Compressed solid-state storage hard disk module testing device based on PCIe-64P interface

Abstract

The utility model discloses a PCIe-64P interface-based compressed solid-state storage hard disk module testing device. The PCIe-64P interface-based compressed solid-state storage hard disk module testing device comprises a circuit board, an adjusting and fixing assembly, a board-to-board connector and a heat dissipation part, the adjusting and fixing assembly, the board-to-board connector and the heat dissipation part are respectively arranged on the same surface of the circuit board; the board-to-board connector is screwed on the circuit board through a height adjusting screw, and a compressed solid-state storage hard disk module is positioned and mounted on the board-to-board connector; and the adjusting and fixing assembly is used for compressing and fixing the compressed solid-state storage hard disk module. Precise positioning of the compressed solid-state storage hard disk module is achieved through the board-to-board connector, pressing and fixing are achieved in cooperation with the adjusting and fixing assembly, the structural stability in the testing process is improved, meanwhile, the safety in the testing process is improved through the configured heat dissipation pad, and the testing efficiency is improved. The adjustable effect of the adjusting and fixing assembly can meet the test requirements of compressed solid-state storage hard disk modules of different specifications, and the applicability is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of equipment testing, and in particular to a compression solid-state storage hard disk module testing device based on a PCIe-64P interface. Background Art

[0002] The Mini-Compression Storage Disk Module (mCSDM) and the (standard-size) Compression Storage Disk Module (CSDM) are next-generation storage hard drive modules, primarily connected via board-to-board connectors. Due to their extremely short and highly consistent spring pins, these high-precision, tiny board-to-board spring pin connections are particularly suitable for high-frequency transmission applications.

[0003] Compression storage hard drive modules are the next generation of storage hard drive technology. High-speed reading and writing is one of its key parameters. Testing the reading and writing speed requires lossless and stable connection to the test equipment. However, during mass production and testing of compression storage hard drive modules by manufacturers, board-to-board installation requires locking and fixing with screws. This operation is complex and not conducive to efficient batch operation. It is also prone to installation mismatch, resulting in poor stability of the connection with the test equipment.

[0004] Meanwhile, existing compression solid-state storage hard disk module testing devices can only test compression solid-state storage hard disk modules of a single specification, and have low compatibility and poor applicability. Utility Model Content

[0005] In view of the above problems, the present invention is proposed to provide a compressed solid-state storage hard disk module testing device based on the PCIe-64P interface, which overcomes the above problems or at least partially solves the above problems.

[0006] The present invention provides a compressed solid-state storage hard disk module testing device based on the PCIe-64P interface, the compressed solid-state storage hard disk module testing device based on the PCIe-64P interface comprising: a circuit board, an adjusting and fixing component, a board-to-board connector and a heat dissipation portion; the circuit board is provided with a PCIe-64P interface; the adjusting and fixing component, the board-to-board connector and the heat dissipation portion are respectively arranged on the same surface of the circuit board, wherein the heat dissipation portion, the board-to-board connector and the adjusting and fixing component are coaxially arranged in sequence from top to bottom; the board-to-board connector is screwed onto the circuit board by a height adjustment screw, and a compressed solid-state storage hard disk module is positioned and mounted on the board-to-board connector; the heat dissipation portion comprises a heat dissipation copper sheet adhered to the circuit board and heat dissipation silica gel covered on the outside of the heat dissipation copper sheet, the heat dissipation silica gel adhered to the compressed solid-state storage hard disk module; the adjusting and fixing component presses and fixes the compressed solid-state storage hard disk module.

[0007] Optionally, an avoidance gap is formed between the board-to-board connector and the adjustment and fixing assembly in the vertical direction.

[0008] Optionally, the adjustment and fixing assembly includes a first connecting member, a second connecting member, a third connecting member, a pressure plate member, a snap assembly and a torsion spring; the first connecting member is screwed and fixed to the circuit board; the second connecting member is hinged to the first connecting member through a first pin; the snap assembly is hinged in the second connecting member through a second pin, and the snap assembly is snapped to the first connecting member; the second connecting member is fixedly connected to a third connecting member at one end away from the first connecting member, and the third connecting member is hinged to the pressure plate member through a third pin.

[0009] Optionally, the torsion spring is sleeved on the first latch.

[0010] Optionally, the pressure plate is provided with a movable groove at one end facing the compressed solid-state storage hard disk module, a connecting screw is threaded in the movable groove, and an end head is threaded on the connecting screw; a first return spring is sleeved on the connecting screw, one end of the first return spring is supported on the bottom of the movable groove, and the other end of the first return spring is supported on the inner side of the end head.

[0011] Optionally, a buffer pad is provided on the outer side of the end head.

[0012] Optionally, the interior of the second connecting member is hollow, and the snap assembly is hinged inside the second connecting member through the second pin; the snap assembly includes a snap member and a handle, the snap member is an L-shaped structure, the bending point of the snap member is hinged to the second pin, and the handle is arranged at one end of the bending point of the snap member and extends to the outside of the second connecting member.

[0013] Optionally, a snap port is provided at the upper end of the snap member, and the first connecting member is provided with a stepped snap opening corresponding to the position of the snap port, and the snap port is snap-connected with the snap.

[0014] Optionally, a second return spring is provided at the lower end of the latch along the rotation direction, and the second return spring is fixedly arranged inside the second connecting member.

[0015] Optionally, a fixing bracket and bracket fixing screws may be further provided on the side of the circuit board.

[0016] The technical solution provided in the embodiments of the present invention has at least the following technical effects or advantages:

[0017] The compressed solid-state storage hard disk module testing device based on the PCIe-64P interface described in the embodiment of the present utility model realizes precise positioning of the compressed solid-state storage hard disk module through a board-to-board connector, and realizes compression and fixation in conjunction with the adjustment and fixing components, thereby improving the structural stability during the test process. At the same time, the configured heat dissipation pad also improves the safety of the test process. The adjustable effect of the adjustment and fixing components can be applied to the test requirements of compressed solid-state storage hard disk modules of different specifications, thereby improving applicability.

[0018] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 This is a front view of the PCIe-64P interface-based compressed solid-state storage hard disk module testing device of the present invention;

[0021] Figure 2 This is a side view of the test device for the compressed solid-state storage hard disk module based on the PCIe-64P interface of the present invention;

[0022] Figure 3 This is a schematic diagram of the assembly of a micro-compression storage hard disk module;

[0023] Figure 4This is a schematic diagram of the assembly of a standard size compression storage hard disk module;

[0024] Figure 5 It is a side sectional view of the pressing plate;

[0025] Figure 6 A side cross-sectional view of the snap assembly.

[0026] Description of reference numerals:

[0027] 1. Circuit board; 2. Adjustment and fixing assembly; 3. Board-to-board connector; 4. Heat dissipation unit; 5. Fixing bracket; 6. PCIe-64P interface; 7. Micro compression storage hard disk module; 8. Standard size compression storage hard disk module; 21. First connecting member; 22. Second connecting member; 23. Third connecting member; 24. Pressure plate; 25. First latch; 26. Second latch; 27. Buckle assembly; 28. Third latch; 29. ​​Torsion spring; 30. Height adjustment screw; 50. Bracket fixing screw; 210. Bayonet; 241. Movable slot; 242. First return spring; 243. End; 244. Connecting screw; 271. Buckle handle; 272. Buckle port; 273. Buckle; 274. Second return spring. DETAILED DESCRIPTION

[0028] Exemplary embodiments of the present disclosure will be described below in more detail with reference to the accompanying drawings.

[0029] In order to enable those skilled in the art to better understand the present invention, the following will be combined with the accompanying drawings of the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. The accompanying drawings show preferred embodiments of the present invention. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0030] Unless otherwise specified, various raw materials, instruments and equipment used in the present invention can be purchased from the market or prepared by existing methods.

[0031] Figure 1 This is a front view of the PCIe-64P interface-based compressed solid-state storage hard disk module testing device described in the present invention. Figure 2 This is a side view of the test device for the compressed solid-state storage hard disk module based on the PCIe-64P interface of the present invention, see Figure 1-2As shown, the compressed solid-state storage hard disk module testing device based on the PCIe-64P interface includes a circuit board 1, an adjustment and fixing component 2, a board-to-board connector 3 and a heat dissipation part 4; the circuit board 1 is provided with a PCIe-64P interface 6 for high-speed communication with the CPU; the adjustment and fixing component 2, the board-to-board connector 3 and the heat dissipation part 4 are respectively arranged on the same side (for example, the front side) of the circuit board 1, wherein the heat dissipation part 4, the board-to-board connector 3 and the adjustment and fixing component 2 are coaxially arranged in sequence from top to bottom. Of course, it should be noted that in other embodiments, according to actual application requirements, the heat dissipation part 4, the board-to-board connector 3 and the adjustment and fixing component 2 can also be coaxially arranged along other directions, such as horizontal direction, inclined direction, etc.

[0032] The compression storage hard disk module can be, for example, a micro compression storage hard disk module 7, a standard size compression storage hard disk module 8, an extended compression storage hard disk module, etc. Figure 3-4 As shown, Figure 3 This is a schematic diagram of the assembly of the micro compression storage hard disk module 7. Figure 4 It is a schematic diagram of the assembly of the standard size compression storage hard disk module 8.

[0033] The heat dissipation portion 4 includes a heat dissipation copper sheet adhered to the circuit board 1 and heat dissipation silica gel covered on the outside of the heat dissipation copper sheet. The heat dissipation silica gel adheres to the compressed solid-state storage hard disk module and can be used to provide heat dissipation function.

[0034] The board-to-board connector 3 is screwed onto the circuit board 1 via a height adjustment screw 30. According to actual application requirements, for compressed solid-state storage hard disk modules of different specifications, the position of the board-to-board connector 3 can be adjusted by adjusting the screwing height of the height adjustment screw 30, so as to facilitate stable connection with the compressed solid-state storage hard disk module; the board-to-board connector 3 is connected to the circuit of the M.2 interface, and at the same time, the side of the board-to-board connector 3 facing the compressed solid-state storage hard disk module is provided with a spring needle connection module and a positioning column that match the compressed solid-state storage hard disk module, and the spring needle connection module and the positioning column cooperate with the positioning hole (or positioning plate groove) of the compressed solid-state storage hard disk module to form precise positioning.

[0035] In an embodiment of the present invention, an avoidance gap is formed in the vertical direction between the board-to-board connector 3 and the adjustment and fixing component 2, so as to provide an avoidance area when the compressed solid-state storage hard disk module is fixed, thereby improving the flexibility during installation, so that it can be suitable for compressed solid-state storage hard disk modules of different specifications; at the same time, the area where the avoidance gap is located can also be used to place decoupling filter capacitors to improve the power supply quality.

[0036] The adjusting and fixing assembly 2 is used to compress and fix the compressed solid-state storage hard disk module positioned and mounted on the board-to-board connector 3 .

[0037] The adjusting and fixing assembly 2 includes a first connecting member 21, a second connecting member 22, a third connecting member 23, a pressing plate 24, a buckle assembly 27 and a torsion spring 29; the first connecting member 21 is screwed and fixed to the circuit board 1; the second connecting member 22 is hinged to the first connecting member 21 through a first latch 25, and the first latch 25 is sleeved with the torsion spring 29, which can provide a reset function based on prestress; the buckle assembly 27 is hinged in the second connecting member 22 through a second latch 26, and the buckle assembly 2 7 is snap-fitted with the first connecting member 21; the second connecting member 22 is fixedly connected to the third connecting member 23 at one end away from the first connecting member 21, and the third connecting member 23 is hinged to the pressure plate member 24 through a third pin 28; thereby, by adjusting the spatial positions of the first connecting member 21, the second connecting member 22, the third connecting member 23 and the pressure plate member 24, when the snap assembly 27 is snap-fitted and fixed with the first connecting member 21, the pressure plate member 24 can be supported on the back of the compressed solid-state storage hard disk module to press and fix it.

[0038] Combine Figure 5 As shown, Figure 5 This is a side sectional view of the pressure plate 24, wherein the pressure plate 24 is provided with a movable groove 241 at one end facing the compressed solid-state storage hard disk module, and a connecting screw 244 is screwed in the movable groove 241, and an end head 243 is screwed on the connecting screw 244, and a buffer pad can be provided on the outside of the end head 243, and the buffer pad can be made of a flexible material such as rubber, which is used to avoid damage to the compressed solid-state storage hard disk module due to hard collision; a first return spring 242 is sleeved on the connecting screw 244, and one end of the first return spring 242 is supported on the bottom of the movable groove 241, and the other end of the first return spring 242 is supported on the inner side of the end head 243. By adjusting the connecting screw 244, the extension distance of the end head 243 can be adjusted accordingly, and the compressed solid-state storage hard disk module can be compressed by cooperating with the elastic action of the first return spring 242.

[0039] Combine Figure 6 As shown, Figure 6It is a side sectional view of the snap assembly 27. The interior of the second connecting member 22 is hollow, and the snap assembly 27 is hinged inside the second connecting member 22 through the second pin 26. The snap assembly 27 includes a snap member 273 and a handle 271. The snap member 273 is an L-shaped structure. The bending point of the snap member 273 is hinged to the second pin 26. The handle 271 is arranged at one end of the bending point of the snap member 273 and extends to the outside of the second connecting member 22, so as to facilitate external control of the rotation angle of the snap member 273.

[0040] A latch port 272 is provided at the upper end of the latch 273, and a stepped latch port 210 is provided on the first connecting member 21 corresponding to the position of the latch port 272. By controlling the rotation angle of the latch 273, the latch port 272 can be connected or separated from the latch accordingly.

[0041] A second return spring 274 is provided at the lower end of the latch 273 along the rotation direction. The second return spring 274 is fixedly arranged inside the second connecting member 22, so that when controlling the rotation angle of the latch 273, the second return spring 274 can provide a certain return elastic effect.

[0042] Optionally, a fixing bracket 5 and a bracket fixing screw 50 may be further provided on the side of the circuit board 1. The circuit board 1 can be fixedly connected to an external support structure through the fixing bracket 5 and the bracket fixing screw 50 to provide physical support.

[0043] The compressed solid-state storage hard disk module testing device based on the PCIe-64P interface described in the embodiment of the present utility model realizes precise positioning of the compressed solid-state storage hard disk module through the board-to-board connector 3, and realizes compression fixation in conjunction with the adjustment and fixing component 2, thereby improving the structural stability during the test process. At the same time, the configured heat dissipation pad also improves the safety of the test process. The adjustable effect of the adjustment and fixing component 2 can be applied to the test requirements of compressed solid-state storage hard disk modules of different specifications, thereby improving applicability.

[0044] In the description provided herein, numerous specific details are described. However, it is understood that embodiments of the present invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques are not shown in detail so as not to obscure the understanding of this description.

[0045] Similarly, it should be understood that in order to streamline the present disclosure and aid in understanding one or more of the various invention aspects, in the above description of exemplary embodiments of the invention, various features of the invention are sometimes grouped together into a single embodiment, figure, or description thereof. However, this disclosed approach should not be interpreted as reflecting an intention that the claimed invention requires more features than are expressly recited in each claim. Rather, as reflected in the claims, the invention aspects lie in less than all of the features of the individual embodiments previously disclosed. Accordingly, the claims that follow the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of the invention.

[0046] It should be noted that the above-mentioned embodiments illustrate rather than limit the invention and that those skilled in the art will be able to design alternative embodiments without departing from the scope of the appended claims.

Claims

1. A compression solid-state storage hard disk module testing device based on PCIe-64P interface, characterized in that: The compressed solid-state storage hard disk module testing device based on the PCIe-64P interface includes: a circuit board, an adjustment and fixing component, a board-to-board connector and a heat dissipation part; the circuit board is provided with a PCIe-64P interface; the adjustment and fixing component, the board-to-board connector and the heat dissipation part are respectively arranged on the same surface of the circuit board, wherein the heat dissipation part, the board-to-board connector and the adjustment and fixing component are coaxially arranged in sequence from top to bottom; the board-to-board connector is screwed to the circuit board by a height adjustment screw, and a compressed solid-state storage hard disk module is positioned and installed on the board-to-board connector; the heat dissipation part includes a heat dissipation copper sheet bonded to the circuit board and heat dissipation silica gel covered on the outside of the heat dissipation copper sheet, and the heat dissipation silica gel is bonded to the compressed solid-state storage hard disk module; the adjustment and fixing component presses and fixes the compressed solid-state storage hard disk module.

2. The PCIe-64P interface-based compressed solid-state storage hard disk module testing device according to claim 1, characterized in that: An avoidance gap is formed between the board-to-board connector and the adjusting and fixing assembly in a vertical direction.

3. The PCIe-64P interface-based compressed solid-state storage hard disk module testing device according to claim 1, characterized in that: The adjustment and fixing assembly includes a first connecting member, a second connecting member, a third connecting member, a pressure plate, a snap assembly and a torsion spring; the first connecting member is screwed and fixed to the circuit board; the second connecting member is hinged to the first connecting member through a first pin; the snap assembly is hinged in the second connecting member through a second pin, and the snap assembly is snapped to the first connecting member; the second connecting member is fixedly connected to a third connecting member at one end away from the first connecting member, and the third connecting member is hinged to the pressure plate through a third pin.

4. The PCIe-64P interface-based compressed solid-state storage hard disk module testing device according to claim 3, characterized in that: The torsion spring is sleeved on the first latch.

5. The device for testing a compressed solid-state storage hard disk module based on a PCIe-64P interface according to claim 3, wherein: The pressure plate is provided with a movable groove at one end facing the compressed solid-state storage hard disk module, a connecting screw is threaded in the movable groove, and an end head is threaded on the connecting screw; a first return spring is sleeved on the connecting screw, one end of the first return spring is supported on the bottom of the movable groove, and the other end of the first return spring is supported on the inner side of the end head.

6. The device for testing a compressed solid-state storage hard disk module based on a PCIe-64P interface according to claim 5, characterized in that: A buffer pad is provided on the outer side of the end head.

7. The device for testing a compressed solid-state storage hard disk module based on a PCIe-64P interface according to claim 3, wherein: The interior of the second connecting member is hollow, and the snap assembly is hinged inside the second connecting member through the second pin; the snap assembly includes a snap member and a handle, the snap member is an L-shaped structure, the bending point of the snap member is hinged to the second pin, and the handle is arranged at one end of the bending point of the snap member and extends to the outside of the second connecting member.

8. The device for testing a compressed solid-state storage hard disk module based on a PCIe-64P interface according to claim 7, wherein: A buckle port is provided at the upper end of the buckle member, and a stepped buckle port is provided at a position corresponding to the buckle port, and the buckle port is buckled with the buckle.

9. The device for testing a compressed solid-state storage hard disk module based on a PCIe-64P interface according to claim 7, wherein: A second return spring is provided at the lower end of the latch member along the rotation direction, and the second return spring is fixedly arranged inside the second connecting member.

10. The device for testing a compressed solid-state storage hard disk module based on a PCIe-64P interface according to claim 1, wherein: A fixing bracket and bracket fixing screws are also provided on the side of the circuit board.

Images