Electroplating sub-bath and electroplating device

Abstract

The utility model provides an electroplating sub-bath and an electroplating device, and belongs to the technical field of electroplating. The electroplating sub-tank comprises a placing assembly and a backflow assembly, baffles are correspondingly arranged in a shell, a plurality of hole grooves are formed in one side of each baffle, a sub-tank is formed in the shell through the two baffles, the backflow assembly comprises a backflow plate, through holes are correspondingly formed in one side of the shell, and the backflow plate is arranged on one side of the shell. Firstly, electroplating operation can be conducted on a wire material through an electroplating solution in a sub-groove formed in the shell by the two baffles, and when the liquid level of the electroplating solution is too high, the electroplating solution flows out of the sub-groove through a plurality of hole grooves in one sides of the baffles, so that the liquid level of the electroplating solution in the sub-groove can be adjusted; and the copper ball container is put into the titanium basket, so that the conductivity uniformity can be improved, the liquid level can be conveniently adjusted by the sub-tank, the applicability is relatively high, and the practicability is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of electroplating, in particular to an electroplating sub-tank and an electroplating device. BACKGROUND

[0002] Plating is a process of plating a thin layer of other metal or alloy on the surface of certain metal by using electrolysis principle, which is a process of attaching a metal film on the surface of metal or other material parts by using electrolysis to prevent metal oxidation, improve wear resistance, electrical conductivity, light reflectivity, corrosion resistance and aesthetics. During electroplating, the plating layer metal or other insoluble material is used as anode, and the workpiece to be plated is used as cathode, and the cation of the plating layer metal is reduced on the surface of the workpiece to be plated to form a plating layer. In order to exclude the interference of other cations and make the plating layer uniform and firm, a solution containing the cation of the plating layer metal is used as the electroplating solution to keep the concentration of the cation of the plating layer metal unchanged. The purpose of electroplating is to plate a metal plating layer on the substrate to change the surface properties or size of the substrate. Electroplating can enhance the corrosion resistance of metal, increase the hardness, prevent wear, improve the electrical conductivity, smoothness, heat resistance and surface aesthetics. However, the existing electroplating sub-tank and electroplating device are usually single-function sub-tank, which is inconvenient to adjust the liquid level and has low applicability, thereby reducing the practicability. SUMMARY

[0003] In order to make up for the above shortcomings, the present application provides an electroplating sub-tank and an electroplating device, which aims to improve the existing electroplating sub-tank and electroplating device, which are usually single-function sub-tank, inconvenient to adjust the liquid level, low applicability, thereby reducing the practicability.

[0004] In a first aspect, the present application provides an electroplating sub-tank comprising a placing assembly and a reflux assembly.

[0005] The placing assembly comprises a shell, a baffle and a titanium basket, the baffle is correspondingly arranged in the shell, a plurality of holes are arranged on one side of the baffle, and the sub-tank is formed by the two baffles in the shell, and the reflux assembly comprises a reflux plate, a through hole is correspondingly arranged on one side of the shell, and the reflux plate is arranged on one side of the shell.

[0006] In a specific embodiment, a plurality of support rods are arranged in the shell.

[0007] In the above implementation process, a plurality of support rods are arranged in the shell, and the support rods can play a supporting role.

[0008] In a specific embodiment, a frame is arranged at one end of the support rod.

[0009] In the above implementation process, a frame is arranged at one end of the support rod, and the frame can play a connecting role.

[0010] In one specific implementation, the support rod is provided with a groove at one end, and the frame is in contact with the groove.

[0011] In the above implementation process, the support rod is provided with a groove at one end, and the groove can limit the position.

[0012] In one specific implementation, the shell is internally provided with an aeration pipe, and the shell is internally provided with a partition plate, and the partition plate is fixedly connected at both ends to the baffle.

[0013] In the above implementation process, the shell is internally provided with an aeration pipe, and the aeration pipe can connect the aeration, and the partition plate can separate the effect.

[0014] In one specific implementation, the titanium basket is provided with a hook on one side, and the hook is hung on one side of the frame.

[0015] In the above implementation process, the titanium basket is provided with a hook on one side, and the hook can be hung.

[0016] In one specific implementation, the titanium basket is internally provided with a placing groove.

[0017] In the above implementation process, the titanium basket is internally provided with a placing groove, and the user can put a copper ball container into the placing groove to improve the uniformity of the conduction.

[0018] In a second aspect, the utility model also provides a kind of electroplating device, including the electroplating sub-tank of above.

[0019] Compared with prior art, the beneficial effects of the present application are as follows: first, the sub-tank formed by the two baffles inside the shell can be electroplated by the electroplating solution inside the sub-tank. When the liquid level of the electroplating solution is too high, the electroplating solution will flow out of the sub-tank through the holes on one side of the baffle, thereby adjusting the liquid level of the electroplating solution inside the sub-tank. Then, the through hole and the reflux plate are used to return the electroplating solution to the inside of the shell. By putting a copper ball container into the titanium basket, the uniformity of the conduction can be improved. The sub-tank can easily adjust the liquid level, has high applicability, and improves the practicality. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be considered as limiting the scope. For those skilled in the art, other related drawings can also be obtained without creative labor.

[0021] Figure 1 is a schematic diagram of an electroplating sub-tank and an electroplating device structure provided by the embodiment of the present application;

[0022] Figure 2 is a schematic diagram of a shell structure provided by the embodiment of the present application;

[0023] Figure 3 is a schematic diagram of a support rod structure provided by the embodiment of the present application;

[0024] Figure 4 is a schematic diagram of a titanium basket structure provided by the embodiment of the present application.

[0025] In the figure: 100 - placement assembly; 110 - shell; 111 - support rod; 1111 - groove; 112 - frame; 113 - aeration pipe; 114 - partition plate; 120 - baffle; 130 - hole groove; 140 - sub-tank; 150 - titanium basket; 151 - hook; 152 - placement groove; 200 - reflux assembly; 210 - through hole; 220 - reflux plate. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

[0027] To make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0028] Please refer to Figures 1-4 The present application provides an electroplating sub-tank, which comprises a placement assembly 100 and a reflux assembly 200.

[0029] Please refer to Figures 1-4 The placement assembly 100 comprises a shell 110, a baffle 120 and a titanium basket 150. The baffle 120 is arranged in the shell 110. The baffle 120 is provided with a plurality of hole grooves 130 on one side. The sub-tank 140 is formed in the shell 110 by the two baffles 120. A plurality of support rods 111 are arranged in the shell 110. The support rods 111 can play a supporting role. The support rod 111 is provided with a frame 112 on one end. The frame 112 can play a connecting role. The support rod 111 is provided with a groove 1111 on one end. The frame 112 is in contact with the groove 1111. The groove 1111 can play a limiting role.

[0030] In some specific embodiments, the shell 110 is internally provided with an aeration pipe 113, the shell 110 is internally provided with a partition plate 114, both ends of the partition plate 114 are fixedly connected with the baffle 120, the aeration pipe 113 can play a role in connecting aeration, the partition plate 114 can play a role in separation, the titanium basket 150 is correspondingly provided with a hook 151 on one side, the hook 151 is hung on one side of the frame 112, the hook 151 can play a role in hanging, and the titanium basket 150 is internally provided with a placing groove 152, so that the user can put a copper ball container into the placing groove 152, thereby improving the uniformity of conduction.

[0031] Please refer to Figure 1 The reflux assembly 200 comprises a reflux plate 220, and the shell 110 is correspondingly provided with a through hole 210 on one side, and the reflux plate 220 is arranged on one side of the shell 110, so that the electroplating solution can flow out of the shell 110 through the through hole 210, thereby adjusting the liquid level.

[0032] The utility model discloses further provide a kind of electroplating device, including above-mentioned electroplating sub-tank.

[0033] The working principle of the electroplating sub-tank and the electroplating device is as follows: first, the two baffles 120 form a sub-tank 140 inside the shell 110, and the electroplating solution inside the sub-tank 140 can be used for electroplating work on the wire material. When the liquid level of the electroplating solution is too high, the electroplating solution will flow out of the sub-tank 140 through the holes 130 on one side of the baffle 120, thereby adjusting the liquid level of the electroplating solution inside the sub-tank 140. The aeration pipe 113 can play a role in connecting aeration, and the partition plate 114 can play a role in separation. Then, the through hole 210 and the reflux plate 220 are used for refluxing into the shell 110. The user can put a copper ball container into the placing groove 152, thereby improving the uniformity of conduction. The sub-tank 140 is convenient for adjusting the liquid level, has high applicability, and improves the practicability.

[0034] The above is only an embodiment of the present application and does not limit the protection scope of the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application. It should be noted that similar reference numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0035] The above merely provides the specific implementation of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can easily think of the changes or replacements within the technical range disclosed by the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An electroplating cell characterized by, Comprising The placing assembly (100) includes a shell (110), a baffle (120) and a titanium basket (150), the baffle (120) is correspondingly arranged inside the shell (110), and a plurality of hole grooves (130) are arranged on one side of the baffle (120), and a sub-slot (140) is formed inside the shell (110) by two baffles (120); The backflow assembly (200) includes a backflow plate (220), and a through hole (210) is correspondingly arranged on one side of the shell (110), and the backflow plate (220) is arranged on one side of the shell (110).

2. An electroplating cell according to claim 1, wherein A plurality of supporting rods (111) are arranged inside the shell (110).

3. An electroplating cell according to claim 2, wherein One end of the supporting rod (111) is provided with a frame (112).

4. An electroplating cell according to claim 3, wherein One end of the supporting rod (111) is provided with a groove (1111), and the frame (112) is in contact with the groove (1111).

5. The electroplating cell of claim 1, wherein An aeration pipe (113) is arranged inside the shell (110), and a partition plate (114) is arranged inside the shell (110), and the partition plate (114) is fixedly connected with the baffle (120) at both ends.

6. An electroplating cell according to claim 4 wherein, A hook (151) is correspondingly arranged on one side of the titanium basket (150), and the hook (151) is hung on one side of the frame (112).

7. The electroplating cell of claim 1, wherein A placing groove (152) is arranged inside the titanium basket (150).

8. The electroplating apparatus characterized by, Comprising The electroplating sub-tank of any one of claims 1-7.

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