Optical chip packaging structure

Abstract

The utility model discloses an optical chip packaging structure, which is applied to the technical field of chip packaging. According to the utility model, the light absorption coating is added on the upper surface of the receiving chip, and the light absorption coating can reduce the reflection of light on the surface of the receiving chip or the transparent plastic package layer, so as to reduce the crosstalk in the package; and meanwhile, the transparent plastic package layer forms a notch at the position of part of the light absorption coating, so that the area of a crosstalk channel can be reduced, and the bulge of the light-proof bracket is arranged in the notch, so that light can be further blocked, and a traditional optical barrier can be replaced. Wherein the light absorption coating is added on the surface of the receiving chip and can be realized at a wafer end in batches, so that the efficiency can be improved and the cost can be reduced; in addition, the notch can be formed in a mode of forming a groove through cutting or mold pressing, and a mode of forming a groove through built-in optical barriers is replaced, so that the packaging operation process can be reduced, the difficulty can be reduced, the production efficiency and the yield can be improved, and the purpose of reducing the cost can be achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip packaging technical field, especially optical chip packaging structure. BACKGROUND

[0002] In the existing DTOF (Direct Time of Flight) product, the design of the light path is a difficulty in the packaging process, and in the plastic packaging scheme, although various optical lenses can be designed through the plastic packaging mold to achieve the optical specification, it is difficult to reduce the crosstalk generated by the laser emitted by the transmitting chip to the receiving chip in the packaging. The current market design blocks the crosstalk by increasing the light barrier, which undoubtedly increases the complexity of the packaging process, reduces the production efficiency, and causes the packaging cost to be high. SUMMARY

[0003] Therefore, the utility model discloses an optical chip packaging structure for improving the product's mass production and production efficiency, ensuring the optical performance of the chip, and reducing the production cost.

[0004] To solve the above technical problems, the utility model provides an optical chip packaging structure, which comprises a substrate and a light -proof support, the light -proof support is connected with the substrate surface, and is surrounded to form a containing cavity, the containing cavity is provided with a transmitting chip, a receiving chip and a transparent plastic packaging layer,

[0005] The transmitting chip and the receiving chip are arranged along the first side, and are electrically connected with the substrate surface, the receiving chip surface is provided with a first sensing area and a light -absorbing coating, and the light -absorbing coating is located between the first sensing area and the transmitting chip,

[0006] The transparent plastic packaging layer at least covers the receiving chip, and the transparent plastic packaging layer comprises a lens, and the lens is located directly above the first sensing area,

[0007] The transparent plastic packaging layer presents a gap above the position corresponding to the light -absorbing coating,

[0008] Part of the light -proof support below is provided with a convex, the convex corresponds to the bottom of the gap, and the light -proof support and the transmitting chip corresponding position and the first sensing area corresponding position are respectively provided with a hole.

[0009] Optionally, the receiving chip surface is provided with a second sensing area.

[0010] Optionally, the light -absorbing coating covers the part of the area of the receiving chip surface between the first sensing area and the second sensing area.

[0011] Optionally, the receiving chip surface is provided with a pad; the light-absorbing coating covers all areas of the receiving chip surface except the pad, the first sensing area and the second sensing area; in a second direction perpendicular to the first direction, the length of the light-absorbing coating is equal to the length of the receiving chip.

[0012] Optionally, the width of the notch is less than the width of the light-absorbing coating.

[0013] Optionally, the protrusion is bonded to the bottom of the notch by light-proof adhesive.

[0014] Optionally, the light-proof support includes a surrounding plate and a cover plate; one end of the surrounding plate is connected to the surface of the substrate, and the other end is connected to the cover plate;

[0015] The side of the cover plate facing the accommodation cavity is provided with the protrusion;

[0016] The cover plate is provided with one opening at a position corresponding to the transmitting chip and a position corresponding to the first sensing area, respectively.

[0017] Optionally, the transparent plastic encapsulation layer covers the receiving chip and does not cover the transmitting chip; in a position corresponding to the light-absorbing coating, the transparent plastic encapsulation layer has the notch, and the bottom and both sides of the notch in the first direction are the transparent plastic encapsulation layer.

[0018] Or, the transparent plastic encapsulation layer includes a first transparent plastic encapsulation layer and a second transparent plastic encapsulation layer; the first transparent plastic encapsulation layer covers a first area of the receiving chip, and the first area includes the first sensing area; the second transparent plastic encapsulation layer covers a second area of the receiving chip; in a position corresponding to the light-absorbing coating, the first transparent plastic encapsulation layer and the second transparent plastic encapsulation layer have the notch, and the bottom of the notch is the light-absorbing coating.

[0019] Optionally, the transparent plastic encapsulation layer includes a first transparent plastic encapsulation layer and a second transparent plastic encapsulation layer; the first transparent plastic encapsulation layer covers the receiving chip, and the second transparent plastic encapsulation layer covers the transmitting chip; in a position corresponding to the light-absorbing coating, the first transparent plastic encapsulation layer has the notch, and the bottom and both sides of the notch in the first direction are the first transparent plastic encapsulation layer.

[0020] Or, the transparent plastic sealing layer includes a first transparent plastic sealing layer, a second transparent plastic sealing layer and a third transparent plastic sealing layer, the first transparent plastic sealing layer covers a first area of the receiving chip, the first area includes the first sensing area, the second transparent plastic sealing layer covers a second area of the receiving chip, and the third transparent plastic sealing layer covers the transmitting chip; the gap exists between the first transparent plastic sealing layer and the second transparent plastic sealing layer at the position corresponding to the light-absorbing coating, and the bottom of the gap is the light-absorbing coating.

[0021] Optionally, the transparent plastic sealing layer covers the receiving chip and the transmitting chip; the gap exists in the transparent plastic sealing layer at the position corresponding to the light-absorbing coating, and the bottom and both sides in the first direction of the gap are the transparent plastic sealing layer.

[0022] Or, the transparent plastic sealing layer includes a first transparent plastic sealing layer and a second transparent plastic sealing layer, the first transparent plastic sealing layer covers a first area of the receiving chip, the first area includes the first sensing area, the second transparent plastic sealing layer covers a second area of the receiving chip and the transmitting chip; the gap exists between the first transparent plastic sealing layer and the second transparent plastic sealing layer at the position corresponding to the light-absorbing coating, and the bottom of the gap is the light-absorbing coating.

[0023] It can be seen that the optical chip packaging structure provided by the utility model increases the light-absorbing coating on the upper surface of the receiving chip, the light-absorbing coating can reduce the reflection of light on the surface of the receiving chip or the transparent plastic sealing layer, so as to reduce the crosstalk in the packaging; meanwhile, the transparent plastic sealing layer forms a gap at the position of the part of the light-absorbing coating, so that the area of the crosstalk channel can be reduced, and the convex of the light-proof support is placed in the gap, which can further block the light, and the traditional optical barrier can be replaced. The light-absorbing coating is added on the surface of the receiving chip, which can be realized in batches at the wafer end, so that the efficiency can be improved and the cost can be reduced; the gap can be realized by cutting or die cutting, which replaces the built-in optical barrier, so that the packaging operation process can be reduced and the difficulty can be reduced, and the production efficiency and yield can be improved, and the cost reduction purpose can be achieved. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed to be used in the embodiment or the prior art description will be briefly introduced below, and obviously, the drawings in the following description are only embodiments of the utility model, and those skilled in the art can obtain other drawings according to the provided drawings without creating labor.

[0025] Figure 1A top view of a receiving chip with a local light-absorbing coating is provided for the embodiment of the utility model;

[0026] Figure 2 A top view of a receiving chip with a global light-absorbing coating is provided for the embodiment of the utility model;

[0027] Figure 3 A top view of a first optical chip packaging structure is provided for the embodiment of the utility model;

[0028] Figure 4 An A-A sectional view of the first optical chip packaging structure is provided for the embodiment of the utility model;

[0029] Figure 5 A top view of a second optical chip packaging structure is provided for the embodiment of the utility model;

[0030] Figure 6 An A-A sectional view of the second optical chip packaging structure is provided for the embodiment of the utility model;

[0031] Figure 7 A top view of a third optical chip packaging structure is provided for the embodiment of the utility model;

[0032] Figure 8 An A-A sectional view of the third optical chip packaging structure is provided for the embodiment of the utility model;

[0033] Figure 9 A top view of a fourth optical chip packaging structure is provided for the embodiment of the utility model;

[0034] Figure 10 An A-A sectional view of the fourth optical chip packaging structure is provided for the embodiment of the utility model;

[0035] Figure 11 A top view of a fifth optical chip packaging structure is provided for the embodiment of the utility model;

[0036] Figure 12 An A-A sectional view of the fifth optical chip packaging structure is provided for the embodiment of the utility model;

[0037] Figure 13 A top view of a sixth optical chip packaging structure is provided for the embodiment of the utility model;

[0038] Figure 14 An A-A sectional view of the sixth optical chip packaging structure is provided for the embodiment of the utility model;

[0039] Figure 15 A top view of a seventh optical chip packaging structure is provided for the embodiment of the utility model;

[0040] Figure 16 A-A sectional view of the seventh optical chip packaging structure provided by the embodiment of the present application;

[0041] Figure 17 A top view of the eighth optical chip packaging structure provided by the embodiment of the present application;

[0042] Figure 18 A-A sectional view of the eighth optical chip packaging structure provided by the embodiment of the present application.

[0043] The reference signs are explained as follows:

[0044] 1 - substrate; 2 - receiving chip; 3 - first sensing area; 4 - second sensing area; 5 - light-absorbing coating; 6 - chip adhesive; 7 - emitting chip; 8 - conductive chip adhesive; 9 - transparent plastic encapsulation layer; 10 - light-proof support; 11 - light-proof adhesive; 12 - lens. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0046] Please refer to Figures 1 to 18 The optical chip packaging structure provided by the embodiment of the present application can include: a substrate 1 and a light-proof support 10; the light-proof support 10 is connected with the surface of the substrate 1 and encloses a containing cavity; an emitting chip 7, a receiving chip 2 and a transparent plastic encapsulation layer 9 are arranged in the containing cavity;

[0047] The emitting chip 7 and the receiving chip 2 are arranged along a first direction and are both electrically connected with the surface of the substrate 1; the receiving chip 2 is provided with a first sensing area 3 and a light-absorbing coating 5 on the surface, and the light-absorbing coating 5 is located between the first sensing area 3 and the emitting chip 7;

[0048] The transparent plastic encapsulation layer 9 covers at least the receiving chip 2; the transparent plastic encapsulation layer 9 includes a lens 12, and the lens 12 is located directly above the first sensing area 3;

[0049] The transparent plastic encapsulation layer 9 presents a gap at a position above the light-absorbing coating 5;

[0050] The opaque support 10 is provided with a protrusion corresponding to the bottom of the gap; the opaque support 10 is provided with an opening at a position corresponding to the emitting chip 7 and a position corresponding to the first sensing area 3.

[0051] It should be noted that the first direction and the second direction in the embodiment are parallel to the surface of the substrate 1.

[0052] The embodiment does not limit the specific connection mode of the opaque support 10 and the substrate 1. The opaque support 10 can be, but is not limited to, pasted on the surface of the substrate 1 through the opaque adhesive 11. In the embodiment, the opaque support 10 is provided to play the role of shading, supporting and protecting the internal structure.

[0053] It should be noted that the emitting chip 7 and the receiving chip 2 in the embodiment are both arranged on the surface of the substrate 1 and are electrically connected to the substrate 1. The embodiment does not limit the specific arrangement mode of the emitting chip 7. The emitting chip 7 can be, but is not limited to, pasted on the surface of the substrate 1 through the conductive chip adhesive 8. The embodiment does not limit the specific arrangement mode of the receiving chip 2. The receiving chip 2 can be, but is not limited to, pasted on the surface of the substrate 1 through the chip adhesive 6 and is electrically connected to the substrate 1 through the binding wire. It should be noted that the surface of the receiving chip 2 in the embodiment is provided with a pad (which can be a metal pad or other conductive pad), and the surface of the substrate 1 is provided with a pad (which can be a metal pad or other conductive pad). One end of the specific binding wire is electrically connected to the pad on the surface of the receiving chip 2, and the other end is electrically connected to the pad on the surface of the substrate 1. In addition, it should be noted that the transparent plastic sealing layer 9 in the embodiment can cover the pads and the binding wire, thereby strengthening the protection of the pads and the binding wire on the receiving chip 2 and the substrate 1 and improving the reliability.

[0054] Further, the surface of the receiving chip 2 in the embodiment can be provided with a second sensing area 4. It should be noted that the second sensing area 4 in the embodiment can be arranged between the emitting chip 7 and the first sensing area 3, so that part of the light of the emitting chip 7 reaches the second sensing area 4 of the receiving chip 2 as a reference signal.

[0055] The embodiment does not limit the specific area covered by the light-absorbing coating 5. For example, as shown in Figure 1 , the light-absorbing coating 5 can cover part of the area of the surface of the receiving chip 2 between the first sensing area 3 and the second sensing area 4; as shown in Figure 2 , the light-absorbing coating 5 can also cover all areas of the surface of the receiving chip 2 except the pads, the first sensing area 3 and the second sensing area 4, so as to improve the light-absorbing efficiency of the light-absorbing coating 5.

[0056] Further, to improve the light absorption efficiency of the light absorption coating 5, the width of the notch can be less than the width of the light absorption coating 5; in the second direction perpendicular to the first direction, the length of the light absorption coating 5 is equal to the length of the receiving chip 2.

[0057] The embodiment is not limited to the specific connection mode of the protrusion and the bottom of the notch, and the protrusion can be, but is not limited to, bonded to the bottom of the notch through the lightproof adhesive 11.

[0058] The embodiment is not limited to the specific structure of the lightproof support 10, and the lightproof support 10 can be, but is not limited to, including a coaming and a cover plate; one end of the coaming is connected to the surface of the substrate 1, and the other end is connected to the cover plate; the cover plate is provided with a protrusion on the side facing the accommodation cavity; the cover plate is provided with an opening at the position corresponding to the emitting chip 7 and the position corresponding to the first sensing area 3, respectively.

[0059] The embodiment is not limited to the specific structure of the transparent plastic packaging layer 9, which can include the following six structures, for example:

[0060] (1) As shown in Figure 3 and Figure 4 , the transparent plastic packaging layer 9 covers the receiving chip 2 and does not cover the emitting chip 7; in the position corresponding to the light absorption coating 5, there is a notch in the transparent plastic packaging layer 9, and the bottom and both sides of the notch in the first direction are the transparent plastic packaging layer 9.

[0061] (2) As shown in Figure 5 and Figure 6 , the transparent plastic packaging layer 9 includes a first transparent plastic packaging layer 9 and a second transparent plastic packaging layer 9, the first transparent plastic packaging layer 9 covers a first area of the receiving chip 2, and the first area includes the first sensing area 3, and the second transparent plastic packaging layer 9 covers a second area of the receiving chip 2, and the second area includes the second sensing area 4; in the position corresponding to the light absorption coating 5, there is a notch between the first transparent plastic packaging layer 9 and the second transparent plastic packaging layer 9, and the bottom of the notch is the light absorption coating 5.

[0062] (3) As shown in Figure 7 and Figure 8 , the transparent plastic packaging layer 9 includes a first transparent plastic packaging layer 9 and a second transparent plastic packaging layer 9, the first transparent plastic packaging layer 9 covers the receiving chip 2, and the second transparent plastic packaging layer 9 covers the emitting chip 7; in the position corresponding to the light absorption coating 5, there is a notch in the first transparent plastic packaging layer 9, and the bottom and both sides of the notch in the first direction are the first transparent plastic packaging layer 9.

[0063] (4) As shown in Figure 9 and Figure 10As shown, the transparent plastic sealing layer 9 includes a first transparent plastic sealing layer 9, a second transparent plastic sealing layer 9 and a third transparent plastic sealing layer 9. The first transparent plastic sealing layer 9 covers the first area of ​​the receiving chip 2, the first area includes the first sensing area 3, the second transparent plastic sealing layer 9 covers the second area of ​​the receiving chip 2, the second area includes the second sensing area 4, and the third transparent plastic sealing layer 9 covers the transmitting chip 7; at the position corresponding to the light-absorbing coating 5, there is a gap between the first transparent plastic sealing layer 9 and the second transparent plastic sealing layer 9, and the bottom of the gap is the light-absorbing coating 5.

[0064] (5) If Figure 11 and Figure 12 As shown, the transparent plastic sealing layer 9 covers the receiving chip 2 and the transmitting chip 7; there is a gap in the transparent plastic sealing layer 9 at the position corresponding to the light-absorbing coating 5, and the bottom of the gap and both sides in the first direction are transparent plastic sealing layers 9.

[0065] (6) If Figure 15 and Figure 16 As shown, the transparent plastic sealing layer 9 includes a first transparent plastic sealing layer 9 and a second transparent plastic sealing layer 9. The first transparent plastic sealing layer 9 covers the first area of ​​the receiving chip 2, and the first area includes the first sensing area 3. The second transparent plastic sealing layer 9 covers the second area of ​​the receiving chip 2 and the transmitting chip 7. At the position corresponding to the light-absorbing coating 5, there is a gap between the first transparent plastic sealing layer 9 and the second transparent plastic sealing layer 9, and the bottom of the gap is the light-absorbing coating 5.

[0066] Based on the above embodiments, the present invention adds a light-absorbing coating to the upper surface of the receiving chip. The light-absorbing coating can reduce the reflection of light on the surface of the receiving chip or the transparent plastic layer, so as to reduce the crosstalk inside the package; at the same time, the transparent plastic layer is formed with a notch at the position of part of the light-absorbing coating, thereby reducing the area of ​​the crosstalk channel, and the protrusion of the opaque bracket is placed in the notch, which can further block the light, thereby replacing the traditional optical barrier. Among them, the addition of the light-absorbing coating to the surface of the receiving chip can be achieved in batches at the wafer end, thereby improving efficiency and reducing costs; the notch can be achieved by cutting or molding, replacing the built-in optical barrier method, thereby reducing the packaging process and reducing the difficulty, thereby improving production efficiency and yield, and achieving the purpose of cost reduction.

[0067] In order to make the present invention easier to understand, the working principle of the optical chip packaging structure provided by the embodiments of the present invention is explained in combination with the following specific embodiments.

[0068] Please refer to Figure 11 and Figure 12, different from the first optical chip packaging structure embodiment, this embodiment is based on the first optical chip packaging structure embodiment, further specific to the light absorption coating 5 and transparent plastic sealing layer 9 are limited, the rest of the content has been in the first optical chip packaging structure embodiment detailed introduction, here will not be repeated.

[0069] In this embodiment, the light absorption coating 5 can cover the part of the receiving chip 2 surface between the first sensing area 3 and the second sensing area 4; the transparent plastic sealing layer 9 covers the receiving chip 2 and the transmitting chip 7; corresponding to the light absorption coating 5, there is a notch in the transparent plastic sealing layer 9, and the bottom and both sides of the notch in the first direction are transparent plastic sealing layer 9.

[0070] In this embodiment, the first sensing area 3 receives the light reflected from the object outside the package emitted by the transmitting chip 7 and converts it into corresponding electrical signals. Among them, the light inlet channel of the first sensing area 3 is composed of the lens 12 and the corresponding hole of the light-proof support 10; the light outlet channel of the transmitting chip 7 is composed of the transparent plastic sealing layer 9 and the corresponding hole on the light-proof support 10, and part of the light of the transmitting chip 7 reaches the second sensing area 4 of the receiving chip 2 through the transparent plastic sealing layer 9 as a reference signal.

[0071] In this embodiment, after the receiving chip 2 and the transmitting chip 7 are completed on the substrate 1, a layer of transparent plastic sealing layer 9 is molded and sealed, and then a notch is cut and formed on the transparent plastic sealing layer 9 between the first sensing area 3 of the receiving chip 2 and the second sensing area 4 of the receiving chip 2, so as to reduce the area of the crosstalk channel, and the protrusion of the light-proof support 10 is placed in the notch, which can further block the light; at the same time, due to the mechanical processing method, in order to prevent the receiving chip 2 from being cut, a certain thickness of the transparent plastic sealing layer 9 will be left at the bottom of the notch, which will form a small channel, but because the thickness is very small and the corresponding position has been designed with the light absorption coating 5, when the light passes through the small channel, it is absorbed after multiple reflections in the light absorption coating 5, and the optical crosstalk problem between the transparent plastic sealing layers 9 on both sides of the notch is solved.

[0072] Please refer to Figure 13 and Figure 14 , different from the first optical chip packaging structure embodiment, this embodiment is based on the first optical chip packaging structure embodiment, further specific to the light absorption coating 5 and transparent plastic sealing layer 9 are limited, the rest of the content has been in the first optical chip packaging structure embodiment detailed introduction, here will not be repeated.

[0073] The light-absorbing coating 5 in the embodiment can also cover all areas on the surface of the receiving chip 2 except the soldering pads, the first sensing area 3 and the second sensing area 4; the transparent plastic encapsulation layer 9 covers the receiving chip 2 and the transmitting chip 7; and in the position corresponding to the light-absorbing coating 5, the transparent plastic encapsulation layer 9 has a notch, and the bottom and both sides of the notch in the first direction are the transparent plastic encapsulation layer 9.

[0074] In the embodiment, the first sensing area 3 receives the light reflected from the object outside the package and converts it into corresponding electrical signals. The light inlet channel of the first sensing area 3 is composed of the lens 12 and the corresponding opening of the light-proof support 10; the light outlet channel of the transmitting chip 7 is composed of the transparent plastic encapsulation layer 9 and the corresponding opening on the light-proof support 10, and part of the light of the transmitting chip 7 reaches the second sensing area 4 of the receiving chip 2 through the transparent plastic encapsulation layer 9 as a reference signal.

[0075] In the embodiment, after the receiving chip 2 and the transmitting chip 7 are fixed and the bonding wires are formed on the substrate 1, a transparent plastic encapsulation layer 9 is molded, and then a notch is formed on the transparent plastic encapsulation layer 9 between the first sensing area 3 of the receiving chip 2 and the second sensing area 4 of the receiving chip 2 by cutting and digging, so as to reduce the area of the crosstalk channel, and the protrusion of the light-proof support 10 is placed in the notch, which can further block the light; at the same time, due to the mechanical processing method, in order to prevent the receiving chip 2 from being cut, a certain thickness of the transparent plastic encapsulation layer 9 is left at the bottom of the notch, which forms a small channel, but because the thickness is very small and the corresponding position has been designed with the light-absorbing coating 5, the optical crosstalk problem between the transparent plastic encapsulation layers 9 on both sides of the notch is solved after the light is absorbed through multiple reflections on the light-absorbing coating 5.

[0076] Please refer to Figure 15 and Figure 16 , which is different from the first optical chip package structure embodiment, the embodiment further specifically limits the light-absorbing coating 5 and the transparent plastic encapsulation layer 9 on the basis of the first optical chip package structure embodiment, and the remaining contents have been described in detail in the first optical chip package structure embodiment, which will not be repeated here.

[0077] In the embodiment, the light-absorbing coating 5 can cover part of the area between the first sensing area 3 and the second sensing area 4 on the surface of the receiving chip 2; the transparent plastic encapsulation layer 9 includes a first transparent plastic encapsulation layer 9 and a second transparent plastic encapsulation layer 9, the first transparent plastic encapsulation layer 9 covers a first area of the receiving chip 2, and the first area includes the first sensing area 3, and the second transparent plastic encapsulation layer 9 covers a second area of the receiving chip 2 and the transmitting chip 7; in the position corresponding to the light-absorbing coating 5, there is a notch between the first transparent plastic encapsulation layer 9 and the second transparent plastic encapsulation layer 9, and the bottom of the notch is the light-absorbing coating 5.

[0078] The first sensing area 3 in the embodiment receives the light reflected from the object outside the package and emitted by the transmitting chip 7 and converts the light into corresponding electrical signals. The light inlet channel of the first sensing area 3 is composed of the lens 12 and the corresponding opening of the light-proof support 10; the light outlet channel of the transmitting chip 7 is composed of the transparent plastic sealing layer 9 and the corresponding opening of the light-proof support 10, and part of the light of the transmitting chip 7 reaches the second sensing area 4 of the receiving chip 2 through the transparent plastic sealing layer 9 as a reference signal.

[0079] After the receiving chip 2 and the transmitting chip 7 are fixed and the bonding wires are completed on the substrate 1, a transparent plastic sealing layer 9 is molded in the embodiment, and the molding mold is specially designed to leave a groove between the first sensing area 3 of the receiving chip 2 and the second sensing area 4 of the receiving chip 2, so that the gap formed does not have residual transparent plastic sealing layer 9 like cutting and digging, thereby reducing the area of the crosstalk channel, and the corresponding position has been designed with the light-absorbing coating 5, which can better reduce the occurrence of crosstalk, and the optical crosstalk problem between the transparent plastic sealing layers 9 on both sides of the gap is solved.

[0080] Please refer to Figure 17 and Figure 18 , which is different from the first optical chip package structure embodiment, the embodiment is further specifically limited to the light-absorbing coating 5 and the transparent plastic sealing layer 9 on the basis of the first optical chip package structure embodiment, and the remaining contents are described in detail in the first optical chip package structure embodiment, which will not be repeated here.

[0081] In the embodiment, the light-absorbing coating 5 can also cover all areas on the surface of the receiving chip 2 except the bonding pads, the first sensing area 3 and the second sensing area 4; the transparent plastic sealing layer 9 includes a first transparent plastic sealing layer 9 and a second transparent plastic sealing layer 9, the first transparent plastic sealing layer 9 covers a first area of the receiving chip 2, and the first area includes the first sensing area 3; the second transparent plastic sealing layer 9 covers a second area of the receiving chip 2 and the transmitting chip 7; there is a gap between the first transparent plastic sealing layer 9 and the second transparent plastic sealing layer 9 at the position corresponding to the light-absorbing coating 5, and the bottom of the gap is the light-absorbing coating 5.

[0082] The first sensing area 3 in the embodiment receives the light reflected from the object outside the package and emitted by the transmitting chip 7 and converts the light into corresponding electrical signals. The light inlet channel of the first sensing area 3 is composed of the lens 12 and the corresponding opening of the light-proof support 10; the light outlet channel of the transmitting chip 7 is composed of the transparent plastic sealing layer 9 and the corresponding opening of the light-proof support 10, and part of the light of the transmitting chip 7 reaches the second sensing area 4 of the receiving chip 2 through the transparent plastic sealing layer 9 as a reference signal.

[0083] After the receiving chip 2 and the transmitting chip 7 are completed die bonding and bonding wire on the substrate 1, a transparent plastic sealing layer 9 is molded and sealed, and the molding mold is specially designed to leave a groove between the first sensing area 3 of the receiving chip 2 and the second sensing area 4 of the receiving chip 2, so that the gap formed will not be like cutting and digging a groove, and the residual transparent plastic sealing layer 9 will be reduced, thereby reducing the area of the crosstalk channel, and the corresponding position has been designed with a light-absorbing coating 5, which can better reduce the occurrence of crosstalk, and the optical crosstalk problem between the transparent plastic sealing layers 9 on both sides of the gap is solved.

[0084] The optical chip packaging structure provided by the utility model is introduced in detail above, and for the general technical personnel in the field, the specific implementation manner and application range will be changed according to the thought of the utility model embodiment, and according to the above, the content of the specification should not be understood as the limitation of the utility model.

Claims

1. An optical chip package structure, characterized by, The application relates to a substrate and an opaque support; the opaque support is connected with the surface of the substrate and encloses a containing cavity; a transmitting chip, a receiving chip and a transparent plastic sealing layer are arranged in the containing cavity; the transmitting chip and the receiving chip are arranged along a first direction and are electrically connected with the surface of the substrate; a first sensing area and a light-absorbing coating are arranged on the surface of the receiving chip, and the light-absorbing coating is located between the first sensing area and the transmitting chip; the transparent plastic sealing layer covers at least the receiving chip; the transparent plastic sealing layer comprises a lens which is located directly above the first sensing area; the transparent plastic sealing layer is provided with a gap at a position corresponding to the light-absorbing coating; a protrusion is arranged below part of the opaque support, the protrusion corresponds to the bottom of the gap; the opaque support is provided with an opening hole at positions corresponding to the transmitting chip and the first sensing area respectively. The surface of the receiving chip is provided with a second sensing area. The light-absorbing coating covers part of the surface of the receiving chip between the first sensing area and the second sensing area. The surface of the receiving chip is provided with a soldering pad; the light-absorbing coating covers all areas of the surface of the receiving chip except the soldering pad, the first sensing area and the second sensing area; in a second direction perpendicular to the first direction, the length of the light-absorbing coating is equal to the length of the receiving chip. The width of the gap is smaller than the width of the light-absorbing coating. The protrusion is bonded with the bottom of the gap through opaque adhesive. The opaque support comprises a surrounding plate and a cover plate; one end of the surrounding plate is connected with the surface of the substrate, and the other end is connected with the cover plate; 2. The optical chip package structure of claim 1, wherein, The side of the cover plate facing the containing cavity is provided with the protrusion; 3. The optical chip package structure of claim 2, wherein, The cover plate is provided with an opening hole at positions corresponding to the transmitting chip and the first sensing area respectively.

4. The optical chip package structure of claim 2, wherein, The transparent plastic sealing layer covers the receiving chip and does not cover the transmitting chip; in the position corresponding to the light-absorbing coating, the gap exists in the transparent plastic sealing layer, and the bottom and both sides of the gap in the first direction are the transparent plastic sealing layer; 5. The optical chip package structure of claim 1, wherein, Or, the transparent plastic sealing layer comprises a first transparent plastic sealing layer and a second transparent plastic sealing layer; the first transparent plastic sealing layer covers a first area of the receiving chip, and the first area comprises the first sensing area; the second transparent plastic sealing layer covers a second area of the receiving chip; in the position corresponding to the light-absorbing coating, the gap exists between the first transparent plastic sealing layer and the second transparent plastic sealing layer, and the bottom of the gap is the light-absorbing coating.

6. The optical chip package structure of claim 1, wherein, The transparent plastic sealing layer comprises a first transparent plastic sealing layer and a second transparent plastic sealing layer; the first transparent plastic sealing layer covers the receiving chip, and the second transparent plastic sealing layer covers the transmitting chip; in the position corresponding to the light-absorbing coating, the gap exists in the first transparent plastic sealing layer, and the bottom and both sides of the gap in the first direction are the first transparent plastic sealing layer.

7. The optical chip package structure of claim 1, wherein, ​ ​ ​ 8. The optical chip package structure according to any one of claims 1 to 7, wherein, ​ ​ 9. The optical chip package structure according to any one of claims 1 to 7, wherein, ​ Or, the transparent plastic sealing layer comprises a first transparent plastic sealing layer, a second transparent plastic sealing layer and a third transparent plastic sealing layer, the first transparent plastic sealing layer covers a first region of the receiving chip, the first region comprises the first sensing area, the second transparent plastic sealing layer covers a second region of the receiving chip, and the third transparent plastic sealing layer covers the transmitting chip; at the position corresponding to the light-absorbing coating, the gap exists between the first transparent plastic sealing layer and the second transparent plastic sealing layer, and the bottom of the gap is the light-absorbing coating.

10. The optical chip package structure according to any one of claims 1 to 7, wherein, The transparent plastic sealing layer covers the receiving chip and the transmitting chip; at the position corresponding to the light-absorbing coating, the gap exists in the transparent plastic sealing layer, and the bottom and both sides in the first direction of the gap are the transparent plastic sealing layer; Or, the transparent plastic sealing layer comprises a first transparent plastic sealing layer and a second transparent plastic sealing layer, the first transparent plastic sealing layer covers a first region of the receiving chip, the first region comprises the first sensing area, the second transparent plastic sealing layer covers a second region of the receiving chip and the transmitting chip; at the position corresponding to the light-absorbing coating, the gap exists between the first transparent plastic sealing layer and the second transparent plastic sealing layer, and the bottom of the gap is the light-absorbing coating.

Images