Fingerprint identification device

Abstract

The utility model provides a fingerprint identification device. The plurality of conductor patterns are respectively formed in the substrate or on the surface of the substrate. The control circuit is connected with the fingerprint sensor through the connecting hole and the conductor pattern, and the control circuit controls the fingerprint sensor to execute fingerprint sensing operation so as to receive a fingerprint sensing signal provided by the fingerprint sensor and provide a fingerprint identification signal according to the fingerprint sensing signal.

Description

Technical Field

[0001] The utility model relates to an electronic device, in particular to a fingerprint recognition device. Background Art

[0002] Fingerprint recognition is now widely used in various electronic products, with portable mobile devices such as smartphones and tablet computers being the most common. Common fingerprint recognition devices used in smartphones include optical, capacitive, and ultrasonic types. With the advancement of fingerprint recognition technology, the demand for faster fingerprint recognition speeds is increasing, making increasing signal transmission efficiency a critical issue. Utility Model Content

[0003] The utility model provides a fingerprint recognition device, which can reduce the signal transmission distance, thereby reducing transmission loss and reducing the size of the device.

[0004] The fingerprint recognition device of the present invention includes a substrate, multiple conductor patterns, a fingerprint sensor, and a control circuit. The multiple conductor patterns are formed in the substrate or on the surface of the substrate. The control circuit connects to the fingerprint sensor through connection holes and the conductor patterns. The control circuit controls the fingerprint sensor to perform fingerprint sensing operations, receives fingerprint sensing signals from the fingerprint sensor, and provides a fingerprint recognition signal based on the fingerprint sensing signals.

[0005] In one embodiment of the present invention, the fingerprint sensor includes a transmitting electrode layer and a receiving electrode layer, and the number of electrodes included in the transmitting electrode layer is greater than the number of electrodes included in the receiving electrode layer.

[0006] In one embodiment of the present invention, the spacing between the multiple electrodes included in the transmitting electrode layer is 50um to 150um, and the spacing between the multiple electrodes included in the receiving electrode layer is 50um to 150um.

[0007] In one embodiment of the present invention, the fingerprint sensor includes an upper electrode layer, a piezoelectric material layer, and a lower electrode layer, wherein the lower electrode layer is formed by at least a portion of a plurality of conductor patterns formed on a surface of a substrate.

[0008] In one embodiment of the present invention, one of the upper electrode layer and the lower electrode layer is used as a transmitting electrode layer, and the other of the upper electrode layer and the lower electrode layer is used as a receiving electrode layer. The number of electrodes in the transmitting electrode layer is greater than the number of electrodes in the receiving electrode layer.

[0009] In one embodiment of the present invention, the upper electrode layer includes a plurality of first electrodes, the lower electrode layer includes a plurality of second electrodes, and the spacing between the plurality of first electrodes and the spacing between the plurality of second electrodes are 50 um to 150 um.

[0010] In one embodiment of the present invention, the above-mentioned fingerprint sensor has a rectangular fingerprint sensing area, the lower electrode layer includes a plurality of first electrodes extending along the long side direction of the fingerprint sensing area and arranged along the short side direction of the fingerprint sensing area, and the upper electrode layer includes a plurality of second electrodes extending along the short side direction and arranged along the long side direction.

[0011] In one embodiment of the present invention, the upper electrode layer is used as a transmitting electrode layer, the lower electrode layer is used as a receiving electrode layer, and the number of the second electrodes is greater than the number of the first electrodes.

[0012] In one embodiment of the present invention, the above-mentioned fingerprint sensor has a rectangular fingerprint sensing area, the lower electrode layer includes a plurality of first electrodes extending along the short side direction of the fingerprint sensing area and arranged along the long side direction of the fingerprint sensing area, and the upper electrode layer includes a plurality of second electrodes extending along the long side direction and arranged along the short side direction.

[0013] In one embodiment of the present invention, the lower electrode layer is used as a transmitting electrode layer, the upper electrode layer is used as a receiving electrode layer, and the number of the first electrodes is greater than the number of the second electrodes.

[0014] In one embodiment of the present invention, the above-mentioned multiple conductor patterns include a first conductor pattern formed on the first surface of the substrate and a second conductor pattern formed on the second surface of the substrate opposite to the first surface. The connection hole includes a first connection hole, the first connection hole connects the first conductor pattern and the second conductor pattern, the control circuit is connected to the fingerprint sensor through the first conductor pattern, the second conductor pattern and the first connection hole, the fingerprint sensor is arranged on the first surface, and the control circuit is arranged on the second surface.

[0015] In one embodiment of the present invention, the above-mentioned multiple conductor patterns include a first conductor pattern formed on the first surface of the substrate, a second conductor pattern formed on the second surface of the substrate opposite to the first surface, and a third conductor pattern formed in the substrate. The at least one connection hole includes a first connection hole and a second connection hole, and the control circuit is connected to the fingerprint sensor through the first connection hole, the second connection hole, the first conductor pattern, the second conductor pattern and the third conductor pattern.

[0016] In one embodiment of the present invention, the plurality of conductor patterns include a first conductor pattern formed on the first surface of the substrate and a second conductor pattern formed in the substrate, the connection hole includes a first connection hole and a second connection hole, and the fingerprint sensor and the control circuit are disposed on the first surface. The control circuit is connected to the fingerprint sensor via the first connection hole, the second connection hole, the first conductor pattern, and the second conductor pattern.

[0017] In one embodiment of the present invention, the substrate has a recess, the control circuit is disposed in the recess, the plurality of conductor patterns further include a third conductor pattern, and the at least one connection hole further includes a third connection hole. The control circuit is further connected to the fingerprint sensor via the third connection hole and the third conductor pattern, wherein the third conductor pattern is formed in the recess.

[0018] In one embodiment of the present invention, the fingerprint sensor is an ultrasonic fingerprint sensor.

[0019] In one embodiment of the present invention, the substrate is a multi-layer substrate formed by stacking a plurality of sub-substrates.

[0020] Based on the above, the control circuit of the present invention can be connected to the fingerprint sensor via connection holes and the conductive pattern of the substrate. Compared to conventional methods that rely on bonding wires and a flexible printed circuit board (FPC) to transmit signals to the reader chip (Application Specific Integrated Circuit, ASIC), the present invention eliminates the need for bonding wires to transmit fingerprint sensing signals. This effectively reduces the signal transmission distance of the fingerprint sensing signal, thereby reducing transmission loss. Furthermore, eliminating the need for bonding wires can reduce the assembly process and the size of the fingerprint recognition device.

[0021] In order to make the above features and advantages of the present invention more clearly understood, embodiments are given below with reference to the accompanying drawings for detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of a fingerprint recognition device created according to the present invention.

[0023] Figure 2 FIG2 is a schematic diagram of a fingerprint recognition device according to another embodiment of the present invention.

[0024] Figure 3 FIG2 is a schematic diagram of a fingerprint recognition device according to another embodiment of the present invention.

[0025] Figure 4 It is a schematic diagram of a fingerprint sensor created according to the present invention.

[0026] Figure 5 FIG2 is a schematic diagram of a fingerprint recognition device according to another embodiment of the present invention.

[0027] Figure 6 FIG2 is a schematic diagram of a fingerprint recognition device according to another embodiment of the present invention. DETAILED DESCRIPTION

[0028] Figure 1 The figure is a schematic diagram of a fingerprint recognition device according to the present invention. The fingerprint recognition device may include a substrate 102, a control circuit 104, conductor patterns P1 and P2, a connection hole V1, and a fingerprint sensor 106. The substrate 102 may be, for example, a printed circuit board, a ceramic circuit board, or a glass substrate. The control circuit 104 may be, for example, an application-specific integrated circuit (ASIC), but is not limited thereto. The conductor patterns P1 and P2 and the connection hole V1 may be formed, for example, from a single metal or a combination of different metals (e.g., copper, tungsten, aluminum). The conductor patterns P1 and P2 are formed on surfaces F1 and F2 of the substrate 102, respectively. The conductor patterns P1 and P2 may be electrically connected via the connection hole V1. The fingerprint sensor 106 is disposed on the surface F1 of the substrate 102, and the control circuit 104 is disposed on the surface F2 of the substrate 102. The control circuit 104 is connected to the fingerprint sensor 106 via conductive patterns P1 and P2 and a connection hole V1. This allows the control circuit 104 to control the fingerprint sensor 106 to perform fingerprint sensing operations, such as providing a driving voltage to the fingerprint sensor 106 to drive the fingerprint sensor 106 for fingerprint sensing. The control circuit 104 receives the fingerprint sensing signal from the fingerprint sensor 106 and, based on the fingerprint sensing signal, provides a fingerprint recognition signal to the flexible printed circuit board (Flex-PCB) FP1 connected to the conductive pattern P2. This arrangement of the fingerprint sensor 106 and the control circuit 104 on the substrate 102 and their connection via the conductive patterns P1 and P2 and the connection hole V1 eliminates the need for bonding wires between the fingerprint sensor 106 and the control circuit 104 as in prior art. This effectively reduces signal transmission distance, thereby minimizing transmission loss of the fingerprint sensing signal and improving fingerprint recognition quality. At the same time, eliminating the use of bonding wires can also reduce the assembly process and reduce the size of the fingerprint recognition device.

[0029] It is worth noting that in other embodiments, the number of connection holes is not limited to Figure 1 The present invention is not limited to the embodiment, and the substrate 102 may be, for example, a multi-layer substrate formed by stacking a plurality of sub-substrates. Figure 2In the embodiment, the substrate 102 is formed by stacking a sub-substrate B1 and a sub-substrate B2, wherein the conductor pattern P1 is formed on the sub-substrate B1 (i.e., formed on the surface of the substrate 102), and the conductor pattern P2 is formed between the sub-substrates B1 and B2 (formed inside the substrate 102). In addition, in the present embodiment, the control circuit 104 and the fingerprint sensor 106 are both disposed on the surface F1 of the substrate 102. Similarly, in the present embodiment, the control circuit 104 can be connected to the fingerprint sensor 106 via the conductor patterns P1, P2, and the connection holes V1 and V2, and control the fingerprint sensor 106 to perform a fingerprint sensing operation, receive a fingerprint sensing signal provided by the fingerprint sensor 106, and provide a fingerprint recognition signal to the flexible circuit board FP1 based on the fingerprint sensing signal, so as to transmit the fingerprint recognition signal to a subsequent processing circuit, such as a processing circuit on the mobile phone system side, but the present invention is not limited thereto.

[0030] The fingerprint sensor 106 may be, for example, an ultrasonic fingerprint sensor. Figure 3 As shown in the embodiment, the fingerprint sensor 106 may include an upper electrode layer EL2, a piezoelectric material layer DL1, and a lower electrode layer EL1, wherein the piezoelectric material layer DL1 is disposed between the upper electrode layer EL2 and the lower electrode layer EL1. The piezoelectric material layer DL1 may be, for example, polyvinylidene fluoride (PVDF) or polyvinylidene fluoride-trifluoroethylene copolymer (PVDF-TrFE). The thickness of the piezoelectric material layer DL1 may be, for example, 5um to 30um, but is not limited thereto. The lower electrode layer EL1 may be formed by a portion of the conductor pattern P1. In addition, the pad PAD1 connected to the upper electrode layer EL2 may also be formed by a portion of the conductor pattern P1. Figure 3 In this embodiment, in addition to conductor pattern P1, substrate 102 also includes conductor patterns P2-P4. Conductor patterns P2 and P3 are located between two corresponding sub-substrates. For simplicity, the sub-substrates are not shown. Conductor pattern P2 can be connected to conductor pattern P1 (lower electrode layer EL1) via connection via V1, and to conductor pattern P3 via connection via V3. Conductor pattern P3 can be connected to conductor pattern P4 via connection via V4. Control circuit 102 and flexible printed circuit board FP1 can be connected, for example, via anisotropic conductive film (ACF) AB1 and conductor pattern P4.

[0031] In this way, the control circuit 102 can connect to the fingerprint sensor 106 through the conductor patterns P1 to P4 and the connection holes V1, V3, and V4 to control the fingerprint sensor 106 to perform a fingerprint sensing operation, so as to receive the fingerprint sensing signal provided by the fingerprint sensor 106, and provide a fingerprint recognition signal to the flexible circuit board FP1 based on the fingerprint sensing signal. Furthermore, the fingerprint sensor 106 may include a transmitting electrode layer and a receiving electrode layer, wherein the number of electrodes included in the transmitting electrode layer is greater than the number of electrodes included in the receiving electrode layer, and the spacing between the multiple electrodes included in the transmitting electrode layer may be, for example, 50um to 150um, and the spacing between the multiple electrodes included in the receiving electrode layer may be, for example, 50um to 150um, but is not limited thereto. For example, Figure 3 In this embodiment, both the upper electrode layer EL2 and the lower electrode layer EL1 can function as a transmitting electrode layer for transmitting ultrasonic signals or a receiving electrode layer for receiving reflected signals generated by the ultrasonic signals reflected by a finger. When the upper electrode layer EL2 functions as the transmitting electrode layer, the lower electrode layer EL1 functions as the receiving electrode layer. Conversely, when the lower electrode layer EL1 functions as the transmitting electrode layer, the upper electrode layer EL2 functions as the receiving electrode layer. The transmitting electrode layer and the receiving electrode layer can each include multiple electrodes. By having a greater number of electrodes in the transmitting electrode layer than in the receiving electrode layer, the signal-to-noise ratio can be improved.

[0032] For example, the layout of the upper electrode layer EL2 and the lower electrode layer EL1 of the fingerprint sensor 106 can be as follows: Figure 4 As shown. Assuming that the fingerprint sensor 106 has a rectangular fingerprint sensing area Z1, the multiple electrodes E1 included in the lower electrode layer EL1 of the fingerprint sensor 106 can be arranged along the long side direction of the fingerprint sensing area Z1, wherein the electrode E1 extends along the short side direction of the fingerprint sensing area Z1. In addition, the multiple electrodes E2 included in the upper electrode layer EL2 of the fingerprint sensor 106 can be arranged along the short side direction of the fingerprint sensing area Z1, wherein the electrode E2 extends along the long side direction of the fingerprint sensing area Z1. Such a layout method can make the lower electrode layer EL1 for transmitting ultrasonic signals in the fingerprint sensor 106 have a larger number of electrodes E1, which is conducive to the use of beam forming technology to improve the signal-to-noise ratio. The spacing between the electrodes E2 and the spacing between the electrodes E1 can be, for example, 50um to 150um, but is not limited thereto. In other embodiments, Figure 4In this embodiment, the upper electrode layer EL2 and the lower electrode layer EL1 are interchanged, with the upper electrode layer EL2 serving as the transmitting electrode layer and the lower electrode layer EL1 serving as the receiving electrode layer. Specifically, the multiple electrodes E2 included in the upper electrode layer EL2 are arranged along the long side of the fingerprint sensing area Z1, while the multiple electrodes E1 included in the lower electrode layer EL1 are arranged along the short side of the fingerprint sensing area Z1. The electrodes E2 extend along the short side of the fingerprint sensing area Z1, while the electrodes E1 extend along the long side of the fingerprint sensing area Z1. This allows the upper electrode layer EL2, which transmits ultrasonic signals, to have a larger number of electrodes E2, thereby improving the signal-to-noise ratio.

[0033] Figure 5 This is a schematic diagram of a fingerprint recognition device according to another embodiment of the present invention. Figure 3 The main difference between the two embodiments is that the control circuit 102 and the fingerprint sensor 106 are disposed on the same surface (side) of the substrate 102. Similarly, the control circuit 102 can be connected to the fingerprint sensor 106 via the conductor patterns P1-P3 and the connection holes V1-V3 to receive the fingerprint sensing signal provided by the fingerprint sensor 106 and provide a fingerprint recognition signal to the flexible printed circuit board FP1 based on the fingerprint sensing signal.

[0034] Figure 6 This is a schematic diagram of a fingerprint recognition device according to another embodiment of the present invention. Figure 5 The main difference between the two embodiments is that the substrate 102 has a recess H1, where the control circuit 102 and the flexible printed circuit board FP1 can be disposed. The conductive pattern P5 in recess H1 can be connected to the conductive pattern P3 via the connection hole V5. Therefore, the control circuit 102 can be connected to the fingerprint sensor 106 via the conductive patterns P1-P3, P5 and the connection holes V1, V3, and V5, and to the flexible printed circuit board FP1 via the conductive pattern P5. The provision of recess H1 reduces the height (thickness) of the area where the control circuit 102 and the flexible printed circuit board FP1 are located, thereby facilitating miniaturization of the fingerprint recognition device. The depth D1 of recess H1 can be, for example, 20 μm, but is not limited to this. In this embodiment, recess H1 is disposed on the same side as the fingerprint sensor 106, but this is not a limitation. In other embodiments, recess H1 can also be disposed on the side of the substrate 102 opposite the fingerprint sensor 106. Similarly, the control circuit 102 can be disposed within recess H1 on the side opposite the fingerprint sensor 106.

[0035] In summary, the control circuit of this novel embodiment can be connected to the fingerprint sensor via the connection holes and the substrate's conductive pattern, eliminating the need for bonding wires to transmit fingerprint sensing signals. This effectively reduces signal transmission distance, thereby effectively reducing transmission loss of fingerprint sensing signals and improving fingerprint recognition quality. Furthermore, eliminating the need for bonding wires reduces the assembly process and reduces the size of the fingerprint recognition device.

[0036] Although the present invention has been disclosed above by way of embodiments, they are not intended to limit the present invention. Any person skilled in the art may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the claims.

Claims

1. A fingerprint recognition device, characterized in that: include: substrate; a plurality of conductor patterns, respectively formed in the substrate or on the surface of the substrate; Fingerprint sensor; as well as A control circuit is connected to the fingerprint sensor through at least one connection hole and the plurality of conductor patterns. The control circuit controls the fingerprint sensor to perform a fingerprint sensing operation, so as to receive a fingerprint sensing signal provided by the fingerprint sensor and provide a fingerprint recognition signal according to the fingerprint sensing signal.

2. The fingerprint recognition device according to claim 1, characterized in that The fingerprint sensor includes a transmitting electrode layer and a receiving electrode layer, and the number of electrodes included in the transmitting electrode layer is greater than the number of electrodes included in the receiving electrode layer.

3. The fingerprint recognition device according to claim 2, characterized in that: The spacing between the multiple electrodes included in the transmitting electrode layer is 50um to 150um, and the spacing between the multiple electrodes included in the receiving electrode layer is 50um to 150um.

4. The fingerprint recognition device according to claim 1, wherein: The fingerprint sensor includes an upper electrode layer, a piezoelectric material layer, and a lower electrode layer, wherein the lower electrode layer is formed by at least a portion of the plurality of conductor patterns formed on the surface of the substrate.

5. The fingerprint recognition device according to claim 4, characterized in that: One of the upper electrode layer and the lower electrode layer serves as a transmitting electrode layer, and the other of the upper electrode layer and the lower electrode layer serves as a receiving electrode layer. The number of electrodes in the transmitting electrode layer is greater than the number of electrodes in the receiving electrode layer.

6. The fingerprint recognition device according to claim 5, characterized in that: The upper electrode layer includes a plurality of first electrodes, the lower electrode layer includes a plurality of second electrodes, and the spacing between the plurality of first electrodes and the spacing between the plurality of second electrodes are 50 um to 150 um.

7. The fingerprint recognition device according to claim 4, characterized in that: The fingerprint sensor has a rectangular fingerprint sensing area, the lower electrode layer includes a plurality of first electrodes extending along the long side direction of the fingerprint sensing area and arranged along the short side direction of the fingerprint sensing area, and the upper electrode layer includes a plurality of second electrodes extending along the short side direction and arranged along the long side direction.

8. The fingerprint recognition device according to claim 7, characterized in that: The upper electrode layer serves as an emitting electrode layer, the lower electrode layer serves as a receiving electrode layer, and the number of the plurality of second electrodes is greater than the number of the plurality of first electrodes.

9. The fingerprint recognition device according to claim 4, characterized in that: The fingerprint sensor has a rectangular fingerprint sensing area, the lower electrode layer includes a plurality of first electrodes extending along the short side direction of the fingerprint sensing area and arranged along the long side direction of the fingerprint sensing area, and the upper electrode layer includes a plurality of second electrodes extending along the long side direction and arranged along the short side direction.

10. The fingerprint recognition device according to claim 9, characterized in that: The lower electrode layer serves as an emitting electrode layer, the upper electrode layer serves as a receiving electrode layer, and the number of the plurality of first electrodes is greater than the number of the plurality of second electrodes.

11. The fingerprint recognition device according to claim 1, wherein: The multiple conductor patterns include a first conductor pattern formed on the first surface of the substrate and a second conductor pattern formed on the second surface of the substrate opposite to the first surface. The at least one connection hole includes a first connection hole, and the first connection hole connects the first conductor pattern and the second conductor pattern. The control circuit is connected to the fingerprint sensor through the first conductor pattern, the second conductor pattern and the first connection hole. The fingerprint sensor is arranged on the first surface, and the control circuit is arranged on the second surface.

12. The fingerprint recognition device according to claim 1, wherein: The multiple conductor patterns include a first conductor pattern formed on the first surface of the substrate, a second conductor pattern formed on the second surface of the substrate opposite to the first surface, and a third conductor pattern formed in the substrate. The at least one connection hole includes a first connection hole and a second connection hole. The control circuit is connected to the fingerprint sensor through the first connection hole, the second connection hole, the first conductor pattern, the second conductor pattern, and the third conductor pattern.

13. The fingerprint recognition device according to claim 1, wherein: The multiple conductor patterns include a first conductor pattern formed on the first surface of the substrate and a second conductor pattern formed in the substrate. The at least one connection hole includes a first connection hole and a second connection hole. The fingerprint sensor and the control circuit are arranged on the first surface. The control circuit is connected to the fingerprint sensor through the first connection hole, the second connection hole, the first conductor pattern and the second conductor pattern.

14. The fingerprint recognition device according to claim 13, characterized in that: The plurality of conductor patterns further include a third conductor pattern formed in the substrate, the at least one connection hole further includes a third connection hole, and the control circuit is further connected to the fingerprint sensor through the third connection hole and the third conductor pattern.

15. The fingerprint recognition device according to claim 13, wherein: The substrate has a groove, the control circuit is arranged in the groove, the multiple conductor patterns also include a third conductor pattern, the at least one connection hole also includes a third connection hole, and the control circuit is further connected to the fingerprint sensor through the third connection hole and the third conductor pattern, wherein the third conductor pattern is formed in the groove.

16. The fingerprint recognition device according to claim 1, wherein: The fingerprint sensor is an ultrasonic fingerprint sensor.

17. The fingerprint recognition device according to claim 1, wherein: The substrate is a multi-layer substrate formed by stacking a plurality of sub-substrates.

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