Printed circuit board type heat exchanger

Abstract

The utility model discloses a printed circuit board type heat exchanger, which relates to the technical field of heat exchangers and comprises a heat exchange bottom plate, a heat exchange sandwich plate and a coated silicon wafer. The heat exchange device further comprises heat exchange runner openings, heat exchange runner channels and nanometer micropores, phase-change heat exchange failure under the sea condition can be restrained, the effective heat exchange area can be remarkably increased through the micro-nano morphology surface, different sea conditions such as typhoon, sea waves and ocean currents can be met in the marine transportation process, the liquefaction device shakes, the fluid flow pattern changes due to shaking, and the heat exchange efficiency is improved. Meanwhile, due to instability superposition with micro-scale flow, thermodynamic parameters such as temperature and pressure fluctuate severely, so that shaking causes non-uniform working medium distribution and gas-liquid phase state deviation; reasonable heat exchange circulation is carried out through the heat exchange runner openings, the heat exchange runner channels and the nanoscale micropores, and the problems of uneven working medium distribution and gas-liquid phase state deviation caused by shaking can be effectively solved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat exchangers, in particular to a printed circuit board type heat exchanger. Background Art

[0002] PCHE (microchannel heat exchanger) is usually composed of multiple layers of metal plates with tiny channels engraved on the plates, forming a complex flow channel network. The working fluid flows through these channels, transferring heat through heat conduction and convection. Compared with traditional heat exchangers, PCHE has higher heat transfer efficiency, smaller volume, lower weight and better corrosion resistance. In addition, PCHE can withstand higher pressures and temperatures, making it suitable for some special working conditions.

[0003] When using this heat exchanger, a high-efficiency natural gas liquefaction heat exchange technology based on micro-nanoscale configuration and surface coordinated regulation is proposed to suppress the phase change heat transfer failure under sea conditions. The micro-nanomorphology surface can significantly increase the effective heat exchange area. Different sea conditions will be encountered during maritime transportation, such as typhoons, waves and currents, which will cause the liquefaction device to slosh, and the sloshing will cause changes in the fluid flow pattern. At the same time, it is superimposed with microscale flow instability, causing thermodynamic parameters such as temperature and pressure to fluctuate violently. Sloshing causes uneven distribution of the working fluid and gas-liquid phase shift. For this reason, we proposed a printed circuit board heat exchanger. Utility Model Content

[0004] The purpose of this utility model is to address the deficiencies in the above technology and to propose a printed circuit board type heat exchanger to solve the above problems.

[0005] The utility model provides a printed circuit board heat exchanger, comprising a heat exchange base plate, a heat exchange sandwich plate, and a coated silicon wafer. The heat exchange sandwich plates are multiple, stacked and connected, with the heat exchange base plate and the coated silicon wafer welded to the bottom and top of the multiple heat exchange sandwich plates, respectively. The heat exchange sandwich plates are provided with a central inlet and outlet area, which is provided with a plurality of heat exchange flow openings arranged in a linear array. The coated silicon wafer is provided with a plurality of nano-micropores arranged in a linear array within the inner portion. Side plates are provided at both ends of the heat exchange base plate, heat exchange sandwich plate, and coated silicon wafer. The number of heat exchange sandwich plates is 4-6.

[0006] Preferably, the heat exchange flow channel openings are connected from top to bottom to form a plurality of heat exchange flow channel channels. The nanopores are vertically aligned with the heat exchange flow channel openings. The surface coating of the coated silicon wafer is a graphene nanoscale porous structure.

[0007] Compared with the existing technology, it has the following beneficial effects:

[0008] 1. By setting a heat exchange base plate, a coated silicon wafer and multiple heat exchange interlayers, and forming a heat exchanger body by welding, compared with traditional heat exchangers, this application has higher heat transfer efficiency, smaller volume, lower weight and better corrosion resistance. In addition, this application can also withstand higher pressures and temperatures and is suitable for some special working conditions. The research of this application mainly focuses on improving heat transfer efficiency, reducing pressure drop, improving reliability and corrosion resistance.

[0009] 2. By setting heat exchange flow channel openings, heat exchange flow channel channels and nano-micropores, the failure of phase change heat transfer under sea conditions can be suppressed. The micro-nano morphology surface can significantly increase the effective heat exchange area. Different sea conditions will be encountered during maritime transportation, such as typhoons, waves and currents, which will cause the liquefaction device to slosh. The sloshing causes changes in the fluid flow pattern. At the same time, it is superimposed with micro-scale flow instability, causing thermodynamic parameters such as temperature and pressure to fluctuate violently, thereby causing uneven distribution of the working fluid and gas-liquid phase shift due to sloshing. Reasonable heat exchange circulation through heat exchange flow channel openings, heat exchange flow channel channels and nano-micropores can effectively solve the problems of uneven distribution of the working fluid and gas-liquid phase shift caused by sloshing. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only preferred embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0011] Figure 1 This is a schematic diagram of the three-dimensional main structure of the utility model;

[0012] Figure 2 This is a schematic diagram of the enlarged structure of the utility model details;

[0013] Figure 3 This is a side view schematic diagram of the three-dimensional structure of the utility model;

[0014] Figure 4 This is a schematic diagram of the planar three-dimensional structure of the utility model;

[0015] Figure 5 This is a schematic diagram of the detailed planar structure of the utility model;

[0016] Figure 6 This is a schematic diagram of the front three-dimensional structure of the utility model.

[0017] In the figure: 1-heat exchange bottom plate; 2-heat exchange interlayer plate; 3-coated silicon wafer; 4-middle inlet and outlet area; 5-heat exchange flow channel; 6-heat exchange flow channel; 7-nanopore; 8-side plate. DETAILED DESCRIPTION

[0018] In order to make it easier to understand the structure of the present invention and the functional features and advantages that can be achieved, the following is a detailed description of the preferred embodiments of the present invention with reference to the accompanying drawings:

[0019] Example:

[0020] like Figures 1 to 6 As shown, the present invention provides a printed circuit board heat exchanger, comprising a heat exchange base plate 1, a heat exchange sandwich plate 2, and a coated silicon wafer 3. The heat exchange sandwich plates 2 are multiple, stacked and connected by welding. The heat exchange base plate 1 and the coated silicon wafer 3 are welded to the bottom and top of the multiple heat exchange sandwich plates 2, respectively. The heat exchange sandwich plates 2 are provided with a central inlet and outlet area 4, which is provided with a plurality of heat exchange flow openings 5 arranged in a linear array. The coated silicon wafer 3 has a plurality of nanopores 7 arranged in a linear array within it.

[0021] See also Figure 1 The heat exchange base plate 1, heat exchange sandwich plate 2, and coated silicon wafer 3 of the present application are each provided with side plates 8 at both ends. The heat exchange sandwich plates 2 of the present application are 4-6, preferably 5, and the side plates 8 have a five-layer structure, which are spliced together. The middle inlet and outlet area 4 has a five-layer structure, which are spliced together.

[0022] See also Figure 5 The heat exchange flow channel openings 5 of the present application are connected from top to bottom to form a plurality of heat exchange flow channel channels 6.

[0023] See also Figure 1 The nano-pores 7 are vertically aligned with the heat exchange channel opening 5. The surface coating of the coated silicon wafer 3 is a graphene nano-scale porous structure.

[0024] The use method and advantages of this utility model: When the printed circuit board type heat exchanger is used, the working process is as follows:

[0025] like Figures 1 to 6 As shown, the heat exchange base plate 1, the heat exchange interlayer plate 2 and the coated silicon wafer 3 are welded into a whole, so that the heat exchange base plate 1 is located at the bottom of the heat exchanger, and then the side plate 8, the middle inlet and outlet area 4 and the coated silicon wafer 3 are welded upward one by one to form the heat exchanger body. Compared with traditional heat exchangers, this application has higher heat transfer efficiency, smaller volume, lower weight and better corrosion resistance. In addition, this application can also withstand higher pressure and temperature and is suitable for some special working conditions. The research of this application mainly focuses on improving heat transfer efficiency, reducing pressure drop, improving reliability and corrosion resistance.

[0026] In addition, the present application also includes a heat exchange flow channel opening 5, a heat exchange flow channel channel 6 and a nano-micropore 7. The heat exchange flow channel opening 5 is connected from top to bottom to form a plurality of heat exchange flow channel channels 6. The heat exchange flow channel opening 5 corresponds one-to-one with the nano-micropore 7 in the vertical direction to suppress the phase change heat transfer failure under sea conditions. The micro-nano morphology surface can significantly increase the effective heat exchange area. Different sea conditions will be encountered during sea transportation, such as typhoons, waves and currents, which will cause the liquefaction device to sway, and the swaying will cause changes in the fluid flow pattern. At the same time, it will be superimposed with the micro-scale flow instability, causing thermodynamic parameters such as temperature and pressure to fluctuate violently, thereby causing uneven distribution of the working fluid and gas-liquid phase shift due to swaying; reasonable heat exchange circulation through the heat exchange flow channel opening 5, the heat exchange flow channel 6 and the nano-micropore 7 can effectively solve the problem of uneven distribution of the working fluid and gas-liquid phase shift caused by swaying.

[0027] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention in any way. Any person skilled in the art can utilize the above technical content to make many possible changes and modifications to the present invention without departing from the scope of the present invention, or modify it into an equivalent embodiment with equivalent changes. Therefore, any changes, modifications, equivalent changes, and modifications made to the above embodiments based on the technology of the present invention that do not depart from the content of the present invention are within the scope of protection of the present invention.

Claims

1. A printed circuit board type heat exchanger, characterized in that: The invention comprises a heat exchange base plate (1), a heat exchange sandwich plate (2) and a coated silicon wafer (3); the heat exchange sandwich plate (2) is composed of multiple pieces, the multiple pieces of the heat exchange sandwich plates (2) are stacked and connected to each other, the heat exchange base plate (1) and the coated silicon wafer (3) are respectively welded to the bottom and the top of the multiple pieces of the heat exchange sandwich plates (2); the heat exchange sandwich plate (2) is provided with a middle inlet and outlet area (4); the middle inlet and outlet area (4) is provided with a plurality of heat exchange flow channel openings (5) distributed in a linear array; the coated silicon wafer (3) is provided with a plurality of nano-micropores (7) distributed in a linear array inside.

2. The printed circuit board type heat exchanger according to claim 1, characterized in that: The heat exchange flow channel openings (5) are connected from top to bottom to form a plurality of heat exchange flow channel channels (6).

3. The printed circuit board type heat exchanger according to claim 2, characterized in that: The nano-micropores (7) are vertically opposite to the heat exchange flow channel opening (5).

4. The printed circuit board type heat exchanger according to claim 1 or 3, characterized in that: The surface coating of the coated silicon wafer (3) is a graphene nanoscale porous structure.

5. The printed circuit board type heat exchanger according to claim 1, characterized in that: Side plates (8) are provided at both ends of the heat exchange bottom plate (1), the heat exchange interlayer plate (2) and the coated silicon wafer (3).

6. The printed circuit board type heat exchanger according to claim 1, characterized in that: The number of the heat exchange interlayer plates (2) is 4-6.

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