Display module and display device

Abstract

The utility model provides a display module and a display device. The display module comprises a display panel; the flexible circuit board is located on the back side of the display panel; the flexible circuit board comprises a first part and a second part, and the first part and the second part are connected into a whole; the first part is electrically connected with the display panel, and the second part is electrically connected with a peripheral circuit board; the supporting layer is located between the flexible circuit board and the display panel; the first bonding layer is located between the supporting layer and the flexible circuit board, and the orthographic projection of the first bonding layer, the orthographic projection of the supporting layer and the orthographic projection of the first part on the display panel are at least partially overlapped; the orthographic projection of the first bonding layer and the orthographic projection of the second part on the display panel are not overlapped; the supporting layer further extends to be at least partially overlapped with the orthographic projection of the second part on the display panel. According to the display module, the die mark degree at the connecting position of the first part and the second part of the flexible circuit board is reduced, and the appearance effect of the display module is improved.

Description

Technical Field

[0001] The utility model belongs to the field of display, and particularly relates to a display module and a display device. Background Art

[0002] OLED (Organic Light-Emitting Diode) displays have attracted widespread attention due to their advantages such as self-luminescence, low power consumption, lightness, flexibility, brilliant colors, high contrast, and fast response rate. Utility Model Content

[0003] The utility model provides a display module, comprising: a display panel;

[0004] a flexible circuit board, located on the back side of the display panel;

[0005] The flexible circuit board includes a first portion and a second portion, the first portion and the second portion are connected as a whole; the first portion is electrically connected to the display panel, and the second portion is used to electrically connect to a peripheral circuit board;

[0006] a supporting layer, located between the flexible circuit board and the display panel;

[0007] a first adhesive layer, located between the supporting layer and the flexible circuit board, wherein the first adhesive layer at least partially overlaps with the supporting layer and an orthographic projection of the first portion on the display panel;

[0008] The first adhesive layer does not overlap with the orthographic projection of the second portion on the display panel; the supporting layer further extends to at least partially overlap with the orthographic projection of the second portion on the display panel.

[0009] In some embodiments, the support layer includes a first portion and a second portion, wherein the first portion and the second portion are connected as one body.

[0010] The orthographic projection of the first portion on the display panel is located within the orthographic projection area of ​​the first portion on the display panel, and the orthographic projection of the second portion on the display panel is located within the orthographic projection area of ​​the second portion on the display panel;

[0011] The width of an edge of the first portion connected to the second portion is greater than the width of an edge of the second portion connected to the first portion;

[0012] The orthographic projections of the first adhesive layer and the first portion on the display panel at least partially overlap.

[0013] In some embodiments, the orthographic projection area of ​​the first adhesive layer on the display panel is smaller than the orthographic projection area of ​​the first portion on the display panel;

[0014] The orthographic projection of an edge of the first adhesive layer close to the second portion on the display panel is located on a side of the orthographic projection of an edge of the first portion connected to the second portion on the display panel that is away from the orthographic projection of the second portion on the display panel;

[0015] One side edge of the first portion connected to the second portion includes a first section and a second section, and the first section is connected to the second section;

[0016] The first section is not connected to the second portion, and the second section is connected to the second portion;

[0017] The first section is arranged at both ends of the second section.

[0018] In some embodiments, an edge of the first adhesive layer adjacent to the second portion is parallel to an edge of the first portion connected to the second portion.

[0019] In some embodiments, the distance between a portion of the first adhesive layer corresponding to the second segment near the side edge of the second portion and the orthographic projection of the second segment on the display panel is greater than the distance between a portion of the first adhesive layer corresponding to the first segment near the side edge of the second portion and the orthographic projection of the first segment on the display panel.

[0020] In some embodiments, the distance between an edge of one side of the first adhesive layer close to the second portion and an orthographic projection of the first segment on the display panel is in a range of 0.1 to 2 mm;

[0021] A distance between an orthographic projection of an edge of the first adhesive layer close to the second portion and an edge of the second portion away from the first portion on the display panel is in a range of 2 to 6 mm.

[0022] In some embodiments, a distance between a portion of the first adhesive layer corresponding to the first segment and a side edge of the second portion close to the first segment and an orthographic projection of the first segment on the display panel is in a range of 0.1 to 0.3 mm;

[0023] The distance between the orthographic projection of a portion of the first adhesive layer corresponding to the second segment close to one side edge of the second portion and one side edge of the second portion away from the first portion on the display panel is 4 to 8 mm.

[0024] In some embodiments, the first portion includes an electrical component;

[0025] The first adhesive layer at least partially overlaps with the support layer and the orthographic projection of the electrical component on the display panel.

[0026] In some embodiments, the second portion has a bending region,

[0027] The display module further includes a first buffer layer located between the second portion and the support layer, wherein the first buffer layer and the orthographic projection of the bending area on the display panel at least partially overlap;

[0028] The first buffer layer is connected to the second portion.

[0029] In some embodiments, the thickness of the first buffer layer is less than the thickness of the first bonding layer;

[0030] Orthographic projections of the first buffer layer and the first adhesive layer on the display panel are spaced apart from each other.

[0031] In some embodiments, a second buffer layer is further included, located between the second portion and the support layer, wherein the orthographic projection of the second buffer layer on the display panel is located within the orthographic projection area of ​​the second portion on the display panel.

[0032] The second buffer layer is connected to the second portion.

[0033] In some embodiments, the thickness of the second buffer layer is less than the thickness of the first bonding layer;

[0034] Orthographic projections of the second buffer layer and the first adhesive layer on the display panel are spaced apart from each other.

[0035] In some embodiments, the orthographic projections of the first buffer layer and the second buffer layer on the display panel at least partially overlap;

[0036] The sum of the thicknesses of the first buffer layer and the second buffer layer is less than or equal to the thickness of the first bonding layer.

[0037] In some embodiments, the bending zone is located at an end of the second portion away from the first portion, and the orthographic projections of the bending zone and the second portion on the display panel do not overlap;

[0038] The display module further includes a third buffer layer located on a side of the flexible circuit board facing away from the display panel and located at a bending starting point of the bending zone;

[0039] The orthographic projections of the third buffer layer and the first buffer layer on the display panel at least partially overlap;

[0040] The third buffer layer is connected to the second portion.

[0041] The utility model also provides a display device, comprising the above-mentioned display module.

[0042] In some embodiments, the display module further includes a peripheral circuit board located on a side of the flexible circuit board facing away from the display panel;

[0043] The bending area of ​​the second portion of the display module is bent toward the side of the flexible circuit board away from the display panel to form a U-shaped groove.

[0044] The second portion includes a connector located at an end of the bending region, the connector being connected to the peripheral circuit board;

[0045] The display device further includes a middle frame located on a side of the peripheral circuit board facing away from the display module, and a portion of the structure of the middle frame is located outside the bottom of the U-shaped groove;

[0046] There is a gap between the middle frame, the U-shaped groove and the display panel.

[0047] In some embodiments, a battery is further included, located on a side of the flexible circuit board facing away from the display panel, and an end of the battery away from the first portion of the flexible circuit board is located in the U-shaped groove formed by the bending area of ​​the second portion.

[0048] An edge of a side of the battery away from the first portion overlaps with an orthographic projection of the third buffer layer in the display module on the display panel.

[0049] The beneficial effects of the present invention are as follows: the display module provided by the present invention makes the orthographic projections of the first adhesive layer and the second part on the display panel not overlap, and the supporting layer also extends to at least partially overlap with the orthographic projection of the second part on the display panel, so that the orthographic projection of the side edge of the first adhesive layer close to the second part on the display panel corresponds to the middle area of ​​the orthographic projection of the supporting layer on the display panel. In this way, when the second part is pulled and bent, the pulling and bending extrusion force acting at the connection position between the second part and the first part will be transmitted to the middle area of ​​the supporting layer through the side edge of the first adhesive layer close to the second part. The middle area of ​​the supporting layer can disperse and conduct the pulling and bending extrusion force, so that the pulling and bending extrusion force acting on the display panel will not be concentrated at one point, but will be evenly distributed on the display panel, thereby effectively reducing the degree of mold printing of the display module at the connection position of the first and second parts of the flexible circuit board, especially reducing the degree of point-shaped mold printing of the display module at the connection position of the first and second parts of the flexible circuit board, thereby improving the appearance effect of the display module.

[0050] The display device provided by the present invention, by adopting the above-mentioned display module, can improve or avoid the mold print on the display side caused by the assembly and testing process of the display device, thereby improving the appearance of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1a This is a schematic top view of the back side of a flexible circuit board bonded to a display panel in the related art;

[0052] Figure 1b Schematic top view of another structure of the back side of a flexible circuit board bonded to a display panel in the related art;

[0053] Figure 1c A schematic diagram of stress transfer when the flexible circuit board on the back side of a display panel is pulled and bent in the related art;

[0054] Figure 1d A schematic diagram of the collision between the flexible circuit board, display panel, and middle frame assembly of a display module during a whole-machine fatigue test in the related art;

[0055] Figure 2a This is a schematic top view of a structure of the side of the flexible circuit board attached to the display panel in the display module according to an embodiment of the present invention;

[0056] Figure 2b This is a schematic top view of another structure of the side of the flexible circuit board in the display module that is bonded to the display panel according to an embodiment of the present invention;

[0057] Figure 2c This is a schematic top view of another structure of the side of the flexible circuit board in the display module in accordance with an embodiment of the present invention that is bonded to the display panel;

[0058] Figure 2d For the Figure 2a Schematic diagram of the structural section along the AA' section line;

[0059] Figure 2e Schematic diagram of stress transmission when the flexible circuit board on the back side of the display panel is pulled and bent in an embodiment of the present invention;

[0060] Figure 2f This is a schematic top view of another structure of the side of the flexible circuit board in the display module in accordance with an embodiment of the present invention that is bonded to the display panel;

[0061] Figure 2g for Figure 2f A schematic side view of the flexible circuit board being bent toward a side away from the display panel;

[0062] Figure 3a for Figure 2aA schematic side view of the flexible circuit board being bent toward a side away from the display panel;

[0063] Figure 3b This is a schematic top view of another structure of the side of the flexible circuit board in the display module in accordance with an embodiment of the present invention that is bonded to the display panel;

[0064] Figure 3c for Figure 3b A schematic side view of the flexible circuit board being bent toward a side away from the display panel;

[0065] Figure 4a This is a side view schematic diagram of a display device in an embodiment of the present utility model;

[0066] Figure 4b It is a side view schematic diagram of another display device in an embodiment of the present invention. DETAILED DESCRIPTION

[0067] In order to enable those skilled in the art to better understand the technical solutions of the embodiments of the present disclosure, a display module and a display device provided by the embodiments of the present disclosure are further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0068] The embodiments of the present disclosure will be described more fully below with reference to the accompanying drawings, but the illustrated embodiments may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully enable those skilled in the art to understand the scope of this disclosure.

[0069] The embodiments of the present disclosure are not limited to the embodiments shown in the drawings, but include modifications of the configurations formed based on the manufacturing process. Therefore, the regions illustrated in the drawings are schematic in nature, and the shapes of the regions shown in the drawings illustrate specific shapes of the regions, but are not intended to be limiting.

[0070] In the related art, an OLED display module includes a display panel and a flexible circuit board. The flexible circuit board is arranged on the back side of the display panel, and one end of the flexible circuit board is bound and connected to the display panel, and the other end is bound and connected to the mainboard of the whole device.

[0071] The flexible circuit board includes a device area, in which electrical components are arranged. A reinforcing steel sheet is provided on the back of the device area (i.e., the side of the flexible circuit board close to the display panel). The reasons for providing the reinforcing steel sheet are: first, to support the circuit board during the punching process, improve the flatness of the circuit board, and ensure the reliability of the punching (prevent cold solder joints and improve the punching yield); second, after the solder is brushed on the circuit board and the device is glued (thermosetting glue) during the punching process, the solder paste and the thermosetting glue gather and shrink, which can easily lead to a deterioration in the flatness of the circuit board, so that the dotted mold in the display area corresponding to the device area is aggravated after the flexible circuit board is attached to the display panel.

[0072] Specifically, the flexible circuit board used in the OLED display module needs to be designed with an end structure (i.e., the end that is connected to the mainboard of the whole machine). Figure 1a and Figure 1b , currently the output structure 20 of the flexible circuit board 2 is designed as a "neck", and the connector 220 is at the end of the "neck area". Due to the design of the overall architecture, the appearance of the output structure 20 is mainly divided into "short neck" and "long neck". The output structure 20 is bent to realize the snap connection between its connector 220 and the mainboard of the whole machine. For the "long neck" output structure 20, the neck area will pass under the battery compartment of the whole machine, bend at a position away from the device area on the flexible circuit board 2 and snap together with the mainboard of the whole machine; for the "short neck" output structure 20, the neck area will bend to the top of the device area of ​​the flexible circuit board 2 and snap together with the mainboard of the whole machine. Refer to Figure 1a and Figure 1b , the reinforcing steel sheet 11 is not arranged in the end structure area.

[0073] Reference Figure 1c In the current manufacturing process of OLED display modules, during the testing of OLED display modules, the end structure 20 of the flexible circuit board 2 needs to be bent and then fastened to the jig (instead of the whole machine motherboard); in the whole machine assembly process, the end structure 20 of the flexible circuit board 2 needs to be bent and then fastened to the whole machine motherboard; the above processes are all manual operations, which may cause the problem of excessive pulling on the root of the neck area, and for the "short neck" end structure 20, the bending starting point of the end structure 20 is located at the root of the neck area. In this way, the extrusion force during pulling and bending will be transmitted to the heat dissipation film 14 on the back side of the display panel 1 through the adhesive 12 between the reinforcing steel sheet 11 and the flexible circuit board 2 and the adhesive 2 13 between the reinforcing steel sheet 11 and the display panel 1, and finally transmitted to the entire display module, resulting in visible concave and convex marks (i.e., mold imprints) on the front side of the display module (i.e., the display surface). In current display modules, because the adhesive 12 and the edges of the reinforcing steel sheet 11 are aligned at the base of the neck region, the pulling, bending, and squeezing forces are concentrated at the edges of the reinforcing steel sheet 11. This prevents the reinforcing steel sheet 11 from distributing these forces, resulting in a concentrated and heavily imprinted impression on the display side of the display module, particularly at the edges of the reinforcing steel sheet 11. Furthermore, manually over-bending the output structure 20 of the flexible circuit board 2 can easily damage the display panel 1, further exacerbating the imprint on the display module and affecting the display quality.

[0074] Reference Figure 1dCurrently, fatigue performance assessments of display modules are performed through micro-motion testing. The micro-motion testing method involves applying a fixed force to a fixed position on the side surface of the display panel 1's cover plate 16 using a jig indenter 15 after assembly. Due to the length fluctuations of the bent output structure 20 (i.e., the "neck") of the flexible circuit board 2, a gap exists between the output structure 20 and the midframe assembly 17. During the micro-motion test, the bent output structure 20 at position ① collides with the midframe assembly 17, potentially leading to malfunctions. The failure location is typically at the base of the output structure 20's neck (i.e., the starting point of the bend or pull), and the failure mode is fatigue fracture of the metal traces in the flexible circuit board 2. To address this issue, related technologies have optimized and improved the overall structure of the device. Furthermore, at position ②, micro-motion, manual bending, and pulling of the "neck" of the flexible circuit board 2 can cause the midframe assembly 17 to squeeze and collide with the heat dissipation film 14, further increasing the degree of imprinting in the corresponding area of ​​the display module.

[0075] In addition, the current structural design of the OLED display module requires lightness and thinness. The thickness of the adhesive backing and the reinforcing steel sheet 11 between the display panel 1 and the flexible circuit board 2 is too thin, resulting in insufficient reinforcement of the flexible circuit board 2. The deformation stress of the flexible circuit board 2 during pulling and bending is very easy to be transmitted to the display panel 1, resulting in defects, especially for the flexible circuit board end structure 20 with a "short neck" design (neck length <5mm); at the same time, due to fluctuations in the fastening process between the flexible circuit board end structure 20 and the main board of the whole machine, the end structure ("neck" structure) 20 is too short or redundant in length. When assembling the whole machine, the end structure 20 is pulled or redundantly pressed, and the degree of mold imprint at the root of the "neck" is aggravated; the length fluctuation of the end structure 20 also worsens the micro-motion test of the whole machine.

[0076] In order to solve the above problems, the present invention provides a display module. Figure 2a 、 Figure 2b 、 Figure 2c 、 Figure 2d 、 Figure 2e 、 Figure 2f and Figure 2g, including: a display panel 1; a flexible circuit board 2, located on the back side of the display panel 1; the flexible circuit board 2 includes a first portion 21 and a second portion 22, the first portion 21 and the second portion 22 are connected as a whole; the first portion 21 is electrically connected to the display panel 1, and the second portion 22 is used to electrically connect to a peripheral circuit board; a supporting layer 3, located between the flexible circuit board 2 and the display panel 1; a first adhesive layer 4, located between the supporting layer 3 and the flexible circuit board 2, the first adhesive layer 4 at least partially overlaps with the orthographic projection of the supporting layer 3 and the first portion 21 on the display panel 1; the first adhesive layer 4 does not overlap with the orthographic projection of the second portion 22 on the display panel 1; the supporting layer 3 also extends to at least partially overlap with the orthographic projection of the second portion 22 on the display panel 1.

[0077] The display panel 1 can be a flexible panel, such as an OLED display panel. The support layer 3 can be a reinforcing steel sheet. The support layer 3 can provide support for the flexible circuit board 2. The first adhesive layer 4 is made of an adhesive material. The second portion 22 is electrically connected to the peripheral circuit board via a connector 220.

[0078] In this embodiment, refer to Figure 2a 、 Figure 2b and Figure 2c The flexible circuit board 2 is provided with an opening E, which separates the first portion 21 from the second portion 22. In this embodiment, the display module further includes a second adhesive layer 18, the orthographic projection of the second adhesive layer 18 on the display panel 1 being located within the orthographic projection area of ​​the support layer 3 on the display panel 1.

[0079] In this embodiment, the first portion 21 of the flexible circuit board 2 is bonded to the support layer 3 via the first adhesive layer 4, providing support for the first portion 21. The second portion 22 and the orthographic projection of the first adhesive layer 4 on the display panel 1 do not overlap, allowing the second portion 22 to be freely pulled and bent to achieve electrical connection with a peripheral circuit board, such as the mainboard of the device.

[0080] In some embodiments, reference Figure 2e and Figure 2g The second portion 22 is bent in a direction away from the back side of the display panel 1 in the subsequent assembly process to achieve a buckle electrical connection with the mainboard of the whole machine. Figure 2a 、 Figure 2b 、 Figure 2c and Figure 2e The length of the second portion 22 along the arrangement direction of the second portion 22 and the first portion 21 is relatively short, and the bending starting point D of the second portion 22 is located at the connection position A between the second portion 22 and the first portion 21. Figure 2f and Figure 2g The length of the second portion 22 along the arrangement direction thereof with the first portion 21 is relatively long, and the bending starting point D of the second portion 22 is located at one end thereof away from the connection position A with the first portion 21 .

[0081] In this embodiment, refer to Figure 2a-2g By making the first adhesive layer 4 and the orthographic projection of the second part 22 on the display panel 1 not overlap, and the supporting layer 3 also extends to at least partially overlap with the orthographic projection of the second part 22 on the display panel 1, the orthographic projection of the edge of the first adhesive layer 4 close to the second part 22 on the display panel 1 can be located in the middle area of ​​the orthographic projection of the supporting layer 3 on the display panel 1. In this way, when the second part 22 is pulled and bent, the pulling and bending squeezing force acting on the connection position A of the second part 22 and the first part 21 will pass through the edge of the first adhesive layer 4 close to the second part 22. The side edge is transmitted to the middle area of ​​the supporting layer 3, and the middle area of ​​the supporting layer 3 can disperse and conduct the pulling and bending extrusion forces, so that the pulling and bending extrusion forces acting on the display panel 1 will not be concentrated at one point, but will be evenly distributed on the display panel 1, thereby effectively reducing the degree of mold printing of the display module at the connection position A between the first part 21 and the second part 22 of the flexible circuit board 2, especially reducing the point-shaped mold printing degree of the display module at the connection position A between the first part 21 and the second part 22 of the flexible circuit board 2, thereby improving the appearance effect of the display module.

[0082] In some embodiments, the supporting layer 3 includes a first part 31 and a second part 32, the first part 31 and the second part 32 are connected as one, the orthographic projection of the first part 31 on the display panel 1 is located within the orthographic projection area of ​​the first part 21 on the display panel 1, and the orthographic projection of the second part 32 on the display panel 1 is located within the orthographic projection area of ​​the second part 22 on the display panel 1; the width of the side edge of the first part 31 connected to the second part 32 is greater than the width of the side edge of the second part 32 connected to the first part 31; the orthographic projection of the first adhesive layer 4 and the first part 31 on the display panel 1 at least partially overlap.

[0083] Such a configuration can make the positive projection of the side edge of the first adhesive layer 4 close to the second part 22 on the display panel 1 correspond to the middle area of ​​the positive projection of the support layer 3 on the display panel 1. In this way, when the second part 22 is pulled and bent, the pulling and bending extrusion force acting at the connection position A between the second part 22 and the first part 21 will be transmitted to the middle area of ​​the support layer 3 through the side edge of the first adhesive layer 4 close to the second part 22. The middle area of ​​the support layer 3 can disperse and conduct the pulling and bending extrusion force, so that the pulling and bending extrusion force acting on the display panel 1 will not be concentrated at one point, but will be evenly distributed on the display panel 1, thereby effectively reducing the degree of mold printing of the display module at the connection position A between the first part 21 and the second part 22 of the flexible circuit board 2, especially reducing the degree of point mold printing of the display module at the connection position A between the first part 21 and the second part 22 of the flexible circuit board 2, thereby improving the appearance effect of the display module.

[0084] In some embodiments, reference Figure 2a 、 Figure 2b 、 Figure 2c and Figure 2f The orthographic projection area of ​​the first adhesive layer 4 on the display panel 1 is smaller than the orthographic projection area of ​​the first portion 31 on the display panel 1; the orthographic projection of the side edge of the first adhesive layer 4 close to the second portion 32 on the display panel 1 is located on the side of the orthographic projection of the side edge of the first portion 31 connected to the second portion 32 on the display panel 1, which is away from the orthographic projection of the second portion 32 on the display panel 1; the side edge of the first portion 31 connected to the second portion 32 includes a first segment B and a second segment C, and the first segment B and the second segment C are connected; the first segment B is not connected to the second portion 32, and the second segment C is connected to the second portion 32; the first segment B is arranged at both ends of the second segment C.

[0085] In some embodiments, reference Figure 2a 、 Figure 2b and Figure 2f The edge of one side of the first adhesive layer 4 close to the second portion 32 is parallel to the edge of one side of the first portion 31 connected to the second portion 32 .

[0086] In some embodiments, reference Figure 2a 、 Figure 2b and Figure 2f The distance s1 between the side edge of the first adhesive layer 4 close to the second part 32 and the orthographic projection of the first segment B on the display panel 1 ranges from 0.1 to 2 mm; the distance s2 between the side edge of the first adhesive layer 4 close to the second part 32 and the orthographic projection of the side edge of the second part 32 away from the first part 31 on the display panel 1 ranges from 2 to 6 mm.

[0087] In some embodiments, reference Figure 2a and Figure 2f The distance s1 between the side edge of the first adhesive layer 4 close to the second part 32 and the orthographic projection of the first segment B on the display panel 1 ranges from 0.1 to 0.3 mm; the distance s2 between the side edge of the first adhesive layer 4 close to the second part 32 and the orthographic projection of the side edge of the second part 32 away from the first part 31 on the display panel 1 ranges from 2 to 4 mm.

[0088] In some embodiments, reference Figure 2b The distance s1 between the side edge of the first adhesive layer 4 close to the second part 32 and the orthographic projection of the first segment B on the display panel 1 ranges from 0.3 to 2 mm; the distance s2 between the side edge of the first adhesive layer 4 close to the second part 32 and the orthographic projection of the side edge of the second part 32 away from the first part 31 on the display panel 1 ranges from 4 to 6 mm.

[0089] Figure 2b In the figure, the orthographic projection of the edge of one side of the first adhesive layer 4 close to the second portion 32 on the display panel 1 is larger than that of the first adhesive layer 4 close to the second portion 32. Figure 2a The solution is further away from the orthographic projection of the side edge of the first portion 31 connected to the second portion 32 on the display panel 1, so that the orthographic projection of the side edge of the first adhesive layer 4 close to the second portion 32 on the display panel 1 is further located in the middle area of ​​the orthographic projection of the support layer 3 on the display panel 1. In this way, when the second portion 22 is pulled and bent, the pulling and bending extrusion force acting on the connection position A between the second portion 22 and the first portion 21 will be transmitted through the side edge of the first adhesive layer 4 close to the second portion 22 to the middle area of ​​the support layer 3 further away from its edge. The middle area of ​​the support layer 3 can disperse and conduct the pulling and bending extrusion force, so that the pulling and bending extrusion force acting on the display panel 1 will not be concentrated at one point, but will be evenly distributed on the display panel 1. This can effectively reduce the degree of mold imprint of the display module at the connection position A between the first portion 21 and the second portion 22 of the flexible circuit board 2, especially the degree of point-like mold imprint of the display module at the connection position A between the first portion 21 and the second portion 22 of the flexible circuit board 2, thereby improving the appearance of the display module.

[0090] In some embodiments, reference Figure 2c , the distance s3 between the portion of the first adhesive layer 4 corresponding to the second segment C at the side edge close to the second portion 32 and the orthographic projection of the second segment C on the display panel 1 is greater than the distance s1 between the portion of the first adhesive layer 4 corresponding to the first segment B at the side edge close to the second portion 32 and the orthographic projection of the first segment B on the display panel 1.

[0091] In some embodiments, reference Figure 2c The distance s1 between the portion of the first adhesive layer 4 corresponding to the first segment B on the side edge close to the second portion 32 and the orthographic projection of the first segment B on the display panel 1 is in the range of 0.1 to 0.3 mm; the distance s4 between the portion of the first adhesive layer 4 corresponding to the second segment C on the side edge close to the second portion 32 and the orthographic projection of the second portion 32 on the display panel 1 is in the range of 4 to 8 mm.

[0092] Figure 2cIn the embodiment, the portion of the first adhesive layer 4 corresponding to the second segment C of the side edge close to the second portion 32 is further away from the positive projection of the side edge of the first portion 31 connected to the second portion 32 on the display panel 1 relative to the portion of the first adhesive layer 4 corresponding to the first segment B of the side edge close to the second portion 32, so that the positive projection of the portion of the first adhesive layer 4 corresponding to the second segment C of the side edge close to the second portion 32 on the display panel 1 is further located in the middle area of ​​the positive projection of the support layer 3 on the display panel 1 (that is, further away from the side edge of the second portion 32 away from the first portion 31), so that when the second portion 22 is pulled and bent, the action acts on the connection position A between the second portion 22 and the first portion 21 The pulling and bending extrusion forces will be transmitted to the middle area of ​​the supporting layer 3 farther away from its edge through the part of the second segment C corresponding to the side edge of the first adhesive layer 4 close to the second part 32. The middle area of ​​the supporting layer 3 can disperse and conduct the pulling and bending extrusion forces, so that the pulling and bending extrusion forces acting on the display panel 1 will not be concentrated at one point, but will be evenly distributed on the display panel 1, thereby effectively reducing the degree of mold printing of the display module at the connection position A between the first part 21 and the second part 22 of the flexible circuit board 2, especially reducing the degree of point mold printing of the display module at the connection position A between the first part 21 and the second part 22 of the flexible circuit board 2, thereby improving the appearance effect of the display module.

[0093] In some embodiments, the first portion 21 includes an electrical component (not shown in the figures); the first adhesive layer 4 at least partially overlaps with the support layer 3 and the orthographic projection of the electrical component on the display panel 1 .

[0094] In some embodiments, the supporting layer 3 overlaps with the orthographic projection of the first part 21 on the display panel 1, and the orthographic projection of the supporting layer 3 on the display panel 1 at least covers the orthographic projection of the electrical component on the display panel 1; the first adhesive layer 4 is at least located in the overlapping area of ​​the orthographic projection of the supporting layer 3 and the electrical component on the display panel 1.

[0095] Among them, on the one hand, the support layer 3 can support the electrical components in the first part 21 of the flexible circuit board 2 during the punching process of the flexible circuit board 2 (that is, soldering the electrical components to the flexible circuit board 2), thereby improving the flatness of the flexible circuit board 2 during the punching process and after the punching process is completed, and ensuring the reliability of the punching; on the other hand, after soldering is brushed on the flexible circuit board 2 and gluing (thermosetting glue) is applied to the electrical components during the punching process, the solder paste and the thermosetting glue gather and shrink, which will cause the flatness of the circuit board to deteriorate. The provision of the support layer 3 can improve or avoid the problem of aggravated dotted printing in the display area corresponding to the device area after the flexible circuit board 2 is attached to the display panel 1.

[0096] It should be noted that Figure 2a-2gIn the scheme, the setting position of the edge of one side of the first adhesive layer 4 close to the second part 32 needs to ensure that the first adhesive layer 4 at least partially overlaps with the support layer 3 and the positive projection of the electrical component on the display panel 1, so as to ensure that the support layer 3 can support the electrical component during the punching process.

[0097] In some embodiments, reference Figure 3a 、 Figure 3b and Figure 3c The second part 22 has a bending area 200, and the display module also includes a first buffer layer 5, which is located between the second part 22 and the supporting layer 3. The positive projections of the first buffer layer 5 and the bending area 200 on the display panel 1 at least partially overlap; the first buffer layer 5 is connected to the second part 22.

[0098] In some embodiments, the orthographic projection of the first buffer layer 5 on the display panel 1 is located within the orthographic projection area of ​​the bending zone 200 on the display panel 1 .

[0099] Among them, since the middle frame of the display module is located on the outside of the U-shaped groove formed after the bending area 200 of the second part 22 is bent, and the middle frame of the whole machine is opposite to the U-shaped groove and is arranged at a distance; the first buffer layer 5 has a buffering performance, and the setting of the first buffer layer 5 can prevent the display module from colliding between the middle frame of the whole machine and the U-shaped groove during the assembly process of the whole machine; in addition, during long-term use or micro-motion testing of the display module, the first buffer layer 5 can effectively reduce the vibration stroke of the flexible circuit board 2 and reduce the activity amplitude of the metal wiring inside the flexible circuit board 2, thereby effectively avoiding fatigue fracture of the metal circuit at the U-shaped groove position formed after the bending area 200 is bent.

[0100] In some embodiments, the first buffer layer 5 can be made of foam or other materials. One side of the first buffer layer 5 that is bonded to the second portion 22 has adhesive, and the bonding between the first buffer layer 5 and the second portion 22 is achieved through the adhesive.

[0101] In some embodiments, the thickness of the first buffer layer 5 is less than the thickness of the first adhesive layer 4 ; the orthographic projections of the first buffer layer 5 and the first adhesive layer 4 on the display panel 1 are spaced apart from each other.

[0102] The thickness of the first buffer layer 5 is required to be set so as not to interfere with the design of the entire midframe. This thickness setting prevents the bent region 200 of the second portion 22 from directly squeezing the first buffer layer 5 when flattened, which could lead to increased stenciling in the corresponding areas of the display module. The orthographic projections of the first buffer layer 5 and the first adhesive layer 4 on the display panel 1 are spaced apart to prevent them from overlapping at their intersection due to process tolerances during the manufacturing process, thereby preventing increased stenciling in the corresponding areas of the display module.

[0103] In some embodiments, the display module further includes a second buffer layer 6, located between the second part 22 and the supporting layer 3, the orthographic projection of the second buffer layer 6 on the display panel 1 is located within the orthographic projection area of ​​the second part 32 on the display panel 1, and the second buffer layer 6 is connected to the second part 32.

[0104] The second buffer layer 6 prevents the second portion 22 of the flexible circuit board 2 from being pressed against the second portion 32 of the support layer 3 during assembly of the display module or during process testing, thereby preventing dents or increased mold marks in the corresponding areas of the display module. The second buffer layer 6 should not interfere with the overall midframe.

[0105] In some embodiments, the second buffer layer 6 can be made of foam or other materials. The side of the second buffer layer 6 that is bonded to the second portion 32 has adhesive, and the bonding between the second buffer layer 6 and the second portion 32 is achieved through the adhesive.

[0106] In some embodiments, the thickness of the second buffer layer 6 is less than the thickness of the first adhesive layer 4 ; the orthographic projections of the second buffer layer 6 and the first adhesive layer 4 on the display panel 1 are spaced apart from each other.

[0107] In some embodiments, the thickness of the second buffer layer 6 is in the range of 0.3 to 0.5 mm.

[0108] The thickness of the second buffer layer 6 is configured to prevent the second portion 22 from directly pressing against the second part 32 when flattened, which could lead to increased stenciling in the corresponding area of ​​the display module. The orthographic projections of the second buffer layer 6 and the first adhesive layer 4 on the display panel 1 are spaced apart, preventing them from overlapping at their intersection due to process tolerances during the manufacturing process, thereby preventing increased stenciling in the corresponding area of ​​the display module.

[0109] In some embodiments, the orthographic projections of the first buffer layer 5 and the second buffer layer 6 on the display panel 1 at least partially overlap; and the sum of the thicknesses of the first buffer layer 5 and the second buffer layer 6 is less than or equal to the thickness of the first adhesive layer 4 .

[0110] The first and second buffer layers 5, 6 are designed to avoid interfering with the overall midframe. The thickness of the first and second buffer layers 5, 6 is designed to prevent the second portion 22 from directly pressing against the second portion 32 when flattened, when the thickness of the overlapping orthographic projections of the first and second buffer layers 5, 6 is relatively large, thereby increasing the degree of stenciling in the corresponding area of ​​the display module.

[0111] In some embodiments, reference Figure 3b and Figure 3cThe bending zone 200 is located at an end of the second portion 22 away from the first portion 21, and the orthographic projections of the bending zone 200 and the second portion 32 on the display panel 1 do not overlap; the display module further includes a third buffer layer 7, which is located on a side of the flexible circuit board 2 away from the display panel 1 and is located at a bending starting point D of the bending zone 200; the orthographic projections of the third buffer layer 7 and the first buffer layer 5 on the display panel 1 at least partially overlap; the third buffer layer 7 is connected to the second portion 22.

[0112] Figure 3b and Figure 3c The length of the second portion 22 along the arrangement direction of the first portion 21 and the second portion 22 is greater than Figure 3a The length of the second portion 22; and Figure 3b and Figure 3c Part of the second portion 22 will be pressed by the battery of the whole device which will be arranged on the side of the flexible circuit board 2 away from the display panel 1, leaving only the end of the second portion 22 connected to the main board of the whole device. Figure 3b and Figure 3c The bending starting point D of the bending zone 200 of the second portion 22 is not located at the connection point A between the second portion 22 and the first portion 21, but rather at the edge of the battery away from the first portion 21. The provision of the third buffer layer 7 prevents stress concentration on the flexible circuit board 2 from the right-angled edge structure of the battery during the manufacturing process and during the fastening of the second portion 22 to the mainboard, thereby preventing damage to the circuitry within the flexible circuit board 2.

[0113] In some embodiments, the third buffer layer 7 may be made of viscose or foam material.

[0114] The display module provided in this embodiment does not overlap the orthographic projections of the first adhesive layer and the second part on the display panel, and the support layer also extends to at least partially overlap with the orthographic projection of the second part on the display panel, so that the orthographic projection of the side edge of the first adhesive layer close to the second part on the display panel corresponds to the middle area of ​​the orthographic projection of the support layer on the display panel. In this way, when the second part is pulled and bent, the pulling and bending extrusion force acting at the connection position between the second part and the first part will be transmitted to the middle area of ​​the supporting layer through the side edge of the first adhesive layer close to the second part. The middle area of ​​the supporting layer can disperse and conduct the pulling and bending extrusion force, so that the pulling and bending extrusion force acting on the display panel will not be concentrated at one point, but will be evenly distributed on the display panel, thereby effectively reducing the degree of mold printing of the display module at the connection position of the first and second parts of the flexible circuit board, especially reducing the degree of point-like mold printing of the display module at the connection position of the first and second parts of the flexible circuit board, thereby improving the appearance of the display module.

[0115] This embodiment further provides a display device, comprising the display module in the above embodiment.

[0116] In some embodiments, reference Figure 4a and Figure 4b The display device also includes a peripheral circuit board 8, which is located on the side of the flexible circuit board 2 in the display module away from the display panel 1; the bending area 200 of the second part 22 in the display module is bent toward the side of the flexible circuit board 2 away from the display panel 1 to form a U-shaped groove, and the second part 22 includes a connector 220, which is located at the end of the bending area 200, and the connector 220 is connected to the peripheral circuit board 8; the display device also includes a middle frame 9, which is located on the side of the peripheral circuit board 8 away from the display module, and part of the structure of the middle frame 9 is located on the outside of the bottom of the U-shaped groove; there is a gap between the middle frame 9 and the U-shaped groove and the display panel 1.

[0117] The peripheral circuit board 8 is such as the mainboard of the whole device. The gap between the middle frame 9 and the U-shaped groove and the display panel 1 can prevent the middle frame 9, the U-shaped groove and the display panel 1 from being bumped or squeezed during the assembly of the whole device, thereby avoiding bumping and squeezing marks on the display side of the display device, thereby improving the appearance of the display device.

[0118] In some embodiments, reference Figure 4b The display device also includes a battery 10, located on the side of the flexible circuit board 2 facing away from the display panel 1. The end of the battery 10, facing away from the first portion 21 of the flexible circuit board 2, is positioned within the U-shaped groove formed by the bending region 200 of the second portion 22. The edge of the battery 10, facing away from the first portion 21, overlaps with the orthographic projection of the third buffer layer 7 in the display module on the display panel 1. This arrangement prevents stress concentration on the flexible circuit board 2 from the right-angled edge of the battery 10 during the manufacturing process and during the fastening of the second portion 22 to the peripheral circuit board 8, thereby preventing damage to the circuitry within the flexible circuit board 2.

[0119] The display device provided in this embodiment, by adopting the display module in the above embodiment, can improve or avoid the mold print on the display side caused by the assembly and testing process of the display device, thereby improving the appearance of the display device.

[0120] The display device can be any product or component with a display function, such as an OLED panel, an OLED TV, an electronic paper, a mobile phone, a tablet computer, a notebook computer, a monitor, a notebook computer, a digital photo frame, a navigator, or the like.

[0121] It is understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present invention, and the present invention is not limited thereto. Those skilled in the art may make various modifications and improvements without departing from the spirit and substance of the present invention, and such modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A display module, comprising: Display panel; a flexible circuit board, located on the back side of the display panel; The flexible circuit board includes a first portion and a second portion, the first portion and the second portion are connected as a whole; the first portion is electrically connected to the display panel, and the second portion is used to electrically connect to a peripheral circuit board; a supporting layer, located between the flexible circuit board and the display panel; a first adhesive layer, located between the supporting layer and the flexible circuit board, wherein the first adhesive layer at least partially overlaps with the supporting layer and an orthographic projection of the first portion on the display panel; It is characterized in that the first adhesive layer and the orthographic projection of the second portion on the display panel do not overlap; the supporting layer also extends to at least partially overlap with the orthographic projection of the second portion on the display panel.

2. The display module according to claim 1, wherein: The supporting layer includes a first portion and a second portion, wherein the first portion and the second portion are connected as one body. The orthographic projection of the first portion on the display panel is located within the orthographic projection area of ​​the first portion on the display panel, and the orthographic projection of the second portion on the display panel is located within the orthographic projection area of ​​the second portion on the display panel; The width of an edge of the first portion connected to the second portion is greater than the width of an edge of the second portion connected to the first portion; The orthographic projections of the first adhesive layer and the first portion on the display panel at least partially overlap.

3. The display module according to claim 2, wherein: The orthographic projection area of ​​the first adhesive layer on the display panel is smaller than the orthographic projection area of ​​the first portion on the display panel; The orthographic projection of an edge of the first adhesive layer close to the second portion on the display panel is located on a side of the orthographic projection of an edge of the first portion connected to the second portion on the display panel that is away from the orthographic projection of the second portion on the display panel; One side edge of the first portion connected to the second portion includes a first section and a second section, and the first section is connected to the second section; The first section is not connected to the second portion, and the second section is connected to the second portion; The first section is arranged at both ends of the second section.

4. The display module according to claim 3, wherein: An edge of the first adhesive layer adjacent to the second portion is parallel to an edge of the first portion connected to the second portion.

5. The display module according to claim 3, wherein: The distance between the portion of the first adhesive layer corresponding to the second segment near the side edge of the second portion and the orthographic projection of the second segment on the display panel is greater than the distance between the portion of the first adhesive layer corresponding to the first segment near the side edge of the second portion and the orthographic projection of the first segment on the display panel.

6. The display module according to claim 4, wherein: A distance between an edge of the first adhesive layer close to the second portion and an orthographic projection of the first segment on the display panel is in a range of 0.1 to 2 mm; A distance between an orthographic projection of an edge of the first adhesive layer close to the second portion and an edge of the second portion away from the first portion on the display panel is in a range of 2 to 6 mm.

7. The display module according to claim 5, wherein: The distance between a portion of the first section of the first adhesive layer adjacent to a side edge of the second section and an orthographic projection of the first section on the display panel is in a range of 0.1 to 0.3 mm; The distance between the orthographic projection of a portion of the first adhesive layer corresponding to the second segment close to one side edge of the second portion and one side edge of the second portion away from the first portion on the display panel is 4 to 8 mm.

8. The display module according to claim 1, wherein: The first part includes electrical components; The first adhesive layer at least partially overlaps with the support layer and the orthographic projection of the electrical component on the display panel.

9. The display module according to claim 2, wherein: The second portion has a bending area, The display module further includes a first buffer layer located between the second portion and the support layer, wherein the first buffer layer and the orthographic projection of the bending area on the display panel at least partially overlap; The first buffer layer is connected to the second portion.

10. The display module according to claim 9, wherein: The thickness of the first buffer layer is less than the thickness of the first bonding layer; Orthographic projections of the first buffer layer and the first adhesive layer on the display panel are spaced apart from each other.

11. The display module according to claim 10, wherein: The invention also includes a second buffer layer located between the second portion and the support layer, wherein the orthographic projection of the second buffer layer on the display panel is located within the orthographic projection area of ​​the second portion on the display panel. The second buffer layer is connected to the second portion.

12. The display module according to claim 11, wherein: The thickness of the second buffer layer is less than the thickness of the first bonding layer; Orthographic projections of the second buffer layer and the first adhesive layer on the display panel are spaced apart from each other.

13. The display module according to claim 12, wherein: The orthographic projections of the first buffer layer and the second buffer layer on the display panel at least partially overlap; The sum of the thicknesses of the first buffer layer and the second buffer layer is less than or equal to the thickness of the first bonding layer.

14. The display module according to claim 12, wherein: The bending zone is located at an end of the second portion away from the first portion, and the orthographic projections of the bending zone and the second portion on the display panel do not overlap; The display module further includes a third buffer layer located on a side of the flexible circuit board facing away from the display panel and located at a bending starting point of the bending zone; The orthographic projections of the third buffer layer and the first buffer layer on the display panel at least partially overlap; The third buffer layer is connected to the second portion.

15. A display device, characterized in that: A display module comprising any one of claims 1-14.

16. The display device according to claim 15, wherein: Also included is a peripheral circuit board located on a side of the flexible circuit board in the display module that is away from the display panel; The bending area of ​​the second portion of the display module is bent toward the side of the flexible circuit board away from the display panel to form a U-shaped groove. The second portion includes a connector located at an end of the bending region, the connector being connected to the peripheral circuit board; The display device further includes a middle frame located on a side of the peripheral circuit board facing away from the display module, and a portion of the structure of the middle frame is located outside the bottom of the U-shaped groove; There is a gap between the middle frame, the U-shaped groove and the display panel.

17. The display device according to claim 16, wherein: The flexible circuit board further includes a battery, which is located on a side of the flexible circuit board away from the display panel, and an end of the battery away from the first portion of the flexible circuit board is located in the U-shaped groove formed by the bending area of ​​the second portion. An edge of a side of the battery away from the first portion overlaps with an orthographic projection of the third buffer layer in the display module on the display panel.

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