Display device

Abstract

A display device is provided. The display device includes a display panel including: a first area including a display area; a second region spaced apart from the first region in the first direction; and a third region between the first region and the second region and configured to be curved, in which the display panel includes: a first substrate including a rigid material; a second substrate disposed on the first substrate and including a flexible material; a protective layer disposed on the second substrate and overlapping the third region; and an alignment mark disposed on the first substrate, where the display panel includes a cut region overlapping the third region, where a portion of the second substrate and a portion of the protective layer are removed from the cut region, where the first substrate at least partially overlaps the cut region, and where the second substrate at least partially overlaps the cut region. And wherein the alignment mark is provided at a position where the first substrate and the dicing region overlap each other.

Description

[0001] Cross - reference to related applications

[0002] This application claims priority and all benefits arising therefrom to Korean Patent Application No. 10 - 2023 - 0104157, filed on August 9, 2023, the entire contents of which are incorporated herein by reference in its entirety. Technical field

[0003] The present disclosure relates to a display device. Background art

[0004] With the development of an information - oriented society, various demands for display devices are continuously increasing.

[0005] For example, a display device may include a display area for displaying an image and a non - display area around the display area. Such a non - display area is a dead zone. In order to further immerse an observer in the content displayed on the display area and increase the aesthetic appeal of the display device, the width of the dead zone in some display devices is being reduced. Summary of the utility model

[0006] Aspects of the present disclosure provide a display device having improved reliability manufactured by removing non - uniform portions of a protective layer.

[0007] Aspects of the present disclosure also provide a display device that supports improving the alignment accuracy of components when the display device is bent by improving the visibility of alignment marks.

[0008] It should be noted that the objectives of the present disclosure are not limited to the above - mentioned objectives, and for those skilled in the art, other objectives of the present disclosure will be apparent from the following description.

[0009] According to an aspect of the present disclosure, there is provided a display device including a display panel. The display panel includes: a first region including a display area; a second region spaced apart from the first region in a first direction; and a third region located between the first region and the second region and configured to be bent, wherein the display panel includes: a first substrate including a rigid material; a second substrate disposed on the first substrate and including a flexible material; a protective layer disposed on the second substrate and overlapping the third region; and alignment marks disposed on the first substrate. The display panel includes a cutting region overlapping the third region, wherein a portion of the second substrate and a portion of the protective layer are removed from the cutting region, wherein the first substrate at least partially overlaps the cutting region, and wherein the alignment marks are disposed at a position where the first substrate and the cutting region overlap each other.

[0010] In an embodiment, the cutting region may be located at one or more ends of the third region in a second direction different from the first direction.

[0011] In an embodiment, the first substrate may include: an opening overlapping with the third region; a first sub-substrate disposed closer to the first region than the second region with respect to the opening; and a second sub-substrate disposed closer to the second region than the first region with respect to the opening. The first sub-substrate may include a first non-overlapping portion, and the second sub-substrate may include a second non-overlapping portion, and the first non-overlapping portion and the second non-overlapping portion may not overlap with the second substrate, and the alignment mark may overlap with at least one of the first non-overlapping portion and the second non-overlapping portion.

[0012] In an embodiment, when the second substrate is bent at the third region, the alignment mark, the first sub-substrate, the second sub-substrate, and the second substrate may be arranged in the order of the alignment mark, the first sub-substrate, the second sub-substrate, and the second substrate along the thickness direction of the first substrate.

[0013] In an embodiment, the second substrate may include a cutting portion located in the cutting region and a non-cutting portion located on one side of the cutting portion, and wherein the alignment mark overlaps with the cutting portion.

[0014] In an embodiment, the non-cutting portion may include: a first non-cutting portion disposed on a first side of the cutting portion in a second direction different from the first direction; a second non-cutting portion disposed on a second side of the cutting portion in the first direction; and a third non-cutting portion disposed on a third side of the cutting portion in the first direction, wherein the third side is opposite to the second side in the first direction.

[0015] In an embodiment, when the second substrate is bent at the third region, the alignment mark may overlap with the third non-cutting portion of the second substrate.

[0016] In an embodiment, the alignment mark may include one or more sides facing the edge of the cutting portion.

[0017] In an embodiment, the protective layer may include a removed portion located in the cutting region and a non-removed portion located on one or more sides of the removed portion, and the alignment mark may overlap with the removed portion.

[0018] In an embodiment, the removed portion may overlap with the cutting portion.

[0019] In an embodiment, the non-removed portion includes: a first non-removed portion disposed on a first side of the removed portion in a second direction different from the first direction; a second non-removed portion disposed on a second side of the removed portion in the first direction; and a third non-removed portion disposed on a third side of the removed portion in the first direction, wherein the third side is opposite to the second side in the first direction.

[0020] In an embodiment, in the thickness direction of the first substrate, the boundary between the cut portion and the non-cut portion may correspond to the boundary between the removed portion and the non-removed portion.

[0021] In an embodiment, at the boundary between the cut portion and the non-cut portion, the angle formed between the side surface of the second substrate and the upper surface of the first substrate may be in the range of 45 degrees to 90 degrees.

[0022] In an embodiment, the display device may further include a process mark provided at the boundary between the cut portion and the non-cut portion.

[0023] In an embodiment, the length of the process mark in the first direction may be in the range from 10 μm to 100 μm.

[0024] In an embodiment, the cutting region may include: a first cutting region positioned closer to the first region than the second region with respect to the center line of the third region; a second cutting region positioned closer to the second region than the first region with respect to the center line of the third region, wherein, in the first direction, the length of the first cutting region may be greater than the length of the second cutting region.

[0025] In an embodiment, the transmittance of the first substrate may be higher than the transmittance of the second substrate.

[0026] In an embodiment, the first substrate further includes: a first surface on which the second substrate is provided; a second surface opposite to the first surface; a first side surface adjacent to the third region and located between the first surface and the second surface; and a first inclined surface provided between the first surface and the first side surface.

[0027] In an embodiment, in the first direction, the length of the cutting region is greater than or equal to the length of the protective layer.

[0028] In an embodiment, the second substrate may include a cut portion located in the cutting region, the protective layer may include a removed portion located in the cutting region, the cut portion and the removed portion may overlap each other, and the length of the cut portion in the first direction may be greater than or equal to the length of the removed portion in the first direction.

[0029] According to an embodiment of the present disclosure, the reliability of the display device may be improved by removing the non-uniform portion of the protective layer.

[0030] According to an embodiment of the present disclosure, the alignment accuracy of the components when the display device is bent may be improved by improving the visibility of the alignment marks.

[0031] It should be noted that the effects of the present disclosure are not limited to those described above, and for those skilled in the art, other effects of the present disclosure will be apparent from the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] By describing embodiments of the present disclosure in detail with reference to the accompanying drawings, the above and other aspects and features of the present disclosure will become more apparent, wherein:

[0033] Figure 1 is a perspective view showing a display device according to an embodiment of the present disclosure.

[0034] Figure 2 is a plan view showing a display panel and a driver IC according to an embodiment.

[0035] Figure 3 is a cross-sectional view showing an example of a display area of a display device according to an embodiment of the present disclosure.

[0036] Figure 4 is along Figure 1 a cross-sectional view taken along line X1-X1' in

[0037] Figure 5 is a cross-sectional view showing an example of a display device when the display device is bent according to Figure 4 an embodiment of

[0038] Figure 6 is a cross-sectional view showing another example of a display device when the display device is bent according to Figure 4 an embodiment of

[0039] Figure 7 is Figure 2 an enlarged view of region A of

[0040] Figure 8 is a plan view showing a part of a first substrate according to an embodiment.

[0041] Figure 9 is a plan view showing a part of a second substrate according to an embodiment.

[0042] Figure 10 is a plan view showing a part of a protective layer according to an embodiment of the present disclosure.

[0043] Figure 11 is along Figure 7 a cross-sectional view taken along line X2-X2' in an example of

[0044] Figure 12 is along Figure 7 a cross-sectional view taken along line X2-X2' in another example of

[0045] Figure 13 is a plan view of a display device showing an embodiment according to when the display device is bent Figure 7 .

[0046] Figure 14 is Figure 13 an enlarged view of region B of

[0047] Figure 15 is a cross-sectional view taken along line X3-X3' in Figure 14 .

[0048] Figure 16 is a plan view showing a part of a display device according to another embodiment of the present disclosure

[0049] Figure 17 is a plan view showing a part of a first substrate according to another embodiment

[0050] Figure 18 is a plan view showing a part of a second substrate according to another embodiment

[0051] Figure 19 is a plan view showing a part of a protective layer according to another embodiment of the present disclosure

[0052] Figure 20 shows an exemplary flowchart of a method according to one or more embodiments of the present disclosure DETAILED DESCRIPTION

[0053] Exemplary aspects of the present disclosure will now be described more fully hereinafter with reference to the accompanying drawings, in which example embodiments are shown. However, the aspects supported by the present disclosure may be implemented in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the exemplary aspects of the invention to those skilled in the art

[0054] It will also be understood that when a layer is referred to as being "on" another layer or substrate, the layer can be directly on the other layer or substrate, or intervening layers may also be present. Throughout the specification, like reference numerals indicate like components

[0055] Terms such as first, second, etc. may be used to describe various components, but these components should not be limited by these terms. These terms used herein may distinguish one component from other components, and these components are not limited by these terms. For example, without departing from the scope of the present disclosure, a first component may be referred to as a second component, and similarly, a second component may also be referred to as a first component. Unless otherwise specified, singular terms may include plural forms

[0056] In view of the measurements being discussed and the errors associated with the measurement of a particular quantity, the terms "about" or "approximately" as used herein include the stated value and include a suitable range of deviation for the particular value determined by a person of ordinary skill in the art. For example, the term "about" may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the stated value.

[0057] To reduce the width of the non-display area of a display device, aspects of the present disclosure may include forming a bending area between a pad area and a display area, and when the bending area is bent, the pad area may be positioned below the display panel. To this end, a substrate formed of a bendable flexible material may be used. As the substrate size increases, a substrate formed of a rigid material may also be included to maintain the shape.

[0058] When the display device is bent, a main area including a display area and a non-display area and a pad area bent below the main area may be precisely aligned with each other by using alignment marks. Specifically, for example, when the display device is bent, elements located at upper and lower layers may be precisely aligned with each other. By doing so, the width of the non-display area may be adjusted.

[0059] In some aspects, to protect the display device from tension or other external forces applied to elements in the bending area, a protective layer may be included in the bending area.

[0060] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0061] Figure 1 is a perspective view showing a display device according to an embodiment of the present disclosure. Figure 2 is a plan view showing a display panel and a driver IC according to an embodiment.

[0062] Reference Figure 1 and Figure 2 , a display device 10 according to an embodiment of the present disclosure is capable of displaying moving images or still images. The display device 10 may be used as a display screen of a portable electronic device such as, for example, a mobile phone, a smart phone, a tablet PC, a smart watch, a watch phone, a mobile communication terminal, an electronic notebook, an e-book, a portable multimedia player (PMP), a navigation device, and an ultra-mobile PC (UMPC), and a display screen of various products such as, for example, a television, a notebook, a monitor, a billboard, and an Internet of Things device.

[0063] According to an embodiment of the present disclosure, the display device 10 may be a light-emitting display device, such as, for example, an organic light-emitting display device using organic light-emitting diodes, a quantum dot light-emitting display device including a quantum dot light-emitting layer, an inorganic light-emitting display device including an inorganic semiconductor, and a micro-LED display device using micro light-emitting diodes or nano light-emitting diodes (micro-LEDs or nano-LEDs). In the following description, the organic light-emitting display device is described as an example of the display device 10. However, it is to be understood that the embodiments supported by the present disclosure are not limited thereto.

[0064] The display device 10 according to an embodiment may include a display panel 100, a driving integrated circuit (IC) 200, and a circuit board 300.

[0065] The display panel 100 may be formed in a rectangular plane having a longer side in a first direction (X-axis direction) and a shorter side in a second direction (Y-axis direction) intersecting the first direction (X-axis direction). Each of the corners where the longer side in the first direction (X-axis direction) meets the shorter side in the second direction (Y-axis direction) may be formed at a right angle or may be rounded with a curvature circle. The shape of the display panel 100 when viewed from the top (e.g., according to a plan view) is not limited to a quadrilateral shape, but may be formed into different polygonal shapes, circular shapes, or elliptical shapes.

[0066] In the drawings, the first direction (X-axis direction) and the second direction (Y-axis direction) intersect each other as corresponding horizontal and vertical directions. For example, the first direction (X-axis direction) and the second direction (Y-axis direction) may be orthogonal to each other. A third direction (Z-axis direction) may intersect the first direction (X-axis direction) and the second direction (Y-axis direction), and may be, for example, a vertical direction orthogonal to the first direction (X-axis direction) and the second direction (Y-axis direction). Herein, the side indicated by an arrow in each of the first to third directions (X-axis direction, Y-axis direction, and Z-axis direction) may be referred to as the first side, while the opposite side may be referred to as the second side.

[0067] The display panel 100 may be formed flat, but the embodiments supported by the present disclosure are not limited thereto. For example, the display panel 100 may be formed at left and right ends and may include a curved portion having a constant curvature or a varying curvature. In some aspects, the display panel 100 may be flexible such that the display panel 100 may be curved, bent, folded, or curled.

[0068] The display panel 100 may include a main area MA, a bending area BA, and a pad area PDA. The main area MA may include a display area DA for displaying an image and a non-display area NDA surrounding the display area DA.

[0069] In the example, the display area DA may occupy most of the area of the display panel 100. The display area DA may be set at the center of the display device 100. The display panel 100 may include pixels disposed in the display area DA, and each pixel includes a plurality of emission areas and is capable of displaying an image.

[0070] The non-display area NDA may be disposed adjacent to the display area DA. The non-display area NDA may be set outside the display area DA. For example, the non-display area NDA may be set outside the display area DA. The non-display area NDA may surround the display area DA. The non-display area NDA may be defined as the edge of the display panel 100.

[0071] The bending area BA may be located between the display area DA and the pad area PDA in the second direction (Y-axis direction). The bending area BA may extend in the first direction (X-axis direction). The bending area BA may be bent such that the bending area BA (or a part of the bending area BA) is located below the display panel 100. In an example where the bending area BA is bent and located below the display panel 100, a plurality of driver ICs 200 and the circuit board 300 may be located below the display panel 100.

[0072] The pad area PDA may be the lower edge area of the display panel 100. The display panel 100 may include display pads DP connected to the circuit board 300 disposed in the pad area PDA, and a first driving pad and a second driving pad connected to the driver IC 200.

[0073] The display panel 100 may include display pads DP connected to the circuit board 300 disposed in the pad area PDA. The display pads DP may be set at one edge of the display panel 100. For example, the display pads DP may be set at the lower edge of the display panel 100.

[0074] In the display device 10 according to one or more embodiments, the display panel 100 may include a cutting area CA. The cutting area CA may be formed by partially removing the second substrate SUB2 in the bending area BA (see Figure 3 ), and exemplary aspects thereof will be described later in this article. For example, aspects of the present disclosure include a process for forming or establishing the cutting area CA by partially removing the second substrate SUB2 in the bending area BA. The term "cutting area CA" may also be referred to as "cut area CA".

[0075] The cutting region CA may be located in the bending region BA. The cutting region CA may be on both sides of the bending region BA in the extending direction of the bending region BA, for example, in the first direction (X-axis direction). The cutting region CA may have a shape that is recessed toward the inside of the display panel 100 in the direction in which the bending region BA extends. For example, as Figure 2 shown, the cutting region CA on the left side of the bending region BA may be recessed in the first direction (X-axis direction), while the cutting region CA on the right side of the bending region BA may be recessed in the direction opposite to the first direction (negative X-axis direction).

[0076] According to one or more embodiments of the present disclosure, the cutting region CA of the display device 10 may support improving the visibility of the alignment mark MRK (see Figure 7 ). Thus, for example, the improved visibility may support improving the alignment accuracy of the components of the display device 10 when the display device 10 is bent. The cutting region CA will be described in detail later with reference to the following drawings (for example, at Figure 7 etc.). Mentioning the situation when the display device 10 is bent may refer to the bent state (or folded state) of the display device 10.

[0077] The driving integrated circuit (IC) 200 may generate data voltages, power voltages, scan timing signals, and other signals. The driver IC 200 may output data voltages, power voltages, scan timing signals, and other signals.

[0078] The driver IC 200 may be disposed in the pad region PDA. The driver IC 200 may be disposed between the display pad DP and the display region DA in the non-display region NDA. The driver IC 200 may be attached to the non-display region NDA of the display panel 100 by chip-on-glass (COG) technology. Optionally or additionally, the driver IC 200 may be attached to the circuit board 300 by chip-on-plastic (COP) technology, respectively.

[0079] The circuit board 300 may be disposed on the display pad DP provided at one edge of the display panel 100. The circuit board 300 may be attached to the display pad DP using a conductive adhesive member such as, for example, an anisotropic conductive film and an anisotropic conductive adhesive. Thus, for example, the circuit board 300 may be electrically connected to the signal lines of the display panel 100. The circuit board 300 may be a flexible printed circuit board, a flexible film such as, for example, a chip-on-film.

[0080] Figure 3 is a cross-sectional view showing an example of the display region of the display device 10 according to an embodiment of the present disclosure.

[0081] Refer to Figure 3, the display device 10 may include a display panel 100, a polarizing film PF, and a cover window CW.

[0082] The display panel 100 may be an organic light-emitting display panel including light-emitting elements LEL, wherein each of the light-emitting elements LEL includes an organic emission layer 172. However, it should be understood that the embodiments supported by the present disclosure are not limited thereto. The display panel 100 may be a light-emitting display panel such as, for example, a quantum dot light-emitting display panel including a quantum dot emission layer, an inorganic light-emitting display panel including an inorganic semiconductor, and a micro-light-emitting display panel using micro-light-emitting diodes or nano-light-emitting diodes (micro-LED or nano-LED). In the description herein, for ease of explanation, the organic light-emitting display panel is used as an example of the display panel 100.

[0083] The display panel 100 may include a substrate SUB, a display layer DISL, a packaging layer ENC, and a sensor electrode layer SENL.

[0084] The substrate SUB may include a first substrate SUB1 formed of a rigid material, and the substrate SUB may include a second substrate SUB2 formed of a flexible material such as a polymer resin.

[0085] The first substrate SUB1 may include a rigid material. For example, the first substrate SUB1 may be formed of glass. The first substrate SUB1 may be formed of ultra-thin glass (UTG) having a thickness of about 500 μm or less. For example, aspects of the present disclosure include processes (e.g., UTG, etc.) for forming the first substrate SUB1 of glass.

[0086] The second substrate SUB2 may include a flexible material. The second substrate SUB2 may be formed of a polymer resin having a thickness less than that of the first substrate SUB1. For example, the second substrate SUB2 may have a thickness of about 20 μm or less. The second substrate SUB2 may be formed of an organic material such as, for example, acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin. Since the second substrate SUB2 is formed of a polymer resin, the second substrate SUB2 may be referred to as a plastic substrate. In some embodiments, the second substrate SUB2 may have a multi-layer structure.

[0087] In some embodiments, the light transmittance (also referred to as transmittance) of the first substrate SUB1 may be higher than that of the second substrate SUB2. In some aspects, the refractive index of the first substrate SUB1 may be lower than that of the second substrate SUB2.

[0088] The display layer DISL may include a thin-film transistor layer TFTL including a plurality of thin-film transistors and an emission material layer EML including a plurality of light-emitting elements.

[0089] The thin film transistor layer TFTL may include a first buffer film BF1, thin film transistors TFT, a gate insulator 130, a first interlayer dielectric film 141, a capacitor Cst, a second interlayer dielectric film 142, a first data metal layer, a first organic film 160, a second data metal layer, and a second organic film 180.

[0090] The first buffer film BF1 may be disposed on the substrate SUB. The first buffer film BF1 may be formed of an inorganic material such as, for example, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer. Optionally, the first buffer film BF1 may be formed of a plurality of layers in which two or more of a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer are stacked.

[0091] The active layer may be disposed on the first buffer film BF1. The channel region TCH, source region TS, and drain region TD of the thin film transistor TFT may each be formed of the active layer and may be disposed on the first buffer film BF1. The active layer may be formed of polysilicon, single crystal silicon, low temperature polysilicon, amorphous silicon, or an oxide semiconductor. In an example where the active layer includes a polysilicon or oxide semiconductor material, the source region TS and drain region TD in the active layer may be conductive regions doped with ions or impurities to have conductivity.

[0092] The gate insulator 130 may be disposed on the active layer of the thin film transistor TFT. The gate insulator 130 may be formed of an inorganic layer such as, for example, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0093] The first gate metal layer may be disposed on the gate insulator 130. The gate electrode TG of the thin film transistor TFT, the first capacitor electrode CAE1 of the capacitor Cst, and the scan line may each be formed of the first gate metal layer and may be disposed on the gate insulator 130. The gate electrode G of the thin film transistor TFT may overlap the channel region TCH in the third direction (Z-axis direction). The first gate metal layer may be formed of a single layer or multiple layers of one or more of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and their alloys.

[0094] The first interlayer dielectric film 141 may be disposed on the first gate metal layer. The first interlayer dielectric film 141 may be formed of an inorganic layer such as, for example, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The first interlayer dielectric film 141 may include a plurality of inorganic layers.

[0095] The second gate metal layer may be disposed on the first interlayer dielectric film 141. The second capacitor electrode CAE2 of the capacitor Cst may be formed of the second gate metal layer and disposed on the first interlayer dielectric film 141. The second capacitor electrode CAE2 may overlap with the first capacitor electrode CAE1 in the third direction (Z-axis direction). Accordingly, the capacitor Cst may be formed of the first capacitor electrode CAE1, the second capacitor electrode CAE2, and an inorganic insulating dielectric film disposed between the first capacitor electrode CAE1 and the second capacitor electrode CAE2, where the inorganic insulating dielectric film serves as a dielectric film. The second gate metal layer may be formed of a single layer or multiple layers of one or more of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and alloys thereof.

[0096] The second interlayer dielectric film 142 may be disposed on the second gate metal layer. The second interlayer dielectric film 142 may be formed of an inorganic layer such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The second interlayer dielectric film 142 may include multiple inorganic layers.

[0097] The first data metal layer may be disposed on the second interlayer dielectric film 142. The first connection electrode CE1 and the data line may be formed of the first data metal layer and disposed on the second interlayer dielectric film 142. The first connection electrode CE1 may be connected to the drain region TD through a first contact hole CT1 that penetrates the gate insulator 130, the first interlayer dielectric film 141, and the second interlayer dielectric film 142. The first data metal layer may be formed of a single layer or multiple layers of one or more of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and alloys thereof.

[0098] The first organic film 160 may be disposed over the first connection electrode CE1 to provide a flat surface over the thin film transistor TFT having an uneven height. For example, the first organic film 160 may planarize the thin film transistor TFT. The first organic film 160 may be formed as an organic layer such as, for example, an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, and a polyimide resin.

[0099] The second data metal layer may be disposed on the first organic film 160. The second connection electrode CE2 may be formed of the second data metal layer and disposed on the first organic film 160. The second data metal layer may be connected to the first connection electrode CE1 through a second contact hole CT2 that penetrates the first organic film 160. The second data metal layer may be formed of a single layer or multiple layers of one or more of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and their alloys.

[0100] The second organic film 180 may be disposed on the second connection electrode CE2. The second organic film 180 may be formed as an organic layer such as, for example, an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, and a polyimide resin.

[0101] In some embodiments, the second data metal layer including the second connection electrode CE2 and the second organic film 180 may be omitted.

[0102] The emission material layer EML is disposed on the thin film transistor layer TFTL. The emission material layer EML may include a light emitting element LEL and a pixel defining film 190.

[0103] Each of the light emitting elements LEL may include a pixel electrode 171, an emission layer 172, and a common electrode 173. In each of the emission regions EA, the pixel electrode 171, the emission layer 172, and the common electrode 173 are sequentially stacked on each other such that holes from the pixel electrode 171 and electrons from the common electrode 173 recombine with each other in the emission layer 172 to emit light. In this case, for example, the pixel electrode 171 may be an anode electrode, and the common electrode 173 may be a cathode electrode.

[0104] The pixel electrode layer may be formed on the second organic film 180. For example, the pixel electrode 171 may be formed of the pixel electrode layer and formed on the second organic film 180. The pixel electrode 171 may be connected to the second connection electrode CE2 through a third contact hole CT3 that penetrates the second organic film 180. The pixel electrode layer may be formed of a single layer or multiple layers of one or more of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and their alloys.

[0105] In a top-emission structure where light is emitted from the emission layer 172 toward the common electrode 173, in order to improve the reflectivity, the pixel electrode 171 may be formed of a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), or aluminum (Al), or the pixel electrode 171 may be formed of a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, or a stacked structure of an APC alloy and ITO (ITO / APC / ITO). The APC alloy may be an alloy of silver (Ag), palladium (Pd), and copper (Cu).

[0106] The pixel defining film 190 may define the emission area EA of the pixel. In an example, the pixel defining film 190 may be formed on the second organic film 180 such that the pixel defining film 190 exposes a part of the pixel electrode 171. The pixel defining film 190 may cover the edge of the pixel electrode 171. The pixel defining film 190 may be disposed inside the third contact hole CT3. In other words, the third contact hole CT3 may be filled with the pixel defining film 190. The pixel defining film 190 may be formed of an organic layer such as, for example, an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, and a polyimide resin.

[0107] The spacer 191 may be disposed on the pixel defining film 190. During the process of manufacturing the emission layer 172, the spacer 191 may support the mask. The spacer 191 may be formed of an organic layer such as, for example, an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, and a polyimide resin.

[0108] The emission layer 172 is formed on the pixel electrode 171. The emission layer 172 may include an organic material to emit light of a specific color. For example, the emission layer 172 may include a hole transport layer, an organic material layer, and an electron transport layer. The organic material layer may include a host and a dopant. The organic material layer may include a material that emits predetermined light, and a phosphor or a fluorescent material may be used to form the organic material layer.

[0109] The common electrode 173 is formed on the emission layer 172. The common electrode 173 may be formed such that the common electrode 173 covers the emission layer 172. The common electrode 173 may be a common layer formed across the emission area EA. A capping layer may be formed on the common electrode 173.

[0110] In the top-emission structure, the common electrode 173 may be formed of a transparent conductive material (TCP) (such as, for example, ITO and IZO that can transmit light) or a semi-transmissive conductive material (such as, for example, magnesium (Mg), silver (Ag), and an alloy of magnesium (Mg) and silver (Ag)). When the common electrode 173 is formed of a semi-transmissive metal material, the light extraction efficiency may be improved by using a microcavity.

[0111] The encapsulation layer ENC can be disposed on the emissive material layer EML. The encapsulation layer ENC can include one or more inorganic films TFE1 and TFE3 that support preventing oxygen or moisture from permeating into the emissive material layer EML. In some aspects, in order to protect the emissive material layer EML from particles such as, for example, dust, the encapsulation layer ENC can include at least one organic film. For example, the encapsulation layer ENC can include a first inorganic encapsulation film TFE1, an organic encapsulation film TFE2, and a second inorganic encapsulation film TFE3.

[0112] The first inorganic encapsulation film TFE1 can be disposed on the common electrode 173, the organic encapsulation film TFE2 can be disposed on the first inorganic encapsulation film TFE1, and the second inorganic encapsulation film TFE3 can be disposed on the organic encapsulation film TFE2. The first inorganic encapsulation film TFE1 and the second inorganic encapsulation film TFE3 can be formed of multiple layers in which one or more inorganic layers such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer are alternately stacked on one another. The organic encapsulation film TFE2 can be an organic film such as, for example, an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, a polyimide resin, etc.

[0113] The sensor electrode layer SENL can be disposed on the encapsulation layer ENC. The sensor electrode layer SENL can include a second buffer film BF2, a first bridge BE1, a first sensor insulating film TINS1, sensor electrodes TE and RE, and a second sensor insulating film TINS2.

[0114] The second buffer film BF2 can be disposed on the encapsulation layer ENC. The second buffer film BF2 can include at least one inorganic film. For example, the second buffer film BF2 can be formed of multiple layers in which one or more inorganic layers such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer are alternately stacked on one another. In some embodiments, the display device 10 can omit the second buffer film BF2.

[0115] The first bridge BE1 can be disposed on the second buffer film BF2. The first bridge BE1 can be formed of a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), or aluminum (Al), or can be formed of a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, or a stacked structure of an APC alloy and ITO (ITO / APC / ITO).

[0116] The first sensor insulating film TINS1 can be disposed on the first bridge BE1. The first sensor insulating film TINS1 can be formed of an inorganic layer such as, for example, a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0117] Sensor electrodes (e.g., driving electrode TE and sensing electrode RE) may be disposed on the first sensor insulating film TINS1. In some aspects, dummy patterns may be disposed on the first sensor insulating film TINS1. In some embodiments, the driving electrode TE, the sensing electrode RE, and the dummy patterns do not overlap with the emission region EA. The driving electrode TE, the sensing electrode RE, and the dummy patterns may be formed of a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), or aluminum (Al), or may be formed of a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, or a stacked structure of an APC alloy and ITO (ITO / APC / ITO).

[0118] The second sensor insulating film TINS2 may be disposed on the driving electrode TE, the sensing electrode RE, and the dummy patterns. The second sensor insulating film TINS2 may include at least one of an inorganic film and an organic film. The inorganic film may be a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic film may include an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

[0119] The polarizing film PF may be disposed on the sensor electrode layer SENL. To reduce reflection of external light, the polarizing film PF may be disposed on the display panel 100. The polarizing film PF may include a first base member, a linear polarizer, a retardation film (such as, for example, a λ / 4 plate (quarter-wave plate)), and a second base member. The first base member, the retardation film, the linear polarizer, and the second base member of the polarizing film PF may be sequentially stacked on the display panel 100.

[0120] The cover window CW may be disposed on the polarizing film PF. The cover window CW may be attached to the polarizing film PF through a transparent adhesive member (such as, for example, an optically clear adhesive (OCA) film).

[0121] Figure 4 is a cross-sectional view taken along the Figure 1 line X1-X1'. Figure 5 is a cross-sectional view showing an example of the display device 10 according to an Figure 4 embodiment when the display device 10 is bent. Figure 6 is a cross-sectional view showing another example of the display device 10 according to an Figure 4 embodiment when the display device 10 is bent.

[0122] Refer to Figures 4 to 6, in addition to the display panel 100, the polarizing film PF, the cover window CW, the driver IC 200, and the circuit board 300, the display device 10 may further include a protective layer PRTL (also referred to as a protective film PRTL herein) and a panel bottom cover PB. The display panel 100 may include a substrate SUB, a display layer DISL, a packaging layer ENC, and a sensor electrode layer SENL.

[0123] In this article, the repeated descriptions of the display layer DISL, the packaging layer ENC, the sensor electrode layer SENL, the polarizing film PF, and the cover window CW provided previously will be omitted.

[0124] The substrate SUB may include a first substrate SUB1 formed of a rigid material and a second substrate SUB2 formed of a flexible material such as a polymer resin. In an example, the first substrate SUB1 may be disposed outside the bending region (e.g., the first substrate SUB1 is not disposed in the bending region BA). For example, the first substrate SUB1 may include an opening BOP that exposes the second substrate SUB2. Thus, for example, since the first substrate SUB1 formed of a rigid material is not disposed in the bending region BA, the bending region BA can be easily bent as Figure 5 shown therein.

[0125] The protective layer PRTL may be disposed on the thin film transistor layer TFTL in the bending region BA. The protective layer PRTL may be a layer for protecting the thin film transistor layer TFTL exposed to the outside in the bending region BA. In some aspects, the protective layer PRTL may protect the thin film transistor layer TFTL from the tension or other external forces that may be applied to the thin film transistor layer TFTL when the display device 10 is bent. The protective layer PRTL may be formed of an organic material such as, for example, an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, and a polyimide resin. In an example, the thickness of the protective layer PRTL may be about 60 μm or greater, but is not limited to about 60 μm or greater.

[0126] The panel bottom cover PB may be disposed on the second surface of the first substrate SUB1 of the display panel 100. The second surface of the first substrate SUB1 may be opposite to the first surface. For example, the panel bottom cover PB may be disposed on the lower surface BS of the first substrate SUB1. The panel bottom cover PB may be attached to the second surface of the first substrate SUB1 of the display panel 100 through an adhesive member. In an example, the adhesive member may be a pressure-sensitive adhesive (PSA), but is not limited thereto.

[0127] The panel bottom cover PB may include at least one of a light-blocking member for absorbing light incident from outside the display device 10, a buffer member for absorbing external impacts, and a heat dissipation member for effectively discharging heat from the display panel 100.

[0128] As Figure 5 shown, the bending region BA can be bent such that the driver IC 200 and the circuit board 300 are located below the display panel 100. The circuit board 300 can be attached to the lower surface of the panel bottom cover PB through an adhesive member 310. In an example, the adhesive member 310 can be a pressure-sensitive adhesive, but is not limited thereto.

[0129] According to some embodiments, the first substrate SUB1 can include an upper surface US, a lower surface BS, a first side surface SS1, and a first inclined surface IP1_1. The upper surface US of the first substrate SUB1 can be a side surface in the third direction (Z-axis direction), and the lower surface BS can be opposite to this side surface in the third direction (Z-axis direction).

[0130] The first side surface SS1 can be positioned at the edge BEG of the bending region BA. The edge BEG of the bending region BA can refer to the edge formed by etching the first substrate SUB1 in the bending region BA.

[0131] The first side surface SS1 can be located between the upper surface US and the lower surface BS. The first side surface SS1 can be positioned at the edge BEG of the bending region BA. The first side surface SS1 can be an inclined surface. According to an embodiment of the present disclosure, the angle formed between the first side surface SS1 and the upper surface US can be an acute angle, and the angle formed between the first side surface SS1 and the lower surface BS can be an obtuse angle.

[0132] The inclined surface of the first side surface SS1 can be formed by attaching a protective film to the first substrate SUB1 during the process of manufacturing the display device 10 and etching a portion of the first substrate SUB1 in the bending region BA (e.g., based on the protective film). For example, by attaching the protective film to the first substrate SUB1 except for the portion of the first substrate SUB1 in the bending region BA, the portion where the protective film is not attached (e.g., the portion of the first substrate SUB1 located in the bending region BA) can be etched first before etching the entire first substrate SUB1. In an example, due to the isotropic nature of wet etching, the portion of the first substrate SUB1 located in the bending region BA can be formed into an inclined surface. After the portion of the first substrate SUB1 located in the bending region BA is etched to a predetermined thickness, the protective film can be removed and the entire first substrate SUB1 can be etched. In this way, for example, the thickness of the first substrate SUB1 can be reduced, and an opening BOP exposing the second substrate SUB2 can be formed in the bending region BA.

[0133] The first inclined surface IP1_1 may be located between the upper surface US and the first side surface SS1. The first inclined surface IP1_1 may be an undercut formed between the first substrate SUB1 and the second substrate SUB2. When the first substrate SUB1 is etched during the process of manufacturing the display device 10, the first inclined surface IP1_1 may be over-etched when the etchant intrudes at the interface between the first substrate SUB1 and the second substrate SUB2.

[0134] According to an embodiment, as Figure 5 shown, the bending region BA may be located between two ends P2 of the edge BEG of the first substrate SUB1 in the bending region BA. According to another embodiment, as Figure 6 shown, since an undercut is formed between the first inclined surface IP1_1 and the upper surface US of the first substrate SUB1, the bending region BA may be located between two points P1 where the first inclined surface IP1_1 of the first substrate SUB1 meets the upper surface US.

[0135] Figure 7 is Figure 2 an enlarged view of region A of Figure 8 is a plan view showing a part of the first substrate SUB1 according to an embodiment. Figure 9 is a plan view showing a part of the second substrate SUB2 according to an embodiment. Figure 10 is a plan view showing a part of the protective layer PRTL according to an embodiment of the present disclosure.

[0136] Figures 7 to 10 is a view showing Figure 2 region A including the cutting region CA of . Since the cutting region CA on the left side of the display device 10 is similar to the cutting region CA on the right side, for the sake of convenience of explanation, the cutting region CA on the left side will be described as an example.

[0137] Referring to Figures 7 to 10 , the display panel 100 may include a first substrate SUB1, a second substrate SUB2 disposed on the first substrate SUB1, and a protective layer PRTL disposed on the second substrate SUB2.

[0138] The first substrate SUB1 may include an opening BOP exposing the second substrate SUB2. For example, as Figure 8As shown, the first substrate SUB1 may include an opening BOP that exposes the second substrate SUB2 in the bending region BA. The opening BOP of the first substrate SUB1 may be formed via an etching process. The opening BOP of the first substrate SUB1 may extend along the first direction (X-axis direction) in which the bending region BA extends. The length of the opening BOP of the first substrate SUB1 in the second direction (Y-axis direction) may be in the range of about 1000 μm to 1200 μm, but is not limited thereto.

[0139] The first substrate SUB1 may include a first sub-substrate SSUB1 and a second sub-substrate SSUB2. In an example, the first sub-substrate SSUB1 is closer to the main region MA than the pad region PDA with respect to the opening BOP, and the second sub-substrate SSUB2 is closer to the pad region PDA than the main region MA with respect to the opening BOP.

[0140] The second substrate SUB2 may have a shape in which at least a portion of one or more ends of the second substrate SUB2 is recessed in the first direction (X-axis direction) or a direction opposite to the first direction. For example, as Figure 9 shown, the second substrate SUB2 may have a shape in which one end is recessed in the first direction (X-axis direction). In some embodiments, the second substrate SUB2 may have a shape in which at least a portion of one end of the second substrate SUB2 is recessed in the first direction (e.g., the positive X-axis direction) and at least a portion of the other end of the second substrate SUB2 is recessed in a direction opposite to the first direction (e.g., the negative X-axis direction).

[0141] In some embodiments, the second substrate SUB2 may include a cutting portion CP and a non-cutting portion NCP. The term "cutting portion CP" may also be referred to as "cut portion CP". The term "non-cutting portion NCP" may also be referred to as "non-cut portion NCP" or "uncut portion NCP".

[0142] The cutting portion CP may be formed by removing a portion of the second substrate SUB2. For example, aspects of the present disclosure include forming the cutting portion CP by removing one or more portions of the second substrate SUB2. The cutting portion CP may be located in a cutting region CA, and exemplary aspects thereof will be described later herein. For example, the cutting portion CP may be located at both ends of the second substrate SUB2 in the first direction (X-axis direction), respectively. The cutting portion CP may extend across the main region MA, the bending region BA, and the pad region PDA.

[0143] The non-cutting portion NCP may include a first non-cutting portion NCP1, a second non-cutting portion NCP2, and a third non-cutting portion NCP3. The first non-cutting portion NCP1 may be located on one side of the cutting portion CP in a first direction (X-axis direction). The second non-cutting portion NCP2 and the third non-cutting portion NCP3 may be located on one side of the first non-cutting portion NCP1 in the first direction (X-axis direction). In some aspects, the second non-cutting portion NCP2 and the third non-cutting portion NCP3 may be respectively located on two sides of the cutting portion CP in a second direction (Y-axis direction). Although the non-cutting portion NCP has been described as the first non-cutting portion NCP1, the second non-cutting portion NCP2, and the third non-cutting portion NCP3 for ease of illustration, the non-cutting portion NCP is not limited thereto. For example, the non-cutting portion NCP may be formed as an integral element that is not divided into sub-elements.

[0144] According to an embodiment, as Figure 9 shown, the cutting portion CP may have a rectangular shape (such as a square shape). For example, a first edge CP_E1 between the cutting portion CP and the first non-cutting portion NCP1 may extend in the second direction (Y-axis direction). A second edge CP_E2 between the cutting portion CP and the second non-cutting portion NCP2 may extend in the first direction (X-axis direction), and a third edge CP_E3 between the cutting portion CP and the third non-cutting portion NCP3 may extend in the first direction (X-axis direction). However, it should be understood that the embodiments supported by the present disclosure are not limited thereto. In other embodiments, the shape of the cutting portion CP may be modified in various ways. For example, the cutting portion CP may have various shapes such as, for example, a circular shape, an oval shape, and other polygons.

[0145] The protective layer PRTL may have a shape in which at least a portion of one or more ends of the protective layer PRTL is recessed in a first direction (X-axis direction). For example, as Figure 10 shown, the protective layer PRTL may have a shape in which one end is recessed in the first direction. In some embodiments, the protective layer PRTL may have a shape in which at least a portion of one end of the protective layer PRTL is recessed in a first direction (e.g., the positive X-axis direction) and at least a portion of the other end of the protective layer PRTL is recessed in a direction opposite to the first direction (e.g., the negative X-axis direction).

[0146] In some embodiments, the protective layer PRTL may include one or more removal portions RV and one or more non-removal portions NRV.

[0147] The removed portion RV can be formed by partially removing the protective layer PRTL. The term "removed portion RV" can refer to an area or region where the protective layer PRTL is absent or from which a portion of the protective layer PRTL has been removed. Referring to the removed portion RV can refer to a single removed portion RV or multiple removed portions RV included in the removed portion RV. The removed portion RV can be located in the cutting area CA, and its exemplary aspects will be described later herein. For example, the removed portion RV can be located at both ends of the protective layer PRTL in the first direction (X-axis direction), respectively. The removed portion RV can extend across the main area MA, the bending area BA, and the pad area PDA.

[0148] The non-removed portion NRV can include a first non-removed portion NRV1, a second non-removed portion NRV2, and a third non-removed portion NRV3. The first non-removed portion NRV1 can be located on one side of the removed portion RV in the first direction (X-axis direction). The second non-removed portion NRV2 and the third non-removed portion NRV3 can be located at one side of the first non-removed portion NRV1 in the first direction (X-axis direction). The second non-removed portion NRV2 and the third non-removed portion NRV3 can be located on both sides of the removed portion RV in the second direction (Y-axis direction), respectively. Although the non-removed portion NRV has been described as the first non-removed portion NRV1, the second non-removed portion NRV2, and the third non-removed portion NRV3 for the sake of convenience, the non-removed portion NRV is not limited thereto. The non-removed portion NRV can be formed as an integral element that is not divided into sub-elements.

[0149] According to an embodiment, as Figure 10 shown, the removed portion RV can have a rectangular shape (such as a square shape). For example, the fourth edge RV_E1 between the removed portion RV and the first non-removed portion NRV1 can extend in the second direction (Y-axis direction). The fifth edge RV_E2 between the removed portion RV and the second non-removed portion NRV2 can extend in the first direction (X-axis direction), and the sixth edge RV_E3 between the removed portion RV and the third non-removed portion NRV3 can extend in the first direction (X-axis direction). However, it should be understood that the embodiments supported by the present disclosure are not limited thereto. In other embodiments, the shape of the removed portion RV can be modified in various ways. For example, the removed portion RV can have various shapes such as, for example, a circle, an ellipse, and other polygons.

[0150] Referring to Figure 7In the example shown, the display panel 100 may include a cutting area CA. The cutting area CA may extend across the main area MA, the bending area BA, and the pad area PDA in the second direction (Y-axis direction). The cutting area CA may be formed by removing a portion of the second substrate SUB2. A portion of the protective layer PRTL may be removed from the cutting area CA. The term "cutting area CA" may refer to an area or region in which a portion of the second substrate SUB2 and / or a portion of the protective layer PRTL has been removed.

[0151] The bending area BA may include a first bending area BA1 that is closer to the main area MA than to the central line BA_CL of the bending area BA, and a second bending area BA2 that is closer to the pad area PDA than to the central line BA_CL of the bending area BA. In some embodiments, in the second direction (Y-axis direction), the length of the first bending area BA1 may be equal to the length of the second bending area BA2.

[0152] The cutting area CA may include a first cutting area CA1 and a second cutting area CA2. With respect to the central line BA_CL of the bending area BA, the first cutting area CA1 may be closer to the main area MA than to the pad area PDA, and with respect to the central line BA_CL of the bending area BA, the second cutting area CA2 may be closer to the pad area PDA than to the main area MA. In other words, based on the central line BA_CL of the bending area BA, the cutting area CA may be divided into the first cutting area CA1 and the second cutting area CA2. The first cutting area CA1 may be closer to the main area MA, and the second cutting area CA2 may be closer to the pad area PDA.

[0153] The first cutting area CA1 may overlap with the first bending area BA1 and the first sub-substrate SSUB1. The second cutting area CA2 may overlap with the second bending area BA2 and the second sub-substrate SSUB2.

[0154] The first sub-substrate SSUB1 may include a first non-overlapping portion SSUB1a. At the first non-overlapping portion SSUB1a, the first sub-substrate SSUB1 may not overlap with the second substrate SUB2 or the protective layer PRTL. Optionally, at the first non-overlapping portion SSUB1a, the first sub-substrate SSUB1 may overlap with the cut portion CP of the second substrate SUB2 and the removed portion RV of the protective layer PRTL. The first non-overlapping portion SSUB1a may be disposed in the first cutting area CA1.

[0155] The second sub-substrate SSUB2 may include a second non-overlapping portion SSUB2a. At the second non-overlapping portion SSUB2a, the second sub-substrate SSUB2 may be arranged such that the second sub-substrate SSUB2 does not overlap with the second substrate SUB2 or the protective layer PRTL. For example, at the second non-overlapping portion SSUB2a, the second sub-substrate SSUB2 may overlap with the cut portion CP of the second substrate SUB2 and the removed portion RV of the protective layer PRTL, such that the second sub-substrate SSUB2 does not overlap with the non-removed portion NRV of the second substrate SUB2 or the protective layer PRTL. The second non-overlapping portion SSUB2a may be arranged in the second cutting region CA2.

[0156] In the display device 10 according to the exemplary embodiment described with reference to Figures 7 to 10 the protective layer PRTL includes a removed portion RV. That is, in the display device 10 according to the exemplary embodiment described with reference to Figures 7 to 10 the portion of the protective layer PRTL has been removed, and as described, the absence of the protective layer PRTL can prevent cracks from forming in the thin film transistor layer TFTL (see Figure 5 ) when the display device 10 is bent. When the protective layer PRTL is applied to the second substrate SUB2, due to surface tension and / or other factors (e.g., the removal of a portion of the protective layer PRTL), the thickness of the end portion (e.g., the end portion in the first direction (X-axis direction)) of the display device 10 may be less than the thickness of the center of the display device 10. If the display device 10 is bent and the thinner portion (e.g., the thinner end portion) of the protective layer PRTL is not removed, cracks may occur in the thin film transistor layer TFTL (see Figure 5 ). Such cracks may propagate to the lines in the bending region BA or the pad region PDA, resulting in defects. By removing the thinner end portion of the protective layer PRTL according to one or more embodiments of the present disclosure as described herein, the reliability of the display device 10 can be improved.

[0157] In some aspects, the display panel 100 may further include alignment marks MRK. The alignment marks MRK may be arranged on the first non-overlapping portion SSUB1a of the first sub-substrate SSUB1. In an example, the alignment marks MRK may be arranged such that the alignment marks MRK do not overlap with the second substrate SUB2 or the protective layer PRTL. Optionally, the alignment marks MRK may overlap with the cut portion CP of the second substrate SUB2 and the removed portion RV of the protective layer PRTL, such that the alignment marks MRK do not overlap with the second substrate SUB2 or the protective layer PRTL. The alignment marks MRK may include a metallic material, but are not limited to a metallic material.

[0158] Although the alignment mark MRK is shown in an L shape in the drawings, the embodiments supported by the present disclosure are not limited thereto. For example, as long as the alignment mark MRK includes an edge or a line facing one or more edges of the cutting portion CP, the shape of the alignment mark MRK can be modified in various ways.

[0159] Although the alignment mark MRK is shown in the drawings as being disposed on the first sub-substrate SSUB1, the alignment mark MRK is not limited thereto. In some alternative and / or additional embodiments, the alignment mark MRK may be disposed on the second sub-substrate SSUB2. In an embodiment, a plurality of alignment marks MRK may be respectively disposed on the first sub-substrate SSUB1 and the second sub-substrate SSUB2.

[0160] When the display device 10 is bent, the alignment mark MRK can be used to check the alignment of the components disposed in the main area MA and the components disposed in the pad area PDA. According to one or more embodiments, the cutting area CA of the display device 10 can support improving the visibility of the alignment mark MRK, so that the alignment accuracy of the components when the display device 10 is bent can be improved.

[0161] Specifically, the alignment mark MRK can be identified using an optical device. As described herein, the light transmittance of the first substrate SUB1 can be higher than that of the second substrate SUB2, and the refractive index of the first substrate SUB1 can be lower than that of the second substrate SUB2. Therefore, for example, the light emitted from the optical device can be less distorted when passing through the first substrate SUB1 than when passing through the second substrate SUB2. Therefore, for example, by disposing or positioning the alignment mark MRK on the first non-overlapping portion SSUB1a of the first sub-substrate SSUB1, the visibility of the alignment mark MRK can be improved. Later, for example, reference will be made to Figures 13 to 15 Describe in detail the exemplary aspects of disposing or positioning the alignment mark MRK on the first non-overlapping portion SSUB1a.

[0162] In some embodiments, in the second direction (Y-axis direction), the length L1 of the first cutting region CA1 may be greater than the length L2 of the second cutting region CA2. In the display device 10 according to one or more embodiments, when the length L1 of the first cutting region CA1 is greater than the length L2 of the second cutting region CA2, even if the alignment mark MRK is only provided on the first sub-substrate SSUB1, the embodiments of the display device 10 support easy inspection of the alignment of elements when the display device 10 is bent. For example, when the display device 10 is bent, the elements can be aligned by comparing the position of the alignment mark MRK on the first sub-substrate SSUB1 with the position provided in the pad region PDA of the second substrate SUB2. For the exemplary aspect of aligning the elements by comparing the position of the alignment mark MRK with the position of the second substrate SUB2, it will be described in detail later with reference to, for example Figures 13 to 15 will be described in detail.

[0163] Figure 11 is a cross-sectional view showing an example taken along the Figure 7 line X2-X2'. Figure 12 is a cross-sectional view showing another example taken along the Figure 7 line X2-X2'.

[0164] Combined with Figures 7 to 10 referring to Figure 11 and Figure 12 , the second substrate SUB2 and the protective layer PRTL may include process marks HZ at the ends of the cutting region CA. For example, the second substrate SUB2 and the protective layer PRTL (or a part of the second substrate SUB2 and a part of the protective layer PRTL) may be removed in the cutting region CA via a laser cutting process. Due to the energy of the laser, the physical properties of the second substrate SUB2 and the protective layer PRTL can be changed in the corresponding regions adjacent to the cutting region CA of the second substrate SUB2 and the protective layer PRTL. That is, the process marks HZ of the second substrate SUB2 and the protective layer PRTL may be heat-affected zones affected by the laser energy. The length of the process mark region HZA in which the process marks HZ are formed in the second direction (Y-axis direction) may be about 10 μm to 100 μm.

[0165] Although in the exemplary drawings, the process marks HZ are formed on the side surface SUB2a of the second substrate SUB2, the side surface PRTLa of the protective layer PRTL, and the upper surface of the protective layer PRTL, the embodiments supported by the present disclosure are not limited thereto. For example, the process marks HZ may optionally and / or additionally be formed at the interface between the second substrate SUB2 and the protective layer PRTL inside the second substrate SUB2 and / or the protective layer PRTL within the process mark region HZA.

[0166] According to an embodiment, asFigure 11 As shown, the side surface SUB2a of the second substrate SUB2 and the side surface PRTLa of the protective layer PRTL may be vertical surfaces. For example, the angle θ1 formed by the side surface SUB2a of the second substrate SUB2 and the side surface PRTLa of the protective layer PRTL with the upper surface US of the first substrate SUB1 may be 90 degrees. According to another embodiment, as Figure 12 shown, the side surface SUB2a of the second substrate SUB2 and the side surface PRTLa of the protective layer PRTL may be inclined surfaces. For example, the angle θ1 formed by the side surface SUB2a of the second substrate SUB2 and the side surface PRTLa of the protective layer PRTL with the upper surface US of the first substrate SUB1 may be equal to or greater than 45 degrees and less than 90 degrees. Depending on the laser emission angle, the angle θ1 formed by the side surface SUB2a of the second substrate SUB2 and the side surface PRTLa of the protective layer PRTL with the upper surface US of the first substrate SUB1 may be in the range between 45 degrees and 90 degrees.

[0167] In some embodiments, as Figure 7 shown, Figure 9 and Figure 10 shown, when viewed from the top (e.g., according to a plan view), the edges of the cutting portion CP and the edges of the removal portion RV may coincide with each other. For example, the first edge CP_E1, the second edge CP_E2, and the third edge CP_E3 may coincide with the fourth edge RV_E1, the fifth edge RV_E2, and the sixth edge RV_E3, respectively. In other words, the respective coordinates of the first edge CP_E1, the second edge CP_E2, and the third edge CP_E3 according to the plan view may be the same as the respective coordinates of the fourth edge RV_E1, the fifth edge RV_E2, and the sixth edge RV_E3. The terms "edge" and "boundary" may be used interchangeably herein.

[0168] As used herein, the phrase that the edges of the cutting portion CP and the edges of the removal portion RV coincide with each other may mean that: when the side surface SUB2a and the side surface PRTLa are vertical surfaces as Figure 11 shown and / or when the side surface SUB2a and the side surface PRTLa are inclined surfaces as Figure 12 shown, the side surface SUB2a of the second substrate SUB2 and the side surface PRTLa of the protective layer PRTL coincide with each other. The description herein of elements that "coincide with each other" may mean that the corresponding coordinates of the elements are the same.

[0169] For example, in some embodiments, in the case where the angle between the side surface SUB2a of the second substrate SUB2 and the upper surface US of the first substrate SUB1 is equal to the angle between the side surface PRTLa of the protective layer PRTL and the upper surface US of the first substrate SUB1, the edge of the cutting portion CP and the edge of the removal portion RV can be described as coinciding with each other, and the side surface SUB2a of the second substrate SUB2 is connected to the side surface PRTLa of the protective layer PRTL to form a surface.

[0170] In the display device 10 according to one or more embodiments, the second substrate SUB2 and the protective layer PRTL provided in the cutting region CA can be simultaneously removed via a laser cutting process. Accordingly, by performing the process of forming the removal portion RV by removing the non-uniform portion of the protective layer PRTL and simultaneously forming the cutting portion CP of the second substrate SUB2, the process efficiency can be improved.

[0171] Figure 13 is a plan view showing the display device 10 according to an embodiment when the display device 10 is bent Figure 7 of the display device 10. Figure 14 is Figure 13 an enlarged view of region B of Figure 15 is a cross-sectional view taken along line X3-X3' in Figure 14 of.

[0172] Figures 13 to 15 shows the display device 10 when the display device 10 is bent. Figure 13 shows that the second bending region BA2 and the pad region PDA are bent and thus are disposed below the first bending region BA1 and the main region MA with respect to Figure 7 the center line BA_CL of the bending region BA in Figure 13 For example, Figure 7 shows that the display panel 100 is bent at the center line BA_CL of the bending region BA in

[0173] Combined with Figures 7 to 12 with reference to Figures 13 to 15 , the display device 10 is bent such that the second bending region BA2 can overlap with the first bending region BA1, and the pad region PDA can overlap with the main region MA. The first non-overlapping portion SSUB1a of the first sub-substrate SSUB1 can overlap with the second non-overlapping portion SSUB2a of the second sub-substrate SSUB2. The first cutting region CA1 can overlap with the second cutting region CA2.

[0174] In some embodiments, the alignment mark MRK may overlap with a first non-overlapping portion SSUB1a of the main area MA, and the alignment mark MRK may overlap with a third non-cutting portion NCP3 and a third non-removal portion NRV3 of the pad area PDA.

[0175] A first end MRKa of the alignment mark MRK facing the first non-cutting portion NCP1 may be spaced apart from a first edge CP_E1 between the cutting portion CP and the first non-cutting portion NCP1 by a first distance d1. Optionally, the first end MRKa may be disposed on the same line as the first edge CP_E1.

[0176] A second end MRKb of the alignment mark MRK facing the second non-cutting portion NCP2 may be spaced apart from a second edge CP_E2 between the cutting portion CP and the second non-cutting portion NCP2 by a second distance d2. Optionally, the second end MRKb may be disposed on the same line as the second edge CP_E2.

[0177] A third end MRKc of the alignment mark MRK facing the third non-cutting portion NCP3 may be spaced apart from a third edge CP_E3 between the cutting portion CP and the third non-cutting portion NCP3 by a third distance d3. Optionally, the third end MRKc may be disposed on the same line as the third edge CP_E3.

[0178] Thus, for example, the display device 10 according to the exemplary embodiment supports checking whether the components of the display device 10 are correctly aligned when the display device 10 is bent based on the distances d1, d2, and d3 between the alignment mark MRK and the edges (i.e., the first edge CP_E1, the second edge CP_E2, and the third edge CP_E3) of the cutting portion CP of the second substrate SUB2.

[0179] Specifically, for example, if the lengths of the first cutting area CA1 and the second cutting area CA2 in the second direction (Y-axis direction) are different from each other, the alignment mark MRK overlaps with the first non-overlapping portion SSUB1a and does not overlap with the second non-overlapping portion SSUB2a. The alignment mark MRK may overlap with the third non-cutting portion NCP3 and the third non-removal portion NRV3.

[0180] In some aspects, since the transmittance of the first substrate SUB1 is higher than that of the second substrate SUB2, the first substrate SUB1 through which light is transmitted may be relatively unrecognizable by an optical device, while the second substrate SUB2 through which less light is transmitted may be relatively recognizable by the optical device. In some examples, since the transmittance of the first substrate SUB1 is higher than that of the second substrate SUB2, the alignment mark MRK is more recognizable by the optical device when the alignment mark MRK is disposed on the first substrate SUB1 (the first substrate SUB1 with a higher transmittance) than when the alignment mark MRK is disposed on the second substrate SUB2.

[0181] In the display device 10 according to one or more embodiments, the visibility of the alignment mark MRK and the second substrate SUB2 disposed thereunder can be improved by overlapping the first non-overlapping portion SSUB1a with the alignment mark MRK. At the same time, embodiments of the present disclosure support using the second substrate SUB2 as another alignment mark by overlapping the alignment mark MRK with the third non-cut portion NCP3 of the second substrate SUB2. Thus, for example, even when the alignment mark MRK is disposed only on the first sub-substrate SSUB1, the alignment of elements can be easily checked. The exemplary aspects described herein can be equally applied to the relationship between the alignment mark MRK and the protective layer PRTL.

[0182] Hereinafter, a display device according to another embodiment of the present disclosure will be described. In the following description, the same or similar elements will be denoted by the same or similar reference numerals, and redundant descriptions will be omitted or briefly described.

[0183] Figure 16 is a plan view showing a part of a display device according to another embodiment of the present disclosure. Figure 17 is a plan view showing a part of the first substrate SUB1 according to another embodiment. Figure 18 is a plan view showing a part of the second substrate SUB2 according to another embodiment. Figure 19 is a plan view showing a part of the protective layer PRTL according to another embodiment of the present disclosure.

[0184] According to Figures 16 to 19 the embodiments, the display device 10 includes aspects of the display device 10 according to the embodiments described herein, and for the sake of brevity, repeated descriptions of similar elements are omitted. According to Figure 7 the embodiments, the display device 10 is different from the display device 10 according to the embodiments such as Figures 16 to 19 in that the cutting region CA corresponding to the embodiment has a different shape. Figure 7 More specifically, referring to

[0185] ​Figure 16 and Figure 19 , the protective layer PRTL may include a removed portion RV and a non-removed portion NRV. The removed portion RV may be located in the cutting area CA. The non-removed portion NRV may be located on one side of the removed portion RV. In an embodiment, the shapes of the removed portion RV and the non-removed portion NRV may be rectangles as shown in Figure 19 , but the embodiments supported by the present disclosure are not limited thereto.

[0186] The length of the cutting area CA in the second direction (Y-axis direction) in the display device 10 according to one or more embodiments may be greater than the length of the cutting area CA in the second direction (Y-axis direction) in the display device 10 according to the embodiments described with reference to Figure 7 etc. For example, with reference to Figure 16 and Figure 18 , in the second direction (Y-axis direction), the length of the cutting portion CP of the second substrate SUB2 may be greater than or equal to the length of the protective layer PRTL.

[0187] In the display device 10 according to one or more embodiments, in the second direction (Y-axis direction), the length of the cutting portion CP of the second substrate SUB2 is greater than or equal to the length of the protective layer PRTL, and the thinner portion (e.g., the thinner end portion) of the protective layer PRTL in the first direction (X-axis direction) may be completely removed. Removing the thinner end portion of the protective layer PRTL according to one or more embodiments of the present disclosure as described herein may prevent cracks in the thin film transistor layer TFTL (see Figure 5 ) and improve the reliability of the display device 10.

[0188] Embodiments of the present disclosure support one or more processes (methods, flowcharts) for manufacturing the display device 10 according to the examples described herein. Descriptions of elements such as "may be provided", "may be formed", etc. include processes (methods, flowcharts) for providing or forming the elements according to the exemplary aspects described herein.

[0189] Figure 20 An exemplary flowchart of a method 2000 for manufacturing a display device 10 according to one or more embodiments of the present disclosure is shown.

[0190] In step 2005, the method 2000 includes preparing a display panel 100, which includes a first region (e.g., a display region DA) having a display region, a second region (e.g., a non-display region NDA) spaced apart from the first region in a first direction, and a third region (e.g., a bending region BA) located between the first region and the second region, wherein the third region is bendable.

[0191] In some aspects, in step 2010, preparing the display panel 100 includes providing a first substrate (e.g., the first substrate SUB1) including a rigid material.

[0192] In some aspects, in step 2015, preparing the display panel 100 includes providing a second substrate (e.g., the second substrate SUB2) on the first substrate, where the second substrate includes a flexible material.

[0193] In some aspects, in step 2020, preparing the display panel 100 includes providing a protective layer (e.g., the protective layer PRTL) on the second substrate, where the protective layer overlaps with a third region.

[0194] In some aspects, in step 2025, preparing the display panel 100 includes forming a cutting region (e.g., the cutting region CA) overlapping with the third region at the display panel, where the cutting region at least partially overlaps with the first substrate. In some aspects, forming the cutting region includes removing one or more portions of the second substrate in the third region.

[0195] In some aspects, in step 2030, preparing the display panel 100 includes providing alignment marks (e.g., the alignment marks MRK) on the first substrate at a position where the first substrate and the cutting region overlap each other.

[0196] In some aspects, in step 2035, preparing the display panel 100 includes removing a portion of the second substrate (e.g., the cutting portion CP) and a portion of the protective layer (e.g., the removed portion RV) from the cutting region.

[0197] In the description of the flowcharts herein, the operations may be performed in an order different from the order shown, or the operations may be performed in a different order or at different times. Certain operations may also be omitted from the flowcharts, one or more operations may be repeated, or other operations may be added to the flowcharts.

[0198] In summarizing the detailed description, those skilled in the art will understand that many variations and modifications can be made to the example embodiments without substantially departing from the principles of the present disclosure. Therefore, the disclosed example embodiments of the present invention are used in a general and descriptive sense and not for purposes of limitation.

Claims

1. A display device, characterized in that, Comprising: A display panel, comprising: A first region having a display area; A second region spaced apart from the first region in a first direction; and A third region located between the first region and the second region and configured to be curved, wherein the display panel comprises: A first substrate comprising a rigid material; A second substrate disposed on the first substrate and comprising a flexible material; A protective layer disposed on the second substrate and overlapping with the third region; and Alignment marks disposed on the first substrate, wherein the display panel comprises a cutting region overlapping with the third region, wherein a portion of the second substrate and a portion of the protective layer are removed from the cutting region, wherein the first substrate at least partially overlaps with the cutting region, and wherein the alignment marks are disposed at a position where the first substrate and the cutting region overlap each other.

2. The display device according to claim 1, Characterized in that, wherein, The first substrate comprises: An opening overlapping with the third region; A first sub-substrate disposed closer to the first region than the second region with respect to the opening; and A second sub-substrate disposed closer to the second region than the first region with respect to the opening, wherein the first sub-substrate comprises a first non-overlapping portion, and the second sub-substrate comprises a second non-overlapping portion, and the first non-overlapping portion and the second non-overlapping portion do not overlap with the second substrate, and wherein the alignment marks overlap with at least one of the first non-overlapping portion and the second non-overlapping portion.

3. The display device according to claim 1, wherein The second substrate comprises a cutting portion located in the cutting region and a non-cutting portion located on one side of the cutting portion, wherein the alignment marks overlap with the cutting portion, wherein the non-cutting portion comprises: A first non-cutting portion disposed on a first side of the cutting portion in a second direction different from the first direction; A second non-cutting portion disposed on a second side of the cutting portion in the first direction; and A third non-cutting portion disposed on a third side of the cutting portion in the first direction, wherein the third side is opposite to the second side in the first direction.

4. The display device according to claim 3, characterized in that, When the second substrate is bent at the third region, the alignment marks overlap with the third non-cutting portion of the second substrate.

5. The display device according to claim 3, characterized in that, Among them, The protective layer comprises a removed portion located in the cutting region and a non-removed portion located on one or more sides of the removed portion, wherein the alignment marks overlap with the removed portion, and wherein the removed portion overlaps with the cutting portion.

6. The display device according to claim 5, wherein In the thickness direction of the first substrate, the boundary between the cutting portion and the non-cutting portion corresponds to the boundary between the removed portion and the non-removed portion, and wherein, at the boundary between the cutting portion and the non-cutting portion, the angle formed between the side surface of the second substrate and the upper surface of the first substrate is in the range of 45 degrees to 90 degrees.

7. The display device according to claim 6, wherein It further includes a process mark disposed at the boundary between the cutting portion and the non-cutting portion, wherein the length of the process mark in the first direction ranges from 10 μm to 100 μm.

8. The display device according to claim 1, Characterized in that, wherein, the cutting region includes: a first cutting region positioned closer to the first region than the second region with respect to the center line of the third region; and a second cutting region positioned closer to the second region than the first region with respect to the center line of the third region, and wherein, in the first direction, the length of the first cutting region is greater than the length of the second cutting region.

9. The display device according to claim 1, wherein The transmittance of the first substrate is higher than that of the second substrate.

10. The display device according to claim 1, wherein The length of the cutting region in the first direction is greater than or equal to the length of the protective layer in the first direction.

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