Electroplating solution treatment equipment

Abstract

The utility model relates to the technical field of electroplating equipment, in particular to electroplating liquid treatment equipment. And in the electroplating process of the to-be-electroplated part, the to-be-electroplated part is placed in the electroplating layer, so that the to-be-electroplated part is electroplated on the electroplating layer. Meanwhile, the pumping assembly operates to pump the electroplating liquid in the dirt collecting bin to the electroplating layer, so that the electroplating liquid of the electroplating layer enters the dirt collecting bin through the communicating port, the electroplating liquid in the dirt collecting bin is filtered by the filtering assembly and then is pumped to the electroplating layer by the pumping assembly, and impurities in the electroplating liquid are collected into the dirt collecting bin, so that the electroplating liquid is subjected to impurity removal; therefore, the impurity content in the electroplating liquid in the electroplated layer is ensured to meet the expected requirement, the electroplating effect is ensured to meet the expected requirement, and the replacement frequency of the electroplating liquid is reduced.

Description

Technical Field

[0001] This application relates to the technical field of electroplating equipment, in particular to an electroplating liquid processing equipment Background Art

[0002] Electroplating is a process that uses the principle of electrolysis to coat a layer of metal film on the surface of metal or other materials. The purpose of electroplating is to improve the appearance of the material and to impart various physical and chemical properties to the surface of the material, such as corrosion resistance, decorative properties, wear resistance, brazing properties, as well as electrical conductivity, magnetic properties, and optical properties. Depending on the function of the coating, electroplating can be divided into corrosion-resistant coatings, decorative coatings, and functional coatings. Electroplating technology uses electrolysis to deposit the cations of the metal to be plated in the plating solution on the surface of the base metal through electrolysis in a salt solution containing the metal to be plated, with the base metal to be plated as the cathode, to form a coating. This technology is widely used in the electronics industry, communications, military industry, aerospace and other fields, among which the application of functional electroplating technology is becoming more and more extensive.

[0003] During the electroplating process, impurities are generated in the electroplating solution, which affects the electroplating effect and increases the frequency of replacing the electroplating solution. This not only leads to a deterioration of the electroplating effect, but also leads to a waste of resources and an increase in production costs.

[0004] It can be seen that how to remove impurities from the electroplating solution is a technical problem that needs to be solved urgently. Utility Model Content

[0005] The present application provides an electroplating solution processing device, which aims to solve the technical problem of how to remove impurities from the electroplating solution in the prior art.

[0006] The present application provides an electroplating solution processing device, comprising:

[0007] An electroplating tank body, wherein the electroplating tank body is used to contain electroplating solution;

[0008] a partition plate, the partition plate being used to separate the electroplating tank into an electroplating layer and a treatment layer, the electroplating layer being located above the treatment layer, the treatment layer being provided with a dirt collection bin, one side of the dirt collection bin being connected to the electroplating layer via a communication port, and the other side of the dirt collection bin being provided with a first sealing plate, the first sealing plate being used to seal the side of the dirt collection bin away from the communication port;

[0009] A filter assembly, the filter assembly being mounted on the first sealing plate, and the electroplating liquid in the sewage collecting bin being filtered by the filter assembly and then discharged from the sewage collecting bin;

[0010] A pumping assembly is used to pump the electroplating liquid in the sewage collection bin to the electroplating layer.

[0011] Optionally, the treatment layer is further provided with a buffer bin, and the first sealing plate separates the buffer bin from the dirt collection bin;

[0012] A second sealing plate is provided on a side of the buffer bin away from the first sealing plate, and the second sealing plate is used to seal the buffer bin;

[0013] Wherein, the pumping direction of the pumping assembly is from the inside of the buffer bin to the outside of the buffer bin.

[0014] Optionally, the buffer bin is provided with a liquid level sensor, and the liquid level sensor is used to detect the liquid level of the buffer bin.

[0015] Optionally, the pumping assembly is installed at the bottom of the second sealing plate.

[0016] Optionally, the height of the partition plate at one end away from the communicating port is higher than the height of the partition plate at one end close to the communicating port.

[0017] Optionally, the sewage collecting bin is provided with a first sewage cleaning port, and the first sewage cleaning port is provided with a first sealing component, and the first sealing component is used to close and open the first sewage cleaning port.

[0018] Optionally, the sewage collecting bin is provided with a flushing port, and the flushing port is used to allow external flushing water to enter the sewage collecting bin to clean the sewage collecting bin.

[0019] Optionally, the buffer bin is provided with a second sewage cleaning port, and the second sewage cleaning port is provided with a second sealing assembly, and the second sealing assembly is used to close and open the second sewage cleaning port.

[0020] Optionally, the communication port is provided with a third sealing component, and the third sealing component is used to open and close the communication port.

[0021] Optionally, the third sealing component includes:

[0022] a sealing member, the sealing member being slidably connected to the partition plate;

[0023] a tension spring, the tension spring being used to pull the sealing member so that the sealing member opens the communication port;

[0024] The electromagnet assembly is used to pull the sealing member through magnetic attraction so that the sealing member overcomes the elastic force of the tension spring and closes the communication port.

[0025] The beneficial effect achieved by the present application is that: during the electroplating process of a workpiece, the workpiece is placed in the electroplating layer so that the workpiece is electroplated in the electroplating layer. At the same time, the pumping component operates to pump the electroplating liquid in the sump bin to the electroplating layer, whereby the electroplating liquid in the electroplating layer enters the sump bin through the connecting port, and the electroplating liquid in the sump bin is filtered by the filter component and then pumped to the electroplating layer by the pumping component, while impurities in the electroplating liquid are collected in the sump bin. In this way, the electroplating liquid is removed from the electroplating liquid, thereby ensuring that the impurity content in the electroplating liquid in the electroplating layer meets the expected requirements, thereby ensuring that the electroplating effect meets the expected requirements, and reducing the frequency of replacing the electroplating liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a cross-sectional view of an electroplating solution processing device in an embodiment of the present utility model;

[0027] Figure 2 This is a schematic diagram of the three-dimensional structure of the electroplating liquid processing equipment in the embodiment of the present invention after the partition plate is removed;

[0028] Figure 3 It is a schematic diagram of the three-dimensional structure of the electroplating tank body after the electroplating liquid processing equipment in the embodiment of the present utility model is cut away.

[0029] Description of main unit symbols:

[0030] 10. Electroplating liquid treatment equipment; 20. Electroplating tank body; 21. Electroplating layer; 22. Treatment layer; 23. Waste collection bin; 231. First waste cleaning port; 232. Rinse port; 233. First sealing assembly; 234. Connecting port; 24. Buffer bin; 241. Second waste cleaning port; 242. Second sealing assembly; 25. Third sealing assembly; 251. Sealing part; 252. Tension spring; 253. Electromagnet assembly; 26. First sealing plate; 27. Second sealing plate; 28. Partition plate; 30. Filter assembly; 40. Pumping assembly; 50. Liquid level sensor. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. Examples of the embodiments are shown in the accompanying drawings, in which the same or similar reference numerals throughout represent the same or similar units or units with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and are not to be construed as limiting the present invention. In addition, it should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0032] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "left", "right", "horizontal", "top", "bottom", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or unit referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0033] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the described features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0034] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, electrical connections, or mutual communication; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two units or interaction between two units. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0035] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0036] The disclosure below provides many different embodiments or examples for realizing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numbers and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but a person of ordinary skill in the art will appreciate the application of other processes and / or the use of other materials.

[0037] See also Figures 1 to 3 In some embodiments of the present application, the present application provides an electroplating liquid processing device 10, comprising: an electroplating tank body 20, a partition plate 28, a filter assembly 30 and a pumping assembly 40. The electroplating tank body 20 is used to contain the electroplating liquid. The partition plate 28 is used to separate the electroplating tank into an electroplating layer 21 and a treatment layer 22. The electroplating layer 21 is located above the treatment layer 22. The treatment layer 22 is provided with a sewage collecting bin 23. One side of the sewage collecting bin 23 is connected to the electroplating layer 21 through a connecting port 234. The other side of the sewage collecting bin 23 is provided with a first sealing plate 26. The first sealing plate 26 is used to seal the side of the sewage collecting bin 23 away from the connecting port 234. The filter assembly 30 is installed on the first sealing plate 26. The electroplating liquid in the sewage collecting bin 23 is filtered by the filter assembly 30 and then discharged from the sewage collecting bin 23. The pumping assembly 40 is used to pump the electroplating liquid in the sewage collecting bin 23 to the electroplating layer 21.

[0038] During the electroplating process of the workpiece, the workpiece is placed in the electroplating layer 21 so that the workpiece is electroplated in the electroplating layer 21. At the same time, the pumping assembly 40 operates to pump the plating solution in the sump 23 to the electroplating layer 21. As a result, the plating solution in the electroplating layer 21 enters the sump 23 through the connecting port 234. The plating solution in the sump 23 is filtered by the filter assembly 30 and then pumped to the electroplating layer 21 by the pumping assembly 40. Impurities in the plating solution are collected in the sump 23. In this way, the plating solution is cleaned to ensure that the impurity content in the plating solution in the electroplating layer 21 meets the expected requirements, thereby ensuring that the electroplating effect meets the expected requirements and reducing the frequency of plating solution replacement.

[0039] In some embodiments of the present application, the processing layer 22 is further provided with a buffer bin 24, and a first sealing plate 26 separates the buffer bin 24 from the waste collection bin 23. A second sealing plate 27 is provided on the side of the buffer bin 24 away from the first sealing plate 26, and is used to seal the buffer bin 24. The pumping direction of the pumping assembly 40 is from the interior of the buffer bin 24 to the exterior of the buffer bin 24.

[0040] During operation, the pumping assembly 40 pumps the electroplating liquid in the buffer chamber 24 toward the electroplating layer 21, thereby creating a negative pressure in the buffer chamber 24. Under the action of the negative pressure in the buffer chamber 24, the electroplating liquid in the sump chamber 23 is filtered by the filter assembly 30 before entering the buffer chamber 24. In this way, the electroplating liquid pumped by the pumping assembly 40 is filtered electroplating liquid, thereby preventing the adverse effects of impurities on the pumping assembly 40, thereby reducing the failure rate of the pumping assembly 40 and increasing the service life of the pumping assembly 40.

[0041] When the impurities collected in the waste collection bin 23 reach full capacity, the filter assembly 30 will be blocked by the impurities, preventing the electroplating liquid in the waste collection bin 23 from entering the buffer bin 24. However, the buffer bin 24 ensures that even when the waste collection bin 23 reaches full capacity, there will still be electroplating liquid in the buffer bin 24 for the pumping assembly 40 to pump. This reduces the risk of the pumping assembly 40 running idle, further reduces the failure rate of the pumping assembly 40, and further increases the service life of the pumping assembly 40.

[0042] When the filtering capacity of the filter assembly 30 decreases, some impurities will pass through the filter assembly 30. After passing through the filter assembly 30, some impurities will settle in the buffer chamber 24, thereby ensuring that the electroplating solution pumped by the pumping assembly 40 is cleaner and preventing impurities from entering the electroplating layer 21. This ensures that the impurity content in the electroplating solution in the electroplating layer 21 meets the expected requirements, thereby ensuring that the electroplating effect meets the expected requirements and reducing the frequency of replacing the electroplating solution.

[0043] See also Figures 2 to 3 In some embodiments of the present application, the buffer bin 24 is provided with a liquid level sensor 50 , which is used to detect the liquid level of the buffer bin 24 .

[0044] The liquid level in the buffer bin 24 is detected by the liquid level sensor 50. If the liquid level in the buffer bin 24 keeps decreasing, it means that there are too many impurities collected in the sewage collecting bin 23 or the filter component 30 is blocked, and the alarm module prompts the staff to clean and maintain the sewage collecting bin 23 or the filter component 30.

[0045] In some embodiments of the present application, the pumping assembly 40 is installed at the lower portion of the second sealing plate 27 .

[0046] By installing the pumping assembly 40 at the lower part of the second sealing plate 27, it is ensured that the pumping assembly 40 can still pump the electroplating liquid when the liquid level in the buffer bin 24 drops, thereby ensuring the continuity of the operation of the pumping assembly 40.

[0047] In some embodiments of the present application, the height of the partition plate 28 at one end away from the communication port 234 is higher than the height of the partition plate 28 at one end close to the communication port 234 .

[0048] By making the height of the end of the partition plate 28 away from the communication port 234 higher than the height of the end of the partition plate 28 near the communication port 234, and thus making the side of the partition plate 28 near the electroplating layer 21 inclined toward the communication port 234, when impurities in the electroplating layer 21 settle on the partition plate 28, the impurities move along the inclined surface of the partition plate 28 toward the communication port 234 and enter the waste collection chamber 23, thereby increasing the efficiency of impurities entering the waste collection chamber 23 and improving the purification effect of the electroplating solution in the electroplating layer 21.

[0049] During operation of the pumping assembly 40, a liquid circulation is formed between the electroplating layer 21 and the treatment layer 22 due to the driving action of the pumping assembly 40. The plating liquid flows from the electroplating layer 21 through the communication port 234 into the sump 23. The plating liquid in the sump 23 then passes through the filter assembly 30 and is pumped back to the electroplating layer 21 by the pumping assembly 40. The plating liquid pumped from the sump 23 to the electroplating layer 21 is filtered by the filter assembly 30, and impurities in the plating liquid are trapped in the sump 23, where they are collected. In this way, when the plating liquid circulates between the plating layer 21 and the treatment layer 22, the impurities in the plating liquid flow into the dirt collecting bin 23 and are intercepted by the filter component 30 in the dirt collecting bin 23, thereby reducing the content of impurities in the plating liquid in the plating layer 21, and then removing impurities from the plating liquid, thereby ensuring that the impurity content in the plating liquid in the plating layer 21 meets the expected requirements, thereby ensuring that the electroplating effect meets the expected requirements, and reducing the frequency of replacing the plating liquid.

[0050] In some embodiments of the present application, the waste collecting bin 23 is provided with a first waste cleaning port 231 , and the first waste cleaning port 231 is provided with a first sealing component 233 , which is used to close and open the first waste cleaning port 231 .

[0051] When there are too many impurities in the waste collection bin 23, the first sealing assembly 233 can be opened, and the impurities in the waste collection bin 23 can be cleaned out through the first cleaning port 231, thereby ensuring that there is sufficient space in the waste collection bin 23 to collect impurities filtered from the electroplating solution. After the waste collection bin 23 is cleaned, the first cleaning port 231 is closed again through the first sealing assembly 233 to prevent the electroplating solution in the waste collection bin 23 from flowing out.

[0052] In some embodiments of the present application, the dirt collecting bin 23 is provided with a flushing port 232 , and the flushing port 232 is used to allow external flushing water to enter the dirt collecting bin 23 to clean the dirt collecting bin 23 .

[0053] During the cleaning process of the waste collection bin 23, a flushing liquid can be introduced through the flushing port 232 to flush the interior of the waste collection bin 23 and the filter assembly 30, thereby improving the cleaning effect and efficiency. When the filter assembly 30 needs to be cleaned, the filter assembly 30 can also be removed and then cleaned, maintained, or replaced to ensure the good filtering effect of the filter assembly 30.

[0054] In some embodiments of the present application, the buffer bin 24 is provided with a second cleaning port 241 , and the second cleaning port 241 is provided with a second sealing assembly 242 , which is used to close and open the second cleaning port 241 .

[0055] When some impurities pass through the filter component 30, they are precipitated in the buffer bin 24, thereby ensuring that the plating liquid pumped by the pumping component 40 is cleaner and preventing impurities from entering the plating layer 21, thereby ensuring that the impurity content in the plating liquid in the plating layer 21 meets the expected requirements, thereby ensuring that the electroplating effect meets the expected requirements and reducing the frequency of replacing the plating liquid.

[0056] When cleaning the dirt collection bin 23, the buffer bin 24 can be cleaned simultaneously. During the cleaning process of the buffer bin 24, the second sealing assembly 242 can be opened, and then the impurities in the buffer bin 24 can be cleaned through the second dirt cleaning port 241, thereby preventing excessive accumulation of impurities in the buffer bin 24 and ensuring the purification effect of the electroplating liquid treatment equipment 10 on the electroplating liquid.

[0057] In some embodiments of the present application, the communication port 234 is provided with a third sealing component 25 , and the third sealing component 25 is used to open and close the communication port 234 .

[0058] During the cleaning process of the dirt collection chamber 23, the communication port 234 can be closed by the third sealing assembly 25, thereby preventing the plating solution of the electroplating layer 21 from entering the dirt collection chamber 23. This allows the cleaning process of the dirt collection chamber 23 to proceed simultaneously with the electroplating process, avoiding interruption of the electroplating process due to the cleaning of the dirt collection chamber 23, thereby ensuring the continuity of the electroplating process and ensuring production efficiency. After the dirt collection chamber 23 is cleaned, the communication port 234 is opened again by the third sealing assembly 25, thereby re-establishing a circulation between the electroplating layer 21 and the treatment layer 22, thereby continuing the purification process of the electroplating solution.

[0059] In some embodiments of the present application, the third sealing assembly 25 includes a sealing member 251, a tension spring 252, and an electromagnet assembly 253. The sealing member 251 is slidably connected to the partition plate 28. The tension spring 252 is used to pull the sealing member 251, thereby opening the communication port 234. The electromagnet assembly 253 is used to pull the sealing member 251 through magnetic attraction, causing the sealing member 251 to overcome the elastic force of the tension spring 252 and thereby close the communication port 234.

[0060] When the third sealing assembly 25 closes the communication port 234, the electromagnet assembly 253 is energized, causing the sealing member 251 to cling to the sidewall of the electroplating tank body 20, thereby sealing the communication port 234. When the third sealing assembly 25 opens the communication port 234, the electromagnet assembly 253 is de-energized, releasing the sealing member 251. The sealing member 251 then leaves the sidewall of the electroplating tank body 20 under the elastic force of the tension spring 252, thereby opening the communication port 234.

[0061] Throughout this specification, references to terms such as "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" indicate that a specific feature, structure, material, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative uses of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0062] Furthermore, the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be subject to the scope of protection of the claims.

Claims

1. An electroplating solution processing device, characterized in that: include: An electroplating tank body, wherein the electroplating tank body is used to contain electroplating solution; a partition plate, the partition plate being used to separate the electroplating tank into an electroplating layer and a treatment layer, the electroplating layer being located above the treatment layer, the treatment layer being provided with a dirt collection bin, one side of the dirt collection bin being connected to the electroplating layer via a communication port, and the other side of the dirt collection bin being provided with a first sealing plate, the first sealing plate being used to seal the side of the dirt collection bin away from the communication port; A filter assembly, the filter assembly being mounted on the first sealing plate, and the electroplating liquid in the sewage collecting bin being filtered by the filter assembly and then discharged from the sewage collecting bin; A pumping assembly is used to pump the electroplating liquid in the sewage collection bin to the electroplating layer.

2. The electroplating solution processing equipment according to claim 1, characterized in that: The treatment layer is further provided with a buffer bin, and the first sealing plate separates the buffer bin from the dirt collection bin; A second sealing plate is provided on a side of the buffer bin away from the first sealing plate, and the second sealing plate is used to seal the buffer bin; Wherein, the pumping direction of the pumping assembly is from the inside of the buffer bin to the outside of the buffer bin.

3. The electroplating solution processing equipment according to claim 2, characterized in that: The buffer bin is provided with a liquid level sensor, and the liquid level sensor is used to detect the liquid level of the buffer bin.

4. The electroplating solution processing equipment according to claim 2, characterized in that: The pumping assembly is installed at the lower part of the second sealing plate.

5. The electroplating solution processing equipment according to claim 4, characterized in that: The height of the partition plate at one end away from the communication port is higher than the height of the partition plate at one end close to the communication port.

6. The electroplating solution processing equipment according to claim 1, characterized in that: The sewage collecting bin is provided with a first sewage cleaning port, and the first sewage cleaning port is provided with a first sealing component, and the first sealing component is used to close and open the first sewage cleaning port.

7. The electroplating solution processing equipment according to claim 1, characterized in that: The dirt collecting bin is provided with a flushing port, and the flushing port is used to allow external flushing water to enter the dirt collecting bin to clean the dirt collecting bin.

8. The electroplating solution processing equipment according to claim 2, characterized in that: The buffer bin is provided with a second sewage cleaning port, and the second sewage cleaning port is provided with a second sealing assembly, and the second sealing assembly is used to close and open the second sewage cleaning port.

9. The electroplating solution processing equipment according to claim 1, characterized in that: The communication port is provided with a third sealing component, and the third sealing component is used to open and close the communication port.

10. The electroplating solution processing equipment according to claim 9, characterized in that: The third sealing component includes: a sealing member, the sealing member being slidably connected to the partition plate; a tension spring, the tension spring being used to pull the sealing member so that the sealing member opens the communication port; The electromagnet assembly is used to pull the sealing member through magnetic attraction so that the sealing member overcomes the elastic force of the tension spring and closes the communication port.

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