Earphone testing mechanism

By designing the headphone testing mechanism, using positioning fixtures and mono simulated ears, the time-consuming and damage problems of acoustic consistency detection of headphone earcups is solved, and more accurate test results and higher finished product yields are achieved.

CN223246712UActive Publication Date: 2025-08-19RISUNTEK INC
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Patent Information

Application Number
CN202421885331.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-05
Publication Date
2025-08-19
Estimated Expiration
2034-08-05

AI Technical Summary

Technical Problem

In the prior art, the acoustic consistency detection of headphone earcups has problems such as labor-consuming, easy-to-damage earcups and high misjudgment rates. Especially when using dual-channel simulated ear testing, the earcups need to be repeatedly assembled and disassembled, resulting in damage to the earcups and ear shells, and the test results are inaccurate.

Method used

A headphone testing mechanism is designed, using simulated ears and positioning fixtures, and the upper mold of the fixture and the lower mold of the fixture are formed, combining the speaker positioning groove and the limiting part to achieve separate verification of the ear cuffs, and using mono simulated ears to test the acoustic curve of the ear cuffs to avoid assembly and disassembly of the ear cuffs and the earclips.

Benefits of technology

It improves detection efficiency, reduces retest rate and test error, reduces equipment costs, protects the integrity of earcups and headphones, and ensures the yield of the acoustic test of the finished headphones.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an earphone testing mechanism, which comprises an artificial ear and a positioning jig, wherein a connecting part is arranged on the artificial ear; the positioning jig is detachably arranged on the artificial ear; the positioning jig comprises an upper jig die and a lower jig die, and the upper jig die and the lower jig die are oppositely arranged up and down so as to define a placement position for mounting an earcap; one of the upper jig die and the lower jig die is provided with a horn positioning groove and a first limiting part; the loudspeaker positioning groove penetrates through the placement position; a connecting hole and a second limiting part are arranged on the other side; the connecting hole is adaptively positioned on the connecting part, so that the placement position, the connecting hole and the connecting part are communicated, and the earcap is optimized to be used as a part for independent verification, so that compared with the traditional dual-track simulated ear detection, the test result is more accurate in the aspects of test mode, difficulty degree and timeliness; and the retest rate and the test error can be reduced.
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Description

Technical Field

[0001] The utility model relates to the field of earphone testing technology, in particular to an earphone testing mechanism. Background Art

[0002] In addition to providing greater comfort, headphones also improve sound quality. Padded earmuffs seal the ear canal, enhancing bass while absorbing high frequencies for a more balanced sound. The damping effect also changes the vibration characteristics of the speaker diaphragm, improving the quality of mid- and low-frequency sound. Headphone earmuffs generally come in two configurations: one that fits directly against the ear and presses against it, called an earpad, and is used on open ear shells; the other seals the earmuffs against the outside world.

[0003] Earmuffs are usually composed of earmuff brackets, earpad sponges, inner pads, inner leather, outer leather and dustproof nets. Earmuffs are used with headphones. The shape, structure and material of the earmuffs will directly affect the wearing comfort and sound quality of the headphones. Due to the wide variety of materials that make up the earmuffs, such as leather, sponges, EVA, velvet, etc., which are basically difficult to use with precise size, there is a large deviation in the overall consistency of the finished earmuffs. In addition to the impact on size, hardness, fit and comfort, the biggest impact is undoubtedly the acoustic performance. The acoustic performance is mainly based on the sound quality of the headphones, which is specifically expressed in the frequency response curve. Compared with in-ear headphones, Compared with headphone and earbud headphones, the frequency response curve of headphones generally has more complex peaks and valleys. The reason is that the earmuffs of headphones generally have a relatively large front cavity. Above 2kHz or 3kHz, the front cavity cannot be described by specific parameters. The interior of the cavity, as a three-dimensional space, will produce standing wave resonance, causing the high-frequency frequency response curve to show more peaks and valleys. The softness of the earmuffs affects the fit of the headphones to the face after wearing and the amount of air leakage, and also plays a crucial role in the low-frequency height of the curve. These many factors cause various problems with the consistency of the frequency response curve of headphones, and earmuffs have always been recognized by the industry as the bottleneck component that has the greatest impact on the consistency of headphone acoustics in mass production.

[0004] In the existing technology, testing the consistency of earmuff materials and ensuring the consistency of the frequency response curve of the assembled headphones has always been a technical topic that everyone has been thinking about and exploring. The most common method currently is to use finished headphones, replace the earmuffs to test the curve, and make judgments. The test includes the following steps:

[0005] 1. Take a pair of good quality headphones that come with the headset and install the gold sample earmuffs;

[0006] 2. Use acoustic testing equipment to measure the frequency response curve of the gold sample earmuff headphones and use it as the gold sample curve. Then use the gold sample curve as the basic curve and deviate up and down to get the upper and lower limit control curves.

[0007] 3. Remove the gold sample earmuffs from the earphones;

[0008] 4. Take the earmuffs that need to be tested and install them on this headset;

[0009] 5. Carry out curve test again. If the curve is within the upper and lower limit control curves, the earmuffs can be judged to be qualified.

[0010] In summary, using the same prototype and hardware benchmark, using the upper and lower limit curves of the gold sample earmuff offset, setting the standard curve range for control, and testing and comparing whether the incoming earmuffs meet the requirements of the curve frame by replacing the incoming earmuffs can effectively control the acoustic consistency issues of the incoming earmuffs; however, there are also many disadvantages, as follows:

[0011] 1. During testing, the earmuffs and earphones need to be assembled and disassembled, which is very time-consuming and inconvenient.

[0012] 2. Earmuffs are designed for comfort, and their outer covers are often made of leather or soft materials, while the earphone shells are made of plastic. Repeated installation and removal can easily cause damage and deformation of the earmuff outer cover, as well as damage to the ear shell, resulting in a poor appearance.

[0013] 3. When testing finished earphones, the overall clamping force of the earphones must be considered. The stability of the clamping force must be ensured to ensure that the earmuffs fit well. Only then can the low-frequency curve test be stable. Therefore, the test equipment generally uses expensive dual-channel artificial ears.

[0014] 4. If Figure 5 The figure shows the structure of the two-channel simulated ear test used in traditional technology. The two-channel simulated ear test (the test principle of two-channel headphones, taking the Gras45CA two-channel simulated ear as an example, 45CA has a built-in microphone on each side, and a circular flat plate on the outside. The headphone is placed centered on the 45CA bracket. According to the clamping force on both sides of the headphone, the earmuffs fit tightly on the circular flat surface. Note that the earmuffs need to be concentric with the simulated ear microphone. The 45CA is connected to the acoustic device. When the headphone makes a sound, the microphone will receive the sound signal and input it into the device, eventually generating an acoustic frequency response curve.) has a high operation misjudgment rate. The earmuffs need to be concentric with the simulated ear. If they are placed off-center, it will affect the test results. Therefore, during the test, the tester will often test multiple times to confirm whether the headphone is placed correctly.

[0015] Therefore, it is necessary to study a new technical solution to solve the above problems. Utility Model Content

[0016] In view of this, the present invention addresses the deficiencies in the prior art and its main purpose is to provide an earphone testing mechanism. The structure of the positioning fixture is optimized to use the earmuff as a separate component for verification, effectively solving the problem in traditional technology of using dual-channel simulated ear testing, where the earmuff and earphone need to be assembled and disassembled, which is time-consuming and easily causes damage and deformation to the outer skin of the earmuff, as well as a high rate of misjudgment in operation.

[0017] To achieve the above purpose, the present invention adopts the following technical solutions:

[0018] A headphone testing mechanism includes a simulated ear and a positioning jig; wherein: the simulated ear is provided with a connecting portion for connecting to the positioning jig; the positioning jig is detachably provided on the simulated ear; the positioning jig includes an upper jig mold and a lower jig mold, the upper jig mold and the lower jig mold being arranged relative to each other in an upper and lower position to form a placement position for installing an earmuff;

[0019] One of the jig upper mold and the jig lower mold is provided with a speaker positioning groove for speaker installation and a first limiting portion for preventing the earmuff from loosening; the speaker positioning groove passes through the placement position;

[0020] The other is provided with a connecting hole for assembling and positioning with the connecting part and a second limiting part for preventing the earmuff from loosening; the connecting hole is adapted to be positioned on the connecting part so that the placement position, the connecting hole and the connecting part are connected.

[0021] As a preferred solution, the speaker positioning groove and the first limiting portion are arranged on the upper mold of the jig, and the connecting hole and the second limiting portion are arranged on the lower mold of the jig.

[0022] As a preferred solution, the upper surface of the upper mold of the jig is further provided with a mass block for increasing the clamping force, and the mass block is provided with an avoidance position for allowing the upper end of the speaker to be exposed.

[0023] As a preferred solution, the mass block is made of metal or wood.

[0024] As a preferred solution, the mass block is bonded to the upper surface of the upper mold of the jig.

[0025] As a preferred solution, the upper mold of the jig includes a first transverse portion, and the speaker positioning groove passes through the upper and lower ends of the first transverse portion, wherein the first limiting portion extends downward from both sides of the first transverse portion to form a first half groove.

[0026] As a preferred solution, the upper mold of the jig includes a second transverse portion, and the connecting hole passes through the upper and lower ends of the second transverse portion, wherein the second limiting portion extends upward from both sides of the second transverse portion to form a second half groove.

[0027] Compared with the prior art, the present invention has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical solution that it mainly adopts the structural design of the positioning jig, and presses the earmuff by the jig upper mold and the jig lower mold to form a positioning. In this way, a single-channel simulated ear test method is adopted during the test, which is conducive to the positioning of the jig and the clamping force of the virtual earphone, and the acoustic curve of the earmuff is tested by the speaker, thereby optimizing the earmuff as a separately verified component. In terms of testing method, difficulty, and timeliness, it has more accurate test results than the traditional two-channel simulated ear test, so that the retest rate and test error can be reduced; the acoustic incoming material inspection of the earmuff before assembly is guaranteed, and the yield rate of the acoustic test of the finished product of the mass production of earphones is improved; in particular, its structural design is ingenious and reasonable, the operation is simple, and it is easy to use, which improves the test efficiency, reduces the cost of the testing equipment, meets the use needs of users, and avoids the repeated assembly and disassembly of the earphone shell and the earmuff, which easily causes damage and deformation of the earmuff skin and damage to the ear shell, including the problem of poor appearance;

[0028] Finally, the first and second limiting parts are designed to accommodate the volume change of the earmuff after being squeezed, and to prevent the earmuff from moving and affecting the accuracy of the test.

[0029] In order to more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 It is a cross-sectional view of an embodiment of the present utility model;

[0031] Figure 2 This is an exploded view of an embodiment of the present utility model;

[0032] Figure 3 This is a structural diagram of a positioning fixture according to an embodiment of the present utility model;

[0033] Figure 4 This is a schematic diagram of a simulation test curve of an embodiment of the present utility model;

[0034] Figure 5 It is a structural diagram of a binaural artificial ear used in traditional technology.

[0035] Description of the accompanying drawings:

[0036] 10. Artificial ear 11. Connecting part

[0037] 20. Positioning fixture 21. Fixture upper mold

[0038] 22. Lower mold of the jig 23. Placement position

[0039] 211, speaker positioning groove 212, first limiting part

[0040] 213. First transverse portion

[0041] 221, connecting hole 222, second limiting portion

[0042] 223, second transverse portion 24, mass block

[0043] 241, avoidance position 30, horn

[0044] 40. Earmuffs. DETAILED DESCRIPTION

[0045] Please refer to Figures 1 to 5 As shown, it shows the specific structure of an embodiment of the present utility model.

[0046] In the description of the present invention, it should be noted that directional words, such as the terms "up", "down", "front", "back", "left", "right", etc., indicating directions and positional relationships are based on the directions or positional relationships shown in the drawings or during normal wear and use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and cannot be understood as limiting the specific protection scope of the present invention.

[0047] An earphone testing mechanism includes an artificial ear 10 and a positioning fixture 20.

[0048] Wherein: the artificial ear 10 is provided with a connecting portion 11 for connecting with the positioning fixture 20;

[0049] The positioning jig 20 is detachably mounted on the artificial ear 10 ; the positioning jig 20 includes an upper jig mold 21 and a lower jig mold 22 , which are disposed vertically opposite to each other to form a placement position 23 for mounting the earmuff 40 ;

[0050] One of the jig upper mold 21 and the jig lower mold 22 is provided with a speaker positioning groove 211 for mounting the speaker 30 and a first limiting portion 212 for preventing the earmuff 40 from loosening; the speaker positioning groove 211 passes through the placement position 23;

[0051] The other side is provided with a connecting hole 221 for assembling and positioning with the connecting part 11 and a second limiting part 222 for preventing the earmuff 40 from loosening; the connecting hole 221 is adapted to be positioned on the connecting part 11, so that the placement position 23, the connecting hole 221 and the connecting part 11 are connected.

[0052] Preferably, the speaker positioning groove 211 and the first limiting portion 212 are provided on the jig upper mold 21, and the connecting hole 221 and the second limiting portion 222 are provided on the jig lower mold 22. Preferably, the jig upper mold 21 includes a first transverse portion 213, and the speaker positioning groove 211 passes through the upper and lower ends of the first transverse portion 213, wherein the first limiting portion 212 extends downward from both sides of the first transverse portion 213 to form a first half groove;

[0053] Preferably, the jig upper mold 21 includes a second transverse portion 223, and the connecting hole 221 passes through the upper and lower ends of the second transverse portion 223, wherein the second limiting portions 222 extend upward from both sides of the second transverse portion 223 to form a second half groove;

[0054] Preferably, the upper surface of the jig upper mold 21 is further provided with a mass block 24 for increasing the clamping force. The mass block 24 is provided with a relief position 241 for exposing the upper end of the speaker 30. Preferably, the mass block 24 is made of metal or wood. Preferably, the mass block 24 is bonded to the upper surface of the jig upper mold 21.

[0055] In this embodiment, based on the required headphone clamping force, the weight of the speaker 30 and the jig upper mold 21 is subtracted from the N to Kg. The remaining weight is then used to create a ring-shaped mass block 24, which is concentrically glued to the top of the jig upper mold 21. Mass block 24 can be made of metal, wood, or other materials. For example, the clamping force requirement for a headphone with a 30mm speaker 30 is 5N, which translates to a weight of 0.51kg. The speaker 30 and jig upper mold 21 weigh a total of 0.31kg, resulting in 0.51kg - 0.31kg = 0.2kg, where 0.2kg is the weight of mass block 24. This creates a complete jig upper mold 21 assembly, with a weight close to the headphone clamping force, equivalent to the effect of a virtual headphone clamping force.

[0056] like Figure 4 As shown, it shows the test curve usage diagram of this embodiment:

[0057] The leads of speaker 30 are connected to the acoustic test system Soundcheck in a conventional test manner. When an audio signal is input to speaker 30, speaker 30 emits sound, and the IEC-318 microphone receives the sound signal, and the frequency response curve appears on the Soundcheck test interface. This is because the virtual clamping force of the jig upper mold 21 and jig lower mold 22 is equivalent to the stress state of headphones wearing artificial ears 1045CA;

[0058] The following details the steps for testing using a single-channel artificial ear 10 (IEC-318):

[0059] S1. Design a test jig upper mold 21 and a jig lower mold 22 for positioning the earmuff 40 according to the size of the earmuff 40.

[0060] S2. The inner diameters of the jig upper mold 21 and the jig lower mold 22 are designed according to the shape and size of the earmuff 40. The size of the earmuff 40 is loosely fitted, and the inner diameter is at least 0.5 mm larger than the outer diameter of the earmuff 40, so that the earmuff 40 can be placed flat on the jig upper mold 21 and the jig lower mold 22 without interference;

[0061] S3. Use the first limiting portion 212 and the second limiting portion 222 on the jig upper mold 21 and the jig lower mold 22 to accommodate the volume change of the earmuff 40 after being squeezed and prevent the earmuff 40 from moving or being intercepted;

[0062] S4. A concentric through hole is opened in the upper mold 21 of the jig, and a positioning groove 211 of the speaker of the headset is designed on the back of the concentric through hole. For example, if the outer diameter of the speaker 30 is 30 mm, the through hole can be designed to be 28 mm and the inner diameter of the positioning groove is 30.1 mm. The through hole of the lower mold 22 of the jig is designed to be 25.6 mm in order to assemble the outer diameter of the artificial ear 10.

[0063] S5, machining the upper die 21 of the jig, assembling the speaker 30, adding the mass block 24, and imagining the earphone clamping force;

[0064] S6. Use the original speaker 30 of this headset and solder two leads to it. Install the speaker 30 into the speaker 30 positioning groove of the jig upper mold 21 and apply a layer of glue to secure it. Based on the required headphone clamping force, convert N to Kg, subtract the weight of the speaker 30 and the jig upper mold 21, and use the remaining weight to create a ring-shaped mass block 24. Glue the remaining mass block concentrically to the top of the jig upper mold 21. Mass block 24 can be made of metal, wood, or other materials.

[0065] For example, the clamping force for a 30mm speaker (30mm headphone) is specified to be 5N, which translates to a weight of 0.51kg. The speaker 30 and the jig upper mold 21 weigh a total of 0.31kg, resulting in 0.51kg - 0.31kg = 0.2kg, where 0.2kg is the weight of mass 24. This gives the complete jig upper mold 21 assembly, and its weight is close to the headphone clamping force, creating a virtual headphone clamping force.

[0066] The general assembly process of this embodiment is described in detail below:

[0067] S1. The lower die 22 of the fixture is concentrically placed on the IEC-318 artificial ear 10.

[0068] S2. Place the earmuff 40 to be tested concentrically on the lower mold 22 of the jig and ensure that it is placed stably.

[0069] S3. Take the upper mold 21 assembly of the jig and press it concentrically onto the earmuff 40.

[0070] The design focus of the present invention is that it mainly adopts the structural design of the positioning jig, and the jig upper mold and the jig lower mold are used to press the earmuff to form a position. In this way, a single-channel simulated ear test method is adopted during the test, which is conducive to the positioning of the jig and the clamping force of the virtual earphone. The acoustic curve of the earmuff is tested by the sound of the speaker, thereby optimizing the earmuff as a separately verified component. In terms of testing method, difficulty, and timeliness, it has more accurate test results than the traditional two-channel simulated ear test, so that the retest rate and test error can be reduced; the acoustic material inspection of the earmuff before assembly is guaranteed, and the yield rate of the acoustic test of the finished product of the mass production of earphones is improved; in particular, the structural design is ingenious and reasonable, the operation is simple, and it is easy to use, which improves the test efficiency, reduces the cost of the testing equipment, meets the use needs of users, and avoids the repeated assembly and disassembly of the earphone shell and the earmuff, which easily causes damage and deformation of the earmuff skin and damage to the ear shell, including the problem of poor appearance;

[0071] Finally, the first and second limiting parts are designed to accommodate the volume change of the earmuff after being squeezed, and to prevent the earmuff from moving and affecting the accuracy of the test.

[0072] The above description is merely a preferred embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any minor modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A headphone testing mechanism, comprising an artificial ear and a positioning fixture; wherein: The artificial ear is provided with a connection portion for connecting to a positioning jig; the characteristic is that the positioning jig is detachably provided on the artificial ear; The positioning jig includes an upper jig mold and a lower jig mold, and the upper jig mold and the lower jig mold are arranged relative to each other up and down to form a placement position for installing the earmuff; One of the jig upper mold and the jig lower mold is provided with a speaker positioning groove for speaker installation and a first limiting portion for preventing the earmuff from loosening; the speaker positioning groove passes through the placement position; The other is provided with a connecting hole for assembling and positioning with the connecting part and a second limiting part for preventing the earmuff from loosening; the connecting hole is adapted to be positioned on the connecting part so that the placement position, the connecting hole and the connecting part are connected.

2. The headphone testing mechanism according to claim 1, characterized in that: The speaker positioning groove and the first limiting portion are arranged on the upper mold of the jig, and the connecting hole and the second limiting portion are arranged on the lower mold of the jig.

3. The headphone testing mechanism according to claim 1, wherein: The upper surface of the upper die of the jig is also provided with a mass block for increasing the clamping force, and the mass block is provided with an avoidance position for allowing the upper end of the speaker to be exposed.

4. The headphone testing mechanism according to claim 3, characterized in that: The mass block is made of metal or wood.

5. The headphone testing mechanism according to claim 3, characterized in that: The mass block is bonded to the upper surface of the upper die of the jig.

6. The headphone testing mechanism according to claim 1, characterized in that: The jig upper mold includes a first transverse portion, and the speaker positioning groove passes through the upper and lower ends of the first transverse portion, wherein the first limiting portion extends downward from both sides of the first transverse portion to form a first half groove.

7. The headphone testing mechanism according to claim 1, characterized in that: The jig upper mold includes a second transverse portion, and the connecting hole passes through the upper and lower ends of the second transverse portion, wherein the second limiting portion extends upward from both sides of the second transverse portion to form a second half groove.