Touch pad pressing structure and touch pad

By using dispensing connections in the touch panel pressing structure and setting a boss on the reinforcement plate to control the adhesive thickness, the problem of insufficient stability and strength caused by double-sided adhesive connection is solved, and higher bonding firmness and cost-effectiveness are achieved.

CN223205842UActive Publication Date: 2025-08-08JIANGSU TRANSIMAGE TECH CO LTD
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Patent Information

Application Number
CN202422185188.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-06
Publication Date
2025-08-08
Estimated Expiration
2034-09-06

AI Technical Summary

Technical Problem

In the existing touch panel press structure, double-sided adhesive connection leads to high product stability and strength and high cost.

Method used

Use dispensing connection method, use hot melt adhesive or AB adhesive instead of double-sided adhesive, and set up a boss on the reinforcement plate to control the uniformity of the adhesive thickness, and design the dispensing area of a specific path.

Benefits of technology

It achieves a firmer bonding effect, reduces the amount of glue used, reduces the cost, and improves the strength and plane stability of the structure.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a touchpad pressing structure and a touchpad, the touchpad pressing structure comprises a PCB and a reinforcing plate, the PCB and the reinforcing plate are connected through dispensing, and one side of the reinforcing plate connected with the PCB is provided with a boss used for controlling the dispensing thickness between the PCB and the reinforcing plate. According to the utility model, back glue is replaced by dispensing connection, so that the glue consumption is reduced, the cost is reduced, the bonding is firm, and the structural strength and the stability are improved.
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Description

Technical Field

[0001] The utility model relates to the field of touch control technology, in particular to a touch panel pressing structure and a touch panel. Background Art

[0002] A touchpad (TP) is an input device used in electronic devices such as laptops. It senses the position and movement of the user's finger through a touch sensor and controls the movement of the pointer on the display interface. Pressing can confirm functions and call up menus. The touchpad pressing structure usually includes a PCB board 1, a reinforcement board 3, and a supporting iron member 4. The PCB board 1 and the reinforcement board 3 are connected by a backing adhesive layer 2, i.e., double-sided adhesive, which is used to reinforce the PCB board 1. Figure 1 However, double-sided tape is a water-based adhesive, and its application requires pressing to activate its properties. During this process, the adhesive will be squeezed and become thinner and uneven, and may also cause slight slippage, resulting in low product stability and strength, and high cost. Utility Model Content

[0003] Purpose of the utility model: The purpose of the utility model is to provide a touch panel pressing structure and a touch panel that can be tightly connected and has better strength and height stability and low cost.

[0004] Technical solution: The touch panel pressing structure described in the utility model includes a PCB board and a reinforcement plate, and the PCB board and the reinforcement plate are connected by glue. A boss is provided on the side where the reinforcement plate is connected to the PCB board for controlling the glue thickness between the PCB board and the reinforcement plate.

[0005] Preferably, the bosses are provided on the four sides and in the middle area of the reinforcing plate.

[0006] Preferably, the height of the boss is 0.1 mm.

[0007] Preferably, the glue dispensing is hot melt glue or AB glue.

[0008] Preferably, the dispensing path is arranged around and in the middle of the PCB board and the reinforcement plate.

[0009] Preferably, the dispensing path is arranged around the boss.

[0010] A touch panel according to the present invention includes the above-mentioned pressing structure.

[0011] Beneficial effects: Compared with the prior art, the utility model has the following advantages: 1. The backing glue is replaced with hot melt glue / AB glue, which can be firmly adhered by point glue connection, is not easy to slip, has good plane and height stability, relatively uniform pressing pressure, and high strength; 2. It saves glue and can reduce costs. Brief Description of the Drawings

[0012] Figure 1 is a structural diagram of a touchpad in the prior art;

[0013] Figure 2 is a schematic diagram of the touchpad pressing structure of the present invention;

[0014] Figure 3 is a perspective view of the touchpad pressing structure in Embodiment 1 of the present invention;

[0015] Figure 4 is a perspective view of the touchpad pressing structure in Embodiment 2 of the present invention;

[0016] Figure 5 is a perspective view of the touchpad pressing structure in Embodiment 3 of the present invention. Detailed Description of the Preferred Embodiments

[0017] The technical solution of the present invention will be further described below with reference to the accompanying drawings.

[0018] As Figure 2 shown, a touchpad pressing structure disclosed by the present invention includes a PCB board 1 and a reinforcing board 3. Among them, the PCB board 1 and the reinforcing board 3 are connected by dispensing glue, replacing the double-sided adhesive connection in the prior art. The dispensing glue uses hot melt glue or AB glue. In order to control the uniform thickness of the dispensing glue between the PCB board and the reinforcing board sandwich, a boss 5 is provided on one side of the reinforcing board connected to the PCB board to control the thickness of the dispensing glue. The position and cross-sectional shape of the boss 5 are not limited and are set according to actual needs. For example, the boss can be provided around the periphery and in the middle area of the reinforcing board 3, and its height is the same as the thickness of the dispensing glue. Preferably, the cross-sectional shape of the boss can be a rectangular or circular structure, and the height is 0.05 - 0.15 mm. In this embodiment, a boss with a height of 0.05 - 0.15 mm is provided on the reinforcing board 3 to ensure that the thickness of the glue after pressing is uniform and the same as the height of the boss. This can not only control the amount of glue used to reduce costs, but also achieve the bonding and fixing effect to ensure strength. If the height of the boss is less than 0.05 mm, the performance of the glue is insufficient and the bonding effect is relatively weak; if the height of the boss is greater than 0.15 mm, the thickness of the glue between the PCB board and the reinforcing board sandwich is relatively thick, the amount of glue used is large, and the cost is increased.

[0019] The dispensing glue area 6 is provided around the periphery and at the local position in the middle of the PCB board and / or the reinforcing board, and is arranged around the boss 5, which can not only save the amount of glue used to reduce costs, but also improve the structural strength and planar stability. As Figure 3 shown in Embodiment 1, the PCB board 1 and the reinforcing board 3 are bonded with hot melt glue, and the hot melt glue dispensing glue area 6 is arranged in a circle along the periphery of the connection between the PCB board and the reinforcing board, and is also arranged in a "宀" shape in the middle. As Figure 4In the embodiment 2 shown, the PCB board 1 and the reinforcing plate 3 are bonded with hot melt adhesive, and the hot melt adhesive dispensing area 6 is arranged along the four sides of the connection between the PCB board and the reinforcing plate, and is arranged in a "cross" shape in the middle. Figure 5 In the illustrated embodiment 3, the PCB board 1 and the reinforcing plate 3 are bonded with hot melt adhesive, and the hot melt adhesive dispensing area 6 is provided along a circle around the connection between the PCB board and the reinforcing plate and is bent in the middle.

[0020] The utility model also provides a touch panel including the pressing structure.

[0021] This new design replaces double-sided adhesive with a point-and-glue method like hot melt adhesive or AB glue, while also creating a convex shape on the reinforcement plate to ensure consistent adhesive thickness between the PCB and reinforcement plate. This reduces adhesive usage and reduces costs, while also ensuring a more secure bond between the PCB and reinforcement plate, and increasing the strength and stability of the press-fit structure. The touchpad, which uses hot-pressed adhesive in the active area, offers superior strength and a relatively good feel, while maintaining structural flatness without limiting PCB deformation that could affect height and feel.

Claims

1. A touch panel pressing structure, comprising a PCB board (1) and a reinforcement board (3), characterized in that: The PCB board (1) and the reinforcing plate (3) are connected by glue dispensing, and a boss (5) is provided on one side where the reinforcing plate is connected to the PCB board for controlling the glue dispensing thickness between the PCB board and the reinforcing plate.

2. The touch panel pressing structure according to claim 1, wherein: The bosses (5) are arranged around and in the middle area of the reinforcing plate (3).

3. The touch panel pressing structure according to claim 1 or 2, wherein: The height of the boss (5) is 0.05-0.15 mm.

4. The touch panel pressing structure according to claim 1, wherein: The dispensing glue is hot melt glue or AB glue.

5. The touch panel pressing structure according to claim 1, wherein: The glue dispensing area is arranged around and in the middle of the PCB board and the reinforcement plate.

6. The touch panel pressing structure according to claim 1, wherein: The glue dispensing area is arranged around the boss.

7. A touch panel, characterized in that: The invention comprises the pressing structure according to any one of claims 1 to 6.