Shading type base assembly and camera module

Abstract

The utility model relates to a shading type base assembly and a camera module, and the shading type base assembly comprises a circuit board; the photosensitive chip is provided with a photosensitive area and a non-photosensitive area located around the photosensitive area; a plurality of connecting lines; the shading base comprises an annular base body and a mounting part, the mounting part extends from the annular base body to the non-photosensitive area of the photosensitive chip, and at least part of one surface, opposite to the photosensitive chip, of the mounting part is an inclined surface; the light-transmitting element is provided with a light-transmitting area and a light-shielding area located around the light-transmitting area, and the light-transmitting element is fixedly arranged on the side, close to the light-sensing chip, of the installation part so that the light-shielding area can cover the connecting line. According to the shading type base assembly, the reflection direction of the light emitted to the mounting part is changed by using the inclined surface, and the shading area of the light-transmitting element of the shading type base assembly can shade stray light generated by reflection of the shading base and the light emitted to the connecting line, so that stray light generated by reflection of the connecting line is avoided, and the stray light problem in the camera module can be effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of camera modules, in particular to a light-shielding base assembly and a camera module. Background Art

[0002] With the development of intelligent driving technology, the application of in-vehicle camera modules is becoming increasingly mature, and more and more cars are equipped with camera modules to implement driver assistance systems. Among in-vehicle camera modules, the use of photosensitive chips packaged in COB (chip-on-board) packaging is becoming increasingly widespread. Typically, COB packages come with a protective base located between the lens and the photosensitive chip. The base's various surface components easily reflect light, generating stray light and affecting image quality. Utility Model Content

[0003] Based on this, it is necessary to provide a light-shielding base assembly and a camera module to address the problem that the COB package base of the existing vehicle-mounted camera module is prone to generating stray light.

[0004] A light-shielding base assembly, comprising:

[0005] Circuit board;

[0006] A photosensitive chip, the photosensitive chip being attached to the circuit board, the photosensitive chip having a photosensitive area and a non-photosensitive area located around the photosensitive area;

[0007] a plurality of connecting wires, one end of each connecting wire being connected to the circuit board, and the other end of each connecting wire being connected to the non-photosensitive area of ​​the photosensitive chip;

[0008] a light-shielding base, the light-shielding base comprising an annular base and a mounting portion, the annular base protruding from the circuit board to surround the photosensitive chip, the mounting portion extending from the annular base toward the non-photosensitive area of ​​the photosensitive chip, a surface of the mounting portion facing away from the photosensitive chip being at least partially an inclined surface, the inclined surface extending obliquely from a side of the mounting portion close to the annular base toward a direction close to the photosensitive chip to a side of the mounting portion away from the annular base; and

[0009] A light-transmitting element having a light-transmitting area and a light-shielding area around the light-transmitting area. The light-transmitting element is fixed on a side of the mounting portion close to the photosensitive chip so that the light-shielding area covers the connecting wire.

[0010] In one embodiment, the light-shielding base further includes a plurality of matting protrusions, and the matting protrusions are protruded from the inclined surface.

[0011] In one embodiment, the matte protrusions are arranged in a zigzag shape on the inclined surface.

[0012] In one embodiment, the light-transmitting element includes a light-transmitting sheet and an ink layer, the ink layer is printed on the light-transmitting sheet in a circumferential manner to form the light-shielding area and the light-transmitting area on the surface of the light-transmitting sheet, and the inner diameter of the ink layer is smaller than the inner diameter of the mounting portion.

[0013] In one embodiment, the ink layer is located on the surface of the light-transmitting sheet close to the photosensitive chip.

[0014] In one embodiment, the ink layer is located on the surface of the light-transmitting sheet away from the photosensitive chip.

[0015] In one embodiment, the surface of the light-transmitting sheet has an anti-reflection film or a light-filtering film.

[0016] In one embodiment, the light-transmitting sheet is bonded to the mounting portion.

[0017] In one embodiment, the light-shielding base has a matte black surface.

[0018] In one embodiment, the light-shielding base assembly further includes a filter element, and the filter element is disposed on a side of the light-shielding base away from the photosensitive chip.

[0019] A camera module, comprising:

[0020] A light-shielding base assembly as described in any one of the above; and

[0021] The lens assembly is mounted on the light-shielding base assembly.

[0022] The mounting portion of the light-shielding base of the above-mentioned light-shielding base assembly uses the inclined surface to change the reflection direction of the light directed toward the mounting portion, so that the stray light generated by the reflection of the mounting portion cannot be directed toward the photosensitive area of ​​the photosensitive chip. The light-shielding area of ​​the light-transmitting element of the light-shielding base assembly can not only block the stray light generated by the reflection of the light-shielding base, but also block the light directed toward the connecting wire, thereby avoiding the stray light generated by the reflection of the connecting wire, which can effectively improve the stray light problem in the camera module and improve the imaging quality of the camera module. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic structural diagram of a camera module provided in one embodiment of the present application;

[0024] Figure 2 A schematic structural diagram of a light-shielding base assembly of a camera module according to the above embodiment of the present application is shown;

[0025] Figure 3 A partially enlarged schematic diagram of a light-shielding base of a light-shielding base assembly of a camera module according to the above embodiment of the present application is shown;

[0026] Figure 4 A schematic diagram of a COB packaging base according to a prior art solution;

[0027] Figure 5 A light diagram of another COB packaging base in the prior art;

[0028] Figure 6 A light diagram of an example of a light-shielding base assembly of the present application;

[0029] Figure 7 A schematic diagram of light when the light-transmitting element of the light-shielding base assembly of the present application is installed upright;

[0030] Figure 8 A schematic diagram of light rays when the light-transmitting element of the light-shielding base assembly of the present application is inverted;

[0031] Figure 9 A light diagram of another example of the light-shielding base assembly of the present application.

[0032] Figure numerals: 11, circuit board; 12, photosensitive chip; 121, photosensitive area; 122, non-photosensitive area; 13, connecting line; 14, light-shielding base; 141, annular base; 142, mounting portion; 1421, inclined surface; 143, matte protrusion; 15, light-transmitting element; 151, light-transmitting area; 152, light-shielding area; 153, light-transmitting sheet; 154, ink layer; 16, filter element; P11, first circuit board; P12, first base; P13, first sensing chip; P14, first connecting line; P15, first light-transmitting element; P16, first filter; P21, second circuit board; P22, second base; P23, second sensing chip; P24, second connecting line; P25, second light-transmitting element. DETAILED DESCRIPTION

[0033] To make the above-mentioned objects, features, and advantages of the present invention more clearly understood, the following detailed description of specific embodiments of the present invention is provided in conjunction with the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art may make similar modifications without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0034] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.

[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this utility model, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0036] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0037] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0038] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0039] Based on the problem of stray light easily generated by the COB package base of existing vehicle-mounted camera modules, the present application provides a light-shielding base assembly and a camera module. The camera module may include a lens assembly and a light-shielding base assembly. The light-shielding base assembly is installed within the lens assembly. The light-shielding area of ​​the light-transmitting element of the light-shielding base assembly can not only block stray light generated by reflection from the light-shielding base, but also block light directed toward the connecting wires, preventing stray light generated by reflection from the connecting wires. This can effectively improve the stray light problem in the camera module and enhance the imaging quality of the camera module.

[0040] For details, please refer to Figures 1 to 3 In some embodiments, the light-shielding base assembly includes a circuit board 11, a photosensitive chip 12, a plurality of connecting wires 13, a light-shielding base 14 and a light-transmitting element 15. The photosensitive chip 12 is attached to the circuit board 11, and the photosensitive chip 12 has a photosensitive area 121 and a non-photosensitive area 122 located around the photosensitive area 121; one end of the connecting line 13 is connected to the circuit board 11, and the other end of the connecting line 13 is connected to the non-photosensitive area 122 of the photosensitive chip 12; the light-shielding base 14 includes an annular base body 141 and a mounting portion 142, the annular base body 141 is protruding from the circuit board 11 to surround the photosensitive chip 12, and the mounting portion 142 extends from the annular base body 141 toward the non-photosensitive area 122 of the photosensitive chip 12; the light-transmitting element 15 has a light-transmitting area 151 and a light-shielding area 152 located around the light-transmitting area 151, and the light-transmitting element 15 is fixed to a side of the mounting portion 142 close to the photosensitive chip 12 so that the light-shielding area 152 covers the connecting line 13.

[0041] It is understandable that the light-transmitting area 151 of the light-transmitting element 15 of the light-shielding base assembly can allow light to pass through so that the photosensitive chip 12 can sense and form an image, and the light-shielding area 152 of the light-transmitting element 15 can block stray light generated by reflection from the light-shielding base 14, preventing stray light generated by reflection from the light-shielding base 14 from being directed toward the photosensitive chip 12. Since the connector is usually implemented as an exposed gold wire, the light-shielding base assembly uses the light-shielding area 152 of the light-transmitting element 15 to block light directed toward the connector, thereby preventing stray light generated by reflection from the connecting wire 13. By installing the light-transmitting element 15 on the side of the mounting portion 142 of the light-shielding base 14 close to the photosensitive chip 12, the light-shielding base assembly can place the light-shielding area 152 closer to the connecting wire 13. While ensuring that there is no dark corner, more light directed toward the connecting wire 13 can be blocked, thereby effectively improving the stray light effect caused by the reflection of the gold wire in the existing COB package base.

[0042] More specifically, if Figure 2 As shown, in some embodiments, a surface of the mounting portion 142 facing away from the photosensitive component is at least partially formed into a sloped surface 1421. The sloped surface 1421 extends obliquely from the side of the mounting portion 142 close to the annular base 141 toward the photosensitive component to the side of the mounting portion 142 away from the annular base 141. With this configuration, the mounting portion 142 uses the sloped surface 1421 to change the reflection direction of light directed toward the mounting portion 142, preventing stray light reflected from the mounting portion 142 from entering the photosensitive area 121 of the photosensitive chip 12, thereby effectively alleviating the effect of stray light reflected from the light-shielding base 14.

[0043] Alternatively, as Figure 3 As shown, in some embodiments, the light shielding base 14 further includes a plurality of extinction protrusions 143, which are protruding from the inclined surface 1421. In this manner, the plurality of extinction protrusions 143 can increase the surface complexity of the inclined surface 1421, thereby reducing the reflectivity of the inclined surface 1421 to light, thereby improving the effect of stray light reflected by the light shielding base 14.

[0044] Preferably, if Figure 3 As shown, in one embodiment, the matt protrusions 143 are arranged in a zigzag shape on the inclined surface 1421. In other words, the matt protrusions 143 have a tooth-like structure. The matt protrusions 143 are arranged at intervals on the inclined surface 1421, so that the multiple matt protrusions 143 present a zigzag structure on the cross section of the mounting portion 142 along a plane perpendicular to the inclined surface 1421. In addition, according to the optical analysis requirements of the camera module, the matt protrusions 143 can also be implemented to have other structures such as an arc structure, and arranged on the inclined surface 1421 according to the arrangement obtained by analysis.

[0045] More preferably, in one embodiment, the light-shielding base 14 can be implemented as a black matte surface to weaken the reflection of light by absorbing light.

[0046] Alternatively, as Figure 2 As shown, in some embodiments, the light-transmitting element 15 includes a light-transmitting sheet 153 and an ink layer 154. The ink layer 154 is printed circumferentially on the light-transmitting sheet 153 to form the light-shielding area 152 and the light-transmitting area 151 on the surface of the light-transmitting sheet 153. The inner diameter of the ink layer 154 is smaller than the inner diameter of the mounting portion 142. In other words, the window size of the light-shielding base 14 is larger than the window size of the ink layer 154 of the light-transmitting element 15, that is, the distance between the light-shielding base 14 and the optical axis of the camera module is greater than the distance between the ink layer 154 of the light-transmitting element 15, so that the ink layer 154 can be used to block stray light generated by reflection from the sharp corners inside the light-shielding base 14, thereby preventing stray light from entering the photosensitive area 121 of the photosensitive chip 12.

[0047] Optionally, in some embodiments, the ink layer 154 is located on the surface of the light-transmitting sheet 153 close to the photosensitive chip 12 , that is, the light-transmitting element 15 is mounted upright on the light-shielding base 14 .

[0048] Preferably, in some embodiments, the ink layer 154 is located on the surface of the light-transmitting sheet 153 away from the photosensitive chip 12 , that is, the light-transmitting element 15 is flip-chip mounted on the light-shielding base 14 .

[0049] It can be understood that, while keeping the window size of the transparent element 15 and the light-shielding base 14 unchanged, the ink layer 154 in the structure of the transparent element 15 flipped on the light-shielding base 14 is closer to the photosensitive chip 12, and has a better light-shielding effect.

[0050] Optionally, in some embodiments, the light-transmitting sheet 153 may be implemented as a glass material, or may be implemented as a material of other light-transmitting materials.

[0051] Optionally, in some embodiments, the surface of the light-transmitting sheet 153 is provided with an anti-reflection film or a light filter. When the surface of the light-transmitting sheet 153 is provided with an anti-reflection film, it can reduce or eliminate reflected light from the surface of the light-transmitting sheet 153, thereby increasing the light transmittance of the light-transmitting element 15. When the surface of the light-transmitting sheet 153 is provided with a light filter, it can transmit light of a predetermined wavelength, thereby filtering out stray light from the external environment, thereby improving the imaging quality of the camera module.

[0052] Optionally, in some embodiments, the light-transmitting sheet 153 is bonded to the mounting portion 142. The light-transmitting sheet 153 can be bonded and fixed to the mounting portion 142 by adhesives such as glue to prevent impurities such as dust and water vapor from entering the light-shielding base 14 and contacting the photosensitive chip 12, thereby ensuring that the camera module has high imaging quality.

[0053] Optionally, in some embodiments, the annular base 141 is bonded to the circuit board 11. The annular base 141 can be bonded and fixed to the circuit board 11 by adhesives such as glue to prevent impurities such as dust and water vapor from entering the light-shielding base 14 and contacting the photosensitive chip 12, thereby ensuring that the camera module has high imaging quality.

[0054] Preferably, if Figure 2 As shown, in some embodiments, the inner diameter of the ink layer 154 is smaller than the inner diameter of the mounting portion 142. In other words, the window size of the light-shielding base 14 is larger than the window size of the ink layer 154 of the light-transmitting element 15, that is, the distance between the light-shielding base 14 and the optical axis of the camera module is greater than the distance between the ink layer 154 of the light-transmitting element 15, so that the ink layer 154 can be used to block stray light generated by reflection from the sharp corners inside the light-shielding base 14, thereby preventing stray light from entering the photosensitive area 121 of the photosensitive chip 12.

[0055] Preferably, if Figure 1 As shown, in some embodiments, the light-shielding base assembly may further include a filter element 16, which is disposed on a side of the light-shielding base 14 away from the photosensitive chip 12, and is used to pass light of a set wavelength so as to filter out stray light in the external environment and only allow light of a specific wavelength in the external environment to enter, which is beneficial to improving the imaging quality of the camera module.

[0056] For example, the light-shielding base assembly of the present application is further described below with reference to specific examples.

[0057] like Figure 4The figure shows a light schematic diagram of a COB packaging base of a solution in the prior art. The COB packaging base of this solution includes a first circuit board P11, a first base P12, a first sensing chip P13, a first connecting wire P14, a first light-transmitting element P15 and a first filter P16. In the COB packaging base of this solution, the first light-transmitting element P15 is mounted on the first base P12, and the silk-screen ink layer of the first light-transmitting element P15 is on the upper surface of the first light-transmitting element P15. The light a directed to the first base P12 is reflected by the first base P12 and directed into the photosensitive area 121 of the first sensing chip P13; the light b directed to the first connecting wire P14 is reflected by the first connecting wire P14, and after directed into the first filter P16, it is reflected by the first filter P16 and directed into the photosensitive area 121 of the first sensing chip P13. The silk-screen ink layer of the first light-transmitting element P15 cannot cover the light a and the light b.

[0058] like Figure 5 The figure shows a light schematic diagram of a COB packaging base of another solution in the prior art. The COB packaging base of the other solution includes a second circuit board P21, a second base P22, a second sensing chip P23, a second connecting line P24 and a second light-transmitting element P25, wherein the window size of the second base P22 is the same as the window size of the first base P12, the window size of the second light-transmitting element P25 is the same as the window size of the first light-transmitting element P15, and the size of the photosensitive area 121 of the second sensing chip P23 is the same as the size of the photosensitive area 121 of the first sensing chip P13. In the COB packaging base of another scheme, the second light-transmitting element P25 is flipped on the second base P22, and the silk-screen ink layer of the second light-transmitting element P25 is on the lower surface of the second light-transmitting element P25. After the light c directed to the second base P22 is reflected by the second base P22, it is directed into the photosensitive area 121 of the second chip. The silk-screen ink layer of the second light-transmitting element P25 cannot cover the light c.

[0059] like Figure 6Shown is a light schematic diagram of a light-shielding base assembly provided in an example of the present application. In the light-shielding base assembly of this example, the window size of the light-transmitting element 15 is the same as the window size of the first light-transmitting element P15 of the above-mentioned one scheme and the second light-transmitting element P25 of the other scheme, the window size of the light-shielding base 14 is the same as the window size of the first base P12 of the above-mentioned one scheme and the second base P22 of the other scheme, the size of the photosensitive area 121 of the photosensitive chip 12 is the same as the size of the photosensitive area 121 of the first photosensitive chip 12 of the above-mentioned one scheme and the second photosensitive chip 12 of the other scheme, and the incident angles of light a, light b and light c are also the same as those of one scheme and the other scheme. Light a directed toward the light-shielding base 14 is intercepted by the ink layer 154 of the light-transmitting element 15, preventing it from reaching the light-shielding base 14 and, therefore, from being reflected and generating stray light. Light b directed toward the connecting wire 13 is intercepted by the ink layer 154 of the light-transmitting element 15, preventing it from reaching the connecting wire 13 and, therefore, from being reflected and generating stray light. Light c directed toward the light-shielding base 14 is reflected by the inclined surface 1421 of the light-shielding base 14 and directed away from the photosensitive chip 12, preventing stray light from entering the photosensitive chip 12. Therefore, under the same conditions, the light-shielding photosensitive component of the present application can better improve the stray light problem of the camera module.

[0060] like Figure 7 The figure shows a schematic diagram of light when the light-transmitting element 15 of the light-shielding base assembly of the present application is installed upright on the light-shielding base 14. In the light-shielding base assembly, the light-transmitting element 15 is fixed to the light-shielding base 14 in an upright manner, and the ink layer 154 of the light-transmitting element 15 cannot block the light d directed toward the connecting line 13.

[0061] like Figure 8 The figure shows a schematic diagram of light when the light-transmitting element 15 of the light-shielding base assembly of the present application is inverted on the light-shielding base 14. In the light-shielding base assembly, the light-transmitting element 15 is fixed to the light-shielding base 14 in an inverted manner. Without changing the window size of the light-shielding base 14 and the window size of the light-transmitting element 15, the incident angle of the light d is kept unchanged. The ink layer 154 of the light-transmitting element 15 can block the light d directed toward the connecting line 13. Therefore, compared with the structure in which the light-transmitting element 15 is upright, the structure in which the light-transmitting element 15 is inverted can achieve a better light-shielding effect.

[0062] like Figure 9As shown, a light schematic diagram of a light-shielding base assembly is provided for another example of the light-shielding base of the present application, wherein the window size of the light-shielding base 14 is larger than the window size of the light-transmitting element 15. When the light e directed toward the sharp corner of the mounting portion 142 of the light-shielding base 14 is reflected and then directed toward the sensing area of ​​the sensing chip, the light-transmitting element 15 can block the light e directed toward the connecting line 13. Therefore, when the inner diameter of the ink layer 154 is smaller than the inner diameter of the mounting portion 142, the light-transmitting element 15 can achieve a better light-shielding effect.

[0063] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0064] The above-described embodiments merely represent several implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present utility model patent shall be determined by the appended claims.

Claims

1. A light-shielding base assembly, characterized in that: include: Circuit board; A photosensitive chip, the photosensitive chip being attached to the circuit board, the photosensitive chip having a photosensitive area and a non-photosensitive area surrounding the photosensitive area; a plurality of connecting wires, one end of each connecting wire being connected to the circuit board, and the other end of each connecting wire being connected to the non-photosensitive area of ​​the photosensitive chip; a light-shielding base, the light-shielding base comprising an annular base and a mounting portion, the annular base protruding from the circuit board to surround the photosensitive chip, the mounting portion extending from the annular base toward the non-photosensitive area of ​​the photosensitive chip, a surface of the mounting portion facing away from the photosensitive chip being at least partially an inclined surface, the inclined surface extending obliquely from a side of the mounting portion close to the annular base toward a direction close to the photosensitive chip to a side of the mounting portion away from the annular base; and A light-transmitting element having a light-transmitting area and a light-shielding area around the light-transmitting area. The light-transmitting element is fixed on a side of the mounting portion close to the photosensitive chip so that the light-shielding area covers the connecting wire.

2. The light-shielding base assembly according to claim 1, wherein: The light-shielding base further includes a plurality of light-extinction protrusions, and the light-extinction protrusions are protruded from the inclined surface.

3. The light-shielding base assembly according to claim 2, wherein: The matte protrusions are arranged on the inclined surface in a zigzag shape.

4. The light-shielding base assembly according to any one of claims 1 to 3, characterized in that: The light-transmitting element includes a light-transmitting sheet and an ink layer. The ink layer is printed on the light-transmitting sheet in a circumferential manner to form the light-shielding area and the light-transmitting area on the surface of the light-transmitting sheet. The inner diameter of the ink layer is smaller than the inner diameter of the mounting portion.

5. The light-shielding base assembly according to claim 4, wherein: The ink layer is located on the surface of the light-transmitting sheet close to the photosensitive chip.

6. The light-shielding base assembly according to claim 4, wherein: The ink layer is located on the surface of the light-transmitting sheet away from the photosensitive chip.

7. The light-shielding base assembly according to claim 4, wherein: The surface of the light-transmitting sheet is provided with an anti-reflection film or a light-filtering film.

8. The light-shielding base assembly according to claim 4, wherein: The light-transmitting sheet is bonded to the mounting portion.

9. The light-shielding base assembly according to any one of claims 1 to 3, characterized in that: The blackout base has a matte black finish.

10. The light-shielding base assembly according to any one of claims 1 to 3, characterized in that: The light-shielding base assembly further includes a filter element, which is arranged on a side of the light-shielding base away from the photosensitive chip.

11. A camera module, characterized in that: include: The light-shielding base assembly according to any one of claims 1 to 10; and The lens assembly is mounted on the light-shielding base assembly.

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