Heat dissipation module and display equipment

Abstract

The utility model belongs to the field of display equipment, and discloses a heat dissipation module and display equipment, the heat dissipation module comprises a fixed support, a first radiator, a second radiator and a plurality of heat conduction pipes; the fixing support is connected to the upper portion of an electronic element, the first radiator is arranged close to one side of the fixing support, and at least one heat conduction pipe is connected between the first radiator and the fixing support; the second radiator is arranged on the side, adjacent to the connecting side of the first radiator and the fixing support, of the first radiator. A connecting piece is arranged between the first radiator and the second radiator, the connecting piece is made of a heat conduction material, one end of the connecting piece is connected with the second radiator, the other end of the connecting piece is connected with the first radiator, and the first radiator is lifted by a preset height relative to the second radiator. In this way, the structure utilization rate and the heat dissipation efficiency of the heat dissipation module are improved.

Description

Technical Field

[0001] The present application relates to the field of display devices, and in particular to a heat dissipation module and a display device. Background Art

[0002] During operation, display devices often generate a large amount of heat due to their high power consumption. If the heat cannot be discharged in time, the temperature of the display device will rise rapidly and cause the device to crash.

[0003] Currently, most display devices mainly use a fan plus an aluminum extruded heat sink to form a heat dissipation module for heat dissipation. The heat dissipation module is directly welded and then installed inside the display device. The structure of the heat dissipation module itself has a certain size and usually occupies a large space in the display device, affecting the air circulation near the electronic components in the display device, making it difficult for the air to carry away the heat. While heat is easily accumulated, it also causes the components that need to be installed on the same layer as the heat dissipation module to be installed in other locations in order to have enough space, seriously affecting the space utilization of the equipment.

[0004] How to improve the structural utilization and heat dissipation efficiency of the heat dissipation module has become an urgent problem to be solved in this field. Utility Model Content

[0005] The present application discloses a heat dissipation module and a display device, the purpose of which is to improve the structural utilization and heat dissipation efficiency of the heat dissipation module itself.

[0006] The present application discloses a heat dissipation module, which includes a fixed bracket, a first radiator, a second radiator and a plurality of heat pipes; the fixed bracket is connected above the electronic component, the first radiator is arranged on a side close to the fixed bracket, and at least one heat pipe is connected between the first radiator and the fixed bracket; the second radiator is arranged on a side adjacent to the connection side of the first radiator and the fixed bracket; a connecting member is provided between the first radiator and the second radiator, the connecting member is made of heat-conducting material, one end of the connecting member is connected to the second radiator, and the other end is connected to the first radiator, and the first radiator is raised to a preset height relative to the second radiator.

[0007] Optionally, the connecting member includes a first connecting part, a second connecting part and a third connecting part, the second connecting part is located between the first connecting part and the third connecting part, and one end of the second connecting part is connected to the first connecting part, and the other end is connected to the third connecting part, and the first connecting part and the third connecting part are arranged in parallel; the end of the first connecting part away from the second connecting part is connected to the first radiator, and the end of the third connecting part away from the second connecting part is connected to the second radiator.

[0008] Optionally, the angles between the first connection portion and the second connection portion, and between the third connection portion and the second connection portion are both between 90° and 135°.

[0009] Optionally, a preset height range of the first radiator raised relative to the second radiator is between 8 mm and 12 mm.

[0010] 12. The heat dissipation device as described in claim 9, wherein the bridge has two opposite ends, and one of the ends is disconnected from the mounting plate to form a cutout between the one of the ends and the mounting plate, and the one of the ends is disconnected from the mounting plate to form a cutout between the one of the ends and the mounting plate, so that the heat dissipation device can be put into operation.

[0011] Optionally, a first heat conductor is further provided between the first heat sink and the second heat sink, the first heat conductor is located above the connecting piece between the first heat sink and the second heat sink, one end of the first heat conductor is connected to the first heat sink, and the other end is connected to the second heat sink, and a first space is formed between the first heat conductor and the connecting piece between the first heat sink and the second heat sink; a second heat conductor is further provided between the third heat sink and the fourth heat sink, the second heat conductor is located above the connecting piece between the third heat sink and the fourth heat sink, one end of the second heat conductor is connected to the third heat sink, and the other end is connected to the fourth heat sink, and a second space is formed between the second heat conductor and the connecting piece between the third heat sink and the fourth heat sink; the first space and the second space are both used for air circulation.

[0012] Optionally, the heat dissipation module also includes a heat spreader, which is connected to below the second radiator and the fourth radiator, and the heat spreader is partially located below the first heat conductor and the second heat conductor, and has a gap between the first heat conductor and the second heat conductor; a first heat dissipation channel is formed between the first radiator, the second radiator and the heat spreader, and between the third radiator, the fourth radiator and the heat spreader; the thickness of the heat dissipation keel is less than the thickness of the second radiator and the fourth radiator, and a second heat dissipation channel is formed between the heat dissipation keel and the second radiator and the fourth radiator; the first heat dissipation channel is connected to the second heat dissipation channel.

[0013] Optionally, the heat dissipation module also includes a flow guide, which is long and has openings at both ends. The flow guide includes a first flow guide and a second flow guide. The first flow guide is mounted on the connecting piece between the first radiator and the second radiator and the first heat-conducting piece, and the second flow guide is mounted on the connecting piece between the third radiator and the fourth radiator and the second heat-conducting piece.

[0014] Optionally, the first air guide member is provided with a plurality of first through holes on the side wall in a direction parallel to the heat spreader, and a plurality of second through holes on the side wall in a direction perpendicular to the heat spreader, the first through holes are connected to the first heat dissipation channel in the vertical direction, and the second through holes are connected to the first heat dissipation channel in the horizontal direction; the second air guide member is provided with a plurality of third through holes on the side wall in a direction parallel to the heat spreader, and a plurality of fourth through holes on the side wall in a direction perpendicular to the heat spreader; the third through holes are connected to the first heat dissipation channel in the vertical direction, and the fourth through holes are connected to the first heat dissipation channel in the horizontal direction.

[0015] The present application also discloses a display device, including a housing and a display panel, wherein the display panel is connected to the housing. The display device also includes the above-mentioned heat dissipation module, which is arranged in the housing.

[0016] The present application provides an improvement to a heat dissipation module. By providing a connector between a first heat sink and a second heat sink, the connector is used to raise the first heat sink near the fixed bracket by a preset height relative to the second heat sink, thereby forming a staggered design between the first and second heat sinks. Since the first heat sink is connected to the fixed bracket via a heat pipe, the heat generated by the electronic component during operation is transferred to the fixed bracket, which then transfers the heat to the first heat sink via the heat pipe. While the first heat sink dissipates the heat to the external environment, it also transfers a portion of the heat to the second heat sink via the connector. The second heat sink shares the heat dissipation pressure of the first heat sink, allowing the second heat sink to ultimately dissipate the heat to the external environment, effectively improving the heat dissipation efficiency. Due to the elevation of the first heat sink, a certain amount of space is created between the first and second heat sinks, which provides a larger flow space for air near the electronic components, ensuring sufficient air circulation to carry away the heat below and near the first heat sink, further improving the heat dissipation efficiency. In addition, the space below the raised first heat sink can also accommodate more structures or devices in the display device, effectively improving the structural utilization of the heat dissipation module. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The included drawings are used to provide a further understanding of the embodiments of the present application, which constitute a part of the specification, are used to illustrate the implementation methods of the present application, and together with the text description, explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without inventive work. In the drawings:

[0018] Figure 1 This is a schematic diagram of a first embodiment of the heat dissipation module of the present application;

[0019] Figure 2 This is a schematic diagram of the connector in the first embodiment of the heat dissipation module of the present application;

[0020] Figure 3 A schematic diagram of a second embodiment of the heat dissipation module of the present application;

[0021] Figure 4 A schematic diagram of a third embodiment of the heat dissipation module of the present application;

[0022] Figure 5 A schematic diagram of a fourth embodiment of the heat dissipation module of the present application;

[0023] Figure 6 This is a schematic diagram of a fifth embodiment of the heat dissipation module of the present application;

[0024] Figure 7This is a schematic diagram of a flow guide member in a sixth embodiment of the heat dissipation module of the present application;

[0025] Figure 8 Schematic diagram of the first flow guide and the second flow guide in the seventh embodiment of the heat dissipation module of the present application;

[0026] Figure 9 This is a schematic diagram of an embodiment of a display device of the present application.

[0027] Among them, 10, display device; 100, heat dissipation module; 200, housing; 300, electronic component; 110, fixing bracket; 111, first radiator; 112, second radiator; 113, heat pipe; 114, connector; 115, first connecting part; 116, second connecting part; 117, third connecting part; 120, heat dissipation keel; 121, third radiator; 122, fourth radiator; 130, first heat pipe Part; 131, first space; 140, second heat-conducting part; 141, second space; 150, heat spreader; 160, first heat dissipation channel; 170, second heat dissipation channel; 171, heat dissipation fin; 172, through hole; 180, first air guide; 181, first through hole; 182, second through hole; 190, second air guide; 191, third through hole; 192, fourth through hole; 400, display panel; 500, air guide. DETAILED DESCRIPTION

[0028] The present application is described in detail below with reference to the accompanying drawings and optional embodiments. It should be noted that, under the premise of no conflict, the embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0029] Figure 1 This is a schematic diagram of the first embodiment of the heat dissipation module of the present application. Figure 2 This is a schematic diagram of the connector in the first embodiment of the heat dissipation module of this application, as shown in FIG. Figure 1 and Figure 2 As shown, the present application discloses a heat dissipation module 100, which includes a fixed bracket 110, a first radiator 111, a second radiator 112 and a plurality of heat pipes 113; the fixed bracket 110 is connected above the electronic component 300, the first radiator 111 is arranged on a side close to the fixed bracket 110, and at least one heat pipe 113 is connected between the first radiator 111 and the fixed bracket 110; the second radiator 112 is arranged on a side adjacent to the connection side of the first radiator 111 and the fixed bracket 110; a connecting member 114 is provided between the first radiator 111 and the second radiator 112, and the connecting member 114 is made of heat-conducting material, one end of the connecting member 114 is connected to the second radiator 112, and the other end is connected to the first radiator 111, and the first radiator 111 is raised to a preset height relative to the second radiator 112.

[0030] The present application improves the heat dissipation module 100 by setting a connector 114 between the first radiator 111 and the second radiator 112, and using the connector 114 to raise the first radiator 111 close to the fixed bracket 110 to a preset height relative to the second radiator 112, so that a staggered design is formed between the first radiator 111 and the second radiator 112; since the first radiator 111 is connected to the fixed bracket 110 through the heat pipe 113, when the electronic component 300 is running, the heat generated is transferred to the fixed bracket 110, and the fixed bracket 110 transfers the heat to the first radiator 111 through the heat pipe 113. While the first radiator 111 dissipates the heat to the external environment, it also transfers part of the heat through the connector 114. A second radiator 112 is provided, and the second radiator 112 is used to share the heat dissipation pressure of the first radiator 111, so that the second radiator 112 will eventually dissipate the heat to the external environment, effectively improving the heat dissipation efficiency; and due to the lifting of the first radiator 111, there is a certain space between the first radiator 111 and the second radiator 112, which makes the air near the electronic component 300 have a larger flow space, and can ensure that there is enough air circulation to take away the heat located below the first radiator 111 and near the electronic component 300, further improving the heat dissipation efficiency, and the lower space formed by the lifting of the first radiator 111 can also accommodate more structures or devices in the display device 10, effectively improving the structural utilization rate of the heat dissipation module 100.

[0031] For details, see Figure 2 The connecting member 114 includes a first connecting portion 115, a second connecting portion 116 and a third connecting portion 117. The second connecting portion 116 is located between the first connecting portion 115 and the third connecting portion 117, and one end of the second connecting portion 116 is connected to the first connecting portion 115, and the other end is connected to the third connecting portion 117. The first connecting portion 115 and the third connecting portion 117 are arranged in parallel; one end of the first connecting portion 115 away from the second connecting portion 116 is connected to the first radiator 111, and one end of the third connecting portion 117 away from the second connecting portion 116 is connected to the second radiator 112.

[0032] In this application, the first connecting part 115, the second connecting part 116 and the third connecting part 117 are connected to each other to form a "Z"-shaped structure, and the first connecting part 115 and the third connecting part 117 are connected to the first radiator 111 and the second radiator 112 respectively, and the second connecting part 116 mainly plays the role of supporting and lifting the first radiator 111 between the first connecting part 115 and the second connecting part 117, thereby ensuring the stability of the connection between the connecting part 114 and the first radiator 111 and the second radiator 112.

[0033] Furthermore, the angle α between the first connection portion 115 and the second connection portion 116, and the angle β between the third connection portion 117 and the second connection portion 116 are both in the range of 90° to 135°; the end of the first connection portion 115 away from the second connection portion 116 is connected to the first radiator 111, and the end of the third connection portion 117 away from the second connection portion 116 is connected to the second radiator 112.

[0034] At the same time, by adjusting the angle α between the first connection portion 115 and the second connection portion 116, and the angle β between the third connection portion 117 and the second connection portion 116, the relative position of the second connection portion 116 can be adjusted to adjust the lifting height of the first radiator 111; for example, when the angle α between the first connection portion 115 and the second connection portion 116, and the angle β between the third connection portion 117 and the second connection portion 116 are 90°, the second connection portion 116 is just perpendicular to the first connection portion 115 and the third connection portion 117. At this time, the position of the first radiator 111 raised by the connector 114 is the highest, and when the angle α between the first connection portion 115 and the second connection portion 116 is 90°, the second connection portion 116 is just perpendicular to the first connection portion 115 and the third connection portion 117. When the angle α between them and the angle β between the third connection part 117 and the second connection part 116 gradually become greater than 90°, the second connection part 116 gradually tilts relative to the first connection part 115 and the third connection part 117, and the height of the first radiator 111 lifted by the entire connection part 114 gradually decreases. When the angle α and the angle β reach 135°, after the connection part 114 lifts the first radiator 111, sufficient space for air circulation is formed under the first radiator 111, and the structural stability of the connection part 114 can be guaranteed, and the radiator will not bend the connection part 114. The specific settings of the angle α and the angle β can be determined according to actual usage.

[0035] Furthermore, in order to ensure that the connector 114 can stably support the first radiator 111 and prevent the connector 114 from bending or breaking when the first radiator 111 is suspended, thereby improving the structural stability of the heat dissipation module 100, the present application also limits the lifting height of the connector 114, as follows:

[0036] If the preset height is lower than 8 mm, the first radiator 111 will not be lifted up enough, and the space left below will be insufficient, which will affect the air circulation below the first radiator 111 and further affect the heat dissipation effect of the heat dissipation module 100; and if the preset height is higher than 12 mm, the connector 114 will not be able to bear the force due to being lifted too high, and the connector 114 will be easily bent or broken; therefore, the preset height range for lifting the first radiator 111 relative to the second radiator 112 is between 8 mm and 12 mm. For example, when the preset height for lifting the first radiator 111 relative to the second radiator 112 is 10 mm, it can ensure that after the connector 114 lifts the first radiator 111, sufficient space for air circulation is formed below the first radiator 111, while also ensuring the connection stability of the connector 114.

[0037] Figure 3 This is a schematic diagram of a second embodiment of the heat dissipation module of the present application, as shown Figure 3 As shown, Figure 3 The embodiment shown is based on Figure 1 The improvement of the heat dissipation module 100 further includes a heat dissipation keel 120, which is made of a metal heat-conducting material; the heat dissipation keel 120 is arranged on a side adjacent to the connection side of the fixed bracket 110 and the first radiator 111, and corresponds to the position of the second radiator 112; at least one heat conducting pipe 113 is connected between the heat dissipation keel 120 and the fixed bracket 110; at least one heat conducting pipe 113 is connected between the second radiator 112 and the heat dissipation keel 120; the heat dissipation module 100 further includes a third radiator 121 and a fourth radiator 122, and the third radiator 121 is arranged on the fixed bracket 1 10 is on a side away from the first radiator 111, and at least one heat pipe 113 is connected between the third radiator 121 and the fixing bracket 110; the fourth radiator 122 is arranged on a side of the heat dissipation keel 120 away from the second radiator 112, and the positions of the third radiator 121 and the fourth radiator 122 correspond to each other, and at least one heat pipe 113 is connected between the fourth radiator 122 and the heat dissipation keel 120; the third radiator 121 and the fourth radiator 122 are connected by a connector 114, and the connector 114 lifts the third radiator 121 to be on the same horizontal plane as the first radiator 111.

[0038] Unlike the previous embodiment, the present embodiment is additionally provided with a heat dissipation keel 120. By connecting the fixing bracket 110 of the heat dissipation module 100 with the electronic component 300 in the display device 10, the heat emitted by the electronic component 300 is directly transferred to the fixing bracket 110, and then the heat of the fixing bracket 110 is transferred to the heat dissipation keel 120 through the heat pipe 113 connected to the fixing bracket 110. In this way, the heat generated by the electronic component 300 as a heat source can be quickly conducted to a position far away from the heat source, avoiding excessive concentration of heat at the heat source, resulting in excessive temperature of the electronic component 300 and burning; and after the heat is transferred to the heat dissipation keel 120, the heat is dissipated by the heat dissipation keel 120. The bone 120 serves as the center of heat conduction, transferring heat to the second radiator 112, thereby expanding the area of ​​heat transfer, and utilizing the first radiator 111 and the second radiator 112 to transfer heat to the environment through the air, so that the entire heat is transferred from the heat source to the radiator in a "point-to-surface" manner. While transferring heat from different directions, the heat dissipation area is also increased; that is, the heat dissipation module 100 in the present application utilizes the structure and material properties of the module itself in combination with air flow to achieve heat dissipation, without the need for additional display devices. In this way, the heat generated on the electronic component 300 can be stably and quickly conducted to the surrounding environment, thereby improving the cooling efficiency of the equipment.

[0039] In addition, in this embodiment, a third radiator 121 and a fourth radiator 122 are also provided. Since the third radiator 121 is located closer to the electronic component 300, the heat emitted by the electronic component 300 will first reach the third radiator 121; when the electronic component 300 generates heat, the heat is transferred to the third radiator 121 and the fourth radiator 122 respectively through the heat pipe 113, and the third radiator 121 and the fourth radiator 122 are used to quickly dissipate the heat generated by the electronic component 300 to the external environment, thereby preventing the heat generated by the electronic component 300 from accumulating in its vicinity. Through the third radiator 121 and the fourth radiator 122, the heat dissipation area of ​​the heat dissipation module 100 is further increased on the basis of the first radiator 111 and the second radiator 112, thereby improving the heat dissipation effect of the heat dissipation module 100.

[0040] By providing a connector 114 between the third heat sink 121 and the fourth heat sink 122, the third heat sink 121 close to the fixing bracket 110 is raised relative to the fourth heat sink 122 to the same height as the first heat sink 111 by the connector 114, so that a staggered design is formed between the third heat sink 121 and the fourth heat sink 122; and due to the lifting of the third heat sink 121, the space between the third heat sink 121 and the fourth heat sink 122 is the same as the space formed below the first heat sink 111, which makes the air near the electronic component 300 have a With a larger flow space and connected with the space formed below the first radiator 111, the convection of air near the electronic component 300 is further increased, ensuring sufficient air circulation to carry away the heat located below the first radiator 111, the third radiator 121 and near the electronic component 300, further improving the heat dissipation efficiency. In addition, the lower space formed by the lifting of the third radiator 121 combined with the lower space formed by the lifting of the first radiator 111 can further accommodate more structures or devices in the display device 10, effectively improving the structural utilization rate of the heat dissipation module 100.

[0041] Figure 4 This is a schematic diagram of a third embodiment of the heat dissipation module of the present application, as shown Figure 4 As shown, a first heat conducting member 130 is further provided between the first heat sink 111 and the second heat sink 112. The first heat conducting member 130 is located above the connecting member 114 between the first heat sink 111 and the second heat sink 112. One end of the first heat conducting member 130 is connected to the first heat sink 111, and the other end is connected to the second heat sink 112. A first space 131 is formed between the first heat conducting member 130 and the connecting member 114 of the first heat sink 111 and the second heat sink 112; the third heat sink 121 and the third heat sink 122 are connected to each other. A second heat-conducting member 140 is also provided between the four radiators 122. The second heat-conducting member 140 is located above the connecting member 114 between the third radiator 121 and the fourth radiator 122. One end of the second heat-conducting member 140 is connected to the third radiator 121, and the other end is connected to the fourth radiator 122. A second space 141 is formed between the second heat-conducting member 140 and the connecting member 114 between the third radiator 121 and the fourth radiator 122; the first space 131 and the second space 141 are both used for air circulation.

[0042] In this embodiment, the first heat conducting member 130 and the second heat conducting member 140 are used to connect the first heat sink 111 and the second heat sink 112, and the third heat sink 121 and the fourth heat sink 122 respectively. Since the first heat sink 111 and the third heat sink 121 are closer to the electronic component 300 than the second heat sink 112 and the fourth heat sink 122, the first heat sink 111 and the third heat sink 121 will first receive the heat transferred from the electronic component 300. In a short period of time, the first heat sink 111 and the third heat sink 121 may be subjected to a large amount of heat, and this When the heat is dissipated, part of the heat is dissipated by the first heat sink 111 and the third heat sink 121, and the heat is brought to the external environment through the air, and the other part of the heat is conducted to the second heat sink 112 and the fourth heat sink 122 through the first heat conductor 130 and the second heat conductor 140 respectively; the second heat sink 112 and the fourth heat sink 122 share the heat dissipation pressure of the first heat sink 111 and the third heat sink 121, so that each heat dissipation area of ​​the entire heat dissipation module 100 can normally exert its heat dissipation performance, and further improve the overall heat dissipation efficiency of the heat dissipation module 100.

[0043] In addition, air can circulate through the first space 131 and the second space 141, which is conducive to quickly taking away the heat between two adjacent radiators (i.e., between the third radiator 121 and the fourth radiator 122, and between the second radiator 112 and the first radiator 111) through air, avoiding heat accumulation between two adjacent radiators, and further improving the heat dissipation efficiency of the heat dissipation module 100.

[0044] Figure 5 This is a schematic diagram of a fourth embodiment of the heat dissipation module of the present application, as shown Figure 5 As shown, Figure 5 The embodiment shown is based on Figure 4 The improvement of the heat dissipation module 100 further includes a heat spreader 150, which is connected below the second radiator 112 and the fourth radiator 122, and the heat spreader 150 is partially located below the first heat conductor 130 and the second heat conductor 140, and there is a gap between the first heat conductor 130 and the second heat conductor 140; a first heat dissipation channel 160 is formed between the first radiator 111, the second radiator 112 and the heat spreader 150, and between the third radiator 121, the fourth radiator 122 and the heat spreader 150; the thickness of the heat dissipation keel 120 is less than the thickness of the second radiator 112 and the fourth radiator 122, and a second heat dissipation channel 170 is formed between the heat dissipation keel 120 and the second radiator 112 and the fourth radiator 122; the first heat dissipation channel 160 is connected to the second heat dissipation channel 170.

[0045] This embodiment is different from the previous embodiment in that, in this embodiment, a heat spreader 150 is further provided below the second radiator 112, the fourth radiator 122 and the heat dissipation keel 120. The heat spreader 150 can be made of graphene material or silicon material. The heat spreader 150 is connected to the second radiator 112, the fourth radiator 122 and the heat dissipation keel 120, so that the heat of the second radiator 112, the fourth radiator 122 and the heat dissipation keel 120 can be evenly dissipated through the heat spreader 150, further accelerating the rate of heat transfer, which is beneficial to improving the heat dissipation efficiency of the heat dissipation module 100.

[0046] In addition, the thickness of the heat spreader 150 can be adjusted according to the actual heat dissipation requirements. If the heat dissipation pressure of the device is large, a heat spreader 150 with a larger thickness can be set. If the heat dissipation performance of the device is stable, the thickness of the heat spreader 150 can be reduced according to the size of the device itself to achieve a lighter and thinner device.

[0047] A first heat dissipation channel 160 is formed by utilizing the gaps between the first heat sink 111, the second heat sink 112 and the heat spreader 150, and between the third heat sink 121, the fourth heat sink 122 and the heat spreader 150. The thickness difference between the heat dissipation keel 120 and the second heat sink 112 and the fourth heat sink 122 is utilized to make the gap formed by the thickness difference between the heat dissipation keel 120 and the second heat sink 112 and the fourth heat sink 122 serve as a second heat dissipation channel 170. When the first heat dissipation channel 160 and the second heat dissipation channel 170 are connected, an air flow path is formed in the heat dissipation module 100. The air in the entire heat dissipation module 100 can circulate over a large area through the first heat dissipation channel 160 and the second heat dissipation channel 170, thereby accelerating the circulation rate of the air in the heat dissipation module 100. When the air passes through the first heat dissipation channel 160 and the second heat dissipation channel 170, the heat at various positions of the heat dissipation module 100 can be taken away to the external environment.

[0048] Figure 6 This is a schematic diagram of a fifth embodiment of the heat dissipation module of the present application, as shown Figure 6 As shown, Figure 6 The embodiment shown is based on Figure 5 The improvement is that the first radiator 111, the second radiator 112, the third radiator 121 and the fourth radiator 122 each include a plurality of spaced-apart heat sinks 171, each heat sink 171 is provided with a through hole 172, the through holes 172 on the plurality of heat sink fins 171 are arranged opposite to each other, and at least one heat pipe 113 passes through the through holes 172 arranged opposite to each other on the plurality of heat sink fins in sequence and is connected to the plurality of heat sink fins 171.

[0049] In this embodiment, the heat pipe 113 is used to pass through the through holes 172 arranged opposite to each other on multiple heat dissipation fins 171 in sequence, so that the heat pipe 113 is connected to the multiple heat dissipation fins 171 and is in direct contact with the heat dissipation fins 171 in the heat dissipation module 100 that mainly play a heat dissipation effect. When the heat pipe 113 transfers the heat from the electronic component 300 to the radiator, the heat of the heat pipe 113 is directly transferred to the heat dissipation fins 171 and dissipated through the heat dissipation fins 171, thereby further improving the heat dissipation effect.

[0050] Figure 7 This is a schematic diagram of the guide member in the sixth embodiment of the heat dissipation module of the present application, as shown in FIG. Figure 7 As shown, the heat dissipation module 100 also includes a flow guide 500, which is long and has openings at both ends. The flow guide 500 includes a first flow guide 180 and a second flow guide 190. The first flow guide 180 is mounted on the connecting member 114 between the first radiator 111 and the second radiator 112 and the first heat conductor 130, and the second flow guide 190 is mounted on the connecting member 114 between the third radiator 121 and the fourth radiator 122 and the second heat conductor 140.

[0051] The present embodiment is different from the previous embodiment in that, in the present embodiment, the first guide member 180 and the second guide member 190 are respectively mounted on the connecting member 114 and the first heat conducting member 130 between the first radiator 111 and the second radiator 112, and on the connecting member 114 and the second heat conducting member 140 between the third radiator 121 and the fourth radiator 122. The first guide member 180 and the second guide member 190 can be cylindrical structural members with openings at both ends; wherein, the space formed between the connecting member 114 and the first heat conducting member 130 between the first radiator 111 and the second radiator 112 is defined as the first airflow space, and the space formed between the connecting member 114 and the first heat conducting member 130 between the third radiator 121 and the fourth radiator 122 is defined as the first airflow space. The space formed between the connecting piece 114 between the heat sink 122 and the second heat conducting piece 140 is the second air flow space; the first air flow space and the second air flow space are respectively covered by the first air guide 180 and the second air guide 190, so that the air passing through the first air flow space and the air in the second air flow space can only circulate in the first air guide 180 and the second air guide 190, thereby accelerating the heat transfer speed between the first radiator 111 and the second radiator 112, and between the third radiator 121 and the fourth radiator 122, so that the heat can be dissipated to the external environment through the radiator more quickly, which is beneficial to improving the heat dissipation efficiency of the heat dissipation module 100.

[0052] The first guide member 180 and the second guide member 190 in the present application can both be made of aluminum material, which is light and thin and will not increase the burden on the entire radiator module.

[0053] Figure 8Schematic diagram of the first guide member and the second guide member in the seventh embodiment of the heat dissipation module of the present application, as shown Figure 8 As shown, Figure 8 The embodiment shown is based on Figure 7 The improvement is that the first air guide 180 is provided with a plurality of first through holes 181 on the side wall in a direction parallel to the heat spreader 150, and a plurality of second through holes 182 on the side wall in a direction perpendicular to the heat spreader 150. The first through holes 181 are connected to the first heat dissipation channel 160 in the vertical direction, and the second through holes 182 are connected to the first heat dissipation channel 160 in the horizontal direction; the second air guide 190 is provided with a plurality of third through holes 191 on the side wall in a direction parallel to the heat spreader 150, and a plurality of fourth through holes 192 on the side wall in a direction perpendicular to the heat spreader 150; the third through holes 191 are connected to the first heat dissipation channel 160 in the vertical direction, and the fourth through holes 192 are connected to the first heat dissipation channel 160 in the horizontal direction.

[0054] In this embodiment, air flows through the first heat dissipation channel 160 in directions specified by the first through holes 181 and the second through holes 182 of the first air guide 180 and the third through holes 191 and the fourth through holes 192 of the second air guide 190 .

[0055] 171 , the heat dissipation fins 171 of the first radiator 111 are arranged in the same direction as the heat dissipation fins 171 of the second radiator 112, and the heat dissipation fins 171 of the third radiator 121 are arranged in the same direction as the heat dissipation fins 171 of the fourth radiator 122. The gaps between the two adjacent heat dissipation fins 171 of the first radiator 111 and the second radiator 112 are positioned correspondingly, and the gaps between the two adjacent heat dissipation fins 171 of the third radiator 121 and the fourth radiator 122 are positioned correspondingly. Air flows through the gaps between the two adjacent heat dissipation fins 171 between the first radiator 111 and the second radiator 112, and between the third radiator 121 and the fourth radiator 122, and then passes through the first guide 180 and the second guide 190. After the air enters the first guide 180 and the second guide 190, the air above and below the first guide 180 and the second guide 190 are The air will form convection with the air inside the first guide member 180 and the second guide member 190 through the first through hole 181 and the third through hole 191 respectively, thereby accelerating the flow rate of the air above and below the first guide member 180 and the second guide member 190, so that the air can take away the heat more quickly and avoid the accumulation of heat in the first guide member 180 and the second guide member 190; at the same time, the air in the first air flow space and the second air flow space is guided toward the two sides of the first guide member 180 and the second guide member 190 through the second through hole 182 and the fourth through hole 192 of the first guide member 180 and the second guide member 190, so that the air in the first guide member 180 and the second guide member 190 circulates with the first heat dissipation channel 160, so that the first heat dissipation channel 160 can be used to form an air circulation loop, thereby accelerating the rate of heat transfer between each radiator, avoiding local accumulation of heat, and further improving the overall heat dissipation effect of the heat dissipation module 100.

[0056] Figure 9 This is a schematic diagram of an embodiment of the display device of the present application, such as Figure 9 As shown, the present application also discloses a display device 10, comprising a housing 200 and a display panel 400, wherein the display panel 400 is connected to the housing 200. The display device 10 also comprises the above-mentioned heat dissipation module 100, which is disposed within the housing 200. The housing 200 is used to protect the heat dissipation module 100 and the display panel 400 from being invaded by external water vapor, thereby preventing water vapor from corroding the heat dissipation module 100 and causing a decrease in the heat dissipation performance of the heat dissipation module 100. At the same time, when the display device 10 is being carried or moved, it can also effectively prevent the heat dissipation module 100 and the display panel 400 from being collided with by the outside world, thereby preventing damage to the heat dissipation module 100 or the display panel 400.

[0057] It should be noted that the display device 10 in this application can be a device with display function such as a computer or a television, and this application does not limit the specific type of the display device 10.

[0058] Since the space in the display device 10 is limited, the electronic components 300 and the structure therein are often relatively complex and compact, and the heat dissipation module 100 itself has a certain size. Therefore, after being installed in the housing 200 of the display device 10, the space inside the housing 200 is often greatly compressed, reducing the space utilization rate; and when the heat dissipation module 100 is large in size, it is easy to hinder the air circulation near the electronic components 300, affecting the heat dissipation effect.

[0059] In response to the above problems, the present application improves the heat dissipation module 100 of the display device 10, by providing a connecting member 114 between the first radiator 111 and the second radiator 112, and using the connecting member 114 to lift the first radiator 111 close to the fixed bracket 110 to a preset height relative to the second radiator 112, so that the first radiator 111 and the second radiator 112 form a staggered design; since the first radiator 111 is connected to the fixed bracket 110 through the heat pipe 113, when the electronic component 300 is running, the heat generated is transferred to the fixed bracket 110, and the fixed bracket 110 will transfer the heat to the first radiator 111 through the heat pipe 113. While the first radiator 111 dissipates the heat to the external environment, it also transfers part of the heat to the second radiator 112 through the connecting member 114, thereby The second radiator 112 is used to share the heat dissipation pressure of the first radiator 111, so that the second radiator 112 will eventually dissipate the heat to the external environment, effectively improving the heat dissipation efficiency; and due to the lifting of the first radiator 111, there is a certain space between the first radiator 111 and the second radiator 112, which makes the air near the electronic component 300 have a larger flow space, and can ensure that there is enough air circulation to take away the heat located below the first radiator 111 and near the electronic component 300, further improving the heat dissipation efficiency, and the lower space formed by the lifting of the first radiator 111 can also accommodate more structures or devices in the display device 10, effectively improving the structural utilization rate of the heat dissipation module 100, further improving the space utilization rate of the display device 10, and extending the service life of the display device 10.

[0060] It should be noted that the inventive concept of this application can form a large number of embodiments, but the length of the application document is limited and it is impossible to list them one by one. Therefore, under the premise of no conflict, the various embodiments or technical features described above can be arbitrarily combined to form new embodiments. After the various embodiments or technical features are combined, the original technical effects will be enhanced.

[0061] The above content is a further detailed description of the present application in conjunction with specific optional implementation methods, and the specific implementation of the present application cannot be considered to be limited to these descriptions. For ordinary technicians in the technical field to which the present application belongs, they can make several simple deductions or substitutions without departing from the concept of the present application, which should be considered to fall within the scope of protection of the present application.

Claims

1. A heat dissipation module, characterized in that: The heat dissipation module includes a fixed bracket, a first radiator, a second radiator and a plurality of heat pipes; the fixed bracket is connected above the electronic component, the first radiator is arranged close to one side of the fixed bracket, and at least one heat pipe is connected between the first radiator and the fixed bracket; The second radiator is arranged on a side adjacent to a connection side of the first radiator and the fixing bracket; A connector is provided between the first radiator and the second radiator. The connector is made of a heat-conducting material. One end of the connector is connected to the second radiator, and the other end is connected to the first radiator, and the first radiator is raised to a preset height relative to the second radiator.

2. The heat dissipation module according to claim 1, wherein: The connecting member includes a first connecting portion, a second connecting portion and a third connecting portion, wherein the second connecting portion is located between the first connecting portion and the third connecting portion, and one end of the second connecting portion is connected to the first connecting portion, and the other end is connected to the third connecting portion, and the first connecting portion and the third connecting portion are arranged in parallel; One end of the first connection portion away from the second connection portion is connected to the first heat sink, and one end of the third connection portion away from the second connection portion is connected to the second heat sink.

3. The heat dissipation module according to claim 2, wherein: The included angles between the first connecting portion and the second connecting portion, and between the third connecting portion and the second connecting portion are both in a range of 90° to 135°.

4. The heat dissipation module according to claim 3, wherein: The preset height range of the first radiator raised relative to the second radiator is between 8 mm and 12 mm.

5. The heat dissipation module according to claim 3, wherein: The heat dissipation module further includes a heat dissipation keel, which is made of a metal heat-conducting material; the heat dissipation keel is arranged on a side adjacent to the connection side of the fixing bracket and the first heat sink, and corresponds to the position of the second heat sink; At least one heat conducting pipe is connected between the heat dissipation keel and the fixing bracket; At least one heat pipe is connected between the second radiator and the heat dissipation keel; The heat dissipation module further includes a third radiator and a fourth radiator, wherein the third radiator is arranged on a side of the fixing bracket away from the first radiator, and at least one heat pipe is connected between the third radiator and the fixing bracket; The fourth radiator is arranged on a side of the heat dissipation keel away from the second radiator, and the third radiator corresponds to the fourth radiator in position, and at least one heat pipe is connected between the fourth radiator and the heat dissipation keel; The third radiator and the fourth radiator are connected via the connecting member, and the connecting member lifts the third radiator to be on the same horizontal plane as the first radiator.

6. The heat dissipation module according to claim 5, wherein: A first heat conducting member is further provided between the first heat sink and the second heat sink. The first heat conducting member is located above the connecting member between the first heat sink and the second heat sink. One end of the first heat conducting member is connected to the first heat sink, and the other end is connected to the second heat sink. A first space is formed between the first heat conducting member and the connecting member between the first heat sink and the second heat sink. A second heat-conducting member is further provided between the third radiator and the fourth radiator. The second heat-conducting member is located above the connecting member between the third radiator and the fourth radiator. One end of the second heat-conducting member is connected to the third radiator, and the other end is connected to the fourth radiator. A second space is formed between the second heat-conducting member and the connecting member between the third radiator and the fourth radiator. Both the first space and the second space are used for air circulation.

7. The heat dissipation module according to claim 6, wherein: The heat dissipation module further includes a vapor chamber connected to below the second heat sink and the fourth heat sink, and the vapor chamber is partially located below the first heat conducting member and the second heat conducting member, with a gap between the vapor chamber and the first heat conducting member and the second heat conducting member; A first heat dissipation channel is formed between the first heat sink, the second heat sink and the vapor chamber, and between the third heat sink, the fourth heat sink and the vapor chamber; The thickness of the heat dissipation keel is smaller than that of the second heat sink and the fourth heat sink, and a second heat dissipation channel is formed between the heat dissipation keel and the second heat sink and the fourth heat sink; The first heat dissipation channel is communicated with the second heat dissipation channel.

8. The heat dissipation module according to claim 7, wherein: The heat dissipation module further includes a flow guide, which is in the form of a long strip and has openings at both ends. The guide member includes a first guide member and a second guide member. The first guide member is mounted on the connecting member between the first radiator and the second radiator and the first heat-conducting member. The second guide member is mounted on the connecting member between the third radiator and the fourth radiator and the second heat-conducting member.

9. The heat dissipation module according to claim 8, wherein: The first air guide has a plurality of first through holes on a side wall parallel to the vapor chamber, and a plurality of second through holes on a side wall perpendicular to the vapor chamber. The first through holes are connected to the first heat dissipation channel in a vertical direction, and the second through holes are connected to the first heat dissipation channel in a horizontal direction. The second air guide member is provided with a plurality of third through holes on the side wall parallel to the direction of the heat spreader, and a plurality of fourth through holes on the side wall perpendicular to the direction of the heat spreader; the third through holes are connected to the first heat dissipation channel in the vertical direction, and the fourth through holes are connected to the first heat dissipation channel in the horizontal direction.

10. A display device comprising a housing and a display panel, wherein the display panel is connected to the housing, wherein: The display device further comprises a heat dissipation module according to any one of claims 1 to 9, wherein the heat dissipation module is disposed in the housing.

Images