Heat conduction pipe, heat dissipation module and display device
By designing a stepped shape and internal baffle structure at the second end of the heat pipe, and combining sensors to control the flow of coolant and the radiation layer of the heat conductor, the problem of uneven heat dissipation of the heat pipe is solved, and the heat dissipation efficiency and stability of the heat pipe are improved.
Patent Information
- Application Number
- CN202422671210.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-31
- Publication Date
- 2025-10-03
- Estimated Expiration
- 2034-10-31
AI Technical Summary
The uneven heat dissipation of the heat pipe leads to reduced overall heat dissipation efficiency.
The cross-sectional area of the second end of the heat pipe is designed to be smaller than that of the first end, and a stepped gradient shape is formed at the second end. Combined with the bending portion and the internal baffle structure, the flow of coolant is controlled by sensors and drivers, and external heat conductive parts and radiation layers are added to improve heat dissipation uniformity.
Effectively slow down heat loss, increase heat transfer rate, enhance heat dissipation uniformity and stability of heat pipes, and extend service life.
Smart Images
Figure CN223415160U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of display technology, and in particular to a heat pipe, a heat dissipation module, and a display device. Background Art
[0002] Because of its good thermal conductivity, heat pipes are often used in heat dissipation devices as important components for heat conduction between radiators and electrical components, thereby accelerating the heat dissipation efficiency of the heat dissipation device.
[0003] Heat pipes are usually connected to electrical components and radiators at both ends respectively, and then the heat generated by the electrical components is transferred from one end of the heat pipe to the radiator at the other end, and the heat is then dissipated to the external environment through the radiator. This will cause the heat dissipation of the heat pipe to be too concentrated at both ends, resulting in uneven heat dissipation of the heat pipe as a whole, affecting the heat dissipation uniformity of the entire heat dissipation module.
[0004] Therefore, how to improve the uniformity of heat dissipation of the heat pipe as a whole has become an urgent problem to be solved in this field. Utility Model Content
[0005] The present application discloses a heat pipe, a heat dissipation module and a display device, the purpose of which is to improve the uniformity of heat dissipation of the entire heat pipe.
[0006] The present application discloses a heat pipe, which includes a first end, a second end and a heat pipe body, wherein the first end and the second end are respectively located on both sides of the heat pipe body in the length direction; the first end is connected to an electrical component, and the second end is connected to a radiator; the cross-sectional area of the second end is smaller than the cross-sectional area of the first end; the second end includes a first connecting portion and a second connecting portion, the first connecting portion is arranged close to the heat pipe body and connected to the heat pipe body, and the second connecting portion is connected to a side of the first connecting portion away from the heat pipe body; the cross-sectional area of the first connecting portion is larger than the cross-sectional area of the second connecting portion.
[0007] Optionally, the first end is cylindrical, the first connecting portion of the second end is truncated cone-shaped, and the second connecting portion of the second end is cylindrical.
[0008] Optionally, a bending portion is formed between the first end and the heat pipe body, and the bending portion raises the first end to a preset height relative to the heat pipe body.
[0009] Optionally, a cavity is formed inside the first end, the bending portion, the heat pipe body, the first connecting portion and the second connecting portion, and a baffle is provided between two adjacent cavities. The multiple baffles divide the cavity into multiple partitions, and each partition is filled with coolant; and each baffle is provided with a through hole, and the through hole connects two adjacent partitions.
[0010] Optionally, a cavity is formed inside the heat pipe body, and a plurality of baffles are arranged at intervals in the cavity. The plurality of baffles divide the cavity into a plurality of partitions, each of which is filled with coolant; and each baffle is provided with a through hole, which connects two adjacent partitions.
[0011] Optionally, each of the partitions is provided with a sensor, a control member and a drive member, the sensor and the drive member are both provided on the baffle, the control member is connected to the side of the heat pipe close to the through hole, and the drive member is connected to the sensor and the control member respectively; the sensor is used to detect the state within the partition, when the sensor detects that the partition reaches a first preset state, the sensor feeds back a signal to the drive member, and the drive member controls the control member to limit the coolant within the respective partitions; when the sensor detects that the partition reaches a second preset state, the sensor feeds back a signal to the drive member, and the drive member controls the control member to release the flow restriction on the coolant.
[0012] Optionally, the coolant includes metal coolant, the control component includes an electromagnet, and the driving component includes an electromagnetic controller. When the sensor detects that the partition reaches a first preset state, the sensor feeds back a signal to the electromagnetic controller, and the electromagnetic controller controls the electromagnet to be electrically turned on; when the sensor detects that the partition reaches a second preset state, the sensor feeds back a signal to the electromagnetic controller, and the electromagnetic controller controls the electromagnet to be electrically turned off.
[0013] Optionally, the heat pipe further includes a heat conducting member, which is made of a heat conducting metal material, and the first end passes through the heat conducting member and is connected to the heat conducting member.
[0014] The present application also discloses a heat dissipation module, comprising a fixing frame and a radiator. The heat dissipation module further comprises the aforementioned heat pipe, and the fixing frame is connected to the radiator via the heat pipe.
[0015] The present application also discloses a display device, comprising a housing and a display panel, wherein the display panel is connected to the housing. The display device also comprises the above-mentioned heat dissipation module, which is disposed in the housing.
[0016] The present application has made improvements to the heat pipe. The cross-sectional area of the second end of the heat pipe is smaller than the cross-sectional area of the first end, so that the heat pipe as a whole is narrowed at the second end, and a first connecting portion and a second connecting portion with different cross-sectional areas are formed at the second end, so that the first connecting portion and the second connecting portion form a stepped gradient shape at the second end of the entire heat pipe. In this way, heat is transferred from the heat source to the first end, and then from the first end to the second end for outward conduction, forming a buffer, thereby effectively slowing down heat loss, accelerating the rate of heat transfer from the first end to the second end, and allowing the heat at the second end to be quickly taken away by the radiator, avoiding excessive concentration of heat at the first and second ends of the heat pipe, and improving the heat dissipation uniformity of the entire heat pipe. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The included drawings are used to provide a further understanding of the embodiments of the present application, which constitute a part of the specification, are used to illustrate the implementation methods of the present application, and together with the text description, explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without inventive work. In the drawings:
[0018] Figure 1 A schematic diagram of a first embodiment of the heat pipe of the present application;
[0019] Figure 2 A schematic diagram of a second embodiment of the heat pipe of the present application;
[0020] Figure 3 A schematic diagram of a third embodiment of the heat pipe of the present application;
[0021] Figure 4 is a schematic diagram of a fourth embodiment of the heat pipe of the present application;
[0022] Figure 5 A top view of a fifth embodiment of the heat pipe of the present application;
[0023] Figure 6 is a schematic diagram of a sixth embodiment of the heat pipe of the present application;
[0024] Figure 7 A partial schematic diagram of a seventh embodiment of the heat pipe of the present application;
[0025] Figure 8 is a schematic diagram of an eighth embodiment of the heat pipe of the present application;
[0026] Figure 9 A schematic diagram of an embodiment of the heat dissipation module of the present application;
[0027] Figure 10 FIG. 1 is a schematic diagram of an embodiment of a display device of the present application.
[0028] Among them, 10, heat dissipation module; 100, heat pipe; 110, first end; 120, second end; 121, first connecting part; 122, second connecting part; 130, heat pipe body; 140, cavity; 150, baffle; 151, through hole; 152, electromagnetic valve; 153, electromagnet; 154, electromagnetic controller; 160, partition; 161, control part; 162, sensor; 163, driving part; 170, coolant; 171, metal coolant; 172, bending part; 180, radiation layer; 190, heat conducting part; 200, electrical component; 300, radiator; 400, fixing frame; 500, display device; 510, housing; 600, display panel. DETAILED DESCRIPTION
[0029] The present application is described in detail below with reference to the accompanying drawings and optional embodiments. It should be noted that, under the premise of no conflict, the embodiments or technical features described below can be arbitrarily combined to form new embodiments.
[0030] Figure 1 This is a schematic diagram of the first embodiment of the heat pipe of the present application, as shown Figure 1 As shown, the present application discloses a heat pipe 100, which is elongated and includes a first end 110, a second end 120 and a heat pipe body 130. The first end 110 and the second end 120 are respectively connected to both sides of the heat pipe body 130 in the length direction; the first end 110 is connected to the electrical component 200, and the second end 120 is connected to the radiator 300; the cross-sectional area of the second end 120 is smaller than the cross-sectional area of the first end 110; the second end 120 includes a first connecting portion 121 and a second connecting portion 122, the first connecting portion 121 is arranged close to the heat pipe body 130 and connected to the heat pipe body 130, and the second connecting portion 122 is connected to a side of the first connecting portion 121 away from the heat pipe body 130; the cross-sectional area of the first connecting portion 121 is larger than the cross-sectional area of the second connecting portion 122.
[0031] The present application provides an improvement to the heat pipe 100. In the longitudinal direction of the heat pipe 100, the cross-sectional area of the second end 120 of the heat pipe 100 is smaller than the cross-sectional area of the first end 110, so that the heat pipe 100 as a whole is narrowed at the second end 120, and a first connecting portion 121 and a second connecting portion 122 of different cross-sectional areas are formed at the second end 120. The first connecting portion 121 and the second connecting portion 122 form a stepped gradient shape at the position of the second end 120 of the entire heat pipe 100. In this way, heat is transferred from the heat source to the first end 110 and then from the first end 110 to the second end 120 for outward conduction, forming a buffer, thereby effectively slowing down heat loss, accelerating the rate of heat transfer from the first end 110 to the second end 120, and allowing the heat at the second end 120 to be quickly removed by the heat sink 300, thereby preventing heat from being excessively concentrated at the first end 110 and the second end 120 of the heat pipe 100, thereby improving the heat dissipation uniformity of the entire heat pipe.
[0032] It should be noted that the first end 110 and the second end 120 of the heat pipe 100 in the present application can be truncated cone-shaped, conical, cylindrical, etc., for example: Figure 1 As shown, when the first end 110 and the second end 120 are both cylindrical, the diameter of the first end 110 can be the same as the diameter of the heat pipe body 130, and the diameter of the second end 120 is smaller than the diameter of the heat pipe body 130, forming a structure similar to a shrink tube.
[0033] Specifically, such as Figure 1 As shown, the first end 110 is cylindrical, the first connection portion 121 of the second end 120 is truncated cone-shaped, and the second connection portion 122 of the second end 120 is cylindrical.
[0034] Because the first connection portion 121 of the second end 120 is truncated cone-shaped and the second connection portion 122 is cylindrical, the first connection portion 121 and the second connection portion 122 are combined to form an elongated and contracted design, shaped like a dropper. The heat pipe 100 with this design is less likely to crack during production and is easy to seal and weld. In addition, the second end 120 of the heat pipe 100 is terminated in the shape of a dropper, forming a buffer, making heat transfer more uniform and more conducive to reducing heat loss.
[0035] Figure 2 This is a schematic diagram of a second embodiment of the heat pipe of the present application, as shown in FIG. Figure 2 As shown, Figure 2 The embodiment shown is based on Figure 1 In the improvement, a bending portion 172 is formed between the first end 110 and the heat pipe body 130, and the bending portion 172 raises the first end 110 relative to the heat pipe body 130 by a preset height.
[0036] This embodiment and Figure 1The difference from the illustrated embodiment is that, in this embodiment, a bend 172 is formed between the first end 110 and the heat pipe body 130. The bend 172 is used to raise the first end 110 relative to the heat pipe body 130, so that there is a height difference between the heat pipe body 130 and the first end 110. When the heat generated by the electrical component 200 is transferred to the heat pipe 100, the heat is transferred from the first end 110 at a higher position to the heat pipe body 130, and then to the second end 120 at a lower position. This high-to-low heat transfer is more conducive to heat conduction, effectively preventing excessive heat concentration at the first end 110, further improving the heat conduction efficiency of the heat pipe 100, and improving the heat conduction uniformity of the heat pipe 100.
[0037] Figure 3 This is a schematic diagram of a third embodiment of the heat pipe of the present application, as shown in FIG. Figure 3 As shown, Figure 3 The embodiment shown is based on Figure 1 The improvement is that only a cavity 140 is formed inside the heat pipe body 130, and a plurality of baffles 150 are arranged at intervals in the cavity 140. The plurality of baffles 150 divide the cavity 140 into a plurality of partitions 160, and each partition 160 is filled with coolant 170; and each baffle 150 is provided with a through hole 151, which connects two adjacent partitions 160.
[0038] The present embodiment improves the heat pipe body 130, which occupies a large proportion in size and volume of the entire heat pipe. A plurality of baffles 150 are arranged at intervals in the cavity 140 of the heat pipe body 130 to divide the cavity 140 of the heat pipe body 130 into a plurality of partitions 160, and the through holes 151 on each baffle 150 are used to connect two adjacent partitions 160. In this way, after the coolant 170 is filled into each partition 160 respectively, the coolant 170 as a whole is divided into multiple parts, and the coolant 170 in each partition 160 can only flow through the through holes 151. When the heat pipe 100 shakes, the coolant 170 in each partition 160 of the heat pipe body 130 also shakes. The coolant 170 in each partition 160 is confined to its own partition 160 by the two adjacent baffles 150, which effectively reduces the space for the coolant 170 to shake in the heat pipe body 130 and reduces the shaking amplitude of the coolant 170. The heat pipe 100 is provided with a heat dissipation plate 150, which is provided with a heat dissipation plate 150. The heat dissipation plate 150 is provided with a heat dissipation plate 150, which is provided with a heat dissipation plate 150. The heat dissipation plate 150 is provided with a heat dissipation plate 150, which is provided with a heat dissipation plate 150. The heat dissipation plate 150 is provided with a heat dissipation plate 150, which is provided with a heat dissipation plate 150.
[0039] Figure 4 This is a schematic diagram of a fourth embodiment of the heat pipe of the present application, as shown in FIG. Figure 4 As shown, a cavity 140 is formed inside the first end 110, the bending portion 172, the heat pipe body 130, the first connecting portion 121 and the second connecting portion 122. A baffle 150 is provided between two adjacent cavities 140. The multiple baffles 150 divide the cavity 140 into multiple partitions 160, and each partition 160 is filled with coolant 170; and each baffle 150 is provided with a through hole 151, which connects two adjacent partitions 160.
[0040] This embodiment is different from the previous embodiment in that, in this embodiment, baffles 150 are provided at the positions of the cavities 140 corresponding to the connection between the first end 110 and the bending portion 172, the connection between the bending portion 172 and the heat pipe body 130, the connection between the heat pipe body 130 and the first connection portion 121, and the connection between the first connection portion 121 and the second connection portion 122; after the coolant 170 is respectively filled into each partition 160, the coolant 170 as a whole forms a stepped distribution from high to low in the entire heat pipe from the first end to the second connection portion.
[0041] When the heat pipe shakes, the coolant at a high position tends to flow to a lower position, which can easily cause the entire heat pipe to shake.
[0042] Therefore, in this embodiment, baffles 150 are provided at the connection points of the various parts of the heat pipe 100, and the coolant 170 in each partition 160 is restricted in its respective partition 160 by two adjacent baffles 150, effectively reducing the space for the coolant 170 to shake in the heat pipe 100 and reducing the shaking amplitude of the coolant 170. At the same time, the baffles 150 are used to block the coolant 170, preventing the coolant 170 from impacting from a high position to a low position in the heat pipe 100 and causing excessive shaking of the heat pipe 100; and the coolant 170 in the two adjacent partitions 160 releases the impact force through the through-holes 151 to form a damping effect, effectively alleviating the impact force generated by the shaking of the coolant 170 in the two adjacent partitions 160.
[0043] It is worth noting that in the heat pipe 100, a portion of the coolant 170 in the first end 110 at a high position will enter the heat pipe body 130 through the through hole 151 during the shaking process, thereby increasing the total amount of coolant 170 in the heat pipe body 130, making the weight of the heat pipe body 130 heavier. The coolant 170 in the heat pipe body 130 is less likely to shake under the restriction of the baffle 150. Since the heat pipe body 130 occupies most of the area of the entire heat pipe 100, when the heat pipe body 130 remains stable as a whole, the entire heat pipe 100 will not shake on a large scale, effectively preventing the coolant 170 from shaking violently in the heat pipe 100, improving the continuous heat dissipation stability of the coolant 170 in the heat pipe 100, and the stability of the heat pipe 100 connected to the radiator.
[0044] In addition, when the heat generated by the electrical component 200 is transferred to the heat pipe 100, the heat is transferred from the first end 110 at a higher position to the heat pipe body 130, and then transferred to the second connecting portion 122 at a lower position. During the heat transfer process, part of the heat is transferred through the heat pipe 100 body, and the other part is transferred through the coolant 170. This forms a double heat transfer from high to low, which is more conducive to the overall heat conduction of the heat pipe 100, effectively avoiding excessive heat concentration at the first end 110, further improving the heat conduction efficiency of the heat pipe 100, and improving the heat conduction uniformity of the heat pipe 100.
[0045] In addition, in the present application, the second end 120 of the heat pipe 100 adopts a stepped design to form a structure similar to a "drip pipe", so that the heat pipe 100 has better sealing performance at the second end 120, and the coolant 170 is not prone to leakage at the second end 120.
[0046] Since the heat pipe 100 of the present application adopts a stepped design in which the first end 110 is raised relative to the heat pipe body 130, the heights of various parts of the heat pipe 100 vary. Therefore, in order to prevent the coolant 170 filled in the heat pipe 100 from excessively flowing from a high position to a low position, resulting in less coolant 170 in the higher part of the heat pipe 100 and affecting the heat dissipation effect, the present application further improves the heat pipe 100, as follows:
[0047] Figure 5 This is a schematic diagram of a fifth embodiment of the heat pipe of the present application, as shown Figure 5 As shown, Figure 5 The embodiment shown is based on Figure 4 The improvement is that each partition 160 is provided with a sensor 162, a control member 161 and a driving member 163, and the sensor 162 and the driving member 163 are both arranged on the baffle 150, the control member 161 is connected to the side of the heat pipe 100 close to the through hole 151, and the driving member 163 is connected to the sensor 162 and the control member 161 respectively; the sensor 162 is used to detect the state in the partition 160, when the sensor 162 detects that the partition 160 reaches a first preset state, the sensor 162 feeds back a signal to the driving member 163, and the driving member 163 controls the control member 161 to limit the coolant 170 to the respective partitions 160; when the sensor 162 detects that the partition 160 reaches a second preset state, the sensor 162 feeds back a signal to the driving member 163, and the driving member 163 controls the control member 161 to release the flow restriction of the coolant 170.
[0048] It should be noted that the state within the detection partition 160 by sensor 162 may be an air pressure state or a temperature sensor. When detecting the air pressure state within the detection partition 160, sensor 162 may be an air pressure sensor. When detecting the temperature state within the detection partition 160, sensor 162 may be a temperature sensor. For example, when sensor 162 is a temperature sensor, the first preset state within the detection partition 160 is a high temperature state, and the temperature may be above 60 degrees Celsius; the second preset state within the detection partition 160 is a low temperature state, and the temperature may be below 40 degrees Celsius.
[0049] When the sensor 162 detects that the partition 160 has reached the first preset state, the sensor 162 feeds back a signal to the driver 163, and the driver 163 controls the control component 161 to limit the coolant 170 to the respective partitions 160. The coolant 170 in each partition 160 will not flow freely, and the amount of the coolant 170 in the corresponding partition 160 will not cause obvious deviation due to the flow, so that there can be a sufficient amount of coolant 170 in the partition 160 to ensure the cooling effect in the partition 160; and when the sensor 162 detects that the partition 160 has reached the second preset state, the sensor 162 feeds back a signal to the driver 163, and the driver 163 controls the control component 161 to release the flow restriction of the coolant 170, which is conducive to maintaining the overall heat dissipation effect of the heat pipe 100.
[0050] Specifically, the coolant 170 includes a metal coolant 171, the control component 161 includes an electromagnet 153, and the driving component 163 includes an electromagnetic controller 154. When the sensor 162 detects that the partition 160 reaches a first preset state, the sensor 162 feeds back a signal to the electromagnetic controller 154, and the electromagnetic controller 154 controls the electromagnet 153 to be electrically turned on; when the sensor 162 detects that the partition 160 reaches a second preset state, the sensor 160 feeds back a signal to the electromagnetic controller 154, and the electromagnetic controller 154 controls the electromagnet 153 to be electrically turned off.
[0051] For example, when the sensor 162 is a temperature sensor detecting the temperature in the partition 160, the first preset state is the first preset temperature, and the second preset state is the second preset temperature. In the actual use of the heat pipe 100, the temperature in each partition 160 is first detected by the sensor 162. When the sensor 162 detects that the temperature in a certain partition 160 exceeds the first preset temperature, the sensor 162 will feed back the detected signal to the driving member 163. When the driving member 163 receives the feedback signal from the sensor 162, it will turn on the control member 161. At this time, the control member 161 has magnetism, and the temperature in the partition 160 is The coolant 170 is a metal coolant 171, so the control component 161 will attract the coolant 170 in the partition 160. Even when the heat pipe 100 shakes, it can ensure that the coolant 170 is controlled in the designated partition 160, thereby preventing the coolant 170 from flowing toward other partitions 160 when the heat pipe 100 shakes, resulting in a reduction in the amount of coolant 170 in the designated partition 160, causing a decrease in the heat dissipation capacity in the partition 160, which is beneficial to forming targeted and effective heat dissipation and cooling in the partition 160 for the local high-temperature area of the heat pipe 100, ensuring the overall thermal conductivity uniformity of the heat pipe 100, and further improving the thermal conductivity effect of the heat pipe 100.
[0052] When the sensor 162 detects that the temperature in the partition 160 is lower than the second preset temperature, the sensor 162 feeds back a signal to the driver 163, and the driver 163 controls the electrical shutdown between the control component 161. At this time, the magnetism of the control component 161 disappears, and the coolant 170 can flow freely in the partition 160 to maintain the overall heat dissipation effect of the heat pipe 100.
[0053] Figure 6 This is a schematic diagram of the sixth embodiment of the heat pipe of the present application, as shown in FIG. Figure 6 As shown, Figure 6 The embodiment shown is based on Figure 5 The improvement is that in the two adjacent baffles 150 in each partition 160, an electromagnetic valve 152 is provided in each through hole 151, and the electromagnetic valve 152 is connected to the driving member 163; when the sensor 162 detects that the state in the partition 160 reaches a first preset state, the sensor 162 feeds back a signal to the driving member 163, and the driving member 163 controls the electromagnetic valves 152 of the two adjacent baffles 150 in the partition 160 to be closed; when the sensor 162 detects that the state in the partition 160 reaches a second preset state, the sensor 162 feeds back a signal to the driving member 163, and the driving member 163 controls the electromagnetic valves 152 of the two adjacent baffles in the partition 160 to be opened.
[0054] It should be noted that, when the sensor 162 is a temperature sensor detecting the temperature in the partition 160 , the first preset state is the first preset temperature, and the second preset state is the second preset temperature.
[0055] and Figure 5 The difference from the illustrated embodiment is that, in this embodiment, an electromagnetic valve 152 is further provided at the through hole 151 on each baffle 150. The opening and closing of the through hole 151 is controlled by the electromagnetic valve 152 to control the connection or closure between two adjacent partitions 160. In this way, it is ensured that the coolant 170 in the first end 110 does not actively flow into the heat pipe body 130 at a relatively low position. The coolant 170 in each part of the heat pipe 100 can also be controlled according to different heat dissipation requirements, thereby ensuring the overall heat dissipation performance of the coolant 170 in the heat pipe 100.
[0056] The specific working process is as follows: when the sensor 162 in a certain partition 160 detects that the temperature in the partition 160 reaches the first preset temperature, the sensor 162 feeds back the detection signal to the driving member 163. At this time, the driving member 163 controls the electromagnetic valves 152 of the two adjacent baffles 150 in the partition 160 to close, and uses the electromagnetic valves 152 to close the through holes 151 of the two adjacent baffles 150, so that the partition 160 forms a closed area. Even if the heat pipe 100 shakes, the coolant 170 in the partition 160 will not flow into other partitions 160. In this way, the amount of coolant 170 in the partition 160 can be effectively guaranteed, so that there is enough coolant 170 in the partition 160 for cooling or heat dissipation, which is conducive to forming targeted and effective heat dissipation and cooling of the local high-temperature area of the heat pipe 100, ensuring the overall thermal conductivity uniformity of the heat pipe 100, and further improving the thermal conductivity effect of the heat pipe 100.
[0057] When the sensor 162 detects that the temperature in the partition 160 reaches the second preset temperature, the sensor 162 feeds back a signal to the driver 163, and the driver 163 controls the electromagnetic valves 152 of the two adjacent baffles 150 in the partition 160 to open. At this time, the through holes 151 on the two adjacent baffles 150 are opened, and the coolant 170 can flow freely in the partition 160 to maintain the overall heat dissipation effect of the heat pipe 100.
[0058] Since the first end 110 of the heat pipe 100 is connected to the electrical component 200, the first end 110 is closer to the heat source. In order to further prevent heat from concentrating at the first end 110 and improve the heat conduction efficiency of the first end 110, the present application also improves the connection between the first end 110 of the heat pipe 100 and the heat pipe body 130:
[0059] Figure 7 This is a partial schematic diagram of the seventh embodiment of the heat pipe of the present application, as shown Figure 7 As shown, the heat pipe 100 is made of a heat-conducting metal material, and the outer side of the heat pipe 100 is wrapped with a radiation layer 180 .
[0060] In this embodiment, a radiation layer 180 is provided on the heat pipe 100. The radiation layer 180 can be made of nano-carbon material. The radiation layer 180 radiates the heat absorbed by the heat pipe 100 to the external environment, thereby expanding the heat dissipation range of the heat pipe 100. When the heat pipe 100 receives heat conducted from the electrical component 200, the heat is first dissipated through the heat pipe 100 itself, and then the heat is further conducted to the radiation layer 180. The radiation layer 180 shares the heat dissipation pressure with the heat pipe 100 and radiates the heat to the external environment through the radiation layer 180. This design can effectively enhance the inherent heat dissipation capacity of the heat pipe 100, further improve the heat dissipation effect of the heat pipe 100, and thus improve the heat dissipation efficiency of the heat dissipation module 10.
[0061] It should be noted that the present application does not impose any specific restrictions on the material of the radiation layer 180, and only uses the radiation layer 180 made of nano-carbon material as an example. The radiation layer 180 in the present application can not only be made of nano-carbon material, but can also be made of special resin, curing agent and other additives, mixed in a certain proportion, and then prepared by processes such as hot extrusion and crushing and screening; then a layer of coating that enhances thermal radiation is applied to the outer surface of the heat pipe 100 to increase the surface emissivity, thereby enhancing thermal radiation and radiating heat into the surrounding air for heat dissipation.
[0062] In addition, since the first end 110 of the heat pipe 100 is closer to the electrical component 200, that is, closer to the heat source, the first end 110 of the heat pipe 100 receives a greater amount of heat and has a higher temperature. In order to alleviate the heat dissipation pressure of the first end 110 of the heat pipe 100, the present application further improves the first end 110 of the heat pipe 100:
[0063] Figure 8 This is a schematic diagram of the eighth embodiment of the heat pipe of the present application, as shown Figure 8 As shown, the heat pipe 100 further includes a heat conducting member 190 . The heat conducting member 190 is made of a heat conducting metal material. The first end 110 passes through the heat conducting member 190 and is connected to the heat conducting member 190 .
[0064] In this embodiment, a heat conducting member 190 is additionally provided on the first end 110 of the heat conducting pipe 100. The heat conducting member 190 can be made of copper or aluminum and has a good heat dissipation effect. When the heat conducting pipe 100 is connected to the electrical component 200, the heat conducting member 190 at the first end 110 is first connected to the electrical component 200, and the second end 120 is connected to the radiator 300. The heat generated by the electrical component 200 during operation is first transferred to the heat conducting member 190, and then transferred to the heat conducting pipe by the heat conducting member 190. At the first end 110 of the heat pipe 100, the heat conducting member 190 performs a first heat dissipation on the heat transferred from the electrical component 200 (i.e., the heat source), and then performs a second heat dissipation through the heat pipe 100. The heat conducting member 190 is used to share the heat dissipation pressure of the first end 110 of the heat pipe 100, so that the heat will not be excessively concentrated on the first end 110 of the heat pipe 100, and the temperature of the first end 110 of the heat pipe 100 is effectively reduced, thereby alleviating the overall heat dissipation pressure of the heat pipe 100 and helping to extend the service life of the heat pipe 100.
[0065] Figure 9 This is a schematic diagram of an embodiment of the heat dissipation module of the present application, as shown in FIG. Figure 9 As shown, the present application also discloses a heat dissipation module 10, including a fixing frame 400 and a radiator 300. The heat dissipation module 10 also includes the above-mentioned heat pipe 100. The fixing frame 400 is usually connected to the electrical component 200 in the electronic device, and then the fixing frame 400 is connected to the radiator 300 through the heat pipe 100; the heat generated by the electrical component 200 during operation will be directly transferred to the fixing frame 400, and then the heat will be transferred to the heat pipe 100 through the fixing frame 400; the heat pipe 100 transfers the heat received by the fixing frame 400 to the radiator 300, and finally dissipates the heat to the external environment through the radiator 300 to achieve a complete heat dissipation process.
[0066] Since the heat of the heat pipe 100 is easily concentrated at both ends of the heat pipe 100, the heat dissipation of the heat pipe 100 as a whole is uneven. Therefore, the present application improves the heat pipe 100 in the heat dissipation module 10. The present application improves the heat pipe 100. The cross-sectional area of the second end 120 of the heat pipe 100 is smaller than the cross-sectional area of the first end 110, so that the heat pipe 100 is narrowed at the second end 120 as a whole, and a first connecting portion 121 and a second connecting portion 122 with different cross-sectional areas are formed at the second end 120, so that the first connecting portion 121 and the second connecting portion 122 have different cross-sectional areas. The second connecting portion 122 forms a stepped gradient shape of the entire heat pipe 100 at the second end 120, so that heat is transferred from the heat source to the first end 110 and then from the first end 110 to the second end 120 for outward conduction, forming a buffer, thereby effectively slowing down heat loss, accelerating the rate of heat transfer from the first end 110 to the second end 120, and allowing the heat at the second end 120 to be quickly removed by the radiator 300, thereby preventing excessive heat concentration at the first end 110 and the second end 120 of the heat pipe 100, thereby improving the heat dissipation uniformity of the entire heat pipe.
[0067] Figure 10 This is a schematic diagram of an embodiment of the display device of the present application, as shown in FIG. Figure 10 As shown, the present application also discloses a display device 500, comprising a housing 510 and a display panel 600, wherein the display panel 600 is connected to the housing 510. The display device 500 also comprises the above-mentioned heat dissipation module 10, which is disposed within the housing 510. The display panel 600 is mounted on the housing 510 for displaying images, and the housing 510 is used to protect the heat dissipation module 10 and the display panel 600 from being directly damaged by external forces during the transportation of the display device 500. The housing 510 can also prevent external moisture, dust, etc. from entering the heat dissipation module 10 and affecting the heat dissipation capacity of the heat dissipation module 10, thereby ensuring the heat dissipation performance of the heat dissipation module 10 and improving the service life of the display device 500.
[0068] The display device 500 in this application can be a computer, a television, or other equipment. This application does not limit the specific type of the display device.
[0069] It should be noted that the inventive concept of this application can form a large number of embodiments, but the length of the application document is limited and it is impossible to list them one by one. Therefore, under the premise of no conflict, the various embodiments or technical features described above can be arbitrarily combined to form new embodiments. After the various embodiments or technical features are combined, the original technical effects will be enhanced.
[0070] The above content is a further detailed description of the present application in conjunction with specific optional implementation methods, and the specific implementation of the present application cannot be considered to be limited to these descriptions. For ordinary technicians in the technical field to which the present application belongs, they can make several simple deductions or substitutions without departing from the concept of the present application, which should be considered to fall within the scope of protection of the present application.
Claims
1. A heat pipe, characterized in that: The heat pipe comprises a first end, a second end and a heat pipe body, wherein the first end and the second end are respectively located on both sides of the heat pipe body in the length direction; the first end is connected to the electrical component, and the second end is connected to the radiator; The cross-sectional area of the second end is smaller than the cross-sectional area of the first end; The second end includes a first connecting part and a second connecting part, the first connecting part is arranged close to the heat pipe body and connected to the heat pipe body, and the second connecting part is connected to the side of the first connecting part away from the heat pipe body; the cross-sectional area of the first connecting part is larger than the cross-sectional area of the second connecting part.
2. The heat pipe according to claim 1, wherein The first end is cylindrical, the first connecting portion of the second end is truncated cone, and the second connecting portion of the second end is cylindrical.
3. The heat pipe according to claim 2, wherein: A bending portion is formed between the first end and the heat pipe body, and the bending portion raises the first end relative to the heat pipe body by a preset height.
4. The heat pipe according to claim 3, wherein: A cavity is formed inside each of the first end, the bent portion, the heat pipe body, the first connecting portion, and the second connecting portion. A baffle is provided between two adjacent cavities. The baffles divide the cavity into a plurality of partitions, each of which is filled with coolant. Each of the baffles is provided with a through hole, and the through hole connects two adjacent partitions.
5. The heat pipe according to claim 3, wherein: A cavity is formed inside the heat pipe body, and a plurality of baffles are arranged in the cavity at intervals. The plurality of baffles divide the cavity into a plurality of partitions, and each of the partitions is filled with coolant; Each of the baffles is provided with a through hole, and the through hole connects two adjacent partitions.
6. The heat pipe according to claim 4 or 5, characterized in that: A sensor, a control component and a driving component are provided in each of the partitions, and the sensor and the driving component are both provided on the baffle. The control component is connected to a side of the heat pipe close to the through hole, and the driving component is connected to the sensor and the control component respectively; the sensor is used to detect the state in the partition, and when the sensor detects that the partition reaches a first preset state, the sensor feeds back a signal to the driving component, and the driving component controls the control component to limit the coolant to the respective partitions; when the sensor detects that the partition reaches a second preset state, the sensor feeds back a signal to the driving component, and the driving component controls the control component to release the flow restriction on the coolant.
7. The heat pipe according to claim 6, wherein: The coolant includes metal coolant, the control element includes an electromagnet, and the driving element includes an electromagnetic controller. When the sensor detects that the partition reaches a first preset state, the sensor feeds back a signal to the electromagnetic controller, and the electromagnetic controller controls the electromagnet to be electrically turned on; when the sensor detects that the partition reaches a second preset state, the sensor feeds back a signal to the electromagnetic controller, and the electromagnetic controller controls the electromagnet to be electrically turned off.
8. The heat pipe according to claim 7, wherein: The heat pipe further includes a heat conducting member, which is made of a heat conducting metal material. The first end passes through the heat conducting member and is connected to the heat conducting member.
9. A heat dissipation module, comprising a fixing frame and a radiator, characterized in that: The heat dissipation module further comprises a heat pipe according to any one of claims 1 to 8, and the fixing frame is connected to the radiator via the heat pipe.
10. A display device comprising a housing and a display panel, wherein the display panel is connected to the housing, and the display device further comprises the heat dissipation module according to claim 9, wherein the heat dissipation module is disposed in the housing.