Camera module

Abstract

The utility model provides a camera module. The camera module comprises a substrate, an image sensing chip, an adhesive material and a lens unit, the substrate comprises an opening, and the opening is provided with an opening inner wall. The image sensing chip is arranged in the opening. The adhesive material adheres the image sensing chip and the inner wall of the opening. The lens unit is arranged on the substrate and covers the opening, and the image sensing chip corresponds to the lens unit.

Description

Technical Field

[0001] An embodiment of the present utility model relates to a camera module, and more particularly to a camera module disposed on a substrate. Background Art

[0002] A known camera module includes a substrate, an image sensing chip, and a lens unit. The image sensing chip is disposed on the substrate. The lens unit corresponds to the image sensing chip. In the known art, the image sensing chip is disposed on the substrate through a chip-on-board technology (COB process; Chip On Board, a technology of directly mounting a bare die on a substrate). However, in the face of the current continuous miniaturization requirements for camera modules, the size of the known camera module is difficult to be further reduced. Summary of the Utility Model

[0003] An embodiment of the present utility model provides a camera module to solve the problems of the known art, which includes a substrate, an image sensing chip, an adhesive material, and a lens unit. The substrate includes an opening, wherein the opening has an inner wall. The image sensing chip is disposed within the opening. The adhesive material bonds the image sensing chip and the inner wall of the opening. The lens unit is disposed on the substrate and covers the opening, wherein the image sensing chip corresponds to the lens unit.

[0004] In one embodiment, the adhesive material contacts the sidewall of the image sensing chip, and the adhesive material bonds the sidewall of the image sensing chip and the inner wall of the opening.

[0005] In one embodiment, the image sensing chip is rectangular, the adhesive material contacts the four sidewalls of the image sensing chip, and the adhesive material bonds the plurality of sidewalls of the image sensing chip and the inner wall of the opening.

[0006] In one embodiment, the camera module further includes a plurality of conductive wires, wherein the image sensing chip includes a plurality of chip contacts, the substrate includes a plurality of substrate contacts, one end of each wire is connected to the corresponding chip contact, and the other end of each wire is connected to the corresponding substrate contact.

[0007] In one embodiment, the opening is a through hole, the image sensing chip includes a first chip surface, the substrate includes a first substrate surface, and the first chip surface is flush with the first substrate surface.

[0008] In one embodiment, no other metal or hard plastic support structure provides support for the first chip surface.

[0009] In one embodiment, the adhesive material is cured by heating. Before the adhesive material is cured, a process tape is attached to the surface of the first chip and the surface of the first substrate to provide support for the image sensing chip.

[0010] In one embodiment, the image sensing chip includes a second chip surface, the substrate includes a second substrate surface, the second chip surface is lower than the second substrate surface, the plurality of chip contacts are arranged on a first chip edge and a second chip edge on the second chip surface, the first chip edge is parallel to the second chip edge, the plurality of substrate contacts are arranged on a first opening edge and a second opening edge on the second substrate surface, and the first opening edge is parallel to the second opening edge.

[0011] In one embodiment, the lens unit further includes a lens and a filter, and the filter is disposed between the image sensing chip and the lens.

[0012] In one embodiment, the lens unit further includes a lens, and the lens includes a filter coating corresponding to the image sensing chip.

[0013] In an embodiment of the present invention, the image sensing chip is disposed within an opening in the substrate, thereby reducing the overall height of the camera module. In particular, in one embodiment, the opening in the substrate is a through hole, and the image sensing chip is located at the bottom of the opening. The image sensing chip is fixed within the opening entirely by the support effect provided by the adhesive material and the like conductors. Therefore, the overall height of the camera module can be further reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to make the above objects, features, and advantages of the present invention more obvious and understandable, the following detailed description of the specific embodiments of the present invention is provided in conjunction with the accompanying drawings, wherein:

[0015] Figure 1 is a perspective view showing a camera module according to an embodiment of the present invention.

[0016] Figure 2 is a cross-sectional view showing a camera module according to an embodiment of the present invention.

[0017] Figure 3 is a top view showing an image sensing chip and an adhesive material according to an embodiment of the present invention.

[0018] Figure 4 is a process step showing a camera module according to an embodiment of the present invention.

[0019] Figure 5 is a cross-sectional view showing a camera module according to another embodiment of the present invention.

[0020] Figure 6 It is a process block diagram showing a camera module according to an embodiment of the present utility model.

[0021] Reference numerals:

[0022] M, M': Camera module

[0023] 1: Substrate

[0024] 11: Opening

[0025] 111: Inner wall of the opening

[0026] 12: Substrate contact

[0027] 131: First opening edge

[0028] 132: Second opening edge

[0029] 191: First substrate surface

[0030] 192: Second substrate surface

[0031] 2: Image sensor chip

[0032] 21: Side wall

[0033] 22: Chip contact

[0034] 231: First chip edge

[0035] 232: Second chip edge

[0036] 291: First chip surface

[0037] 292: Second chip surface

[0038] 3: Adhesive

[0039] 4, 4': Lens unit

[0040] 41, 41': Lens

[0041] 411: Filter coating

[0042] 42: Filter

[0043] 5: Conductive wire

[0044] 61: Process tape

[0045] S1, S2, S3, S4, S5: Steps Detailed implementation manner

[0046] Figure 1 It is a perspective view showing a camera module according to an embodiment of the present utility model. Figure 2It is a cross-sectional view showing the camera module according to an embodiment of the present invention. Refer to Figure 1 , 2 , the camera module M according to an embodiment of the present invention includes a substrate 1, an image sensing chip 2, an adhesive 3, and a lens unit 4. The substrate 1 includes an opening 11, wherein the opening 11 has an inner wall 111 of the opening. The image sensing chip 2 is disposed within the opening 11. The adhesive 3 bonds the image sensing chip 2 and the inner wall 111 of the opening. The lens unit 4 is disposed on the substrate 1 and covers the opening 11, wherein the image sensing chip 2 corresponds to the lens unit 4.

[0047] In one embodiment, the substrate can be a printed circuit board, a flexible circuit board, or a substrate with other characteristics.

[0048] Refer to Figure 2 , in one embodiment, the adhesive 3 contacts the side wall 21 of the image sensing chip 2, and the adhesive 3 bonds the side wall 21 of the image sensing chip 2 and the inner wall 111 of the opening.

[0049] Figure 3 It is a top view showing the image sensing chip and the adhesive according to an embodiment of the present invention. Refer to Figure 2 , 3 , in one embodiment, the image sensing chip 2 is rectangular, the adhesive 3 contacts the four side walls 21 of the image sensing chip 2, and the adhesive 3 bonds the plurality of side walls 21 of the image sensing chip 2 and the inner wall 111 of the opening. The above disclosure does not disclose the present invention. For example, in another embodiment, the adhesive 3 may only contact two of the side walls 21 of the image sensing chip 2, or three of the side walls 21.

[0050] Refer to Figure 2 , in one embodiment, the camera module M further includes a plurality of wires 5, wherein the image sensing chip 2 includes a plurality of chip contacts 22, the substrate 1 includes a plurality of substrate contacts 12, one end of each wire 5 is connected to the corresponding chip contact 22, and the other end of each wire 5 is connected to the corresponding substrate contact 12.

[0051] Refer to FIGS. 2 and 3. In one embodiment, the opening 11 is a through hole, the image sensing chip 2 includes a first chip surface 291, the substrate 1 includes a first substrate surface 191, and the first chip surface 291 is flush with the first substrate surface 191. In this embodiment, the first chip surface 291 is the lower surface of the image sensing chip 2, and the first substrate surface 191 is the lower surface of the substrate 1. The shape of the opening 11 can be changed appropriately. For example, the upper and lower widths of the opening 11 can be different from each other. The above disclosure does not limit the present invention.

[0052] Referring to FIGS. 2 and 3, in one embodiment, there is no support structure of other metals or hard plastics to provide support for the surface 291 of the first chip. In other words, the image sensing chip 2 is fixed in the opening 11 entirely by the support effect provided by the adhesive material 3 and the plurality of wires 5.

[0053] Figure 4 shows the manufacturing process steps of the camera module according to an embodiment of the present invention. Referring to Figure 4 , in one embodiment, the adhesive material 3 is cured by heating. Before the adhesive material 3 is cured, a process tape 61 is attached to the surface 291 of the first chip and the surface 191 of the first substrate to provide support for the image sensing chip 2.

[0054] Referring to FIGS. 2 and 3, in one embodiment, the image sensing chip 2 includes a second chip surface 292, the substrate 1 includes a second substrate surface 192, the second chip surface 292 is lower than the second substrate surface 192, the plurality of chip contacts 22 are arranged on a first chip edge 231 and a second chip edge 232 on the second chip surface 292, the first chip edge 231 is parallel to the second chip edge 232, the plurality of substrate contacts 12 are arranged on a first opening edge 131 and a second opening edge 132 on the second substrate surface 192, and the first opening edge 131 is parallel to the second opening edge 132.

[0055] Referring to Figure 2 , in one embodiment, the lens unit 4 further includes a lens 41 and a filter 42, and the filter 42 is disposed between the image sensing chip 2 and the lens 41.

[0056] Figure 5 is a cross-sectional view of a camera module according to another embodiment of the present invention. In one embodiment, the lens unit 4' of the camera module M' further includes a lens 41', and the lens 41' includes a filter coating 411, and the filter coating 411 corresponds to the image sensing chip 2. In one embodiment, the filter coating 411 can be an infrared absorption coating or an infrared cut-off coating. The above disclosure does not limit the present invention, and the filter coating 411 can also be a coating with other functions, or a coating with multiple functions.

[0057] Figure 6 is a process block diagram of the camera module according to an embodiment of the present invention. Referring to Figure 6 , the manufacturing process of the camera module according to the embodiment of the present invention is as follows. First, in combination with the foregoing Figure 4, with the process tape as an aid, the image sensing chip is disposed within the opening, and an adhesive material is applied between the edge of the image sensing chip and the inner wall of the opening. At this time, the adhesive material is not cured (S1). Then, the substrate, the image sensing chip, and the adhesive material are heated to cure the adhesive material (S2). Next, a wire bonding process is performed on the substrate and the image sensing chip to connect the chip contacts of the image sensing chip and the substrate contacts of the substrate with wires (S3). Then, the process tape is removed (S4). Finally, the lens unit is assembled onto the substrate (S5).

[0058] In one embodiment, in the step of performing the wire bonding process on the substrate and the image sensing chip, methods such as heating and ultrasonic waves can be used for the wire bonding process. The above-mentioned wires can be copper wires or wires made of other materials.

[0059] In an embodiment of the present invention, the image sensing chip is disposed within the opening on the substrate. Thereby, the overall height of the camera module can be reduced. In particular, in one embodiment, the opening on the substrate is a through hole, and the image sensing chip is located at the bottom of the opening. The image sensing chip is fixed within the opening entirely by the supporting effect provided by the adhesive material and the wires. Therefore, the overall height of the camera module can be further reduced.

[0060] The camera module according to the embodiment of the present invention can be applied to laptop computers, tablet computers, mobile phones, or other electronic products. The above disclosure does not limit the present invention.

[0061] Although the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications and improvements without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be defined by the claims.

Claims

1. A camera module, characterized in that, Comprising: A substrate including an opening, wherein the opening has an inner wall of the opening; An image sensing chip disposed within the opening; An adhesive bonding the image sensing chip and the inner wall of the opening; and A lens unit disposed on the substrate and covering the opening, wherein the image sensing chip corresponds to the lens unit.

2. The camera module according to claim 1, wherein The adhesive contacts a sidewall of the image sensing chip, and the adhesive bonds the sidewall of the image sensing chip and the inner wall of the opening.

3. The camera module according to claim 1, wherein The image sensing chip is rectangular, the adhesive contacts four sidewalls of the image sensing chip, and the adhesive bonds the plurality of sidewalls of the image sensing chip and the inner wall of the opening.

4. The camera module according to claim 2 or 3, characterized in that, It further includes a plurality of conductive wires, wherein the image sensing chip includes a plurality of chip contacts, the substrate includes a plurality of substrate contacts, one end of each wire is connected to the corresponding chip contact, and the other end of each wire is connected to the corresponding substrate contact.

5. The camera module according to claim 4, characterized in that, The opening is a through hole, the image sensing chip includes a first chip surface, the substrate includes a first substrate surface, and the first chip surface is flush with the first substrate surface.

6. The camera module according to claim 5, wherein, There is no support structure of other metal or hard plastic providing support to the first chip surface.

7. The camera module according to claim 6, characterized in that, The adhesive is cured by heating. Before the adhesive is cured, a process tape is attached to the first chip surface and the first substrate surface to provide support to the image sensing chip.

8. The camera module according to claim 5, wherein The image sensing chip includes a second chip surface, the substrate includes a second substrate surface, the second chip surface is lower than the second substrate surface, the plurality of chip contacts are arranged on a first chip edge and a second chip edge on the second chip surface, the first chip edge is parallel to the second chip edge, the plurality of substrate contacts are arranged on a first opening edge and a second opening edge on the second substrate surface, and the first opening edge is parallel to the second opening edge.

9. The camera module according to claim 5, wherein, The lens unit further includes a lens and a filter, and the filter is disposed between the image sensing chip and the lens.

10. The camera module according to claim 5, characterized in that, The lens unit further includes a lens, and the lens includes a filter coating corresponding to the image sensing chip.

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