Lamp bead substrate fixing frame

Abstract

The utility model relates to a lamp bead substrate fixing frame which comprises a bottom plate. The heat-conducting plate is arranged at one end of the bottom plate; the positioning plate is arranged at the other end of the bottom plate; the fixing columns are arranged on the bottom plate and used for fixing the circuit board, heat generated by the lamp beads is conducted to the bottom plate through the heat conduction plate, the heat dissipation area is increased, then the heat is transmitted to a shell of the oral cavity therapeutic apparatus through the bottom plate, and therefore the heat generated by the lamp beads during working can be dissipated more quickly; a certain distance is formed between the circuit board and the bottom plate, heat generated by the lamp beads can be effectively prevented from being transmitted to the circuit board, and the circuit board is prevented from being damaged by too high temperature.

Description

Technical Field

[0001] The utility model relates to the technical field of fixing frames, and particularly relates to a fixing frame for a lamp bead substrate. Background Art

[0002] Oral treatment instruments mainly utilize the energy of red light to irradiate the diseased parts of the oral mucosa, thereby playing a therapeutic role. Oral red light treatment instruments can promote the regeneration of mucosa and the subsidence of inflammation, and have a certain effect on the treatment of diseases such as oral ulcers and oral mucosal inflammation.

[0003] Since the oral treatment instrument relies on the light emitted by the lamp beads for treatment, the resistance loss generated by the lamp beads when current passes through and part of the light energy will be converted into heat. When this heat cannot be dissipated in time, it will greatly shorten the service life of the treatment instrument. When a large amount of heat energy accumulates inside the treatment instrument, it may cause the lamp beads or the circuit board to burn out. Content of the Utility Model

[0004] Aiming at the deficiencies of the existing technology, the purpose of the utility model is to provide a fixing frame for a lamp bead substrate.

[0005] The purpose of the utility model can be achieved by the following technical solutions: a fixing frame for a lamp bead substrate, including a bottom plate; a heat conducting plate provided at one end of the bottom plate; a positioning plate provided at the other end of the bottom plate; and fixing columns provided on the bottom plate for fixing the circuit board.

[0006] Preferably, a first positioning groove is provided on the heat conducting plate.

[0007] Preferably, mounting holes are provided on the end face of the heat conducting plate.

[0008] Preferably, a second positioning groove is provided on the positioning plate.

[0009] Preferably, the fixing columns include a first fixing column and a second fixing column. The first fixing column is provided at one end of the bottom plate close to the heat conducting plate, and the second fixing column is provided at one end of the bottom plate close to the positioning plate. The first fixing column and the second fixing column are arranged diagonally.

[0010] Preferably, a first support block is provided on one side of the bottom plate where the first fixing column is located, and a second support block is provided on one side of the bottom plate where the second fixing column is located. The first support block and the second support block are arranged diagonally.

[0011] Preferably, auxiliary support blocks are provided at the upper edge of the bottom plate.

[0012] Preferably, the cross section of the bottom plate is in a circular arc structure.

[0013] Preferably, heat conducting silicone grease is provided at the bottom of the bottom plate.

[0014] Preferably, heat dissipation notches are provided on the bottom plate.

[0015] The beneficial effects of the present utility model are as follows: The heat generated by the lamp beads is conducted to the bottom plate through the heat conduction plate, increasing the heat dissipation area, and then transferred to the outer shell of the oral treatment instrument through the bottom plate, so that the heat generated by the operation of the lamp beads can be dissipated faster. The circuit board of the oral treatment instrument is installed on the fixing posts, so that there is a certain distance between the circuit board and the bottom plate, which can effectively prevent the heat generated by the lamp beads from being transferred to the circuit board and prevent the circuit board from being damaged due to overheating. Description of the Drawings

[0016] The present utility model will be further described with reference to the accompanying drawings. However, the embodiments in the drawings do not constitute any limitation to the present utility model. For those of ordinary skill in the art, other drawings can also be obtained based on the following drawings without creative efforts.

[0017] Figure 1 It is a schematic structural diagram of a lamp bead substrate fixing frame of the present utility model.

[0018] Figure 2 It is another schematic structural diagram of a lamp bead substrate fixing frame of the present utility model.

[0019] Figure 3 It is a schematic structural diagram of the heat conduction plate of a lamp bead substrate fixing frame of the present utility model.

[0020] Figure 4 It is a cross-sectional view of a lamp bead substrate fixing frame of the present utility model.

[0021] Figure 5 It is a schematic structural diagram when a lamp bead substrate fixing frame of the present utility model is specifically used.

[0022] The reference numerals shown in the figure are as follows: 1, bottom plate; 2, heat conduction plate; 201, first positioning groove; 3, positioning plate; 301, second positioning groove; 4, fixing post; 401, first fixing post; 402, second fixing post; 5, support block; 501, first support block; 502, second support block; 6, auxiliary support block; 7, mounting hole; 8, lamp bead substrate; 9, circuit board; 10, heat dissipation notch. Detailed Embodiments

[0023] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) involved in the embodiments of the present utility model, the directional indications are only used to explain the relative position relationship and movement conditions between components in a specific posture (as shown in the drawings). If the specific posture changes, the directional indications will also change accordingly.

[0024] In addition, if descriptions such as "first" and "second" are involved in the embodiments of the present utility model, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be construed as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0025] Next, specific embodiments will be used to clearly and completely describe the technical solutions of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the protection scope of the present utility model.

[0026] Refer to Figures 1 to 5 As shown, the structure of the present utility model is: a lamp bead substrate fixing bracket, including a bottom plate 1; a heat conducting plate 2 provided at one end of the bottom plate 1; a positioning plate 3 provided at the other end of the bottom plate 1; fixing columns 4 provided on the bottom plate 1 for fixing a circuit board 9. Specifically, the entire fixing bracket is made of a metal material. The lamp bead substrate 8 is installed on the heat conducting plate 2, and the heat generated by the lamp beads is conducted to the bottom plate 1 through the heat conducting plate 2. The heat dissipation area is increased through the bottom plate 1 and transferred to the shell of the oral treatment instrument, so that the heat generated by the lamp beads during operation can be dissipated more quickly. The positioning plate 3 is used for positioning the circuit board 9. The circuit board 9 is installed on the fixing columns 4, so that there is a certain distance between the circuit board 9 and the bottom plate 1, which can effectively prevent the heat generated by the lamp beads from being transferred to the circuit board 9 and prevent the circuit board 9 from being damaged due to excessive temperature.

[0027] As Figure 2 、 Figure 3 As shown, a first positioning groove 201 is formed on the heat conducting plate 2. Specifically, the first positioning groove 201 is used for positioning the lamp bead substrate 8.

[0028] As Figure 3 As shown, mounting holes 7 are provided on the end face of the heat conducting plate 2. Specifically, the mounting holes 7 are used for mounting the lamp bead substrate 8.

[0029] As Figure 2 、 Figure 4 As shown, a second positioning groove 301 is provided on the positioning plate 3. Specifically, the second positioning groove 301 is used for positioning the circuit board 9, facilitating the alignment of the hole positions of the circuit board 9 with the fixing columns 4 and facilitating installation.

[0030] As Figure 2As shown in the figure, the fixing posts 4 include a first fixing post 401 and a second fixing post 402. The first fixing post 401 is arranged at one end of the bottom plate 1 close to the heat conducting plate 2, and the second fixing post 402 is arranged at one end of the bottom plate 1 close to the positioning plate 3. The first fixing post 401 and the second fixing post 402 are arranged diagonally. Specifically, the first fixing post 401 and the second fixing post 402 are used to install the circuit board 9.

[0031] As Figure 2 shown in the figure, a first support block 501 is arranged on one side of the bottom plate 1 where the first fixing post 401 is located, and a second support block 502 is arranged on one side of the bottom plate 1 where the second fixing post 402 is located. The first support block 501 and the second support block 502 are arranged diagonally. Specifically, the first support block 501 and the second support block 502 are used to support the circuit board 9.

[0032] As Figure 1 、 Figure 2 shown in the figure, an auxiliary support block 6 is arranged at the upper edge of the bottom plate 1. Specifically, the auxiliary support block 6 is used to assist in supporting the circuit board 9 to prevent the circuit board 9 from bending and deforming.

[0033] As Figure 4 shown in the figure, the cross-section of the bottom plate 1 is in an arc-shaped structure. Specifically, the arc-shaped bottom plate 1 can better contact the outer shell of the oral treatment instrument, increase the heat dissipation area, and improve the heat dissipation effect.

[0034] Furthermore, heat-conducting silicone grease is arranged at the bottom of the bottom plate 1. Specifically, the heat-conducting silicone grease is used to fill the gap between the bottom plate 1 and the outer shell of the oral treatment instrument to further improve the heat dissipation effect.

[0035] Furthermore, a heat dissipation notch 10 is formed on the bottom plate 1. Specifically, a hole is formed on the outer shell of the oral treatment instrument corresponding to the heat dissipation notch 10. When the lamp beads are lit, the surrounding air becomes hot, and the hot air rises, taking away part of the heat. The external cold air flows into the interior through the hole on the outer shell of the oral treatment instrument and the heat dissipation notch 10 on the bottom plate 1 to fill the hot air, forming a convection to promote the dissipation of heat.

[0036] During specific use, as Figure 5 shown in the figure, the lamp bead substrate 8 is installed on the heat conducting plate 2. The heat generated by the lamp beads is conducted to the bottom plate 1 through the heat conducting plate 2. The heat dissipation area is increased through the bottom plate 1 and transferred to the outer shell of the oral treatment instrument, so that the heat generated by the lamp beads during operation can be dissipated faster. The positioning plate 3 is used for positioning the circuit board 9. The circuit board 9 is installed on the fixing posts 4, so that there is a certain distance between the circuit board 9 and the bottom plate 1, which can effectively prevent the heat generated by the lamp beads from being transferred to the circuit board 9 and prevent the circuit board 9 from being damaged due to excessive temperature.

[0037] The above further describes the present utility model by means of specific embodiments. However, it should be understood that this specific description should not be construed as a limitation on the essence and scope of the present utility model. Various modifications made by those of ordinary skill in the art to the above embodiments after reading this specification all fall within the scope protected by the present utility model.

Claims

1. A lamp bead substrate fixing bracket, characterized in that: It includes a bottom plate (1); A heat conduction plate (2) is arranged at one end of the bottom plate (1); A positioning plate (3) is arranged at the other end of the bottom plate (1); Fixing columns (4) are arranged on the bottom plate (1) for fixing the circuit board.

2. The lamp bead substrate fixing bracket according to claim 1, characterized in that: A first positioning groove (201) is formed on the heat conduction plate (2).

3. The fixing bracket for a lamp bead substrate according to claim 1, wherein: Mounting holes (7) are provided on the end face of the heat conduction plate (2).

4. The fixing bracket for a lamp bead substrate according to claim 1, wherein: A second positioning groove (301) is provided on the positioning plate (3).

5. The fixing bracket for a lamp bead substrate according to claim 1, characterized in that: The fixing columns (4) include a first fixing column (401) and a second fixing column (402). The first fixing column (401) is arranged at one end of the bottom plate (1) close to the heat conduction plate (2), and the second fixing column (402) is arranged at one end of the bottom plate (1) close to the positioning plate (3). The first fixing column (401) and the second fixing column (402) are arranged diagonally.

6. The lamp bead substrate fixing bracket according to claim 5, wherein: A first support block (501) is arranged on one side of the bottom plate (1) where the first fixing column (401) is located, and a second support block (502) is arranged on one side of the bottom plate (1) where the second fixing column (402) is located. The first support block (501) and the second support block (502) are arranged diagonally.

7. The fixing bracket for the lamp bead substrate according to claim 1, wherein: Auxiliary support blocks (6) are provided at the upper edge of the bottom plate (1).

8. The fixing bracket for a lamp bead substrate according to claim 1, characterized in that: The cross-section of the bottom plate (1) is in an arc-shaped structure.

9. The fixing bracket for a lamp bead substrate according to claim 1, wherein: Thermal grease is provided at the bottom of the bottom plate (1).

10. The fixing bracket for the lamp bead substrate according to claim 1, wherein: A heat dissipation notch (10) is formed on the bottom plate (1).

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