Glue outlet device of semiconductor spin coater

Abstract

The utility model belongs to the technical field of semiconductor manufacturing, and provides a semiconductor spin coater glue discharging device which comprises a control unit, an electromagnetic valve, a gas storage device and a diaphragm pump body, the electromagnetic valve is electrically connected with the control unit, and the control unit controls on-off of the electromagnetic valve; the gas storage device is connected with the electromagnetic valve; the diaphragm pump body is connected with the gas storage device; when the electromagnetic valve is switched on, the air storage device supplies air to the diaphragm pump body, and a glue outlet of the pump body outputs a glue solution; and when the electromagnetic valve is switched off, the reset spring of the diaphragm pump body is reset, and the glue solution is sucked from the glue inlet of the diaphragm pump body. A traditional pump body is replaced by the diaphragm pump body, the diaphragm of the diaphragm pump body is isolated from glue liquid, glue liquid leakage is avoided, and the problem that an existing traditional pump body is prone to being abraded and blocked after being used for a long time can be solved. Meanwhile, the electromagnetic valve is arranged at the output end of the diaphragm pump body, and accurate control over glue conveying can be achieved by controlling the opening and closing states of the electromagnetic valve through the control unit.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a glue discharging device for a semiconductor glue spreader. Background Art

[0002] Spread coater pumps are key equipment used to evenly coat photoresist on wafer surfaces during semiconductor manufacturing. As technology advances and process requirements increase, semiconductor device sizes are shrinking, and the photolithography process places increasingly stringent requirements on the uniformity and precision of the resist layer.

[0003] Different processes may require different types of photoresists, each with significantly varying viscosities and chemical properties. Traditional spin coater pumps may not meet these stringent requirements. There is a growing demand for spin coater pumps that can handle a wide range of photoresist materials and enhance the versatility and adaptability of the equipment. Bubbles and impurities in photoresist can severely impact coating uniformity and quality. Therefore, optimizing the pump's fluid dynamics to minimize bubble formation and impurity adsorption has become a key approach to improving photolithography process quality.

[0004] Traditional glue pumps can be prone to wear and clogging over time, leading to frequent equipment downtime and maintenance. Furthermore, with rising environmental and safety standards, the modification of glue pumps for glue spreaders must also consider reducing harmful gas emissions and lowering energy consumption. Utility Model Content

[0005] In view of the defects in the prior art, the utility model provides a glue discharging device for a semiconductor glue spreader to solve the problem that the current traditional glue pump may be easily worn and blocked during long-term use.

[0006] The utility model provides a semiconductor glue discharging device for a glue spreader, comprising:

[0007] control unit;

[0008] A solenoid valve electrically connected to the control unit and controlled on and off by the control unit;

[0009] an air storage device connected to the solenoid valve;

[0010] The diaphragm pump body is connected to the air storage device; when the solenoid valve is turned on, the air storage device supplies air to the diaphragm pump body, and the glue outlet of the pump body outputs glue; when the solenoid valve is turned off, the return spring of the diaphragm pump body is reset, and the glue is sucked into the glue inlet of the diaphragm pump body.

[0011] It can be seen from the above technical solution that the semiconductor glue dispensing machine glue dispensing device provided by the utility model adopts a diaphragm pump body instead of a traditional pump body, which can solve the problem that the current traditional pump body is prone to wear and blockage during long-term use; at the same time, a solenoid valve is configured at the output end of the glue pump, and precise control of the glue liquid delivery is achieved by controlling the opening and closing state of the solenoid valve.

[0012] Optionally, the control unit includes a power supply circuit, which includes a power supply chip and a voltage regulator. The V+ pin of the power supply chip outputs +24V and is connected to the input end of the voltage regulator, and the output end of the voltage regulator outputs Vcc.

[0013] Optionally, the control unit includes a control circuit and a drive circuit, and the control circuit includes a single chip microcomputer, an optocoupler and a transistor.

[0014] When the single chip microcomputer detects the glue spraying signal from the glue spreader, it outputs a high level to control the optical coupler and the transistor to be turned on, and the driving circuit is turned on.

[0015] Optionally, the driving circuit includes a Darlington array, and the Darlington array is used to drive the solenoid valve;

[0016] The input end of the Darlington array is connected to the output end of the optocoupler;

[0017] When the transistor is turned on, the COM pin of the Darlington array is grounded; when the transistor is turned off, the COM pin of the Darlington array is suspended.

[0018] Optionally, the transistor is an NPN transistor.

[0019] The collector of the NPN transistor is connected to the +24V of the power chip, the emitter of the NPN transistor is connected to the input end of the voltage regulator, and the collector of the NPN transistor is connected to the +24V of the power chip through a current limiting resistor.

[0020] Optionally, the model of the single chip microcomputer is STC15F104W.

[0021] By adopting the above technical solution, this application has the following technical effects:

[0022] (1) The utility model adopts a diaphragm pump body to replace the traditional pump body, which can solve the problem that the traditional pump body is prone to wear and clogging after long-term use; the diaphragm pump body is safer because it uses pneumatic drive and no electric sparks are generated; the diaphragm pump body uses compressed air as a power source, and has a high energy conversion efficiency, which can save energy under appropriate conditions;

[0023] (2) The utility model configures a solenoid valve at the output end of the glue pump, and the precise control of the glue liquid delivery can be achieved by controlling the opening and closing state of the solenoid valve by the control unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly describes the drawings required for the specific embodiments or the description of the prior art. Similar elements or parts are generally identified by similar reference numerals throughout the drawings. Elements or parts in the drawings are not necessarily drawn to scale.

[0025] Figure 1 A schematic diagram of a dispensing device for a semiconductor spin coater provided by an embodiment of the present invention;

[0026] Figure 2 A schematic diagram of a diaphragm pump body provided in an embodiment of the present utility model;

[0027] Figure 3 A schematic diagram of a power supply circuit provided in an embodiment of the present utility model;

[0028] Figure 4 This is a schematic diagram of the control circuit and drive circuit provided in an embodiment of the present utility model.

[0029] Reference numerals:

[0030] 1-Control unit; 2-Solenoid valve; 3-Air storage device; 4-Diaphragm pump body. DETAILED DESCRIPTION

[0031] The following embodiments of the technical solution of the present invention are described in detail with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention and are therefore only examples and are not intended to limit the scope of protection of the present invention.

[0032] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in this application should have the common meanings understood by those skilled in the art to which this utility model belongs.

[0033] like Figure 1 As shown, the present embodiment provides a glue discharging device for a semiconductor glue spreader, comprising: a control unit, a solenoid valve 2, an air storage device 3 and a diaphragm pump body 4, wherein the solenoid valve 2 and the control unit are electrically connected, and the control unit controls the on and off; the air storage device 3 and the solenoid valve 2 are connected; the diaphragm pump body 4 and the air storage device 3 are connected; when the solenoid valve 2 is turned on, the air storage device 3 supplies air to the diaphragm pump body 4, and the glue outlet of the pump body outputs glue liquid; when the solenoid valve 2 is turned off, the reset spring of the diaphragm pump body 4 is reset, and the glue liquid is sucked in from the glue inlet of the diaphragm pump body 4.

[0034] This embodiment adopts a diaphragm pump body 4 to replace the traditional pump body. The diaphragm of the diaphragm pump body 4 is isolated from the glue liquid, and the glue liquid will not leak. It can solve the problem that the current traditional pump body is prone to wear and blockage after long-term use; at the same time, a solenoid valve 2 is configured at the output end of the diaphragm pump body 4, and the opening and closing state of the solenoid valve 2 is controlled by the control unit to achieve precise control of the glue liquid delivery.

[0035] The principle of diaphragm pump is as follows Figure 2 As shown, it includes a diaphragm, which is arranged inside the pump body to drive the flow of glue. The outside of the diaphragm pump has three ports, namely the air supply port, the suction port and the output port. In this embodiment, the air supply port is connected to the air piping (using a 6mm outer diameter PU tube), and the suction port and the output port are connected to the fluid conveying piping (using a 6mm outer diameter PFA tube).

[0036] Before use, the pilot air pressure must be set within the range of 0.3-0.5 MPa. When the control unit issues a +24V signal, solenoid valve 2 is energized (ON), supplying air to the drive chamber, causing the diaphragm to move to the left. This allows the adhesive in the pump chamber to be discharged from the output port through the upper check valve. When the control circuit issues a 0V signal, solenoid valve 2 is de-energized (OFF), allowing the air in the drive chamber to be exhausted to the exhaust port. The return spring's restoring force causes the diaphragm to shift to the right, allowing the adhesive in the intake port to be drawn into the pump chamber through the check valve. By repeatedly turning solenoid valve 2 ON and OFF, the adhesive is continuously suctioned and discharged, delivering the adhesive.

[0037] It should be noted that the viscosity of the glue is recommended to be lower than 1600CP.

[0038] The materials of the diaphragm pump body and pump membrane can be selected from corrosion-resistant materials. Using a diaphragm pump as a rubber pump has the following technical effects:

[0039] Since the diaphragm of the diaphragm pump is isolated from the glue liquid, there will be no glue leakage problem; it is pneumatically driven and no electric sparks are generated; it uses compressed air as the power source, the energy conversion efficiency is high, and energy can be saved under appropriate conditions; it has a simple structure, is easy to disassemble and maintain, and has low maintenance costs.

[0040] In this embodiment, the diaphragm pump body 4 adopts an SMC air-controlled diaphragm pump.

[0041] like Figure 3 As shown, the control unit includes a power supply circuit, which includes a power supply chip and a voltage regulator. The V+ pin of the power supply chip outputs +24V and is connected to the input end of the voltage regulator, and the output end of the voltage regulator outputs Vcc.

[0042] In one embodiment, Figure 4As shown, the control unit includes a control circuit and a drive circuit. The control circuit includes a single-chip microcomputer, an optocoupler and a transistor. When the single-chip microcomputer detects the glue-spraying signal of the glue spreader, it outputs a high level to control the optocoupler and the transistor to turn on, and the drive circuit is turned on.

[0043] The input end of the optocoupler obtains the glue output signal of the equipment through the terminal and the current limiting resistor. The output end of the optocoupler is also connected to the microcontroller. When the pin connected to the microcontroller and the optocoupler is high, the optocoupler is turned on. At this time, the base of the transistor also receives the control signal, and the transistor is turned on. At this time, the drive circuit is turned on, and the solenoid valve 2 is powered on and starts working.

[0044] Once the microcontroller detects the glue termination signal of the device again, the pin connected to the optocoupler outputs a low level, the optocoupler is not conducting, and the drive circuit is not conducting.

[0045] like Figure 4 As shown, the driving circuit includes a Darlington array, which is used to drive the solenoid valve 2; the input end of the Darlington array is connected to the output end of the optocoupler; when the transistor is turned on, the COM pin of the Darlington array is grounded; when the transistor is turned off, the COM pin of the Darlington array is left floating.

[0046] In this embodiment, the working principle of the control unit is:

[0047] When the microcontroller detects a glue-applying signal from the device, it outputs a high level, turning on the optocoupler's internal LED and the optocoupler's output. The Darlington array's input receives the signal. The base of the transistor also receives the control signal, turning on the transistor. The COM pin of the Darlington array is grounded, enabling the Darlington array. The Darlington array's output turns on, powering on solenoid valve 2 and commencing operation.

[0048] Once the microcontroller detects the device's glue termination signal again, it outputs a low level, turning off the optocoupler's internal LED and the optocoupler's output. This results in a loss of signal at the Darlington array input. The transistor's base loses signal, causing the transistor to cut off. The COM pin of the Darlington array floats, and the array stops operating. The Darlington array's output becomes non-conductive, disconnecting the power supply to solenoid valve 2 and causing it to cease operation.

[0049] A voltage regulator stabilizes the 24V input voltage to 5V, supplying the microcontroller and other 5V components. Optocouplers isolate the microcontroller's I / O pins, ensuring safe isolation between the control unit and the solenoid valve 2 circuit. A Darlington array drives solenoid valve 2, while transistors control its on / off switching. This circuit design is simple and ensures isolation between the microcontroller control section and the high-current drive section, improving circuit safety and reliability.

[0050] In one embodiment, the solenoid valve 2 is a 24V three-way solenoid valve.

[0051] In one embodiment, the transistor is an NPN transistor, the collector of the NPN transistor is connected to the +24V of the power chip, the emitter of the NPN transistor is connected to the input end of the voltage regulator, and the collector of the NPN transistor is connected to the +24V of the power chip through a current limiting resistor.

[0052] In one embodiment, the model of the single chip microcomputer (CPU) is STC15F104W, the model of the Darlington array is ULN2003, the model of the optocoupler is PC817, the model of the voltage regulator is 7805, and the model of the transistor is 9013.

[0053] In the specification of the present invention, a large number of specific details are described. However, it is understood that the embodiments of the present invention can be practiced without these specific details. In some instances, well-known methods, structures and techniques are not shown in detail so as not to obscure the understanding of this specification.

[0054] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention, and they should all be included in the scope of the claims and description of the present invention.

Claims

1. A semiconductor glue dispensing device, characterized in that: include: control unit; A solenoid valve electrically connected to the control unit and controlled on and off by the control unit; an air storage device connected to the solenoid valve; The diaphragm pump body is connected to the air storage device; when the solenoid valve is turned on, the air storage device supplies air to the diaphragm pump body, and the glue outlet of the pump body outputs glue; when the solenoid valve is turned off, the return spring of the diaphragm pump body is reset, and the glue is sucked into the glue inlet of the diaphragm pump body.

2. The semiconductor glue dispensing device according to claim 1, characterized in that: The control unit includes a power supply circuit, which includes a power supply chip and a voltage regulator. The V+ pin of the power supply chip outputs +24V and is connected to the input end of the voltage regulator, and the output end of the voltage regulator outputs Vcc.

3. The semiconductor glue discharging device according to claim 2, characterized in that: The control unit includes a control circuit and a drive circuit. The control circuit includes a single chip microcomputer, an optical coupler and a transistor. When the single chip microcomputer detects the glue spraying signal from the glue spreader, it outputs a high level to control the optical coupler and the transistor to be turned on, and the driving circuit is turned on.

4. The semiconductor glue discharging device according to claim 3, characterized in that: The driving circuit includes a Darlington array, and the Darlington array is used to drive the solenoid valve; The input end of the Darlington array is connected to the output end of the optocoupler; When the transistor is turned on, the COM pin of the Darlington array is grounded; when the transistor is turned off, the COM pin of the Darlington array is suspended.

5. The semiconductor glue discharging device according to claim 4, characterized in that: The transistor is an NPN transistor. The collector of the NPN transistor is connected to the +24V of the power chip, the emitter of the NPN transistor is connected to the input end of the voltage regulator, and the collector of the NPN transistor is connected to the +24V of the power chip through a current limiting resistor.

6. The semiconductor glue discharging device according to claim 3, characterized in that: The model of the single chip microcomputer is STC15F104W.

Images