Sensing insole with flexible stress structure

By introducing flexible stress structure and pressure sensors into the insole, the problem of poor fit between traditional insoles and feet is solved, accurate monitoring of foot pressure and data collection is achieved, and comfort and data accuracy are improved.

CN223111151UActive Publication Date: 2025-07-18LULIANG UNIV
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Patent Information

Application Number
CN202422178618.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-05
Publication Date
2025-07-18
Estimated Expiration
2034-09-05

AI Technical Summary

Technical Problem

The existing insoles cannot fit well with the foot, resulting in inaccurate pressure data received by the sensor, affecting the analysis of the foot's movement status and stress conditions.

Method used

A sensing insole with a flexible stress structure is designed, including irregular annular edging, grooved, sweat-absorbing pad, buffer layer, rebound pad and airbag. Flexible support is provided through the airbag and rebound pad, and combined with the pressure sensing structure and chip hardware to achieve accurate monitoring of sole pressure.

Benefits of technology

It realizes a personalized fit between the sensor insole and the foot, accurately monitors the pressure changes of the sole of the foot, reduces foot fatigue, and improves the accuracy of pressure data and the stability of the sensor.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a sensing insole with a flexible stress structure, which comprises a covered edge, the covered edge is of an irregular annular structure, the sensing insole further comprises an open groove, the open groove is arranged on the side surface of the covered edge, the covered edge is connected with the flexible stress structure, and the flexible stress structure is arranged in the open groove. The flexible stress structure can flexibly support the foot sole through the rebound pad when the sweat absorbing pad is pressed, the flexible stress structure comprises the sweat absorbing pad, the sweat absorbing pad is fixedly installed on the surface of the inner wall of the covered edge, the lower surface of the sweat absorbing pad is connected with a buffer layer, the upper surface of the buffer layer is connected with the rebound pad in an embedded mode, and the rebound pad is fixedly installed on the lower surface of the buffer layer. And an air bag is fixedly mounted on the surface of the inner wall of the springback pad. According to the sensing insole with the flexible stress structure, the flexible stress structure is arranged, the sole can be supported during walking through the rebound pad, meanwhile, accurate pressure change conditions are provided for the pressure sensing points, and chip hardware in the interlayer bag of the pressure sensing structure can be replaced according to requirements.
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Description

Technical Field

[0001] The utility model relates to the technical field of insoles, in particular to a sensing insole provided with a flexible force-bearing structure. Background Technique

[0002] An insole is an item placed inside a shoe, which reduces the impact on the feet during walking and exercise, protects the foot joints and bones, makes the shoe fit the foot better, relieves foot fatigue. For shoes that are slightly too large, the insole can fill the gap and make the shoe fit better.

[0003] For patients with foot injuries or foot diseases, doctors can use sensing insoles to monitor the foot force and movement state of patients during the rehabilitation process. Ordinary insoles cannot be adjusted according to the shape and movement state of the feet, cannot fit well with the feet, may slide inside the shoe, affecting the wearing stability and comfort, making the pressure data received by the sensor inaccurate, and also causing deviations in the analysis of the foot movement state and force condition. Content of the Utility Model

[0004] The purpose of the utility model is to provide a sensing insole provided with a flexible force-bearing structure to solve the problem that the ordinary insole in the above background technique cannot fit well with the feet, resulting in inaccurate pressure data received by the sensor.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A sensing insole provided with a flexible force-bearing structure, including a side edge, the side edge is set as an irregular annular structure, and also includes a slot, the side surface of the side edge is provided with a slot, the side edge is connected with a flexible force-bearing structure, and the flexible force-bearing structure can flexibly support the sole of the foot through a resilient pad when the sweat-absorbing pad is pressed.

[0006] Preferably, the flexible force-bearing structure includes a sweat-absorbing pad, the sweat-absorbing pad is fixedly installed on the inner wall surface of the side edge, the lower surface of the sweat-absorbing pad is connected with a buffer layer, the upper surface of the buffer layer is embedded with a resilient pad, and an airbag is fixedly installed on the inner wall surface of the resilient pad. The airbag is set as an elliptical cylindrical structure, and a plurality of airbags are installed at equal intervals.

[0007] By adopting the above technical solution, the pressure on the sole of the foot is buffered by the airbag, which is convenient for the pressure sensing point to monitor the pressure.

[0008] Preferably, the resilient pad is set as an irregular shape, and there are 3 resilient pads.

[0009] By adopting the above technical solution, the 3 resilient pads respectively correspond to the front sole, the center of the foot and the heel.

[0010] Preferably, an isolation film is fixedly connected to the lower surface of the buffer layer, and the isolation film is made of an insulating material.

[0011] With the above technical solution, the sensing layer and the buffer layer are isolated by the isolation film.

[0012] Preferably, the edge binding is further connected with a pressure sensing structure, and the pressure sensing structure can be connected to the pressure sensing points through the chip hardware installed inside the sandwich bag to receive pressure data.

[0013] With the above technical solution, the chip hardware transmits the pressure data.

[0014] Preferably, the pressure sensing structure includes a sensing layer. An isolation film is covered and connected to the upper surface of the sensing layer. A plurality of pressure sensing points are arranged on the upper surface of the sensing layer. A sandwich bag is arranged on the upper surface of the sensing layer. A chip hardware is installed inside the sandwich bag, and the chip hardware is connected to the pressure sensing points. The lower surface of the sensing layer is connected with a wear-resistant layer. The wear-resistant layer is fixedly installed on the inner wall surface of the edge binding, and the lower surface of the wear-resistant layer is flush with the lower surface of the edge binding.

[0015] With the above technical solution, the pressure sensing points can be evenly stressed to collect the pressure conditions.

[0016] Preferably, the side surface opening of the sandwich bag corresponds to the slot.

[0017] With the above technical solution, it is convenient for chip installation.

[0018] Compared with the prior art, the beneficial effects of the present invention are as follows: The sensing insole provided with a flexible force-bearing structure:

[0019] 1. The sensing insole is provided with a flexible force-bearing structure. When walking, the sole of the foot will sequentially press three rebound pads, which can effectively absorb the impact force generated during walking or exercise, provide comfortable support for the feet, and reduce foot fatigue and pain;

[0020] 2. Further, an airbag is arranged inside the rebound pad, so that the sweat-absorbing pad is flexibly attached to the sole of the foot, and can be adaptively adjusted according to the shape and movement state of the foot. Through the airbag, the sensing layer can also be evenly stressed, and the pressure data of each part can be accurately obtained;

[0021] 3. Further, through the pressure sensing points of the pressure sensing structure, abnormal changes in foot pressure can be detected in time. By receiving the pressure sensing data through the chip hardware, the movement can be adjusted in time according to the feedback of the pressure data. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the axonometric surface structure of the present invention;

[0023] Figure 2 Schematic diagram of the axonometric surface structure of the buffer layer of the present utility model;

[0024] Figure 3 Schematic diagram of the side sectional structure of the buffer layer of the present utility model;

[0025] Figure 4 Schematic diagram of the axonometric surface structure of the sensing layer of the present utility model;

[0026] Figure 5 Schematic diagram of the front sectional structure of the rebound pad of the present utility model;

[0027] Figure 6 Schematic diagram of the explosion structure of the present utility model.

[0028] In the figure: 1, edge wrapping; 2, slotting; 3, sweat-absorbing pad; 4, buffer layer; 5, rebound pad; 6, airbag; 7, isolation film; 8, sensing layer; 9, pressure sensing point; 10, interlayer bag; 11, wear-resistant layer. Specific embodiments

[0029] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0030] Please refer to Figure 1-6 , the present utility model provides a technical solution: a sensing insole provided with a flexible force-bearing structure, including an edge wrapping 1, a slotting 2, a sweat-absorbing pad 3, a buffer layer 4, a rebound pad 5, an airbag 6, an isolation film 7, a sensing layer 8, a pressure sensing point 9, an interlayer bag 10, and a wear-resistant layer 11.

[0031] Embodiment 1: The sensing insole is provided with a flexible force-bearing structure, so that the sweat-absorbing pad 3 fits with the rubber pad to protect the feet. Specifically:

[0032] The edge wrapping 1 is set as an irregular annular structure, and further includes a slot 2. The side surface of the edge wrapping 1 is provided with the slot 2. The edge wrapping 1 is connected with a flexible force-bearing structure, and the flexible force-bearing structure can flexibly support the sole of the foot through a rebound pad 5 when the sweat-absorbing pad 3 is pressed. The flexible force-bearing structure includes a sweat-absorbing pad 3, and the sweat-absorbing pad 3 is fixedly installed on the inner wall surface of the edge wrapping 1. The lower surface of the sweat-absorbing pad 3 is connected with a buffer layer 4, and a rebound pad 5 is embedded and connected to the upper surface of the buffer layer 4. An airbag 6 is fixedly installed on the inner wall surface of the rebound pad 5. The airbag 6 is set as an elliptical cylindrical structure, and a plurality of airbags 6 are installed at equal intervals. The rebound pad 5 is set as an irregular shape, and there are 3 rebound pads 5;

[0033] The sensing insole is provided with a sweat-absorbing pad 3. The sweat-absorbing pad 3 is arranged on the uppermost layer of the inner wall surface of the edge wrapping 1. The sweat-absorbing pad 3 can quickly absorb the sweat generated by the feet, avoid the accumulation of sweat between the insole and the feet, so as to keep the feet dry. A buffer layer 4 is connected to the lower surface of the sweat-absorbing pad 3. The rebound pads 5 embedded and installed on the upper surface of the buffer layer 4 correspond to the forefoot, the arch of the foot and the heel respectively. When walking, the rebound pads 5 will be squeezed in turn, so that the rebound pads 5 reduce the burden on the feet during exercise. The buffer layer 4 and the rebound pads 5 can effectively absorb and disperse these impact forces, reduce the damage to the foot joints, bones and soft tissues, and an airbag 6 is installed on the inner wall of the rebound pad 5. As Figure 5 shown, the airbag 6 can be adaptively adjusted according to the foot shapes and pressure distributions of different people. When the foot steps on the insole, the airbag 6 will deform according to the magnitude and direction of the pressure, so as to provide a more fitting and personalized support for the foot. During exercise, the shape and force-bearing conditions of the foot will change continuously, and the airbag 6 can respond to these changes in real time, providing dynamic support, so that the pressure sensing structure collects pressure more accurately.

[0034] Embodiment 2: The sensing insole is further provided with a pressure sensing structure, which can monitor the sole pressure in real time. Specifically:

[0035] The lower surface of the buffer layer 4 is fixedly connected with an isolation film 7. The isolation film 7 is made of an insulating material. The edge wrapping 1 is also connected with a pressure sensing structure. The pressure sensing structure can be connected to the pressure sensing points 9 through the chip hardware installed inside the sandwich bag 10 to receive pressure data. The pressure sensing structure includes a sensing layer 8. An isolation film 7 is covered and connected to the upper surface of the sensing layer 8. A plurality of pressure sensing points 9 are arranged on the upper surface of the sensing layer 8. A sandwich bag 10 is arranged on the upper surface of the sensing layer 8. A chip hardware is installed inside the sandwich bag 10, and the chip hardware is connected to the pressure sensing points 9. The lower surface of the sensing layer 8 is connected with a wear-resistant layer 11. The wear-resistant layer 11 is fixedly installed on the inner wall surface of the edge wrapping 1, and the lower surface of the wear-resistant layer 11 is flush with the lower surface of the edge wrapping 1. The side surface opening of the sandwich bag 10 corresponds to the slot 2;

[0036] Furthermore, the isolation film 7 fixedly connected to the lower surface of the buffer layer 4 covers the upper surface of the sensing layer 8. The isolation film 7 can effectively block external conductive substances and prevent them from directly contacting the electronic components in the sensing layer 8, thereby reducing the risk of short circuit. When the foot moves on the insole, friction and extrusion may occur. The isolation film 7 can play a certain physical protection role, reducing the wear of the external factors on the electronic components on the upper surface of the sensing layer 8. The isolation film 7 can buffer these acting forces and extend the service life of the electronic components. A plurality of pressure sensing points 9 are arranged on the upper surface of the sensing layer 8, which can quickly and accurately transmit the sensed pressure signals to the chip in the sandwich bag 10. The chip hardware is installed in the sandwich bag 10, and the position of the sandwich bag 10 is under the sole of the foot, ensuring the reliability and stability of the pressure signal transmission. The connection between the pressure sensing point 9 and the chip adopts advanced electronic technologies and designs, which can effectively reduce signal interference and data loss. Even in complex usage environments, such as severe vibrations and sweating during exercise, it can ensure the accurate transmission and processing of pressure data. The side surface opening of the sandwich bag 10 corresponds to the slot 2, enabling the chip hardware to be replaced according to different requirements and application scenarios. Finally, a wear-resistant layer 11 is provided on the bottom surface, which has a certain roughness or anti-slip performance, can increase the friction between the insole and the inner bottom surface of the shoe, and make the insole more stable in the shoe and not prone to displacement.

[0037] Working principle: When using the sensing insole provided with the flexible force-bearing structure, the flexible force-bearing structure is provided, so that while the sole of the foot can be adaptively supported, the pressure sensing structure is more accurately pressed, can timely sense the change of the foot pressure, and increases the overall practicability.

[0038] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A sensing insole provided with a flexible stress-bearing structure, comprising a wrapping edge (1), wherein the wrapping edge (1) is arranged in an irregular annular structure, and is characterized in that: It further includes a slot (2), the side surface of the edge banding (1) is provided with the slot (2), the edge banding (1) is connected with a flexible force-bearing structure, and the flexible force-bearing structure can flexibly support the sole through a resilient pad (5) when the sweat-absorbing pad (3) is pressed.

2. The sensing insole with a flexible force-bearing structure according to claim 1, wherein: The flexible force-bearing structure includes a sweat-absorbing pad (3), the sweat-absorbing pad (3) is fixedly installed on the inner wall surface of the edge banding (1), a buffer layer (4) is connected to the lower surface of the sweat-absorbing pad (3), a resilient pad (5) is embedded and connected to the upper surface of the buffer layer (4), an airbag (6) is fixedly installed on the inner wall surface of the resilient pad (5), the airbag (6) is arranged in an elliptical cylindrical structure, and a plurality of airbags (6) are installed at equal intervals.

3. The sensing insole with a flexible force-bearing structure according to claim 2, characterized in that: The resilient pad (5) is arranged in an irregular shape, and there are 3 resilient pads (5).

4. A sensing insole provided with a flexible force-bearing structure according to claim 2, characterized in that: The lower surface of the buffer layer (4) is fixedly connected with an isolation film (7), and the isolation film (7) is made of an insulating material.

5. The sensing insole with a flexible force-bearing structure according to claim 4, characterized in that: The edge banding (1) is also connected with a pressure sensing structure, and the pressure sensing structure can receive pressure data by connecting with a pressure sensing point (9) through a chip hardware installed inside a sandwich bag (10).

6. The sensing insole with a flexible force-bearing structure according to claim 5, wherein: The pressure sensing structure includes a sensing layer (8), an isolation film (7) is covered and connected to the upper surface of the sensing layer (8), a plurality of pressure sensing points (9) are arranged on the upper surface of the sensing layer (8), a sandwich bag (10) is arranged on the upper surface of the sensing layer (8), a chip hardware is installed inside the sandwich bag (10), and the chip hardware is connected with the pressure sensing point (9). The lower surface of the sensing layer (8) is connected with a wear-resistant layer (11), the wear-resistant layer (11) is fixedly installed on the inner wall surface of the edge banding (1), and the lower surface of the wear-resistant layer (11) is flush with the lower surface of the edge banding (1).

7. The sensing insole with a flexible force-bearing structure according to claim 6, characterized in that: The side surface opening of the sandwich bag (10) corresponds to the slot (2).