Electric connection structure, display device and display module
By setting conductive glue and protective glue at the solder joint position, the problem of insufficient connection reliability between semiconductor chips and peripheral components is solved, the connection stability and conductivity performance are improved, the failure rate is reduced, and the equipment life is extended.
Patent Information
- Application Number
- CN202422392525.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-27
- Publication Date
- 2025-10-03
- Estimated Expiration
- 2034-09-27
AI Technical Summary
The connection reliability between existing semiconductor chips and peripheral components is weak, which can easily lead to failure or scrapping of electronic equipment.
Conductive glue, including silver glue or epoxy resin glue doped with gold powder, is set at the soldering point to enhance the connection stability between the soldering point and the connector, and the soldering wire and soldering point are covered with protective glue to improve the connection reliability.
It improves the connection stability and conduction yield between the solder joints and the connectors, reduces the probability of solder joints falling off, improves the conductive performance, reduces the problem of poor contact, and extends the service life of electronic equipment.
Smart Images
Figure CN223415225U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of semiconductor technology, and in particular to an electrical connection structure, a display device, and a display module. Background Art
[0002] With the rapid development of electronic technology, the semiconductor industry has become one of the core technologies of the modern information industry. As the core component of electronic equipment, the quality and reliability of semiconductor chips are closely related to the performance and life of the entire electronic equipment.
[0003] However, the connection reliability between existing semiconductor chips and peripheral components is weak, which can easily cause electronic equipment to malfunction or become scrapped. Utility Model Content
[0004] The present application provides an electrical connection structure, a display device, and a display module, for improving the connection reliability between a first connecting member and a second connecting member.
[0005] The present application provides an electrical connection structure, comprising a first connection member, a second connection member and a welding wire;
[0006] One end of the welding wire is welded to the first connecting member to form a first welding point, and a first conductive adhesive is connected between the first welding point and the first connecting member;
[0007] One end of the welding wire away from the first welding point is welded to the second connecting member to form a second welding point, and a second conductive adhesive is connected between the second welding point and the second connecting member;
[0008] The first conductive paste and the second conductive paste both include silver paste.
[0009] In some possible implementations, the first solder joint includes a solder ball structure, the first conductive adhesive is arranged around the circumference of the solder ball structure by 1 / 3 to 1 / 2 circle, and the first conductive adhesive is connected to the solder ball structure and the first connector.
[0010] In some possible implementations, the first conductive adhesive is provided around the circumference of the solder ball structure to form a 1 / 3 circle.
[0011] In some possible implementations, the second solder joint includes a solder tab structure, the second conductive adhesive covers the solder tab structure and is connected to the second connector, and the second conductive adhesive covers 1 / 3 to 1 / 2 of an area of the solder tab structure.
[0012] In some possible implementations, the second conductive adhesive covers 1 / 3 of the area of the solder pad structure.
[0013] In some possible implementations, the welding wire is configured with a wire arc high point, and the wire arc high point is the position of the welding wire with the maximum vertical height from the second connecting member.
[0014] In some possible implementations, a vertical height between the highest point of the line arc and the second connecting member is 120 μm to 200 μm.
[0015] In some possible implementations, the electrical connection structure further includes a protective adhesive, and the protective adhesive covers the welding wire, the first welding point, the second welding point, the first conductive adhesive, and the second conductive adhesive.
[0016] In a second aspect, the present application provides a display device, comprising the electrical connection structure provided in the above embodiments.
[0017] In a third aspect, the present application further provides a display module, comprising the electrical connection structure provided in the above embodiments.
[0018] The beneficial effects of this application are as follows: The electrical connection structure provided by this application, by providing conductive adhesive at the two solder joints, each of which may include silver adhesive, can increase the stability and reliability of the connection between the solder joints and the corresponding connectors, reduce the probability of solder joint detachment, improve the conductivity yield and connection reliability between the solder wire and the two connectors, and thus improve the connection reliability between the first connector and the second connector. At the same time, it can also reduce problems such as poor contact caused by solder joint defects and improve the electrical conductivity between the solder wire and the connectors. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.
[0020] Figure 1 shows a partial structural schematic diagram of the electrical connection structure in some embodiments;
[0021] Figure 2 Schematic diagrams of electrical connection structures in some embodiments are shown.
[0022] Description of main component symbols:
[0023] 100-first connecting member;
[0024] 200- second connecting member;
[0025] 300-welding line; 310-first welding point; 320-second welding point; 330-line arc high point;
[0026] 410-first conductive adhesive; 420-second conductive adhesive;
[0027] 500-Protective glue. DETAILED DESCRIPTION
[0028] The following describes in detail embodiments of the present application. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application.
[0029] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.
[0031] In this application, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components or interactions between two components. Those skilled in the art will understand the specific meanings of these terms in this application based on specific circumstances.
[0032] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.
[0033] An embodiment provides an electrical connection structure that can be applied to structures such as display modules.
[0034] like Figure 1 As shown, the electrical connection structure includes a first connector 100, a second connector 200, and a welding wire 300. One end of the welding wire 300 can be welded to the first connector 100 to form a first welding spot 310. The other end of the welding wire 300, away from the first welding spot 310, can be welded to the second connector 200 to form a second welding spot 320. Thus, the first connector 100 and the second connector 200 can be electrically connected via the welding wire 300.
[0035] In some embodiments, the first connector 100 may be a driver chip or a light emitting chip, etc. The second connector 200 may be a flexible printed circuit (FPC) or a printed circuit board (PCB).
[0036] In addition, a first conductive adhesive 410 is provided at the position of the first solder joint 310. The first conductive adhesive 410 can be connected between the first solder joint 310 and the first connector 100. On the one hand, this can strengthen the connection stability between the first solder joint 310 and the first connector 100, reduce the probability of the first solder joint 310 detaching from the first connector 100, improve the conductive yield between the solder wire 300 and the first connector 100, and also improve the conductive performance between the solder wire 300 and the first connector 100.
[0037] In some embodiments, silver paste can be used as the first conductive paste 410. Silver paste has the characteristics of high temperature resistance, strong conductivity, low resistance, high bonding strength, good heat dissipation, and low cost. While reducing cost, it can effectively improve the connection stability and conductive performance between the first solder joint 310 and the first connector 100.
[0038] In other embodiments, the first conductive adhesive 410 may be epoxy resin adhesive doped with metal powder such as gold powder, or the first conductive adhesive 410 may be a mixture of silver adhesive and other conductive adhesives.
[0039] A second conductive adhesive 420 is provided at the second solder joint 320, and the second conductive adhesive 420 can be connected between the second solder joint 320 and the second connector 200. This can strengthen the connection stability between the second solder joint 320 and the second connector 200, reduce the probability of the second solder joint 320 detaching from the second connector 200, improve the conductive yield between the solder wire 300 and the second connector 200, and also improve the conductive performance between the solder wire 300 and the second connector 200.
[0040] In some embodiments, the second conductive glue 420 can be made of silver glue, which has the characteristics of high temperature resistance, strong conductivity, low resistance, high bonding strength, good heat dissipation, and low cost. While reducing cost investment, it can effectively improve the connection stability and conductive performance between the second solder joint 320 and the second connecting member 200.
[0041] In other embodiments, the second conductive adhesive 420 may be epoxy adhesive doped with metal powder such as gold powder, or the second conductive adhesive 420 may be a mixture of silver adhesive and other conductive adhesives.
[0042] In the embodiment of the present application, by applying conductive adhesive to the two solder joints, the connection stability and reliability between the solder joints and the corresponding connectors can be increased, and the probability of solder joints falling off can be reduced. This can improve the conductivity yield and connection reliability between the solder wire 300 and the two connectors, and further improve the connection reliability between the first connector 100 and the second connector 200. At the same time, it can also reduce problems such as poor contact caused by solder joint defects, improve the electrical conductivity between the solder wire 300 and the connectors, and therefore improve the electrical conductivity between the first connector 100 and the second connector 200.
[0043] In some embodiments, the bonding wire 300 may include but is not limited to gold wire, silver wire, copper wire, or alloy wire.
[0044] In some embodiments, the first solder joint 310 may include a solder ball structure, i.e., the first solder joint 310 exhibits a spherical structure. The first conductive adhesive 410 may be disposed around the circumference of the connection between the first solder joint 310 and the first connector 100, and may be disposed around the circumference of the first solder joint 310 by 1 / 3 to 1 / 2 a circle. This reduces the use of conductive adhesive and reduces cost, while ensuring improved connection stability and electrical conductivity between the first solder joint 310 and the first connector 100. For example, in some embodiments, the first conductive adhesive 410 may be disposed around the circumference of the first solder joint 310 by 1 / 3 a circle.
[0045] In other embodiments, the first conductive adhesive 410 may be provided around the circumference of the first solder joint 310 in a size of 5 / 12, 1 / 2, or any other size ranging from 1 / 3 to 1 / 2.
[0046] like Figure 1 As shown, in some embodiments, the second solder joint 320 may include a solder tab structure, that is, the second solder joint 320 is generally a sheet-like structure. The second conductive adhesive 420 may cover the side of the solder tab structure facing away from the second connector 200, and a portion of the edge of the second conductive adhesive 420 may cover the second connector 200. This improves the connection stability and conductivity between the second solder joint 320 and the second connector 200.
[0047] In some embodiments, the second conductive adhesive 420 may cover 1 / 3 to 1 / 2 of the area of the second solder joint 320. This reduces the use of conductive adhesive and reduces costs while ensuring improved connection stability and electrical conductivity between the second solder joint 320 and the second connector 200. For example, in some embodiments, the second conductive adhesive 420 may cover 1 / 3 of the area of the second solder joint 320.
[0048] In other embodiments, the second conductive adhesive 420 may cover 5 / 12, 1 / 2, or any other area size between 1 / 3 and 1 / 2 of the area of the second solder joint 320 .
[0049] In some embodiments, the portion of the wire bond 300 between the first solder joint 310 and the second solder joint 320 may be roughly arc-shaped. Accordingly, the wire bond 300 may include a high point 330, where the high point 330 may be the point on the wire bond 300 with the greatest vertical distance from the second connector 200. In some embodiments, the vertical height between the high point 330 and the second connector 200 may be set to 120 μm to 200 μm. This prevents the high point 330 of the wire bond 300 from being too high, potentially affecting subsequent plastic encapsulation. Furthermore, it prevents the high point 330 from being too low, potentially causing defects such as collapse and impacting the conductive yield.
[0050] For example, in some embodiments, the handling height between the arc high point 330 and the second connector 200 can be set to 120μm, 125μm, 130μm, 145μm, 160μm, 177μm, 185μm, 190μm, 192μm, 200μm or any other height between 120μm and 200μm.
[0051] like Figure 2As shown, in some embodiments, the electrical connection structure further includes a protective adhesive 500. The protective adhesive 500 can simultaneously wrap the bonding wire 300, the first bonding point 310, the second bonding point 320, the first conductive adhesive 410, and the second conductive adhesive 420. This can further improve the connection stability between the bonding wire 300 and the first and second connectors 100 and 200, reducing the likelihood of the first bonding point 310 detaching from the first connector 100 and the second bonding point 320 detaching from the second connector 200. Furthermore, the protective adhesive 500 can protect the bonding wire 300 between the first and second bonding points 310 and 320, reducing the risk of bonding wire 300 breakage and preventing short circuits caused by contact between the bonding wire 300 and other metal wires. Furthermore, the service life of the display module in which it is used can be extended.
[0052] In some embodiments, the protective adhesive 500 may be made of thermosetting adhesive such as epoxy resin adhesive or silicone adhesive.
[0053] The embodiments further provide a display module that may include the electrical connection structure provided in the embodiments. The display module may be a micro-light emitting diode (Micro-LED) display module, a mini-light emitting diode (Mini-LED) display module, or the like.
[0054] The first connector 100 may be a driving chip or a light-emitting chip in a display module, etc. The second connector 200 may be an FPC or a PCB in a display module, etc.
[0055] In addition, an embodiment further provides an electronic product, which may include the electrical connection structure provided in the embodiment.
[0056] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.
[0057] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.
Claims
1. An electrical connection structure, characterized in that: It comprises a first connecting member (100), a second connecting member (200) and a welding wire (300); One end of the welding wire (300) is welded to the first connecting member (100) to form a first welding point (310), and a first conductive adhesive (410) is connected between the first welding point (310) and the first connecting member (100); One end of the welding wire (300) away from the first welding point (310) is welded to the second connecting member (200) to form a second welding point (320), and a second conductive adhesive (420) is connected between the second welding point (320) and the second connecting member (200); The first conductive paste (410) and the second conductive paste (420) both include silver paste.
2. The electrical connection structure according to claim 1, wherein: The first solder joint (310) includes a solder ball structure, the first conductive adhesive (410) surrounds the circumference of the solder ball structure by 1 / 3 to 1 / 2 of a circle, and the first conductive adhesive (410) is connected to the solder ball structure and the first connector (100).
3. The electrical connection structure according to claim 2, wherein: The first conductive adhesive (410) is arranged around the circumference of the solder ball structure to form a 1 / 3 circle.
4. The electrical connection structure according to any one of claims 1 to 3, characterized in that: The second solder joint (320) includes a soldering plate structure, the second conductive adhesive (420) covers the soldering plate structure and is connected to the second connector (200), and the second conductive adhesive (420) covers 1 / 3 to 1 / 2 of the area of the soldering plate structure.
5. The electrical connection structure according to claim 4, characterized in that: The second conductive adhesive (420) covers 1 / 3 of the area of the soldering sheet structure.
6. The electrical connection structure according to claim 1, wherein: The welding line (300) is provided with a line arc high point (330), and the line arc high point (330) is the position of the welding line (300) with the maximum vertical height from the second connecting member (200).
7. The electrical connection structure according to claim 6, wherein: The vertical height between the arc high point (330) and the second connecting member (200) is 120 μm to 200 μm.
8. The electrical connection structure according to claim 1, wherein: The electrical connection structure further comprises a protective adhesive (500), wherein the protective adhesive (500) covers the welding wire (300), the first welding point (310), the second welding point (320), the first conductive adhesive (410) and the second conductive adhesive (420).
9. A display device, characterized in that: The invention comprises the electrical connection structure according to any one of claims 1 to 8.
10. A display module, characterized in that: The invention comprises the electrical connection structure according to any one of claims 1 to 8.