Loudspeaker module and electronic equipment
By setting a sound guide through groove and silicone ring on the first housing of the speaker module, combined with the sealing of the electronic equipment housing, the problems of high material costs and difficulty in ultra-thinization in the prior art are solved, and the thickness thinning and acoustic performance improvement of the speaker module are achieved.
Patent Information
- Application Number
- CN202422407043.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-30
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2034-09-30
AI Technical Summary
The existing speaker module structure has high material cost, complex process and difficult to achieve ultra-thinization. The existing sealing method leads to large design space and affects the sound quality effect.
A sound guide channel and a silicone ring are arranged on the first housing of the speaker module. The sealing cooperation between the silicone ring and the electronic device housing is eliminated, and a complete front cavity is formed, and an acoustic pipe is formed through the sound guide channel and the shell is cooperated with the shell to replace the silicone dustproof mesh structure.
The thickness of the speaker module is reduced by 0.35mm, while improving acoustic performance and sealing effect, reducing material cost and assembly complexity, and maintaining sound quality.
Smart Images
Figure CN223182326U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of electroacoustic conversion, and particularly relates to a speaker module and an electronic device. Background Art
[0002] As a device that can convert electrical energy into sound energy, the speaker module has been widely used in electronic devices such as smart phones, portable cameras, cameras, and laptop computers. With the increasing thinness of electronic devices, the thickness requirement for the speaker module is also getting thinner and thinner. Reducing the Z-axis space while maintaining performance has become the focus.
[0003] In the related art, the front cavity is usually sealed by using a front cavity rear-mounted steel sheet or an injection-molded steel sheet to reduce the Z-axis height, and the front cavity is sealed and waterproofed by applying glue. When the speaker module is assembled with the whole machine, a waterproof silica gel ring double-sided tape needs to be pasted at the sound outlet hole to achieve the sealing and waterproofing of the whole machine. As a result, the existing structure not only has a high material cost and a complex process, but also requires a large design space due to the material strength and the assembly between materials, making it difficult to achieve an ultra-thin structure.
[0004] Therefore, in view of the above problems, the present utility model is specifically proposed. Summary of the Utility Model
[0005] The purpose of the present utility model is to provide a speaker module and an electronic device to solve the problems in the prior art that the speaker structure not only has a high material cost, a complex process, but also has a poor thinning effect.
[0006] The first aspect of the present utility model provides a speaker module, including:
[0007] A first housing, provided with an opening and a first surface and a second surface communicating through the opening, an arc surface is formed at one edge of the first surface, and a sound guiding groove extending from the opening to the arc surface is provided on the first surface;
[0008] A silica gel ring, formed on the first surface and arranged around the opening and the sound guiding groove;
[0009] A sounding element, installed on the second surface, and the side of the sounding element provided with a vibration system faces the opening; wherein,
[0010] The first surface is hermetically attached to the housing of an electronic device through the silica gel ring, so that the housing closes the opening and the sound guiding groove to form a front cavity, and the sound guiding groove is used to communicate with a sound outlet hole provided on the housing.
[0011] The speaker module provided by the present utility model may also have the following additional technical features:
[0012] In a specific embodiment of the present utility model, a boss is further provided on the second surface, which is disposed around the open end. The boss and the second surface jointly define an installation position for supporting the sound generating element.
[0013] In a specific embodiment of the present utility model, an installation groove is further provided on the first surface, and the open end, the sound guiding through groove, and the silica gel ring are all disposed within the installation groove.
[0014] In a specific embodiment of the present utility model, it further includes a second housing, which is connected to the second side surface of the first housing, and the second housing, the first housing, and the sound generating element jointly enclose a rear cavity.
[0015] In a specific embodiment of the present utility model, a recessed portion and a damping sheet adapted to the recessed portion are further provided on the first surface. A filling hole communicating with the rear cavity is provided in the recessed portion, and the damping sheet is used to seal the filling hole.
[0016] In a specific embodiment of the present utility model, a through hole corresponding to the sound generating element is further provided on the second housing, and the sound generating element is exposed through the through hole.
[0017] In a specific embodiment of the present utility model, a magnetic isolation member is provided on the surface of the sound generating element exposed through the through hole.
[0018] In a specific embodiment of the present utility model, the first housing includes a main body portion and a sound guiding portion connected to the side surface of the main body portion. The arc surface is the upper surface of the sound guiding portion;
[0019] Connection portions are provided on the second housing and are respectively disposed on both sides of the sound guiding portion. Mounting holes are provided on the connection portions.
[0020] In the second aspect of the present utility model, an electronic device is further provided, which includes a housing and the speaker module described in any one of the above. The housing is cooperatively sealed with the silica gel ring on the first surface of the housing to form a front cavity. An sound outlet hole and a sound duct communicating the sound outlet hole with the front cavity are further provided on the housing.
[0021] In a specific embodiment of the present utility model, a composite mesh for dust prevention and filtration is inserted into the sound duct.
[0022] Compared with the prior art, the loudspeaker module provided by the present utility model forms an opening communicating the first surface and the second surface on the first housing, and a sound guiding groove and a silica gel ring are formed on the first surface. When the loudspeaker module is assembled with the housing of the electronic device, sealing can be achieved by compression after the silica gel ring is adapted to the mating surface of the housing. In this way, part of the cavity wall for forming the front cavity in the first housing can be omitted, and the housing of the electronic device, the first housing and the sounding element together form a complete front cavity. In this way, the Z-direction dimension of the loudspeaker module is greatly reduced, and further, while the thickness of the loudspeaker module is reduced, the sound quality effect of the loudspeaker module is not affected. Theoretically, the Z-direction of the loudspeaker module can be thinned by at least 0.35 mm (0.25 mm for the steel sheet + 0.1 mm for the assembly gap). At the same time, in the present application, the sound guiding groove forms a sound duct in cooperation with the housing of the electronic device, so that the local height of the sound duct can be further increased. And since the silica gel ring also replaces the silica gel dust-proof net structure in the related art, the length of the sound duct can be further reduced, thereby further improving the acoustic performance of the whole machine. In addition, the above structure also has beneficial effects such as simple structure, low material cost, good waterproof effect and simple assembly. Description of the Drawings
[0023] In order to more clearly illustrate the specific embodiments of the present utility model or the technical solutions in the prior art, the following will briefly introduce the drawings required to be used in the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0024] Figure 1 It is the front view of the loudspeaker module in the embodiment of the present utility model;
[0025] Figure 2 is Figure 1 the structural exploded view of
[0026] Figure 3 is Figure 1 the schematic cross-sectional structure of A-A in
[0027] Figure 4 is Figure 1 the schematic cross-sectional structure of B-B in
[0028] Description of the reference numerals:
[0029] 100 - Loudspeaker module;
[0030] 10 - First housing, 11 - First surface, 12 - Mounting groove, 13 - Arc surface, 14 - Opening, 15 - Sound guiding groove, 16 - Silica gel ring, 17 - Main body part, 18 - Sound guiding part, 19 - Filling hole, 10a - Front cavity;
[0031] 20 - Second housing, 21 - Connecting part, 22 - Mounting hole, 23 - Magnetic isolation part, 20a - Rear cavity;
[0032] 30 - Sound - generating monomer, 40 - Damping sheet, 50 - Outer shell, 51 - Sound - outlet hole, 52 - Sound duct, 60 - Composite mesh cloth. Specific embodiments
[0033] The exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided so that the present invention can be more thoroughly understood and the scope of the present invention can be completely conveyed to those skilled in the art.
[0034] It should be understood that the terms used herein are for the purpose of describing specific exemplary embodiments only and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" as used herein may also include the plural forms. The terms "comprising", "including", "containing" and "having" are inclusive and thus specify the presence of the stated features, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring them to be performed in the particular order described or illustrated, unless the order of performance is explicitly stated. It should also be understood that additional or alternative steps may be used.
[0035] Although the terms first, second, third, etc. may be used in this document to describe multiple elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or section from another. Unless the context clearly indicates otherwise, terms such as "first", "second", and other numerical terms used herein do not imply an order or sequence. Thus, a first element, component, region, layer, or section discussed below may be referred to as a second element, component, region, layer, or section without departing from the teachings of the exemplary embodiments.
[0036] For ease of description, spatial relative terms may be used in this document to describe the relationship of one element or feature shown in the figures to another element or feature. These relative terms are, for example, "inner", "outer", "inner side", "outer side", "below", "beneath", "above", "upper", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientations depicted in the figures. For example, if the device in the figure is flipped, an element described as "below" or "beneath" another element or feature will then be oriented as "above" or "upper" to the other element or feature. Thus, the exemplary term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions) and the spatial relative descriptors used in this document are interpreted accordingly.
[0037] The speaker module in the related art generally has an independent front cavity structure, that is, a closed front cavity is directly formed on the speaker module by means of a mounting housing or integral molding. The housing forming the front cavity and other structures form two layers of shell walls, occupying a large amount of space. To meet the requirement of ultra-thinness, the related art usually sets through holes on the front cavity housing and then installs steel sheets or injects steel sheets, and uses the steel sheets to thin the thickness of the front cavity housing to reduce the Z-axis height. However, the steel sheets need to be sealed by gluing to achieve front cavity sealing and waterproofing. At the same time, the sound holes of the speaker module also need to be sealed with the outer shell of the electronic device by pasting a silica gel dustproof net. Thus, the existing structure not only has a high material cost and a complex process, but also requires a large design space due to reasons such as the strength of the materials and the assembly between the materials. Therefore, it is difficult to meet the ultra-thin requirement.
[0038] The following refers to Figures 1-4 Describe the speaker module 100 of some embodiments of the present invention.
[0039] Embodiments of the present invention provide a speaker module 100, which can be applied to electronic devices such as mobile phones, tablets, speakers, foldable devices, etc.
[0040] Refer to Figures 1-4As shown, the speaker module 100 includes a first housing 10, a silicone ring 16, and a sounding element 30. The first housing 10 is provided with an opening 14 and a first surface 11 and a second surface that communicate through the opening 14. An arc surface 13 is formed at one edge of the first surface 11. The first surface 11 is provided with a sound guiding groove 15 extending from the opening 14 to the arc surface 13; the silicone ring 16 is formed on the first surface 11 and is arranged around the opening 14 and the sound guiding groove 15; the sounding element 30 is installed on the second surface, and the side of the sounding element 30 where the vibration system is located faces the opening 14; wherein, the first surface 11 is hermetically attached to the housing 50 of an electronic device through the silicone ring 16, so that the housing 50 closes the opening 14 and the sound guiding groove 15 to form a front cavity 10a, and the sound guiding groove 15 is used to communicate with the sound outlet hole 51 provided on the housing 50.
[0041] Specifically, the sounding element 30 includes a vibration system and a magnetic circuit system arranged oppositely. The magnetic circuit system includes a magnetic yoke and a plurality of magnetic parts arranged on the magnetic yoke to form a magnetic gap. The vibration system includes a vibrating diaphragm and a voice coil connected to each other. The voice coil is inserted into the magnetic gap. In this way, when energized, the voice coil can vibrate in the magnetic gap, and then drive the vibrating diaphragm to vibrate and generate sound.
[0042] The first housing 10 includes a first surface 11 and a second surface arranged oppositely and an opening 14 communicating the first surface 11 and the second surface. Among them, the side of the sounding element 30 where the vibration system is located is connected to the second surface, and the vibration system is arranged corresponding to the opening 14. In this way, the sound waves generated by the vibration of the sounding element 30 can be transmitted from the opening 14 to the side of the first surface 11. An arc surface 13 is further formed at one edge of the first surface 11. The arc surface 13 is located on the periphery of the opening 14. In this way, a height difference can be formed in the Z-axis direction on the first surface 11 of the first housing 10, where the height of the outer edge of the arc surface 13 is lower than the height of the opposite side. In this way, the arc surface 13 can form a part of the side surface of the first housing 10. The sound guiding groove 15 is arranged on the first surface 11, with one end communicating with the opening 14 and the other end extending to the arc surface 13. In this way, the sound waves of the sounding element 30 can propagate from the opening 14 along the sound guiding groove 15, and then the sound waves can be transmitted to the side surface of the speaker module 100, that is, side sound output is realized.
[0043] The first housing 10 is further provided with a silica gel ring 16 injection-molded on the first surface 11. The silica gel ring 16 is arranged in a ring around the open port 14 and the sound guiding groove 15. The housing 50 of the electronic device is provided with a mating surface corresponding to the position of the silica gel ring 16. When assembled in this way, the first surface 11 is attached to the mating surface of the housing 50 through the silica gel ring 16, and the silica gel ring 16 is compressed by the torque of the threaded fastener. In this way, a sealed fit between the first housing 10 and the housing 50 of the electronic device is achieved, so that the housing 50 closes the open port 14 and the sound guiding groove 15 to form a front cavity 10a. The sound guiding groove 15 is used to communicate with the sound outlet hole 51 provided on the housing 50.
[0044] Compared with the prior art, the speaker module 100 provided by the present utility model is provided with an open port 14 communicating with the first surface 11 and the second surface on the first housing 10, and the first surface 11 is formed with a sound guiding groove 15 and a silica gel ring 16. When the speaker module 100 is assembled with the housing 50 of the electronic device, sealing can be achieved by compression after the silica gel ring 16 is adapted to the mating surface of the housing 50. In this way, part of the cavity wall for forming the front cavity 10a in the first housing 10 can be omitted, and the housing 50 of the electronic device, the first housing 10 and the sounding element 30 together form a complete front cavity 10a. In this way, the Z-axis dimension of the speaker module 100 is greatly reduced, and further, while the thickness of the speaker module 100 is reduced, the sound quality effect of the speaker module 100 is not affected. In theory, the Z-axis of the speaker module 100 can be thinned by at least 0.35 mm (0.25 mm for the steel sheet + 0.1 mm assembly gap). At the same time, in the present application, the sound guiding groove 15 forms a sound duct 52 in cooperation with the housing 50 of the electronic device. In this way, the local height of the sound duct 52 can be further increased, and since the silica gel ring 16 also replaces the silica gel dust-proof net structure in the related art, the length of the sound duct 52 can be further reduced, thereby further improving the acoustic performance of the whole machine. In addition, the above structure also has beneficial effects such as simple structure, low material cost, good waterproof effect and simple assembly.
[0045] Further, compared with the structure forms of post-installed steel sheets or injection-molded steel sheets, the Z-axis of the speaker module 100 in this embodiment is thinned by at least 0.35 mm (0.25 mm for the steel sheet + 0.1 mm gap).
[0046] In one embodiment, the second surface is further provided with a boss arranged in a ring around the open port 14. The boss and the second surface together define an installation position for supporting the sounding element 30.
[0047] Specifically, the second surface is used to adapt to and bond with the sound surface of the sound unit 30, and the inner side surface of the boss is suitable for adapting to and bonding with the outer peripheral surface of the sound unit 30, so that the connection between the sound unit 30 and the first shell 10 can be achieved. Due to the provision of the boss, this not only improves the positioning accuracy of the sound unit 30 and the first shell 10 during assembly, but also limits the flow of glue, thereby making the appearance of the assembly structure beautiful.
[0048] In one embodiment, the first surface 11 further comprises a mounting groove 12, wherein the opening 14, the sound-conducting groove 15, and the silicone ring 16 are all disposed within the mounting groove 12. Specifically, the mounting groove 12 is a through groove, i.e., its two ends extend to opposite sides of the first surface 11, and the opening 14 and the sound-conducting groove 15 are disposed within the mounting groove 12. This further increases the height of the front cavity 10a, thereby improving the acoustic performance of the speaker module 100. Furthermore, the silicone ring 16 disposed within the mounting groove 12 also increases its height, thereby increasing its volume and improving the sealing performance between the silicone ring 16 and the electronic device housing 50.
[0049] In one embodiment, a second shell 20 is further included. The second shell 20 is connected to the second side surface of the first shell 10, and the second shell 20, the first shell 10 and the sound unit 30 are together enclosed to form a rear cavity 20a.
[0050] In this embodiment, a second shell 20 adapted to the first shell 10 is provided, which not only forms a receiving space for the sound unit 30, but also defines a rear cavity 20a by the first shell 10, the second shell 20 and the sound unit 30, thereby improving the structure of the speaker module 100 to be more complete, thereby reducing the assembly requirements of the speaker module 100 and the electronic device, and improving the reliability of the entire structure.
[0051] In one embodiment, the first surface 11 is further provided with a recessed portion and a damping plate 40 adapted to the recessed portion. The recessed portion is provided with a filling hole 19 communicating with the rear cavity 20 a , and the damping plate 40 is used to seal the filling hole 19 .
[0052] Specifically, there are two filling holes 19, which are arranged on both sides of the open mouth 14. The sound-absorbing particles can be filled into the rear cavity 20a on both sides of the sound-emitting unit 30 through the above two filling holes 19, thereby realizing a full filling design of the sound-absorbing particles, effectively improving the low-frequency acoustic performance of the speaker module 100.
[0053] At the same time, by providing a recessed portion and a damping plate 40 adapted to the recessed portion, not only the sealing of the filling hole 19 is achieved, but also the influence of the damping plate 40 on the Z-axis height of the speaker module 100 can be reduced, thereby further ensuring the ultra-thin performance of the speaker module 100.
[0054] In one embodiment, the second housing 20 is further provided with a through hole corresponding to the sound emitting element 30, and the sound emitting element 30 is exposed through the through hole. In this way, the Z-axis height of the speaker module 100 can be further reduced.
[0055] In one embodiment, a magnetic shielding member 23 is provided on the surface of the sound emitting element 30 exposed through the through hole. Specifically, by providing the magnetic shielding member 23, the magnetic field leakage of the magnetic circuit system is reduced, the magnetic circuit performance is improved, and at the same time, the influence of the magnetic field on other components in the electronic device is reduced, improving the acoustic performance of the speaker module 100 and the electronic device.
[0056] In one embodiment, the first housing 10 includes a main body portion 17 and a sound guiding portion 18 connected to the side surface of the main body portion 17. The upper surface of the sound guiding portion 18 is an arc surface 13, and the lower surface of the sound guiding portion 18 is coplanar with the surface of the second housing 20 away from the first housing 10; connection portions 21 are provided on both sides of the sound guiding portion 18 on the second housing 20, and mounting holes 22 are provided on the connection portions 21.
[0057] The arc surface 13 and the upper surface of the main body portion 17 together form the first surface 11. By making the upper surface of the sound guiding portion 18 an arc surface 13 and the lower surface coplanar with the second housing 20, the thickness of the sound guiding portion 18 can be increased, and further the depth of the sound guiding groove 15 can be increased, and accordingly the local height of the sound pipe 52 can be increased, improving the smoothness of the sound pipe 52, and further improving the sound quality effect and acoustic performance of the speaker module 100. At the same time, by providing the connection portions 21 with mounting holes 22 on the second housing 20, the speaker module 100 can be connected to the housing 50 of the electronic device through the threaded fasteners inserted into the mounting holes 22, thereby realizing the sealed connection between the speaker module 100 and the housing 50 of the electronic device.
[0058] It should be noted that the arc surface 13 may only include a circular arc surface. In this case, the circular arc surface is connected to the upper surface of the main body portion in a transitional manner, or the arc surface 13 may further include a circular arc surface and an inclined surface. In this case, the inclined surface is connected to the upper surface of the main body portion 17 through the circular arc surface in a transitional manner.
[0059] In a second aspect of the present invention, there is also provided an electronic device, including a housing 50 and the speaker module 100 in any one of the above. The housing 50 is hermetically fitted with the silicone ring 16 on the first surface 11 of the first housing 11 to form a front cavity 10a. The housing is further provided with a sound outlet hole 51 and a sound pipe 52 communicating the sound outlet hole 51 with the front cavity 10a.
[0060] Since the electronic device includes the speaker module 100 in all the above embodiments and is hermetically fitted with the silicone ring 16 of the speaker module 100 through the housing 50, the electronic device at least has the beneficial effects of the above speaker module 100, which will not be elaborated here one by one.
[0061] In one embodiment, a composite mesh 60 for dust-proof filtering is inserted into the sound duct 52. Specifically, a slot perpendicular to the flow direction of the sound duct 52 is formed therein. The composite mesh 60 can be a metal mesh or a non-metal mesh, and is inserted into the slot, thereby achieving dust-proofing of the whole machine.
[0062] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. A speaker module, characterized in that, Comprising: A first housing, provided with an opening and a first surface and a second surface communicating through the opening, an arc surface is formed at one edge of the first surface, and a sound guiding groove extending from the opening to the arc surface is provided on the first surface; A silica gel ring, formed on the first surface and disposed around the opening and the sound guiding groove; A sounding monomer, mounted on the second surface, and the side of the sounding monomer provided with a vibration system faces the opening; wherein, The first surface is hermetically attached to the housing of an electronic device through the silica gel ring, so that the housing closes the opening and the sound guiding groove to form a front cavity, and the sound guiding groove is used for communicating with a sound outlet hole provided on the housing.
2. The loudspeaker module according to claim 1, wherein The second surface is further provided with a boss disposed around the opening, and the boss and the second surface jointly define a mounting position for supporting the sounding monomer.
3. The loudspeaker module according to claim 1, wherein The first surface is further provided with a mounting groove, and the opening, the sound guiding groove and the silica gel ring are all disposed in the mounting groove; And / or, the silica gel ring is injection molded on the first housing.
4. The loudspeaker module according to claim 1, wherein Further comprising a second housing, the second housing is connected to the second side surface of the first housing, and the second housing, the first housing and the sounding monomer jointly enclose a rear cavity.
5. The loudspeaker module according to claim 4, wherein The first surface is further provided with a recess and a damping sheet adapted to the recess, the recess is provided with a filling hole communicating with the rear cavity, and the damping sheet is used for sealing the filling hole.
6. The loudspeaker module according to claim 4, wherein The second housing is further provided with a through hole corresponding to the sounding monomer, and the sounding monomer is exposed outside the through hole.
7. The loudspeaker module according to claim 6, wherein, A magnetic isolation member is provided on the surface of the sounding monomer exposed outside the through hole.
8. The loudspeaker module according to claim 4, wherein The first housing includes a main body portion and a sound guiding portion connected to the side surface of the main body portion, the upper surface of the sound guiding portion is the arc surface, and the lower surface of the sound guiding portion is coplanar with the surface of the second housing away from the first housing; The second housing is provided with connecting portions disposed on both sides of the sound guiding portion, and mounting holes are provided on the connecting portions.
9. An electronic device, characterized in that, Comprising a housing and the speaker module according to any one of claims 1-8, the housing is cooperatively sealed with the silica gel ring on the first surface of the housing to form a front cavity, and the housing is further provided with a sound outlet hole and a sound duct communicating the sound outlet hole with the front cavity.
10. The electronic device according to claim 9, characterized in that, A composite mesh for dust prevention and filtration is inserted in the sound duct.