Ultrasonic beauty handle and skin management system

Abstract

The utility model relates to an ultrasonic beauty handle and a skin management system, an ultrasonic module, a refrigeration module, a heat dissipation module and a control device are arranged in a space defined by a probe and the handle, and the ultrasonic module generates ultrasonic vibration and transmits the ultrasonic vibration to the skin through the probe; the refrigeration module is used for reducing the temperature of the surface of the probe, so that the probe with lower temperature performs ice compress on a treatment part, and thermal damage of ultrasonic waves to skin is reduced; the heat dissipation module comprises a heat dissipation flow channel, a first connector and a second connector, the heat dissipation flow channel and an external water supply source form a circulating water loop through the first connector and the second connector, heat transfer occurs between liquid in the heat dissipation flow channel and the refrigeration module, the liquid absorbs heat generated by the refrigeration module and then flows back into the external water supply source through the second connector, and circulation is conducted in this way. The cooling module is continuously cooled; through mutual cooperation of the ultrasonic module, the refrigeration module and the heat dissipation module, the effects of promoting essence introduction and cold compress can be achieved at the same time.

Description

Technical Field

[0001] This application relates to the technical field of beauty equipment, and particularly to an ultrasonic beauty handle and a skin management system. Background Art

[0002] A skin management system is a beauty instrument that integrates massage, cleansing, and introduction. Among them, the skin management system can promote the introduction of essence into the skin through a handle with ultrasonic function. This handle generates high-frequency ultrasonic vibrations to drive the movement of molecules inside and outside skin cells, and promotes the ability of the skin to deeply absorb the nutritional components of the essence.

[0003] However, during use, the heat generated by the ultrasonic module during high-frequency vibration and the heat effect generated during the conduction of ultrasonic waves will cause the probe to become hot when it comes into contact with the skin, affecting the user experience and even causing skin burns. Summary of the Utility Model

[0004] Based on this, it is necessary to provide an ultrasonic beauty handle and a skin management system to address the above problems.

[0005] An ultrasonic beauty handle of this application, the ultrasonic beauty handle includes a handle, a probe, and an ultrasonic module, a refrigeration module, a heat dissipation module, and a control device disposed in an installation cavity formed by enclosing the handle and the probe;

[0006] The refrigeration module is configured to reduce the surface temperature of the probe;

[0007] The heat dissipation module, the heat dissipation module is in contact with the refrigeration module, the heat dissipation module is provided with a heat dissipation channel and a first interface and a second interface communicated with the heat dissipation channel, and the heat dissipation channel forms a circulating water circuit with an external water supply source through the first interface and the second interface;

[0008] The control device, the control device is electrically connected to the ultrasonic module and the refrigeration module respectively.

[0009] The ultrasonic beauty handle disclosed in the first aspect of the present application is provided with an ultrasonic module, a refrigeration module, a heat dissipation module, and a control device in the space enclosed between the probe and the handle. The ultrasonic module can generate high-frequency ultrasonic vibrations, and the ultrasonic waves are transmitted through the probe to the user's skin. The refrigeration module can be used to lower the temperature of the probe surface, so that the probe with a lower temperature can perform ice compress on the treatment site or its nearby area, reducing the thermal damage of the ultrasonic module to the skin. The heat dissipation module includes a heat dissipation channel and a first interface and a second interface communicated with the heat dissipation channel. The heat dissipation channel can form a circulating water circuit with an external water supply source through the first interface and the second interface. The low-temperature liquid transfers heat with the refrigeration module in the heat dissipation channel. After the low-temperature liquid absorbs the heat generated by the refrigeration module, it flows back to the external water supply source through the second interface. In this way, the refrigeration module can be continuously dissipated. Through the mutual cooperation of the ultrasonic module, the refrigeration module, and the heat dissipation module, the beauty handle of the present application can simultaneously promote the introduction of essence liquid and the effect of cold compress.

[0010] In one embodiment, the refrigeration module includes a semiconductor refrigeration sheet and a heat conduction block. The heat conduction block is clamped between the probe and the semiconductor refrigeration sheet. The heat absorption surface of the semiconductor refrigeration sheet abuts against the heat conduction block, and the heat release surface abuts against the surface of the heat dissipation module.

[0011] For the ultrasonic beauty handle in the above embodiment, it is further defined that the heat generated by the ultrasonic module and the heat on the probe surface are transferred to the heat absorption surface of the semiconductor refrigeration sheet through the heat conduction block for heat absorption, thereby reducing the temperature of the probe surface. The heat released by the heat release surface of the semiconductor refrigeration sheet transfers heat with the low-temperature liquid in the heat dissipation module, thereby dissipating heat from the semiconductor refrigeration sheet and ensuring the reliable operation of the semiconductor refrigeration sheet.

[0012] In one embodiment, a groove is formed on the inner wall of the side of the probe facing the handle. The ultrasonic module is installed in the groove, and the heat conduction block abuts against the inner wall of the probe outside the groove range.

[0013] For the ultrasonic beauty handle in the above embodiment, it is further defined that the ultrasonic module is installed in the groove formed on the inner wall of the probe, avoiding direct contact between the ultrasonic module and the heat conduction block. At the same time, the heat conduction block abuts against the inner wall of the probe outside the groove range, which can increase the contact area between the heat conduction block and the probe and improve the heat transfer efficiency between the heat conduction block and the probe.

[0014] In one embodiment, the heat conduction block is made of aluminum alloy.

[0015] In the ultrasonic beauty handle in the above embodiments, it is further defined that the material of the heat conduction block is aluminum alloy, which can quickly conduct the heat of the probe and the heat generated by the ultrasonic module to the heat absorption surface of the semiconductor refrigeration sheet for absorption, accelerating the temperature drop on the surface of the probe.

[0016] In one of the embodiments, the surface of the probe is made of a skin-friendly material.

[0017] In one of the embodiments, the heat dissipation module is a water tank structure. The heat dissipation module includes a box body and a box cover. The heat dissipation flow channel is provided on the box body. The first interface and the second interface are provided on the box body or the box cover. The first interface and the second interface respectively extend out of the handle through pipelines to be connected with an external water supply source. The box cover is covered on the box body.

[0018] In the ultrasonic beauty handle in the above embodiments, it is further defined that the heat dissipation module is a water tank structure. The water tank structure forms a circulating water circuit with an external water supply source. The external water supply source continuously transports low-temperature liquid into the heat dissipation flow channel. The low-temperature liquid absorbs the heat released by the heat release surface in the heat dissipation flow channel, realizing the heat dissipation of the semiconductor refrigeration sheet.

[0019] In one of the embodiments, the heat dissipation flow channel is in a meandering shape or a spiral shape.

[0020] In the ultrasonic beauty handle in the above embodiments, it is further defined that the shape of the heat dissipation flow channel is in a meandering shape or a spiral shape. Based on the above-designed heat flow channel, the residence time of the low-temperature liquid in the heat dissipation flow channel can be prolonged and the contact area between the low-temperature liquid and the heat dissipation flow channel can be increased, thereby improving the heat dissipation efficiency.

[0021] In one of the embodiments, a light guide cover is clamped between the probe and the handle. At least part of the light guide cover is exposed outside the installation cavity. The part of the light guide cover exposed outside the installation cavity is made of a transparent material. A light-emitting module is arranged in the installation cavity. The light-emitting module displays a light signal through the light guide cover.

[0022] In the ultrasonic beauty handle in the above embodiments, it is further defined that a light-emitting module capable of emitting light is arranged in the installation cavity, and the light-emitting module can display the light through the transparent part of the light guide cover, improving the atmosphere of the beauty handle and enabling the working state of the current beauty handle to be intuitively obtained through the color of the light.

[0023] In one of the embodiments, the control device includes a first circuit board module and a second circuit board module. The light-emitting module is electrically connected to the first circuit board module. The second circuit board module is electrically connected to at least one or a combination of the ultrasonic module and the refrigeration module.

[0024] In the ultrasonic beauty handle in the above embodiments, the installation cavity is further defined to be provided with a first circuit board module and a second circuit board module. According to the shape of the installation cavity formed by enclosing between the probe and the handle, the installation positions of the first circuit board module and the second circuit board module are reasonably configured to avoid affecting the volume and aesthetics of the beauty handle.

[0025] In one embodiment, the heat dissipation module is fixedly installed on the light guide cover, at least part of the light guide cover is sleeved with the probe, and the light guide cover is detachably connected to the handle.

[0026] In one embodiment, the probe is detachably connected to the light guide cover.

[0027] In one embodiment, the skin management system provided in the second aspect of the present application includes: the ultrasonic beauty handle according to any one of the above; a water circulation component, the water circulation component includes a water tank and a water pump, two openings of the water tank, one of which is communicated with the first interface through the water pump, and the other is directly communicated with the second interface. Description of the Drawings

[0028] Figure 1 is an exploded view of the ultrasonic beauty handle in one embodiment;

[0029] Figure 2 is a sectional view of the ultrasonic beauty handle in one embodiment;

[0030] Figure 3 is a structural schematic diagram of the heat dissipation module in one embodiment.

[0031] Reference Signs:

[0032] 11 handle, 12 probe, 13 light guide cover, 101 installation cavity, 102 groove;

[0033] 20 ultrasonic module;

[0034] 30 refrigeration module, 31 semiconductor refrigeration sheet, 32 heat conduction block;

[0035] 40 heat dissipation module, 41 box body, 42 box cover, 43 first interface, 44 second interface, 401 heat dissipation flow channel;

[0036] 50 control device, 51 first circuit board module, 52 second circuit board module. Detailed Embodiments

[0037] To enable those skilled in the art to better understand the solution of this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in this application without creative efforts shall fall within the scope of protection of this application.

[0038] It should be noted that the terms "first", "second", etc. in the description and claims of this application and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily need to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so as to implement the embodiments of this application described herein.

[0039] As Figures 1 to 3 shown, this embodiment provides an ultrasonic beauty handle, which includes a handle 11, a probe 12, and an ultrasonic module 20, a refrigeration module 30, a heat dissipation module 40, and a control device 50 disposed in an installation cavity 101 formed by enclosing the handle 11 and the probe 12;

[0040] The refrigeration module 30 is configured to reduce the surface temperature of the probe 12;

[0041] The heat dissipation module 40, the heat dissipation module 40 is in contact with the refrigeration module 30, the heat dissipation module 40 is provided with a heat dissipation channel 401 and a first interface 43 and a second interface 44 communicating with the heat dissipation channel 401, and the heat dissipation channel 401 forms a circulating water circuit with an external water supply through the first interface 43 and the second interface 44;

[0042] The control device 50, the control device 50 is electrically connected to the ultrasonic module 20 and the refrigeration module 30 respectively.

[0043] Among them, the ultrasonic module 20 can be used to generate high-frequency ultrasonic vibrations. The ultrasonic module 20 can be one of a piezoelectric ultrasonic generator, a magnetostrictive ultrasonic generator, and an electromagnetic ultrasonic generator. Preferably, the piezoelectric ultrasonic generator is adopted in this embodiment. The ultrasonic waves generated by the ultrasonic module 20 in the installation cavity 101 are transmitted to the user's skin through the probe 12, promoting skin metabolism, accelerating cell activation, and deeply penetrating into the skin basal layer, so that the essence can be better absorbed by the skin.

[0044] The refrigeration module 30 can be used to lower the temperature of the surface of the probe 12. The refrigeration module 30 can adopt electronic refrigeration or semiconductor refrigeration methods. For example, in the case of semiconductor refrigeration for the refrigeration module 30, the heat absorption surface of the refrigeration module 30 is close to the side of the surface of the probe 12, thereby reducing the temperature of the surface of the probe 12. Furthermore, when the ultrasonic module 20 uses high-frequency radio waves to stimulate collagen contraction on the skin, the probe 12 with a lower temperature can be used to ice the treatment site or the area near it, reducing the thermal damage to the skin caused by the ultrasonic module 20.

[0045] The heat dissipation module 40 can be used to dissipate the heat generated by the refrigeration module 30. The heat dissipation module 40 may include a heat dissipation flow channel 401 and a first interface 43 and a second interface 44 communicating with the heat dissipation flow channel 401. The heat dissipation flow channel 401 can form a circulating water circuit with an external water supply source through the first interface 43 and the second interface 44. Specifically, the external water supply source may include a water tank and a water pump. The water pump transports the low-temperature liquid stored in the water tank to the first interface 43 through a pipeline and into the heat dissipation flow channel 401. Heat transfer occurs between the low-temperature liquid in the heat dissipation flow channel 401 and the refrigeration module 30. After the low-temperature liquid absorbs the heat generated by the refrigeration module 30, it flows back into the water tank through the second interface 44. In this way, continuous heat dissipation of the refrigeration module 30 can be achieved.

[0046] The first interface 43 and the second interface 44 can be hollow columnar structures that are convenient for connecting with pipelines.

[0047] It should be noted that in some embodiments, the water tank and the water pump can also be installed in the installation cavity 101 enclosed by the handle 11 and the probe 12.

[0048] The control device 50 can be used to control the working modes of the ultrasonic module 20 and the refrigeration module 30. Exemplarily, the control device can adjust the output power of the ultrasonic module 20 and / or the refrigeration module 30 according to the received user instructions or preset programs.

[0049] In the ultrasonic beauty handle in the above embodiments, an ultrasonic module 20, a refrigeration module 30, a heat dissipation module 40, and a control device 50 are arranged in the space enclosed between the probe 12 and the handle 11. The ultrasonic module 20 can generate high-frequency ultrasonic vibrations, and the ultrasonic waves are transmitted through the probe 12 to the user's skin; the refrigeration module 30 can be used to lower the temperature of the surface of the probe 12, so that the probe 12 with a lower temperature performs ice compress on the treatment site or its nearby area, reducing the thermal damage of the ultrasonic module 20 to the skin; the heat dissipation module 40 includes a heat dissipation channel 401 and a first interface 43 and a second interface 44 communicated with the heat dissipation channel 401. The heat dissipation channel 401 can form a circulating water circuit with an external water supply source through the first interface 43 and the second interface 44. The low-temperature liquid transfers heat to the refrigeration module 30 in the heat dissipation channel 401. After the low-temperature liquid absorbs the heat generated by the refrigeration module 30, it flows back to the external water supply source through the second interface 44. In this way, the refrigeration module 30 can be continuously dissipated. Through the mutual cooperation of the ultrasonic module 20, the refrigeration module 30, and the heat dissipation module 40, the beauty handle 11 of the present application can simultaneously play the effects of promoting the introduction of essence and cold compress.

[0050] As Figures 1 to 2 shown, in addition to the features of the above embodiments, this embodiment further defines that: the refrigeration module 30 includes a semiconductor refrigeration sheet 31 and a heat conduction block 32. The heat conduction block 32 is clamped between the probe 12 and the semiconductor refrigeration sheet 31. The heat absorption surface of the semiconductor refrigeration sheet 31 abuts against the heat conduction block 32, and the heat dissipation surface abuts against the surface of the heat dissipation module 40.

[0051] In the above embodiments, it is further defined that the heat generated by the ultrasonic module 20 and the heat on the surface of the probe 12 are transferred to the heat absorption surface of the semiconductor refrigeration sheet 31 through the heat conduction block 32 for heat absorption, thereby reducing the temperature of the surface of the probe 12. The heat released by the heat dissipation surface of the semiconductor refrigeration sheet 31 transfers heat to the low-temperature liquid in the heat dissipation module 40, thereby dissipating heat from the semiconductor refrigeration sheet 31 and ensuring the reliable operation of the semiconductor refrigeration sheet 31.

[0052] Among them, the heat conduction block 32 can be used to realize the heat transfer between the probe 12 and the semiconductor refrigeration sheet 31. The heat conduction block 32 can be a metal material or a non-metal material with good heat conduction performance. The heat generated by the ultrasonic module 20 can be transferred to the semiconductor refrigeration sheet 31 through the heat conduction block 32 for absorption.

[0053] The semiconductor refrigeration chip 31 may include a heat absorption surface and a heat dissipation surface. After the semiconductor refrigeration chip 31 obtains an electric current, a Peltier effect is formed between the heat absorption surface and the heat dissipation surface. The heat absorption surface absorbs the heat on the heat conduction block 32, causing the temperature of the heat conduction block 32 to decrease, thereby causing the temperature of the probe 12 to drop for ice application to the skin. The heat dissipation surface of the semiconductor refrigeration chip 31 releases heat. Since the heat dissipation surface abuts against the surface of the heat dissipation module 40, the low-temperature liquid of the heat dissipation module 40 absorbs the heat released by the heat dissipation surface to dissipate heat from the semiconductor refrigeration chip 31, thereby ensuring the reliable operation of the semiconductor refrigeration chip 31.

[0054] As Figure 2 shown, in addition to the features of the above embodiment, this embodiment further defines that: a groove 102 is formed on the inner wall of one side of the probe 12 facing the handle 11, the ultrasonic module 20 is installed in the groove 102, and the heat conduction block 32 abuts against the inner wall of the probe 12 outside the range of the groove 102.

[0055] In the above embodiment, it is further defined that the ultrasonic module 20 is installed in the groove 102 formed on the inner wall of the probe 12 to avoid the ultrasonic module 20 directly contacting the heat conduction block 32. At the same time, the heat conduction block 32 abuts against the inner wall of the probe 12 outside the range of the groove 102, which can increase the contact area between the heat conduction block 32 and the probe 12 and improve the heat transfer efficiency between the heat conduction block 32 and the probe 12.

[0056] Among them, the groove 102 can be used to install the ultrasonic module 20 to avoid the ultrasonic module 20 directly abutting against the heat conduction block 32. The groove 102 can be centrally distributed on the inner wall of the probe 12, and the heat conduction block 32 directly abuts against the inner wall of the probe 12 and is circumferentially distributed along the groove 102 to increase the contact area between the heat conduction block 32 and the inner wall of the probe 12. The heat generated by the centrally arranged ultrasonic module 20 undergoes heat transfer with the circumferential surface of the probe 12, thereby making the temperature on the surface of the probe 12 relatively uniform. In addition, on the side of the heat conduction block 32 away from the ultrasonic module 20, a groove body for fixing the shape of the semiconductor refrigeration chip 31 is formed, so that the heat absorption surface of the semiconductor refrigeration chip 31 directly abuts against the heat conduction block 32 to improve the heat transfer efficiency.

[0057] In addition to the features of the above embodiment, this embodiment further defines that: the heat conduction block 32 is made of aluminum alloy.

[0058] In the above embodiment, it is further defined that the material of the heat conduction block 32 is aluminum alloy, which can quickly conduct the heat of the probe 12 and the heat generated by the ultrasonic module 20 to the heat absorption surface of the semiconductor refrigeration chip 31 for absorption, accelerating the temperature drop on the surface of the probe 12.

[0059] In addition to the features of the above embodiment, this embodiment further defines that: the surface of the probe 12 is made of a skin-friendly material.

[0060] Among them, the material on the surface of the probe 12 can be other skin-friendly materials such as stainless steel or silica gel. Exemplarily, the material of the probe 12 is stainless steel, which can better transfer the cold feeling to the skin. In addition, using stainless steel material can make the probe 12 corrosion-resistant and ensure the service life of the probe 12.

[0061] As Figures 1 to 3 As shown, in addition to the features of the above embodiments, this embodiment further defines that: the heat dissipation module 40 is a water tank structure. The heat dissipation module 40 includes a box body 41 and a box cover 42. A heat dissipation flow channel 401 is opened on the box body 41. The box body 41 or the box cover 42 is provided with a first interface 43 and a second interface 44. The first interface 43 and the second interface 44 are respectively connected to an external water supply source through pipelines extending out of the handle 11. The box cover 42 is covered on the box body 41.

[0062] In the above embodiment, it is further defined that the heat dissipation module 40 is a water tank structure. The water tank structure forms a circulating water circuit with an external water supply source. The external water supply source continuously delivers low-temperature liquid into the heat dissipation flow channel 401. The low-temperature liquid absorbs the heat released by the heat release surface in the heat dissipation flow channel 401 to achieve heat dissipation of the semiconductor refrigeration chip 31.

[0063] Among them, the heat dissipation module 40 may include a box body 41 and a box cover 42. A heat dissipation flow channel 401 for the flow of low-temperature liquid is opened on the box body 41. The box cover 42 is covered on the box body 41 to form a closed space, so that the low-temperature liquid can only enter and exit the heat dissipation flow channel 401 from the first interface 43 and the second interface 44. Specifically, the low-temperature liquid in the external water tank enters the heat dissipation flow channel 401 through the pipeline and the first interface 43 under the action of a water pump. Since one side of the box body 41 or the box cover 42 is in contact with the heat release surface of the semiconductor refrigeration chip 31, after the low-temperature liquid absorbs the heat released by the heat release surface in the heat dissipation flow channel 401, it successively passes through the second interface 44 and the pipeline and enters the external water tank, and so on in a cycle to achieve continuous heat dissipation of the semiconductor refrigeration chip 31.

[0064] As Figure 3 As shown, in addition to the features of the above embodiments, this embodiment further defines that: the heat dissipation flow channel 401 is in a meandering shape or a spiral shape.

[0065] In the above embodiment, it is further defined that the shape of the heat dissipation flow channel 401 is in a meandering shape or a spiral shape. Based on the above-designed heat flow channel, it can extend the residence time of the low-temperature liquid in the heat dissipation flow channel 401 and increase the contact area between the low-temperature liquid and the heat dissipation flow channel 401, thereby improving the heat dissipation efficiency.

[0066] As Figure 1 And Figure 2As shown, in addition to the features of the above embodiments, this embodiment further defines that: a light guide cover 13 is clamped between the probe 12 and the handle 11, at least part of the light guide cover 13 is exposed outside the installation cavity 101, the part of the light guide cover 13 exposed outside the installation cavity 101 is made of a transparent material, and a light emitting module is arranged in the installation cavity 101, and the light emitting module displays a light signal through the light guide cover 13.

[0067] In the above embodiments, it is further defined that a light emitting module capable of emitting light is arranged in the installation cavity 101, and the light emitting module can display the light through the transparent part of the light guide cover 13, improving the atmosphere of the beauty handle 11 and enabling the working state of the current beauty handle 11 to be intuitively obtained through the color of the light.

[0068] Among them, the light emitting module can be used to emit light signals. The light emitting module can be an LED lamp. The number of LED lamps can be multiple. Exemplarily, one of the LED lamps can emit green light, indicating that the beauty handle 11 of the present application is in an operating state.

[0069] The light guide cover 13 is a hollow shell structure. The light guide cover 13 is partially clamped between the probe 12 and the handle 11 and exposed outside the installation cavity 101. The light guide cover 13 of this part is made of a transparent material, so that the light emitted by the light emitting module can be displayed through the transparent part of the light guide cover 13.

[0070] As Figure 1 and Figure 2 As shown, in addition to the features of the above embodiments, this embodiment further defines that: the control device 50 includes a first circuit board module 51 and a second circuit board module 52. The light emitting module is electrically connected to the first circuit board module, and the second circuit board module 52 is electrically connected to at least one or a combination of the ultrasonic module 20 and the refrigeration module 30.

[0071] In the above embodiments, it is further defined that a first circuit board module 51 and a second circuit board module 52 are arranged in the installation cavity 101. According to the shape of the installation cavity 101 formed by enclosing between the probe 12 and the handle 11, the installation positions of the first circuit board module 51 and the second circuit board module 52 are reasonably configured to avoid affecting the volume and aesthetics of the beauty handle 11.

[0072] Among them, the first circuit board module can be used to control the working state of the light-emitting module, and the second circuit board module 52 can be used to control the working states of the ultrasonic module 20 and the refrigeration module 30. Based on the limited space of the installation cavity 101 enclosed between the probe 12 and the handle 11, the first circuit board module and the second circuit board module 52 need to be made into two independent circuit boards to reasonably configure their installation positions in the installation cavity 101. Exemplarily, the circuit board of the first circuit board module is in an arc-shaped block and is horizontally installed in the installation cavity 101, and the circuit board of the second circuit board module 52 is in a long strip shape and is vertically installed in the installation cavity 101.

[0073] As Figure 2 shown, in addition to the features of the above embodiments, this embodiment further defines that: the heat dissipation module 40 is fixedly installed on the light guide cover 13, the probe 12 is sleeved on at least part of the light guide cover 13, and the light guide cover 13 and the handle 11 are detachably connected.

[0074] Among them, the light guide cover 13 and the handle 11 can be detachably connected by means of snap fasteners, threads, bolts, magnetic attraction, etc.

[0075] In addition to the features of the above embodiments, this embodiment further defines that: the probe 12 and the light guide cover 13 are detachably connected.

[0076] This embodiment provides a skin management system, including: the above-mentioned ultrasonic beauty handle 11; a water circulation component, the water circulation component includes a water tank and a water pump, and there are two openings in the water tank, one of which is communicated with the first interface 43 through the water pump, and the other is directly communicated with the second interface 44.

[0077] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as the combinations of these technical features do not conflict, they should all be considered as the scope described in this specification.

[0078] The above embodiments only represent several implementation manners of the present application, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the patent scope of the present application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several deformations and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the utility model patent should be subject to the appended claims.

Claims

1. An ultrasonic beauty handle, characterized in that, It includes a handle (11), a probe (12), and an ultrasonic module (20), a refrigeration module (30), a heat dissipation module (40) and a control device (50) disposed in an installation cavity (101) formed by enclosing the handle (11) and the probe (12); The refrigeration module (30) is configured to reduce the surface temperature of the probe (12); The heat dissipation module (40), the heat dissipation module (40) is in contact with the refrigeration module (30), the heat dissipation module (40) is provided with a heat dissipation channel (401) and a first interface (43) and a second interface (44) communicated with the heat dissipation channel (401), and the heat dissipation channel (401) forms a circulating water circuit with an external water supply source through the first interface (43) and the second interface (44); A control device (50), the control device (50) is electrically connected to the ultrasonic module (20) and the refrigeration module (30) respectively.

2. The ultrasonic beauty handle according to claim 1, characterized in that The refrigeration module (30) includes a thermoelectric cooler (31) and a heat conducting block (32), the heat conducting block (32) is clamped between the probe (12) and the thermoelectric cooler (31), the heat absorbing surface of the thermoelectric cooler (31) is in contact with the heat conducting block (32), and the heat releasing surface is in contact with the surface of the heat dissipation module (40).

3. The ultrasonic beauty handle according to claim 2, wherein A groove (102) is formed on the inner wall of one side of the probe (12) facing the handle (11), the ultrasonic module (20) is installed in the groove (102), and the heat conducting block (32) is in contact with the inner wall of the probe (12) outside the range of the groove (102).

4. The ultrasonic beauty handle according to claim 2, wherein The heat conducting block (32) is made of aluminum alloy; And / or The surface of the probe (12) is made of skin-friendly material.

5. The ultrasonic beauty handle according to claim 1, characterized in that, The heat dissipation module (40) is of a water tank structure, the heat dissipation module (40) includes a box body (41) and a box cover (42), the box body (41) is provided with the heat dissipation channel (401), the first interface (43) and the second interface (44) are provided on the box body (41) or the box cover (42), the first interface (43) and the second interface (44) respectively extend out of the handle (11) through pipelines to be connected with an external water supply source, and the box cover (42) covers the box body (41).

6. The ultrasonic beauty handle according to claim 1 or 5, characterized in that, The heat dissipation channel (401) is in a meandering shape or a spiral shape.

7. The ultrasonic beauty handle according to claim 1, characterized in that, A light guide cover (13) is clamped between the probe (12) and the handle (11), at least part of the light guide cover (13) is exposed outside the installation cavity (101), the part of the light guide cover (13) exposed outside the installation cavity (101) is made of a transparent material, and a light emitting module is arranged in the installation cavity (101), and the light emitting module displays a light signal through the light guide cover (13).

8. The ultrasonic beauty handle according to claim 7, characterized in that, The control device (50) includes a first circuit board module (51) and a second circuit board module (52). The light-emitting module is electrically connected to the first circuit board module, and the second circuit board module is electrically connected to at least one or a combination of the ultrasonic module (20) and the refrigeration module (30).

9. The ultrasonic beauty handle according to claim 7, wherein The heat dissipation module (40) is fixedly installed on the light guide cover (13). The probe (12) is sleeved on at least a part of the light guide cover (13), and the light guide cover (13) is detachably connected to the handle (11).

10. A skin management system, characterized in that, Comprising: The ultrasonic beauty handle (11) according to any one of claims 1-9 above; A water circulation assembly, the water circulation assembly includes a water tank and a water pump. There are two openings in the water tank, one of which is communicated with the first interface (43) through the water pump, and the other is directly communicated with the second interface (44).

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