Forming mechanism for improving flatness of white glue of product and LED product

Abstract

The utility model relates to the technical field of LED packaging, in particular to a forming mechanism for improving flatness of white glue of a product and an LED product, the forming mechanism comprises a substrate, a plurality of LED units and a flexible glue release film, and the LED units are installed on the substrate; the flexible glue release film covers the surface, away from the substrate, of the LED unit, so that a glue injection space used for injecting white glue is formed between the flexible glue release film and the substrate, the forming mechanism solves the problem that the white glue of a product is uneven by changing the space filling mode and the filling space for filling the white glue, and the consistency of the lighting effect of the product is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of automobile handles, in particular to a molding mechanism for improving the flatness of white glue of a product and an LED product. Background Art

[0002] The existing LED products on the market made of ceramic (aluminum nitride or aluminum oxide) / CSP / FR4 / PCT / SMC / EMC flat substrates all use the white wall process to produce white light. The current white wall development process uses glue dispensers / glue injectors / glue scribing machines to apply and fill the white glue to allow the glue to flow smoothly. The self-flowing process of the white glue is affected by the viscosity and fluidity of the white glue. The surface of the white glue after baking and curing will not be very flat, and the side of the product will appear uneven after cutting. Figure 1 As shown, the product will have edge light leakage and uneven light when emitting light. Utility Model Content

[0003] In order to solve the problem of light leakage at the edge and uneven light caused by the uneven surface of the existing LED white glue in the prior art, the utility model provides a molding mechanism and LED product that improves the flatness of the product white glue and enhances the consistency of the product light output.

[0004] The technical solution adopted by the utility model to solve its technical problems is:

[0005] A molding mechanism for improving the flatness of white glue products, comprising:

[0006] substrate,

[0007] A plurality of LED units, wherein the LED units are mounted on a substrate;

[0008] A soft adhesive release film is covered on the surface of the LED unit away from the substrate, so that a glue injection space for injecting white glue is formed between the soft adhesive release film and the substrate.

[0009] Furthermore, the molding mechanism also includes a mold for injecting glue, and the mold is provided with a mold cavity for placing the substrate together with the LED unit and the soft glue release film. The soft glue release film is arranged between the substrate and the mold, and the white glue molding does not contact the mold, thereby eliminating the flatness of the white glue molding surface caused by the step difference caused by factors such as flatness error during mold manufacturing.

[0010] Furthermore, the LED units are arranged in an array along at least two directions on the substrate. The LED units are evenly distributed, which can ensure a uniform effect of filling with white glue.

[0011] Furthermore, the LED unit and the substrate are fixed in a face-down or flip-down manner.

[0012] An LED product is formed by using the above-mentioned molding mechanism to form white glue. The LED unit includes a wafer and a fluorescent silicone sheet attached to the wafer.

[0013] Furthermore, the upper surface of the LED product is also provided with a mist-like adhesive film.

[0014] Beneficial effects:

[0015] (1) The molding mechanism of the utility model improves the unevenness of the white glue of the product by changing the space filling method and filling space of the white glue, thereby improving the consistency of the light effect of the product;

[0016] (2) Improve the efficiency of process production, simple structure and low cost;

[0017] (3) The molding mechanism of the present invention will not change the structure and optical characteristics of the LED product itself. The client does not need to make any design modifications during use and can directly replace it. The product has higher stability and better effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 It is a schematic diagram of the uneven surface of white glue in the prior art;

[0020] Figure 2 It is a schematic cross-sectional view of the forming mechanism of the present invention in the first direction;

[0021] Figure 3 It is a schematic cross-sectional view in the second direction of the forming mechanism of the present invention;

[0022] Figure 4 This is a schematic diagram of the effect of filling the molding mechanism of the utility model with white glue.

[0023] 1. Substrate, 2. Chip, 3. Soft release film, 4. White glue. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is in no way intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0026] Unless otherwise specifically stated, the relative arrangement of the parts and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to actual proportional relationships. The technology, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be considered as part of the specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following figures, and therefore, once an item is defined in one figure, it does not need to be further discussed in subsequent figures.

[0027] In the description of the present invention, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "horizontal, vertical, vertical, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention; the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself.

[0028] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figures. For example, if the device in the drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0029] In addition, it should be noted that the use of words such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above words have no special meaning and therefore cannot be understood as limiting the scope of protection of this utility model.

[0030] like Figures 2-3 .A molding mechanism for improving the flatness of white glue of a product, comprising a substrate 1, a plurality of LED units and a soft glue release film 3, wherein the LED units are mounted on the substrate 1; the soft glue release film 3 covers the surface of the LED units away from the substrate 1, so that a glue injection space for injecting white glue 4 is formed between the soft glue release film 3 and the substrate 1.

[0031] The molding mechanism also includes a mold for injecting glue, and the mold is provided with a mold cavity for placing the substrate 1 together with the LED unit and the soft glue release film 3.

[0032] The LED units are arranged in an array along at least two directions on the substrate 1. The LED units are fixed to the substrate 1 in a face-up or face-down manner.

[0033] An LED product is formed by using the above-mentioned molding mechanism to form white glue, wherein the LED unit comprises a chip 2 and a fluorescent silicone sheet attached to the chip 2. A mist-like glue film is also provided on the upper surface of the LED product.

[0034] The utility model adopts a molding mechanism to fill white glue, which can be injected manually or by equipment such as molds. Taking the use of equipment for injection as an example, the following steps are included:

[0035] 1. Die bonding: Fix the LED chip on the substrate with conductive glue or other adhesive and solidify it;

[0036] 2. Wire bonding: Connect the electrodes of the chip 2 to the bottom substrate 1 through conductive wires to form a conductive connection;

[0037] 3. Apply fluorescent film: stick the square film on the surface of chip 2 and solidify it in the same way as the solid chip 2. The square film here is a fluorescent silicone sheet for making white light. Sticking the fluorescent silicone sheet on the blue light chip can emit white light.

[0038] 4. Place the substrate 1 and the wafer 2 on it in the mold and pad it with a soft release film 3 to compensate for the unevenness of the product flatness;

[0039] 5. Filling with white glue: Fill the sidewalls of the wafer with white glue neatly through a mold and solidify it for a long time. Specifically, inject white glue 4 into the mold groove and fill it completely. After the mold is heated and the white glue 4 is slightly solidified, the product in the mold is taken out and the surface release film 3 is peeled off before placing it in an oven for a long time of baking and solidification.

[0040] 6. Pressing mold: Press a layer of mist film on the surface of the product;

[0041] 7. Cutting: Cut the whole product into individual LED finished products;

[0042] 8. Test taping: Conduct electrical tests on LED products before taping and packaging.

[0043] The molding mechanism of the utility model improves the unevenness of the white glue of the product by changing the space filling method and filling space of the white glue. The filling effect is as follows: Figure 4 As shown, improve the consistency of product lighting effect

[0044] The above are only preferred specific implementation methods of the present invention, but the protection scope of the present invention is not limited to them. Any technician familiar with the technical field can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention within the technical scope disclosed by the present invention, and they should be covered by the protection scope of the present invention.

Claims

1. A molding mechanism for improving the flatness of white glue products, characterized by: include: base plate(1), A plurality of LED units, wherein the LED units are mounted on a substrate (1); A soft adhesive release film (3) is covered on the surface of the LED unit away from the substrate (1), so that a glue injection space for injecting white glue (4) is formed between the soft adhesive release film (3) and the substrate (1).

2. A molding mechanism for improving the flatness of white glue products according to claim 1, characterized in that The molding mechanism further comprises a mold for injecting glue, wherein the mold is provided with a mold cavity for placing the substrate (1) together with the LED unit and the soft glue release film (3).

3. A molding mechanism for improving the flatness of white glue products according to claim 1 or 2, characterized in that The LED units are arranged in an array along at least two directions on the substrate (1).

4. A molding mechanism for improving the flatness of white glue products according to claim 1, characterized in that The LED unit and the substrate (1) are fixed in a face-up or face-down manner.

5. An LED product, formed by molding white glue using the molding mechanism according to any one of claims 1 to 4, characterized in that: The LED unit comprises a chip (2) and a fluorescent silicone sheet attached to the chip (2).

6. The LED product according to claim 5, characterized in that: The upper surface of the LED product is also provided with a mist-like adhesive film.

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