Structure for realizing sharing of memory liquid cooling modules of multiple CPU (Central Processing Unit) platforms

Abstract

The utility model discloses a structure used for achieving sharing of a plurality of CPU platform memory liquid cooling modules. The structure used for achieving sharing of the multiple CPU platform memory liquid cooling modules comprises a supporting body, the supporting body is provided with at least one positioning column and at least two mounting holes, the positioning columns are arranged in a vertical state and used for positioning the memory liquid cooling modules, and the mounting holes are used for being connected with a mainboard. According to the utility model, the corresponding support bodies are designed according to different mainboards, so that the same memory liquid cooling module can be shared on different mainboards, the problem that the same memory liquid cooling module cannot be reused by different mainboards is avoided, and the research and development cost and the production cost are reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of servers, in particular to a structure for realizing the sharing of memory liquid cooling modules of multiple CPU platforms. Background Art

[0002] The new generation of servers demands higher computing and image processing capabilities, and therefore places higher demands on CPU and memory power consumption. However, there is no unified standard for the screw hole positions of different server motherboards that have been developed. This poses a challenge to the structural design compatibility of memory liquid cooling modules. Different motherboards cannot reuse the same memory liquid cooling module, resulting in higher production costs. Utility Model Content

[0003] The purpose of the utility model is to overcome the deficiencies of the prior art and provide a structure for realizing the sharing of memory liquid cooling modules of multiple CPU platforms.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0005] An embodiment of the present utility model provides a structure for realizing the sharing of memory liquid cooling modules of multiple CPU platforms, comprising: a support body, wherein the support body is provided with at least one positioning column and at least two mounting holes, the positioning column is arranged in a vertical state and is used to position the memory liquid cooling module, and the mounting hole is used to connect to the motherboard.

[0006] In a specific embodiment, the top end of the positioning post is conical.

[0007] In a specific embodiment, a supporting protrusion extends downward from the bottom of the mounting hole.

[0008] In a specific embodiment, the side of the support body is further provided with an inwardly concave avoidance area.

[0009] In a specific embodiment, the mounting hole is a countersunk hole.

[0010] In a specific embodiment, an annular protrusion extends upward from the top of the support body.

[0011] In a specific embodiment, a positioning pin is further provided at the bottom of the support body.

[0012] In a specific embodiment, the positioning post and the supporting body are an integrally formed structure.

[0013] In a specific embodiment, the support body is provided with a plurality of threaded holes, and the positioning posts are connected to the threaded holes.

[0014] In a specific embodiment, the supporting body is made of metal.

[0015] The structure of the utility model for realizing the sharing of memory liquid cooling modules of multiple CPU platforms has the following beneficial effects compared with the prior art: corresponding support bodies are designed according to different motherboards, so that the same memory liquid cooling module can be shared on different motherboards, avoiding the problem that different motherboards cannot reuse the same memory liquid cooling module, thereby reducing R&D costs and production costs.

[0016] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0018] Figure 1 This is a schematic diagram of a first embodiment of a structure for realizing a shared memory liquid cooling module for multiple CPU platforms provided by the present invention;

[0019] Figure 2 This is a schematic diagram of a second structural embodiment of the present invention for realizing the sharing of memory liquid cooling modules for multiple CPU platforms;

[0020] Figure 3 This is a schematic diagram of an application scenario of a first structural embodiment of the present invention for realizing a shared memory liquid cooling module for multiple CPU platforms;

[0021] Figure 4 This is a schematic diagram of an application scenario of the second structural embodiment provided by the present invention for realizing the sharing of memory liquid cooling modules of multiple CPU platforms. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0023] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts shall fall within the scope of protection of the present invention.

[0024] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0026] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0027] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0028] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine the different embodiments or examples described in this specification.

[0029] See also Figures 1 to 4 In the specific embodiment shown, the utility model discloses a structure for realizing the sharing of memory liquid cooling modules of multiple CPU platforms, including: a support body 10, the support body 10 is provided with at least one positioning column 11, and at least two mounting holes 12, the positioning column 11 is arranged in a vertical state and is used to position the memory liquid cooling module 20, and the mounting hole 12 is used to connect to the motherboard 30.

[0030] Specifically, the shared structure is used to separate the memory liquid cooling module 20 and the motherboard 30, preventing the memory liquid cooling module 20 from pressing against components on the motherboard 30, and is also used to position and support the memory liquid cooling module 20. In addition, corresponding support bodies are designed according to different motherboards 30 so that the same memory liquid cooling module 20 can be shared on different motherboards 30, avoiding the problem of different motherboards 30 being unable to reuse the same memory liquid cooling module 20, thereby reducing R&D costs and production costs. In addition, since the cross-platform sharing of the memory liquid cooling module 20 is achieved, manufacturers do not need to develop a corresponding memory liquid cooling module 20 for each motherboard 30, thereby reducing the R&D cycle and R&D investment, and reducing overall R&D costs. In addition, as R&D costs decrease and production scale expands, production costs will also decrease accordingly, because the same memory liquid cooling module 20 can be produced in large quantities and adapted to different motherboards 30 by adjusting the shared structure, avoiding the additional costs incurred by designing and producing multiple models of memory liquid cooling modules 20.

[0031] In one embodiment, the top end of the positioning post 11 is conical.

[0032] Specifically, the conical design allows the positioning column 11 to be inserted into the corresponding hole in the memory liquid cooling module 20 more easily and accurately. This design reduces the difficulty of alignment during installation, improves installation efficiency, and reduces the risk of damage caused by improper installation. In addition, the top of the cone can gradually expand the contact area with the memory liquid cooling module 20 during the insertion process, forming a tighter and more stable connection. This design helps ensure that the memory liquid cooling module 20 can be firmly fixed to the motherboard 30 after installation, avoiding loosening or falling off due to vibration or other external forces. In addition, the conical design helps to reduce friction and resistance between the hole wall of the memory liquid cooling module 20 during the insertion process, making the installation process smoother. This not only protects the positioning column 11 and the memory liquid cooling module 20 from unnecessary wear, but also improves the user experience.

[0033] In one embodiment, a supporting protrusion 13 extends downward from the bottom of the mounting hole 12 .

[0034] Specifically, by designing the mounting holes 12 with support protrusions 13 extending downward from their bottoms, it is ensured that when the support body 10 is secured to the motherboard 30 through the mounting holes 12, the primary weight and pressure of the support body 10 is concentrated on these support protrusions 13, rather than acting directly on the plane of the motherboard 30. This ensures that the majority of the support body 10 is kept clear of the components on the motherboard 30, effectively preventing pressure and damage to sensitive or fragile components on the motherboard 30. Furthermore, the design of the support protrusions 13 not only protects the components but also enhances the stability of the connection between the support body 10 and the motherboard 30. Because the support protrusions 13 directly contact the motherboard 30 and provide additional support points, this helps reduce the risk of the support body 10 loosening or falling off due to vibration or other external forces. Furthermore, the fact that the support body 10 is kept clear of the components on the motherboard 30 also means that it does not block or restrict the ventilation and heat dissipation paths of other heat dissipating components on the motherboard 30 (such as radiators, fans, etc.), which helps maintain good heat dissipation performance for the motherboard 30 and its components, ensuring stable system operation. In addition, since the design of the support protrusion 13 allows the support body 10 to avoid the components on the motherboard 30, the structure is more likely to be suitable for motherboards 30 of different brands and models. This design improves the compatibility and versatility of the support body 10, allowing the same memory liquid cooling module 20 to be more widely used on different hardware platforms.

[0035] See also Figure 1 and Figure 3 In the first embodiment shown, the side of the support body 10 is further provided with an inwardly concave avoidance area 14 .

[0036] Specifically, the motherboard 30 is typically filled with various components, such as capacitors, resistors, and chips. These components are positioned and at varying heights. When the support body 10 is mounted on the motherboard 30, its sides may interfere with or conflict with these components, making installation difficult or damaging the components. By designing the inwardly concave escape area 14, the support body 10 can be ensured to smoothly avoid the components on the motherboard 30 during installation, preventing interference or conflict. Furthermore, the design of the escape area 14 provides greater flexibility during installation of the support body 10. Even if the components on the motherboard 30 are compactly or irregularly arranged, the support body 10 can adjust its position and angle to find a suitable installation location, ensuring that the memory liquid cooling module 20 is stably and securely fixed to the motherboard 30. Furthermore, the escape area 14 not only avoids the components on the motherboard 30 but also optimizes heat dissipation to a certain extent. By reducing the direct contact area between the support body 10 and the components on the motherboard 30, heat accumulation caused by heat conduction can be reduced, helping to maintain a low temperature for the motherboard 30 and its components, thereby improving system stability and reliability.

[0037] See also Figure 2 The second embodiment shown is different from the first embodiment in that, in the second embodiment, the side of the support body 10 is not provided with an avoidance area 14 to adapt to other application scenarios.

[0038] In one embodiment, the mounting hole 12 is a countersunk hole.

[0039] Specifically, the countersunk hole design allows the screw heads to be completely sunken into the holes when the support body 10 is secured to the motherboard 30 via screws, preventing the screws from being exposed. This not only improves the overall aesthetics but also reduces potential safety hazards caused by protruding screws, such as scratching the memory liquid cooling module 20 or other surrounding components. Furthermore, because the screws are completely concealed within the countersunk holes, they do not come into direct contact with the memory liquid cooling module 20, thus preventing scratches or damage caused by loose screws, falling off, or accidental contact. This is crucial for maintaining the integrity of the memory liquid cooling module 20 and extending its service life.

[0040] In one embodiment, an annular protrusion 15 extends upward from the top of the support body 10 .

[0041] Specifically, the design of the annular protrusion 15 effectively reduces the direct contact area between the memory liquid cooling module 20 and the support body 10. This design helps reduce heat transfer caused by excessive contact area, thereby optimizing the heat dissipation effect to a certain extent. Furthermore, the annular protrusion 15 is not only a simple decorative feature, but also serves to strengthen the structural strength of the support body 10. By providing the upwardly extending annular protrusion 15, the support body 10 can better disperse and resist external forces, thereby improving the stability and durability of the overall structure. This design helps ensure that the support body 10 can maintain its original shape and function during long-term use, and will not be deformed or damaged by external forces.

[0042] In one embodiment, a positioning pin is further provided at the bottom of the support body 10 .

[0043] Specifically, the positioning pin is a mechanical connector whose main function is to ensure precise alignment and firm connection between the support body 10 and the motherboard 30; when the support body 10 cooperates with the corresponding hole on the motherboard 30 through the positioning pin, error-free docking between the two can be achieved, thereby ensuring that the installation position of the memory liquid cooling module 20 is accurate. This precise positioning not only helps to improve the stability and reliability of the entire hardware system, but also avoids performance degradation or failure due to position deviation.

[0044] In one embodiment, the positioning post 11 and the supporting body 10 are integrally formed.

[0045] Specifically, the one-piece molding structure means that there are no additional connectors or interfaces between the positioning column 11 and the support body 10, which makes the entire structure stronger and more stable. When subjected to external forces, the one-piece molding structure can better disperse and resist these forces, thereby improving the strength and durability of the overall structure. In addition, the one-piece molding process is usually achieved through precise molds and advanced production equipment, which ensures the size and position accuracy between the positioning column 11 and the support body 10. This high precision not only helps to ensure that the memory liquid cooling module 20 can be accurately installed on the motherboard 30, but also improves the performance and stability of the entire hardware system. In addition, compared with the traditional split assembly process, the one-piece molding structure simplifies the production process. There is no need for separate positioning column 11 processing and assembly steps, which reduces production costs and manpower requirements. At the same time, the one-piece molding structure also reduces quality problems caused by improper assembly and improves the product yield and reliability.

[0046] In one embodiment, the support body 10 is provided with a plurality of threaded holes, and the positioning posts 11 are connected to the threaded holes.

[0047] Specifically, by providing multiple threaded holes on the support body 10 and allowing the positioning posts 11 to be connected through these threaded holes, the user can adjust the position of the positioning posts 11 according to actual needs. This design provides great flexibility and adjustability, allowing the hardware system to adapt to different installation environments and requirements. In addition, components such as motherboards 30 and memory liquid cooling modules 20 of different models or specifications may have different installation dimensions and hole position requirements. By providing multiple threaded holes and adjustable positioning posts 11, the same support body 10 can be adapted to a variety of different hardware components, enhancing the product's adaptability and versatility.

[0048] Preferably, the number of positioning posts 11 is two. By adopting the design of two positioning posts 11, the memory liquid cooling module 20 can be provided with stable support in two different directions. This two-point fixing method can effectively limit the freedom of movement of the memory liquid cooling module 20 in the horizontal plane, thereby reducing the risk of displacement caused by vibration, temperature changes or other external factors during operation. In addition, the two positioning posts 11 can ensure that the memory liquid cooling module 20 can be accurately aligned with the corresponding position on the motherboard 30 during installation. This precise alignment not only helps to improve the stability and performance of the overall hardware system, but also avoids problems such as poor heat dissipation or component damage caused by installation position deviation.

[0049] In one embodiment, the support body 10 is made of metal.

[0050] Specifically, metal materials generally have high strength and durability, which enables the support body 10 made of metal to withstand large external forces and pressures without being easily deformed or damaged. This is particularly important for the support body 10 that needs to support and fix heavy components such as the memory liquid cooling module 20, and can ensure the stability and reliability of the system. In addition, many metal materials (such as aluminum, copper, etc.) have good thermal conductivity. Although the support body 10 itself may not directly participate in the heat dissipation process, its metal material helps to quickly conduct the heat that may be generated to the surrounding environment, thereby assisting heat dissipation to a certain extent; in addition, the metal material can also act as a thermal bridge to transfer the heat generated by components such as the memory liquid cooling module 20 to the heat dissipation system more quickly. In addition, metal materials generally have good machinability and formability, and can be processed and formed through a variety of processes such as casting, forging, stamping, and cutting. This allows manufacturers to design support bodies 10 of various shapes and complex structures according to specific needs to meet the installation requirements of different hardware systems.

[0051] See also Figure 3 and Figure 4As shown, the support body 10 is first fixed to the motherboard 30 by screws, and then the memory liquid cooling module 20 is inserted into the positioning column 11. Finally, the memory liquid cooling module 20 and the motherboard 30 are locked by screws.

[0052] The above embodiments are preferred implementation schemes of the present invention. In addition, the present invention can also be implemented in other ways. Any obvious replacement without departing from the concept of the present technical solution is within the scope of protection of the present invention.

Claims

1. A structure for realizing the sharing of memory liquid cooling modules of multiple CPU platforms, characterized in that: include: The support body is provided with at least one positioning column and at least two mounting holes. The positioning column is arranged in a vertical state and is used to position the memory liquid cooling module. The mounting holes are used to connect to the motherboard.

2. The structure for realizing the sharing of memory liquid cooling modules of multiple CPU platforms according to claim 1, characterized in that: The top end of the positioning column is cone-shaped.

3. The structure for realizing the sharing of memory liquid cooling modules of multiple CPU platforms according to claim 1, characterized in that: A supporting protrusion is further extended downward from the bottom of the mounting hole.

4. The structure for realizing the sharing of memory liquid cooling modules of multiple CPU platforms according to claim 1, characterized in that: The side of the support body is further provided with an inwardly concave avoidance area.

5. The structure for realizing the sharing of memory liquid cooling modules of multiple CPU platforms according to claim 1, characterized in that: The mounting hole is a countersunk hole.

6. The structure for realizing the sharing of memory liquid cooling modules of multiple CPU platforms according to claim 1, characterized in that: An annular protrusion extends upward from the top of the support body.

7. The structure for realizing the sharing of memory liquid cooling modules of multiple CPU platforms according to claim 1, characterized in that: A positioning pin is also provided at the bottom of the support body.

8. The structure for realizing the sharing of memory liquid cooling modules of multiple CPU platforms according to claim 1, characterized in that: The positioning column and the supporting body are an integrally formed structure.

9. The structure for realizing the sharing of memory liquid cooling modules of multiple CPU platforms according to claim 1, characterized in that: The support body is provided with a plurality of threaded holes, and the positioning posts are connected to the threaded holes.

10. The structure for realizing the sharing of memory liquid cooling modules of multiple CPU platforms according to claim 1, characterized in that: The supporting body is made of metal material.

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