips 211 on the first surface 21a of the light board 21, so as to make full use of the gaps between the light-emitting chips 211 to arrange these components to meet the control requirements for the light-emitting chips 211 on the light board 21.

[0120] In the embodiments of the present application, the number and arrangement pitch of the light-emitting chips 211 can be set according to actual needs. For example, in some embodiments, the light board 21 is provided with light-emitting chips 211 arranged in an M×N array, where M represents the number of rows of the light-emitting chips 211, N represents the number of columns of the light-emitting chips 211, and both M and N are positive integers. Exemplarily, when M is 20 and N is 50, the light-emitting chips 211 on the light board 21 are arranged in 20 rows × 50 columns.

[0121] The number of the electrical connection parts 2122 and the corresponding pins 221 connected thereto can be configured according to actual needs and will not be limited herein. For example, in some embodiments, the number of the electrical connection parts 2122 is 5 to 15; correspondingly, the terminal 22 has an appropriate number of pins 221 to be correspondingly connected to the electrical connection parts 2122. It should be noted that in some embodiments, the pins 221 can be connected to the electrical connection parts 2122 one by one, or in a one-to-many or many-to-one manner, as long as the terminal 22 can connect the power supply line or signal line to the light board 21 to supply power to or transmit signals to multiple light-emitting chips 211.

[0122] The light-emitting chips 211 can be Mini LED chips or Micro LED chips. The type of the light-emitting chips 211 is not limited herein. Mini LED chips and Micro LED chips have the characteristics of small volume, high efficiency, long life, environmental protection and low energy consumption, which is conducive to arranging a larger number of light-emitting chips 211 when the area of the light board 21 is fixed, so as to realize more backlight zones and improve the fineness of the picture displayed by the display device.

[0123] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered to be within the scope described in this specification.

[0124] The above embodiments merely represent several implementation manners of the present application. The description thereof is relatively specific and detailed, but it should not be construed as a limitation on the patent scope of the present application. It should be noted that for those of ordinary skill in the art, without departing from the inventive concept of the present application, several modifications and improvements can still be made, and these all fall within the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.

Claims

1. A display device, characterized in that, Comprising: A display screen; A backlight module, disposed on the back of the display screen, the backlight module being configured to provide a backlight source for the display screen such that the display screen can display an image; The backlight module includes a lamp board and a terminal block; The lamp board includes: A circuit board having a first side and a second side disposed opposite to each other, the first side being the side of the circuit board facing the display screen, the circuit board having a wiring layer with a plurality of electrical connection portions, and a plurality of the electrical connection portions being exposed on the first side of the circuit board; Light-emitting chips disposed on the first side of the circuit board; The terminal block includes an insulating body and a plurality of pins; A plurality of the pins are disposed on the insulating body, and a plurality of the pins are correspondingly connected to a plurality of the electrical connection portions; The pin has a wiring portion for electrically connecting a power supply line or a signal line; Wherein, the pin penetrates through the circuit board, the wiring portion and the insulating body are connected to each other, and both the wiring portion and the insulating body are located on the second side of the circuit board.

2. The display device according to claim 1, wherein There are a plurality of the light-emitting chips, and a partial structure of at least one of the light-emitting chips is located within a region of a positive projection of the insulating body on the first side of the circuit board.

3. The display device according to claim 2, characterized in that, The plurality of light-emitting chips are arranged in a rectangular array, and the plurality of electrical connection portions are disposed between adjacent two columns or adjacent two rows of light-emitting chips.

4. The display device according to claim 2, wherein The edge contour of the circuit board is rectangular, and the plurality of electrical connection portions are disposed along one side edge of the circuit board.

5. The display device according to any one of claims 1-4, characterized in that, The insulating body is provided with a plurality of fixing members, and the insulating body is fixed to the second side of the circuit board through the plurality of fixing members.

6. The display device according to any one of claims 1-4, characterized in that, Through holes are provided on the circuit board, and the through holes penetrate from the first side of the circuit board to the second side of the circuit board; The pin includes a first portion, a second portion, and a third portion connected in sequence; The first portion is located on the first side of the circuit board and is connected to the electrical connection portion; The second portion penetrates through the through hole; The third portion is located on the second side of the circuit board and is connected to the insulating body, and the wiring portion is located on the third portion.

7. The display device according to claim 6, wherein The first portion and / or the third portion is bent relative to the second portion.

8. The display device according to claim 7, wherein, The electrical connection portion includes an annular pad disposed around the circumference of the through hole, and a partial structure of the first portion is located within a surrounding space of the annular pad and is electrically connected to the annular pad.

9. A display device, characterized in that, Comprising: A display screen; A backlight module, disposed on the back of the display screen, the backlight module being configured to provide a backlight source for the display screen such that the display screen can display an image; The backlight module includes: A lamp board having a first surface and a second surface disposed opposite to each other, the first surface being the surface of the lamp board facing the display screen, the lamp board having a plurality of exposed electrical connection portions, and a plurality of the electrical connection portions being exposed on the first surface; A terminal block, the terminal block including a plurality of pins, and the pin including a lead-out portion and a wiring portion connected to each other; The lead-out portion is connected to the electrical connection portion, and the wiring portion is for electrically connecting a power supply line or a signal line; Wherein, the lead-out part is located on the first surface of the lamp board, and the wiring part is located on the second surface of the lamp board.

10. The display device according to claim 9, characterized in that, The lamp board includes a plurality of light-emitting chips, and a partial structure of at least one of the light-emitting chips is located within a preset area, and the preset area is the orthographic projection area on the first surface of the lamp board of the structure of the wiring terminal located on the second surface of the lamp board.

11. The display device according to claim 9 or 10, characterized in that, The pin includes a penetrating part, the penetrating part is connected between the lead-out part and the wiring part, the penetrating part penetrates from the first surface of the lamp board to the second surface of the lamp board, and at least one of the lead-out part and the wiring part is bent relative to the penetrating part.

Citation Information

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