Projector facilitating heat dissipation

Abstract

The utility model relates to the technical field of projectors, and discloses a projector beneficial to heat dissipation, which comprises a projection shell. The light source assembly comprises a circuit substrate arranged in the projection shell and an LED chip arranged on the front surface of the circuit substrate; the heat dissipation assembly comprises a blind window, a heat dissipation base and at least one heat dissipation copper pipe, the heat dissipation base is arranged on the back face of the circuit substrate in an attached mode, the heat dissipation base is provided with an avoiding groove allowing the heat dissipation copper pipe to pass through, the heat dissipation copper pipe is tightly pressed on the back face of the circuit substrate through the heat dissipation base, and the heat dissipation copper pipe is arranged on the blind window. The shutter is arranged on one side of the heat dissipation base, and the heat dissipation copper pipe is connected with the shutter. According to the design, the plurality of tightly attached heat dissipation copper pipes are arranged on the circuit substrate, so that the heat dissipation capability is enhanced, and heat accumulation in the long-time working process is avoided.

Description

Technical Field

[0001] The utility model relates to the field of projectors, in particular to a projector which is advantageous for heat dissipation. Background Art

[0002] With the rapid advancement of technology, projectors, as an important display device, have been widely used in various fields, including education, conferencing, and entertainment. However, because LED chips directly convert electrical energy into light and heat, their electro-optical conversion efficiency is approximately 20%-30%, while the light-to-thermal conversion efficiency is as high as 70%-80%. This leads to significant heat accumulation during operation. When the junction temperature of the LED chip exceeds the maximum allowable temperature (typically 150°C), it not only causes problems such as reduced light intensity, spectral shift, increased color temperature, and increased thermal stress, but also accelerates component aging, significantly reducing the projector's service life. More seriously, excessive temperatures can directly damage the projector's internal electronic components, such as circuit boards, driver ICs, and capacitors, leading to frequent projector failures and affecting the user experience.

[0003] Most existing projectors still have shortcomings in their LED chip heat dissipation design. Traditional heat dissipation methods often rely on simple heat sinks or heat sinks. While these heat dissipation components can improve heat conduction efficiency to a certain extent, their heat dissipation effect is often insufficient in high-power and long-term operating scenarios. Utility Model Content

[0004] The main purpose of the utility model is to provide a projector that is conducive to heat dissipation, aiming to solve the technical problem that heat is easily accumulated when the projector works for a long time.

[0005] To achieve the above-mentioned objectives, the present invention provides a projector that is conducive to heat dissipation, comprising a projection housing; a light source assembly, comprising a circuit substrate arranged in the projection housing and an LED chip arranged on the front of the circuit substrate; a heat dissipation assembly, comprising a shutter, a heat dissipation base and at least one heat dissipation copper tube, the heat dissipation base being fitted and arranged on the back of the circuit substrate, the heat dissipation base being provided with an avoidance groove for allowing the heat dissipation copper tube to pass through, the heat dissipation base pressing the heat dissipation copper tube against the back of the circuit substrate, the shutter being arranged on one side of the heat dissipation base, and the heat dissipation copper tube being connected to the shutter.

[0006] In some embodiments, a heat-dissipating copper tube is provided with a heat-conducting plane on a side facing the heat-dissipating base, and the heat-conducting plane is attached to the heat-dissipating base.

[0007] In some embodiments, one side or both sides of the light source assembly are provided with a mounting wall, the mounting wall is provided with a plug-in slot, and one side or both sides of the circuit substrate are clamped in the plug-in slot.

[0008] In some embodiments, a positioning block is provided at the bottom of the plug slot, and the positioning block abuts against the heat dissipation base.

[0009] In some embodiments, an avoidance gap is provided in the plug-in slot, and the heat dissipation copper tube passes through the avoidance gap.

[0010] In some embodiments, a support seat is provided on the end surface of the projection housing, the support seat is provided with a placement notch, and the bottom surface of the heat dissipation base is pressed against the placement notch.

[0011] In some embodiments, the side wall of the support base is provided with support ribs, and the bottom of the heat dissipation base is pressed against the top of the support ribs.

[0012] In some embodiments, it also includes a first heat dissipation fan arranged on one side of the shutter, the air outlet of the first heat dissipation fan is facing the shutter, and the side wall of the projection shell is provided with a heat dissipation port, which is located on the side of the shutter away from the first heat dissipation fan.

[0013] In some embodiments, a projection assembly and a second heat dissipation fan are further included. The projection assembly is located at the front end of the light source assembly, and the second heat dissipation fan is located at one side of the projection assembly.

[0014] In some embodiments, a support column is provided on one side of the installation wall, and reinforcing ribs connected to the installation wall are provided around the support column.

[0015] The technical solution provided by this utility model achieves close thermal contact between the LED chip and the heat dissipation copper tube by directly attaching the heat dissipation base to the back of the circuit board and providing a relief groove to accommodate the heat dissipation copper tube. The heat dissipation copper tube, with its excellent thermal conductivity, can quickly transfer the heat generated by the LED chip to the area where the louver is located. The heat is then exchanged with the outside through the louver, effectively dissipating the heat from the heat dissipation copper tube to the surrounding environment, thus avoiding heat accumulation during long-term operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] One or more embodiments are exemplarily illustrated by corresponding drawings, which do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings are represented as similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0017] Figure 1 This is a schematic diagram of the overall structure of an embodiment of a projector that is conducive to heat dissipation according to the utility model;

[0018] Figure 2 This is a schematic diagram of the overall structure of an embodiment of a projector that is conducive to heat dissipation of the utility model with the top projection shell removed;

[0019] Figure 3 This is a schematic diagram of the exploded structure of an embodiment of the projector that is advantageous for heat dissipation of the utility model with the top projection shell removed;

[0020] Figure 4 for Figure 3 A partial enlarged view of point A in the middle;

[0021] Figure 5 This is an exploded view of the light source assembly and heat dissipation assembly.

[0022] In the figure: 1. Projection shell; 11. Mounting wall; 111. Plug-in slot; 1111. Avoidance gap; 112. Support column; 1121. Reinforcement rib; 12. Support base; 121. Placement gap; 122. Support rib; 13. Heat dissipation port; 2. Light source assembly; 21. Circuit substrate; 22. LED chip; 3. Heat dissipation assembly; 31. Shutter; 32. Heat dissipation base; 321. Avoidance groove; 33. Heat dissipation copper tube; 331. Heat conduction plane; 4. First heat dissipation fan; 5. Second heat dissipation fan; 6. Projection assembly. DETAILED DESCRIPTION

[0023] To facilitate understanding of the present invention, the present invention is described in more detail below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as being "fixed to" another element, it can be directly attached to the other element, or one or more elements can be interposed therebetween. When an element is described as being "connected to" another element, it can be directly connected to the other element, or one or more elements can be interposed therebetween. The terms "vertical," "horizontal," "left," "right," "inner," "outer," and similar expressions used in this specification are for illustrative purposes only. In the description of the present invention, the terms "first" and "second" are used solely for descriptive purposes and are not to be construed as indicating relative importance or implicitly specifying the number of technical features indicated. Therefore, unless otherwise specified, features specified as "first" or "second" may explicitly or implicitly include one or more of such features; "plurality" means two or more. The term "comprising" and any variations thereof are intended to be non-exclusive, and one or more other features, integers, steps, operations, units, components, and / or combinations thereof may be present or added.

[0024] In addition, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediate medium, or internal communication between two components. All technical and scientific terms used in this specification have the same meaning as those commonly understood by technicians in the technical field of this utility model. The terms used in the specification of this utility model are only for the purpose of describing specific embodiments and are not used to limit the utility model. The term "and / or" used in this specification includes any and all combinations of one or more related listed items.

[0025] In addition, the technical features involved in different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0026] Please refer to Figures 1 to 5 The utility model provides a projector that is conducive to heat dissipation, including: a projection housing 1; a light source assembly 2, including a circuit substrate 21 arranged in the projection housing 1 and an LED chip 22 arranged on the front of the circuit substrate 21; a heat dissipation assembly 3, including a shutter 31, a heat dissipation base 32 and at least one heat dissipation copper tube 33, the heat dissipation base 32 is fitted on the back of the circuit substrate 21, the heat dissipation base 32 is provided with an avoidance groove 321 for allowing the heat dissipation copper tube 33 to pass through, the heat dissipation base 32 presses the heat dissipation copper tube 33 against the back of the circuit substrate 21, the shutter 31 is arranged on one side of the heat dissipation base 32, and the heat dissipation copper tube 33 is connected to the shutter 31.

[0027] The technical solution provided by the present invention achieves close thermal contact between the LED chip 22 and the heat dissipation copper tube 33 by directly attaching the heat dissipation base 32 to the back of the circuit substrate 21 and providing a relief groove 321 to accommodate the heat dissipation copper tube 33. With its excellent thermal conductivity, the heat dissipation copper tube 33 can quickly transfer the heat generated by the LED chip 22 to the area where the louver 31 is located. The heat is then exchanged with the outside through the louver 31, effectively dissipating the heat from the heat dissipation copper tube 33 to the surrounding environment, thus preventing heat accumulation.

[0028] Please refer to Figures 1 to 5In this embodiment, the projector further includes a first heat dissipation fan 4, a projection assembly 6, and a second heat dissipation fan 5, which are arranged on one side of the louver 31. A heat conducting surface 331 is provided on the side of the heat dissipation copper tube 33 facing the heat dissipation base 32. The heat conducting surface 331 is in contact with the heat dissipation base 32. The air outlet of the first heat dissipation fan 4 faces the louver 31. The side wall of the projection housing 1 is provided with a heat dissipation vent 13, which is located on the side of the louver 31 facing away from the first heat dissipation fan 4. The projection assembly 6 is located at the front end of the light source assembly 2, and the second heat dissipation fan 5 is located on the side of the projection assembly 6. The heat conducting surface 331 minimizes the contact thermal resistance during heat conduction, ensuring that heat can be efficiently transferred from the LED chip 22 through the circuit substrate 21 and the heat dissipation base 32 to the heat dissipation copper tube 33, and then dissipated into the air. The placement of heat dissipation vents 13 on the side of the louver 31 facing away from the first cooling fan 4 facilitates the formation of an air convection circuit. During operation, the first cooling fan 4 blows the louver 31, expelling hot air through it. Simultaneously, external cold air enters the projection housing 1 through the heat dissipation vents 13, effectively exchanging hot and cold air and further enhancing the heat dissipation effect. The projection assembly 6 includes projection components such as the front mirror, rear mirror, and insulating glass layer. The second cooling fan 5, as part of the internal cooling system, specifically dissipates heat from the projection assembly 6, preventing localized overheating.

[0029] Please refer to Figures 1 to 5 In this embodiment, a mounting wall 11 is provided on one or both sides of the light source assembly 2, and a plug-in slot 111 is provided on the mounting wall 11. One or both sides of the circuit substrate 21 are clamped in the plug-in slot 111. A positioning block is provided at the bottom of the plug-in slot 111, and the positioning block abuts against the heat dissipation base 32. An avoidance notch 1111 is provided in the plug-in slot 111, and the heat dissipation copper tube 33 passes through the avoidance notch 1111. A support column 112 is provided on one side of the mounting wall 11, and a reinforcing rib 1121 connected to the mounting wall 11 is provided around the support column 112. The design of the plug-in slot 111 allows the circuit substrate 21 to be easily clamped on the mounting wall 11, simplifying the assembly process. The positioning block in the plug-in slot 111 directly abuts against the heat dissipation base 32, ensuring that the circuit substrate 21 can be accurately positioned during the installation process, avoiding poor heat dissipation or circuit failure due to position offset. The avoidance notch 1111 ensures that the heat dissipation copper tube 33 can be smoothly connected to the heat dissipation base 32 without affecting the installation and fixation of the circuit substrate 21. The support column 112 enables the light source assembly 2 to resist external impact and vibration during installation and use. The reinforcing ribs 1121 provided on the side of the support column 112 further enhance the connection strength between the support column 112 and the mounting wall 11.

[0030] Please refer to Figures 1 to 5In this embodiment, the end surface of the projection housing 1 is provided with a support base 12, which is provided with a mounting notch 121. The bottom surface of the heat sink base 32 presses against the mounting notch 121. The sidewalls of the support base 12 are provided with support ribs 122, and the bottom of the heat sink base 32 presses against the top of the support ribs 122. The bottom surface of the heat sink base 32 fits tightly against the mounting notch 121, reducing thermal resistance and facilitating rapid heat transfer. The ribs increase the surface area of the support base 12 and disperse stress, thereby enhancing the support capacity of the support base 12 for the heat sink base 32.

[0031] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them. Under the idea of the present invention, the technical features in the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other changes in different aspects of the present invention as described above. For the sake of simplicity, they are not provided in detail. Although the present invention has been described in detail with reference to the above embodiments, ordinary technicians in this field should understand that it is still possible to modify the technical solutions recorded in the above embodiments, or to make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A projector that is conducive to heat dissipation, characterized in that: include: Projection housing (1); A light source assembly (2) comprising a circuit substrate (21) disposed in the projection housing (1) and an LED chip (22) disposed on the front of the circuit substrate (21); A heat dissipation assembly (3) comprises a louver (31), a heat dissipation base (32) and at least one heat dissipation copper tube (33), wherein the heat dissipation base (32) is arranged on the back of the circuit substrate (21), the heat dissipation base (32) is provided with an avoidance groove (321) for allowing the heat dissipation copper tube (33) to pass through, the heat dissipation base (32) presses the heat dissipation copper tube (33) against the back of the circuit substrate (21), the louver (31) is arranged on one side of the heat dissipation base (32), and the heat dissipation copper tube (33) is connected to the louver (31).

2. The projector according to claim 1, wherein: A heat-conducting plane (331) is provided on one side of the heat-dissipating copper tube (33) facing the heat-dissipating base (32), and the heat-conducting plane (331) is attached to the heat-dissipating base (32).

3. The projector with heat dissipation according to claim 1 or 2, characterized in that: One side or both sides of the light source assembly (2) are provided with a mounting wall (11), the mounting wall (11) is provided with a plug-in slot (111), and one side or both sides of the circuit substrate (21) are clamped in the plug-in slot (111).

4. The projector with heat dissipation as claimed in claim 3, characterized in that: A positioning block is provided at the bottom of the plug-in slot (111), and the positioning block abuts against the heat dissipation base (32).

5. The projector with heat dissipation as claimed in claim 4, characterized in that: An avoidance notch (1111) is provided in the plug-in slot (111), and the heat dissipation copper tube (33) passes through the avoidance notch (1111).

6. The projector with heat dissipation as claimed in claim 5, characterized in that: The end surface of the projection housing (1) is provided with a support seat (12), the support seat (12) is provided with a placement notch (121), and the bottom surface of the heat dissipation base (32) is pressed against the placement notch (121).

7. The projector with heat dissipation as claimed in claim 6, characterized in that: The side wall of the support seat (12) is provided with a support rib (122), and the bottom of the heat dissipation base (32) is pressed against the top of the support rib (122).

8. The projector with heat dissipation benefits according to claim 7, characterized in that: The projection housing (1) further comprises a first heat dissipation fan (4) arranged on one side of the louver (31), the air outlet of the first heat dissipation fan (4) facing the louver (31), and a heat dissipation port (13) is provided on the side wall of the projection housing (1), the heat dissipation port (13) being located on the side of the louver (31) facing away from the first heat dissipation fan (4).

9. The projector with heat dissipation as claimed in claim 8, characterized in that: It also includes a projection assembly (6) and a second heat dissipation fan (5), wherein the projection assembly (6) is located at the front end of the light source assembly (2), and the second heat dissipation fan (5) is located at one side of the projection assembly (6).

10. The projector with heat dissipation benefits according to claim 9, characterized in that: A support column (112) is provided on one side of the installation wall (11), and a reinforcing rib (1121) connected to the installation wall (11) is provided on the circumference of the support column (112).

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