Sound insulation board and electronic equipment

Abstract

The utility model provides a sound insulation board and electronic equipment, and relates to the technical field of electronic equipment. The electronic equipment comprises a shell, a sound production device and a sound insulation plate. A first cavity is formed in the shell, the sound production device is installed in the shell, and the first cavity forms at least part of a rear cavity of the sound production device. The sound insulation plate is located in the first cavity, the peripheral edge of the sound insulation plate is fixed to the inner surface of the shell through a fixing piece, and the sound insulation plate is separated from the inner surface of the shell through the fixing piece. The sound insulation board comprises at least one sound insulation unit. Each sound insulation unit comprises a first plate body and a balancing weight, the surface of one side of the first plate body in the thickness direction is a first surface, and the balancing weight is located in the center of the first surface and fixed to the first plate body. The sound insulation amount of the sound insulation units is larger than or equal to 40 dB. The sound insulation plate is arranged in the electronic equipment, so that the problem that the sound production device drives the shell of the electronic equipment to generate vibration, and the user experience is greatly influenced is solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic devices, and in particular to a sound insulation plate and an electronic device. BACKGROUND

[0002] A sound production device is used to restore audio electrical signals such as music and voice into sound, and has the function of supporting audio external playing, and thus is applied more and more widely in electronic devices such as mobile phones, tablet computers, and notebook computers.

[0003] With the vibration sound production of the sound production device, the sound production device drives the shell of the electronic device to vibrate, which greatly affects the experience of the user. CONTENT OF THE UTILITY MODEL

[0004] Therefore, the present application provides a sound insulation plate and an electronic device to solve the problem that the sound production device drives the shell of the electronic device to vibrate, which greatly affects the experience of the user.

[0005] To achieve the above-mentioned purpose, the present application adopts the following technical solutions:

[0006] In a first aspect, the present application provides a sound insulation plate comprising at least one sound insulation unit. The sound insulation unit comprises a first plate body and a counterweight. One side surface of the first plate body in the thickness direction is a first surface, and the counterweight is located at the center of the first surface and is fixed to the first plate body.

[0007] In this way, during the vibration of the sound insulation plate and the diaphragm group, the vibration displacement of the sound insulation plate and the diaphragm group is offset or completely offset to a certain extent by using the even-order symmetry of the vibration of the sound insulation plate and the diaphragm group, so as to achieve the sound insulation plate to a certain extent. Interception and blocking of the vibration sound waves generated by the vibration of the diaphragm group, which is conducive to reducing the vibration sound waves transmitted to the shell to a certain extent, thereby weakening the vibration of the shell, realizing the vibration reduction function of the sound insulation plate to the shell, and improving the user experience.

[0008] In some possible implementation manners of the first aspect of the present application, the sound insulation amount of the sound insulation unit is greater than or equal to 40 dB. In this way, the sound insulation plate can achieve better sound insulation and vibration reduction effect.

[0009] In some possible implementation manners of the first aspect of the present application, the sound insulation plate comprises a plurality of sound insulation units, and the plurality of sound insulation units are arranged in the direction of the first surface. The first plate bodies of any two adjacent sound insulation units are connected together.

[0010] In this way, on the one hand, based on the sound insulation amount of the sound insulation board being the sum of the sound insulation amounts of the sound insulation units, by arranging multiple sound insulation units on the sound insulation board, the number of sound insulation units is increased, and thus the sound insulation and vibration reduction effect of the sound insulation board is improved; on the other hand, by connecting the first plate bodies of two adjacent sound insulation units on the sound insulation board together, the structural strength of the sound insulation board is improved.

[0011] In some possible implementation manners of the first aspect of the present application, the multiple sound insulation units are arranged in a rectangular array.

[0012] In this way, the sound insulation units are uniformly distributed on the sound insulation board, facilitating the processing and manufacturing of the sound insulation board, and the sound insulation performance at each sound insulation unit on the sound insulation board is better. Of course, the present application is not limited thereto, and in other embodiments, the multiple sound insulation units can also be arranged in a ring array.

[0013] In some possible implementation manners of the first aspect of the present application, the first plate bodies of the multiple sound insulation units are connected as an integrally formed piece. In this way, the structural strength of the sound insulation board is improved, the processing technology of the sound insulation board is simplified, and the manufacturing cost is reduced.

[0014] In some possible implementation manners of the first aspect of the present application, the first plate body and the counterweight are an integrally formed piece. In this way, the structural strength of the sound insulation board is improved, the processing technology of the sound insulation board is simplified, and the manufacturing cost is reduced.

[0015] In some possible implementation manners of the first aspect of the present application, the sound transmission coefficient of the sound insulation unit is T, and T satisfies:

[0016]

[0017] wherein ω = 2πf, f is the resonance frequency of the sound insulation unit, m eff is the quotient of the mass of the sound insulation unit and the area of the side surface of the sound insulation unit facing the sound source, θ is the included angle between the line connecting the sound source to the center of the first plate body and the direction perpendicular to the first plate body, ρ0 is the density of the sound insulation unit, and c is the propagation speed of sound in the sound insulation unit.

[0018] In this way, the sound insulation board can be designed by adjusting the angular frequency ω, the included angle θ between the line connecting the sound source to the center of the first plate body and the direction perpendicular to the first plate body, the density ρ0 of the sound insulation unit, the propagation speed c of sound in the sound insulation unit, and the equivalent surface mass density m eff , so as to facilitate the purpose of optimizing the structural layout of the sound insulation board and improving the vibration reduction effect of the sound insulation board.

[0019] In some possible implementation manners of the first aspect of the present application, the resonance frequency of the sound insulation unit is f, and f is less than or equal to 500 Hz.

[0020] In this way, the sound insulation plate offsets the vibration sound waves below 500 Hz generated when the sound generating device vibrates to a certain extent, which is conducive to reducing the vibration sound waves transmitted to the shell to a certain extent, thereby weakening the vibration of the shell, realizing the vibration reduction function of the sound insulation plate on the shell, and improving the user experience.

[0021] In some possible implementation manners of the first aspect of the present application, an included angle θ between a line connecting the sound source to the center of the first plate body and a direction perpendicular to the first plate body is greater than 0° and less than or equal to 60°.

[0022] In this way, it is conducive to reasonably optimizing the structure of the sound insulation unit, improving the structural strength of the sound insulation unit, and improving the sound insulation amount of each sound insulation unit to improve the vibration reduction effect.

[0023] In some possible implementation manners of the first aspect of the present application, the thickness of the first plate body is hp, hp is less than or equal to 0.15 mm and greater than or equal to 0.08 mm.

[0024] In this way, after simulating multiple different thickness values of the first plate body, it is found that when the thickness hp of the first plate body is in the range of 0.08 mm to 0.15 mm, the greater the thickness hp of the first plate body, the greater the sound insulation amount, and the smaller the sound transmission coefficient T, which is conducive to exerting the low-frequency sound insulation and vibration reduction function of the sound insulation unit.

[0025] In some possible implementation manners of the first aspect of the present application, the equivalent diameter of the first plate body is a, a is less than or equal to 40 mm and greater than or equal to 30 mm.

[0026] In this way, after simulating multiple groups of different equivalent diameters a of the first plate body, it is found that when the equivalent diameter a of the first plate body is in the range of 30 mm to 40 mm, the greater the equivalent diameter a of the first plate body, the smaller the sound transmission coefficient T, and the greater the sound insulation amount, and the equivalent diameter a of the first plate body in this range is conducive to exerting the low-frequency sound insulation and vibration reduction function of the sound insulation unit.

[0027] In some possible implementation manners of the first aspect of the present application, the equivalent diameter of the cross section of the counterweight is d0, d0 is less than or equal to 40 mm and greater than or equal to 11 mm.

[0028] In this way, after simulating multiple groups of different equivalent diameters d0 of the cross section of the counterweight, it is found that when the equivalent diameter d0 of the cross section of the counterweight is in the range of 11 mm to 40 mm, the greater the equivalent diameter d0 of the cross section of the counterweight, the greater the sound insulation amount, and the smaller the sound transmission coefficient T, which is conducive to exerting the low-frequency sound insulation and vibration reduction function of the sound insulation unit.

[0029] In some possible implementation manners of the first aspect of the present application, the height of the counterweight is h0, h0 is less than or equal to 5 mm and greater than or equal to 1 mm.

[0030] In this way, the height h0 of the counterweight is simulated in multiple groups, and it is found that when the height h0 of the counterweight is selected in the range of 1 mm to 5 mm, the greater the height h0 of the counterweight, the greater the sound insulation amount, and the smaller the sound transmission coefficient T, which is beneficial to the low-frequency sound insulation and vibration reduction function of the sound insulation unit.

[0031] In some possible implementation manners of the first aspect of the present application, the density of the sound insulation unit is p0, p0 is greater than or equal to 1x10 3 kg / m 3 and less than or equal to 1x10 4 kg / m 3 .

[0032] In this way, the structure of the sound insulation unit is reasonably optimized, the structural strength of the sound insulation unit is improved, the sound insulation amount of each sound insulation unit is improved, and the vibration reduction effect is improved

[0033] In some possible implementation manners of the first aspect of the present application, the counterweight and the first plate body are made of the same material.

[0034] In this way, the counterweight and the first plate body are made of the same material, the performance parameters are consistent, the uncertainty caused by material differences is reduced, and the reliability and consistency of the sound insulation board are improved; the same material usually has similar mechanical properties, such as vibration reduction, high strength and rigidity, and can withstand the same pressure and load, thereby ensuring the stability of sound insulation and vibration reduction; using the same material can also simplify the manufacturing process, improve production efficiency and facilitate the processing and manufacturing of the sound insulation board.

[0035] In some possible implementation manners of the first aspect of the present application, the counterweight and the first plate body are made of the same material.

[0036] In this way, when the vibration amplitude of the sound generating device is too large, the local resonance of the sound generating device and the sound insulation board is realized based on the even-order symmetry generated when the two vibrate, so that the displacement of the vibration of the two is offset. The metal has a certain mass, and under the action of the gravity of the metal, the sound insulation board can coordinate the consistency of the vibration time of the sound insulation board and the sound generating device, offset the vibration displacement of the sound generating device, reduce the vibration displacement of the sound insulation board, and reduce the vibration amplitude of the sound insulation board.

[0037] In a second aspect, the present application also provides an electronic device, comprising: a shell, a sound generating device, and a sound insulation plate. The shell has a first cavity therein. The sound generating device is mounted in the shell, and the first cavity constitutes at least part of a back cavity of the sound generating device. The sound insulation plate is located in the first cavity, and a peripheral edge of the sound insulation plate is fixed to an inner surface of the shell by a fixing member, and the sound insulation plate is spaced apart from the inner surface of the shell by the fixing member.

[0038] According to the electronic device of the present application, the vibration displacement generated by the sound insulation plate when the sound generating device vibrates is opposite, so that the vibration displacement of the sound insulation plate and the displacement of the sound generating device are offset to a certain extent or completely offset, which is beneficial to at least reducing the vibration sound wave transmitted to the shell to a certain extent, thereby weakening the vibration of the shell, realizing the damping function of the sound insulation plate on the shell, and improving the user experience.

[0039] In some possible implementation manners of the second aspect of the present application, the electronic device comprises a screen. The shell comprises a back cover and a frame. The back cover and the screen are arranged in a stack, and the frame surrounds a periphery of the back cover and the screen. A middle plate is arranged in the frame, and the middle plate is arranged in a stack between the screen and the back cover. The sound generating device is fixed to the middle plate. The middle plate, the frame, and the back cover enclose the first cavity, and the sound insulation plate is fixed to a surface of the back cover facing the middle plate by the fixing member.

[0040] In this structure, it is beneficial to weaken the vibration of the back cover to a greater extent, thereby being beneficial to weakening the overall vibration of the back cover and the frame to a greater extent, and improving the user experience.

[0041] In some possible implementation manners of the second aspect of the present application, a vertical projection of the sound generating device on the back cover overlaps a vertical projection of the sound insulation plate on the back cover.

[0042] In this way, the vibration sound wave in the overlapping area of the sound insulation plate can be intercepted and blocked to a certain extent, the vibration amplitude of the back cover at this position is reduced, and the damping effect of the back cover is improved. BRIEF DESCRIPTION OF DRAWINGS

[0043] Figure 1 A perspective view of an electronic device according to some embodiments of the present application;

[0044] Figure 2 An exploded view of an electronic device according to Figure 1 ;

[0045] Figure 3 A partial cross-sectional view of an electronic device according to Figure 1 ;

[0046] Figure 4 An enlarged view of a core in an electronic device according to Figure 3 ;

[0047] Figure 5 Fig. 1 shows an exploded view of an electronic device according to an embodiment of the present application; Figure 1 Fig. 2 shows a partial cross-sectional view of the electronic device according to an embodiment of the present application;

[0048] Figure 6 Fig. 3 shows a schematic view of a soundproofing panel in the electronic device according to an embodiment of the present application; Figure 5 Fig. 4 shows a partial cross-sectional view of the electronic device according to an embodiment of the present application;

[0049] Figure 7 Fig. 5 shows a schematic view of a soundproofing panel in the electronic device according to an embodiment of the present application; Figure 5 Fig. 6 shows a schematic view of a soundproofing panel in the electronic device according to an embodiment of the present application;

[0050] Figure 8 Fig. 7 shows a schematic view of a soundproofing panel in the electronic device according to an embodiment of the present application; Figure 7 Fig. 8 shows a schematic view of a soundproofing unit in the soundproofing panel according to an embodiment of the present application;

[0051] Figure 9 Fig. 9 shows a vibration displacement cloud map of the soundproofing unit;

[0052] Figure 10a Fig. 10 shows a schematic view of a first connection position of a fixing member and the soundproofing panel;

[0053] Figure 10b Fig. 11 shows a schematic view of a second connection position of a fixing member and the soundproofing panel;

[0054] Figure 10c Fig. 12 shows a schematic view of a third connection position of a fixing member and the soundproofing panel;

[0055] Figure 10d Fig. 13 shows a schematic view of a fourth connection position of a fixing member and the soundproofing panel;

[0056] Figure 10e Fig. 14 shows a schematic view of a fifth connection position of a fixing member and the soundproofing panel;

[0057] Figure 10f Fig. 15 shows a schematic view of a sixth connection position of a fixing member and the soundproofing panel;

[0058] Figure 11 Fig. 16 shows a soundproofing curve diagram of a soundproofing unit simulating the equivalent diameter a value of different first plate bodies;

[0059] Figure 12 Fig. 17 shows a soundproofing curve diagram of a soundproofing unit simulating the thickness hp value of different first plate bodies in the Z-axis direction of the soundproofing panel;

[0060] Figure 13 Fig. 18 shows a soundproofing curve diagram of a soundproofing unit simulating the equivalent diameter d0 value of different cross sections of the counterweight;

[0061] Figure 14A sound insulation curve diagram of sound insulation amount STL and frequency of the sound insulation unit with different thickness h0 of the weight block in the Z-axis direction of the sound insulation plate;

[0062] Figure 15 A partial cross-sectional view of the electronic device shown in Figure 5

[0063] Reference signs:

[0064] 100-electronic device;

[0065] 1-screen; 11-light-transmitting cover plate; 12-display screen;

[0066] 2-bezel; 21-middle plate;

[0067] 3-back cover;

[0068] 4-main circuit board;

[0069] 5-secondary circuit board;

[0070] 6-battery;

[0071] 7-sound emitting device; 71-housing; 711-fixing opening; 72-core; 721-bowl frame; 722-vibrating diaphragm group; 7221-fixing part; 7222-folded ring; 7223-spherical top; 723-voice coil; 724-magnetic circuit system; 7241-magnetic gap;

[0072] 8-sound insulation plate; 81-sound insulation unit; 811-first plate body; 8111-first surface; 812-weight block;

[0073] 9-fixing member;

[0074] 10-sound outlet hole; K1-front cavity; K2-rear cavity; Q-first cavity. DETAILED DESCRIPTION

[0075] In the embodiments of the present application, the terms "first", "second" are only used for descriptive purpose, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features.

[0076] In the description of the embodiments of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connection" should be understood in a broad sense, for example, "connection" can be detachable connection, or can be non-detachable connection; can be direct connection, or can be indirect connection through intermediate medium. Among them, "fixed connection" means that the relative position relationship after connection is unchanged.​

[0077] In the embodiments of the present application, “and / or” only describes an association relationship of associated objects, which means that there can be three relationships, for example, A and / or B can mean that there are three cases of A alone, A and B together, and B alone. In addition, the character “ / ” herein generally represents an “or” relationship between the front and rear associated objects.

[0078] In the description of the embodiments of the present application, the terms “include”, “contain” or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or device. Without more limitations, the element defined by the sentence “including a…” does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0079] The present application provides an electronic device, which is a kind of electronic device with support for audio playback function. Specifically, the electronic device can be a portable electronic device or other suitable electronic device. For example, the electronic device can be a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a camera, a personal computer, a notebook computer, a vehicle-mounted device, a wearable device (such as a watch or a bracelet), augmented reality (AR) glasses, an AR helmet, virtual reality (VR) glasses or a VR helmet, etc.

[0080] Please refer to Figure 1 and Figure 2 , wherein, Figure 1 is a perspective view of the electronic device 100 of some embodiments of the present application; Figure 2 is an exploded schematic view of the electronic device 100 shown in Figure 1 In the present embodiment, the electronic device 100 is exemplified as a mobile phone. The electronic device 100 can include a screen 1, a frame 2, a back cover 3, a main circuit board 4, a secondary circuit board 5, a battery 6 and a sound generating device 7.

[0081] It can be understood that, Figure 1 and Figure 2 only schematically show some components included in the electronic device 100, and the actual shape, actual size, actual position and actual structure of these components are not limited by Figure 1 andFigure 2 restrictions.

[0082] The screen 1 is used to display image information, video information, etc. The screen 1 includes a transparent cover plate 11 and a display screen 12. The transparent cover plate 11 is flat. Specifically, the shape of the transparent cover plate 11 includes but is not limited to a rectangular flat plate, a square flat plate, an oblong flat plate, a circular flat plate, and an elliptical flat plate. The material of the transparent cover plate 11 includes but is not limited to glass, plastic, and ceramic. The transparent cover plate 11 and the display screen 12 are stacked and fixedly connected. The connection method between the transparent cover plate 11 and the display screen 12 includes but is not limited to gluing. The transparent cover plate 11 is mainly used to protect the display screen 12 and prevent dust.

[0083] The display screen 12 can be a flexible display screen or a rigid display screen. For example, the display screen 12 can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (OLED) display screen, a micro organic light-emitting diode (OLED) display screen, a micro organic light-emitting diode (OLED) display screen, a quantum dot light-emitting diode (QLED) display screen, or a liquid crystal display (LCD) display screen, etc.

[0084] The display surface of the display screen 12 faces the transparent cover plate 11 , so that the images, videos and other information displayed on the display screen 12 can be observed by the user through the transparent cover plate 11 .

[0085] In order to facilitate the description of the embodiments below, an XYZ coordinate system is established for the electronic device 100. Specifically, the thickness direction of the electronic device 100 (that is, the stacking direction of the light-transmitting cover plate 11 and the display screen 12) is defined as the Z-axis direction, and the directions perpendicular to the Z-axis direction are the X-axis direction and the Y-axis direction, and the X-axis direction is perpendicular to the Y-axis direction. Specifically, in this embodiment, the electronic device 100 is in the shape of a rectangular flat plate, wherein the length direction of the electronic device 100 is the Y-axis direction, and the width direction of the electronic device 100 is the X-axis direction. It can be understood that the coordinate system setting of the electronic device 100 can be flexibly set according to actual needs and is not specifically limited here.

[0086] The frame 2 is in the shape of a ring frame. The frame 2 surrounds a periphery of the screen 1. The connection relationship between the frame 2 and the screen 1 includes but is not limited to adhesion, clamping, etc.

[0087] The frame 2 is provided with a middle plate 21. Exemplarily, the middle plate 21 and the frame 2 can be an integral structure. In this way, the structural strength of the shell is improved, and the processing technology of the shell is simplified, and the production cost of the shell is reduced. Of course, the present application is not limited to this, and in other examples, the frame 2 and the middle plate 21 can also be assembled to form, and the connection mode between the frame 2 and the middle plate 21 includes but is not limited to adhesion, clamping, screw connection and welding, etc.

[0088] The middle plate 21 is in the shape of a flat plate. The shape of the middle plate 21 is adapted to the shape of the light-transmitting cover plate 11. The middle plate 21 is located on the side of the display screen 12 away from the light-transmitting cover plate 11. The middle plate 21 serves as a structural "skeleton" of the electronic device 100, and the main circuit board 4, the auxiliary circuit board 5 and the battery 6, etc. can be fixed on the middle plate 21.

[0089] Please continue to refer to Figure 2 The back cover 3 is in the shape of a flat plate. The shape of the back cover 3 includes but is not limited to a rectangular flat plate, an oblong flat plate, a circular flat plate or an elliptical flat plate. Specifically, the shape of the back cover 3 is adapted to the shape of the light-transmitting cover plate 11. The material of the back cover 3 includes but is not limited to glass, plastic, metal and ceramic.

[0090] The back cover 3 is located on the side of the middle plate 21 away from the screen 1, and is stacked with the middle plate 21 and the screen 1. The frame 2 is arranged around the periphery of the back cover 3 and is fixed to the back cover 3. In this way, the light-transmitting cover plate 11, the frame 2 and the back cover 3 can jointly enclose the shell of the electronic device 100.

[0091] Exemplarily, the frame 2 can be fixedly connected to the back cover 3 by means of adhesion, welding or clamping, etc. That is, the frame 2 and the back cover 3 can be assembled together.

[0092] Please refer to Figure 3 and Figure 3 , Figure 1 is a partial sectional view of the electronic device 100 shown in Figure 3 at the A-A line. The middle plate 21, the frame 2 and the back cover 3 enclose a first cavity Q of the electronic device 100. The first cavity Q can accommodate the main circuit board 4, the auxiliary circuit board 5 and the battery 6, etc. therein.

[0093] The main circuit board 4 is located in the first cavity Q and is fixed to the middle plate 21. Exemplarily, the main circuit board 4 can be fixed to the middle plate 21 by means of threaded connection, clamping, adhesion or welding, etc. In some embodiments, the main circuit board 4 is electrically connected with the display screen 12, and the main circuit board 4 is used to control the display screen 12 to display images or videos.

[0094] The sub-circuit board 5 is located in the first cavity Q and is fixed to the middle plate 21. Specifically, the sub-circuit board 5 can be fixed to the surface of the middle plate 21 facing the back cover 3 by means of screw connection, clamping, gluing or welding, etc. The sub-circuit board 5 and the main circuit board 4 are arranged in the Y-axis direction.

[0095] The battery 6 is located in the first cavity Q. And the battery 6 is located between the main circuit board 4 and the sub-circuit board 5. The battery 6 is used to provide power for the main circuit board 4, the sub-circuit board 5, the screen 1 and the sound generating device 7, etc.

[0096] The battery 6 can include but is not limited to a nickel-cadmium battery 6, a nickel-hydrogen battery 6, a lithium battery 6 or other types of batteries 6. And the number of batteries 6 in the embodiments of the present application can be multiple or one. The specific number and arrangement of the battery 6 in the embodiments of the present application can be set according to actual needs.

[0097] The sound generating device 7 is used to convert audio electrical signals into sound signals. The electronic device 100 is provided with a sound outlet hole 10, which is arranged at the gap between the frame 2 and the screen 1. The sound signal emitted by the sound generating device 7 can be transmitted to the outside of the electronic device 100 by the sound outlet hole 10. In some embodiments, the sound generating device 7 can be electrically connected with the main circuit board 4. The voice electrical signal sent by the main circuit board 4 is transmitted to the sound generating device 7 and further converted into a sound signal by the sound generating device 7 for output.

[0098] The sound generating device 7 can be a receiver module, also known as a "earpiece". When the electronic device 100 answers a phone or voice message, the receiver module can be placed close to the ear to listen to the voice. The sound generating device 7 can also be a speaker module, also known as a "loudspeaker". The electronic device 100 can listen to music or listen to hands-free calls through the speaker module, so that the electronic device 100 can support sound external output. The number of sound generating devices 7 can be multiple, part of the multiple sound generating devices 7 are receiver modules, and the other part of the multiple sound generating devices 7 are speaker modules. Or, all sound generating devices 7 are speaker modules or receiver modules. In other embodiments, the number of sound generating devices 7 can also be one.

[0099] Please continue to refer to Figure 3 The sound generating device 7 is installed in the shell. Specifically, the sound generating device 7 is fixed to the middle plate 21. The connection relationship between the sound generating device 7 and the middle plate 21 includes but is not limited to gluing, clamping or screw connection.

[0100] The sound generating device 7 includes a shell 71 and a core 72.

[0101] It should be noted that, Figure 3Some components of the sound production device 7 are shown only schematically, and the actual shape, actual size, actual position and actual configuration of these components are not limited by Figure 3 the drawings.

[0102] Please continue to refer to Figure 4 The shell 71 is used to support and fix the inner core 72. Specifically, the inner core 72 is installed in the shell 71, and the inner core 72 blocks the side of the shell 71 facing the screen 1. The material of the shell 71 includes but is not limited to metal, plastic or a combination of metal and plastic. Of course, it can be understood that in other examples, the sound production device 7 can also not include the shell 71, but only include the inner core 72.

[0103] Please refer to Figure 4 , Figure 3 is Figure 5 An enlarged view of the inner core 72 in the electronic device shown in FIG. 1 is shown. The inner core 72 includes a basket 721, a diaphragm group 722, a voice coil 723 and a magnetic circuit system 724.

[0104] The basket 721 serves as a “support skeleton” of the inner core 72, and is used to support the diaphragm group 722, the voice coil 723 and fix the magnetic circuit system 724. The material of the basket 721 includes but is not limited to metal, plastic and a combination of the two. The inner core 72 can be fixed in the shell 71 by means of the basket 721.

[0105] The diaphragm group 722 includes a fixed part 7221, a folded ring 7222 and a ball top 7223. The fixed part 7221 is formed in the shape of a ring sheet. The fixed part 7221 is fixed in layers on the side of the basket 721 facing the screen 1. The connection mode of the fixed part 7221 and the basket 721 includes but is not limited to gluing, clamping, welding or screw connection. The shape of the fixed part 7221 is adapted to the shape of the basket 721.

[0106] In some examples, the diaphragm group 722 is a one-piece molded part. That is, the fixed part 7221, the folded ring 7222 and the ball top 7223 are an integral structure. In this way, the structural strength of the diaphragm group 722 is improved, the structural stability of the diaphragm group 722 is improved, and the processing technology of the diaphragm group 722 is also simplified. Of course, the present application is not limited to this, the fixed part 7221, the folded ring 7222 and the ball top 7223 can also be independently formed, the fixed part 7221 and the folded ring 7222 can be connected by gluing, and the folded ring 7222 and the ball top 7223 can be connected by gluing. The material of the diaphragm group 722 includes but is not limited to metal, plastic, plant fiber and animal fiber.

[0107] The voice coil 723 is located in the yoke 721, and one end of the voice coil 723 is connected to the surface of the ball top 7223 facing the inside of the yoke 721. The connection between the voice coil 723 and the ball top 7223 includes but is not limited to gluing, clamping, welding or screwing. The voice coil 723 is generally in the shape of a ring frame. The voice coil 723 is used to cooperate with the magnetic circuit system 724 to synchronously drive the vibration of the diaphragm group 722. Specifically, after the voice coil 723 is energized, an induced magnetic field can be generated, the magnetic circuit system 724 can respond to the induced magnetic field and exert a driving force on the voice coil 723, the voice coil 723 is driven by the magnetic force of the magnetic circuit system 724 to displace, thereby driving the diaphragm group 722 to vibrate.

[0108] The magnetic circuit system 724 is fixed on the end surface of the yoke 721 away from the fixed opening 711. The magnetic circuit system 724 has a ring-shaped magnetic gap 7241, and the part of the voice coil 723 away from the diaphragm group 722 can extend into the magnetic gap 7241, so that the magnetic circuit system 724 can cooperate with the voice coil 723 to drive the diaphragm group 722 to vibrate synchronously. It can be understood that in other embodiments, when the voice coil 723 is a planar voice coil 723, the voice coil 723 can also not extend into the above-mentioned magnetic gap 7241. The planar voice coil 723 can be manufactured by winding or printed circuit.

[0109] On this basis, the sound generating device 7 has an acoustic cavity K. The acoustic cavity K includes a front cavity K1 and a rear cavity K2, wherein the side of the diaphragm group 722 facing the screen 1 is formed as the front cavity K1, the front cavity K1 is in communication with the gap between the middle frame 2 and the display screen 12, forming an open front cavity. When the magnetic circuit system 724 and the voice coil 723 jointly drive the diaphragm group 722 to vibrate, the diaphragm group 722 can drive the air in the front cavity K1 to vibrate to generate sound, and the sound is transmitted to the outside of the electronic device 100 through the sound hole 10.

[0110] The side of the diaphragm group 722 facing the back cover 3 is formed as the rear cavity K2. The side of the shell 71 facing the back cover 3 is open, so that the rear cavity K2 is in communication with the first cavity Q, forming an open rear cavity. The front cavity K1 and the rear cavity K2 of the sound generating device 7 are both open acoustic cavities in the examples described in this application.

[0111] It is worth noting that the foregoing is an example of taking the first cavity Q enclosed by the middle plate 21, the frame 2 and the back cover 3 as the expanded rear cavity of the sound generating device 7.

[0112] In order to ensure the sealing effect, the shell of the electronic device 100 is usually a closed cavity. In this way, when the sound generating device 7 works and the diaphragm group 722 vibrates, vibration sound waves will be generated in the rear cavity K2, and when the vibration sound waves reach the shell, they will drive the back cover 3 to resonate, and due to the vibration of the back cover 3, it will also cause noise during the sound generating process of the sound generating device 7, affecting the user's experience.

[0113] In order to solve the above technical problems, the present application provides another electronic device 100. The difference between the electronic device 100 and the electronic device 100 in the above embodiment is that the electronic device 100 includes a sound insulation board 8. Figure 5 , Figure 1 For Figure 6 The figure shows an exploded schematic diagram of an electronic device 100 in which a sound insulation board 8 is installed.

[0114] Specifically, see Figure 6 , Figure 5 Based on Figure 7 A partial cross-sectional schematic diagram of an electronic device 100 is shown. A sound insulation panel 8 is located within the first cavity Q. The sound insulation panel 8 is fixed to the inner surface of the housing and spaced apart from the inner surface. For example, the inner surface of the housing can refer to the surface of the back cover 3 facing the middle plate 21, the surface of the frame 2 facing the middle plate 21, or both. In this application, the inner surface of the housing is described by referring to the surface of the back cover 3 facing the middle plate 21.

[0115] In this way, the sound insulation board 8 is fixed to the back cover 3 and spaced apart from the back cover 3, providing a vibration space for the sound insulation board 8 to vibrate in the rear cavity K2, which is conducive to reducing the vibration sound waves transmitted to the shell at least to a certain extent, thereby weakening the vibration of the shell, realizing the vibration reduction function of the sound insulation board 8 on the shell, and improving the user experience.

[0116] In some embodiments, the shape of the sound insulation board 8 is adapted to the shape of the back cover 3. This helps to reduce the vibration of the back cover 3, thereby helping to reduce the vibration of the housing and improving the user experience.

[0117] For example, the outer contour of the sound insulation board 8 includes, but is not limited to, square, rectangular, circular, elliptical or irregular shapes.

[0118] In some embodiments of the present application, the vertical projection of the sound-generating device 7 on the back cover 3 overlaps with the vertical projection of the sound insulation board 8 on the back cover 3. It is understood that the closer to the diaphragm assembly 722, the stronger the vibration amplitude of the sound wave. The area on the back cover 3 directly opposite the sound-generating device 7, due to its proximity, tends to have a higher vibration amplitude. Therefore, by overlapping the vertical projection of the sound-generating device 7 on the back cover 3 with the vertical projection of the sound insulation board 8 on the back cover 3, the sound insulation board 8 can offset the vibration waves at this location to a certain extent, reducing the vibration amplitude of the back cover 3 at this location and improving the vibration reduction effect of the back cover 3.

[0119] Of course, it is understandable that, in other embodiments, the vertical projection of the sound-generating device 7 on the back cover 3 and the vertical projection of the sound insulation board 8 on the back cover 3 may not overlap.

[0120] It is worth noting that, on the one hand, due to the limited space in the rear cavity K2, the thickness of the sound insulation board 8 in the Z-axis direction (i.e., the thickness direction of the electronic device 100) should be less than the distance from the inner surface of the back cover 3 to the battery 6. This reserves a certain amount of space for the open rear cavity K2 of the electronic device 100 and ensures the low-frequency performance of the electronic device 100. On the other hand, in order to reduce the impact of the thickness of the sound insulation board 8 on the thickness of the electronic device 100, the thickness of the sound insulation board 8 needs to be adjusted according to the actual thickness of the electronic device 100.

[0121] The structure and vibration reduction principle of the sound insulation board 8 will be introduced in detail below.

[0122] See also Figure 7 , Figure 5 Based on Figure 8 FIG. 1 is a schematic diagram of a sound insulation board 8 in an electronic device 100. The sound insulation board 8 includes at least one sound insulation unit 81. That is, the sound insulation board 8 may include one or more sound insulation units 81.

[0123] Each sound insulation unit 81 includes a first plate 811 and a counterweight 812. One side surface of the first plate 811 in the Z-axis direction is a first surface 8111. The counterweight 812, whose perpendicular projection onto the first surface 8111 covers the center of the first surface 8111, is fixed to the first plate 811. For example, the first plate 811 and the counterweight 812 can be integrally formed, i.e., they form a single structural unit. The first plate 811 and the counterweight 812 can also be fixedly connected by gluing, snapping, welding, threading, or screwing.

[0124] For example, the shape of the first plate 811 includes but is not limited to a circle, a semicircle, a racetrack, a waist-round polygon or an anisotropic shape. Also, the shape of the counterweight 812 includes but is not limited to a circle, a semicircle, a racetrack, a waist-round polygon or an anisotropic shape.

[0125] See also Figure 9 and Figure 6 , and combined with Figure 8 , Figure 7 Based on Figure 9 The structural diagram of the sound insulation unit 81 in the sound insulation board 8 is shown in FIG. Figure 10aTo simulate the vibration displacement cloud of the sound insulation unit 81. When the diaphragm group 722 vibrates, the air in the rear cavity K2 generates vibration sound waves due to vibration, and the sound insulation unit 81 is excited by the vibration sound waves. Based on the sound insulation unit 81, the acoustic metamaterial characteristics of the vibration sound waves are formed. During the excitation of the sound waves, the first plate body 811 and the counterweight 812 will generate local resonance, realize the sound wave band gap, and make the displacement of the vibration of the sound insulation plate 8 and the displacement of the vibration of the diaphragm group 722 in opposite directions, realizing the even-order symmetry of the vibration of the sound insulation plate 8 and the diaphragm group 722. For example, when the diaphragm group 722 vibrates towards the front cavity K1, the first plate body 811 is driven by the counterweight 812 to vibrate towards the back cover 3. When the diaphragm group 722 vibrates towards the rear cavity K2, the first plate body 811 is driven by the counterweight 812 to vibrate towards the middle plate 21.

[0126] In this way, during the vibration of the sound insulation plate 8 and the diaphragm group 722, the even-order symmetry of the vibration of the sound insulation plate 8 and the diaphragm group 722 is utilized to offset or completely offset the vibration displacement of the sound insulation plate 8 and the diaphragm group 722 to a certain extent, realizing a certain degree of interception and blocking of the vibration sound waves generated by the vibration of the diaphragm group 722 by the sound insulation plate 8, which is conducive to reducing the vibration sound waves transmitted to the shell, thereby weakening the vibration of the shell, realizing the damping function of the sound insulation plate 8 to the shell, and improving the user's experience.

[0127] In some embodiments of the present application, the counterweight 812 and the first plate body 811 are made of the same material. In this way, by using the same material for the counterweight 812 and the first plate body 811, the performance parameters are consistent, reducing the uncertainty caused by material differences and improving the reliability and consistency of the sound insulation plate; the same material usually has similar mechanical properties, such as damping, high strength and rigidity, and can withstand the same pressure and load, ensuring the stability of sound insulation and damping. Using the same material can also simplify the manufacturing process, improve production efficiency and facilitate the processing and manufacturing of the sound insulation plate 8. Of course, in other embodiments, the counterweight 812 and the first plate body 811 can also be made of different materials.

[0128] In some examples, the counterweight 812 and the first plate body 811 can be made of metal. In this way, when the diaphragm group 722 vibrates too much, based on the even-order symmetry generated during vibration, the local resonance of the diaphragm group 722 and the sound insulation plate 8 is realized, and the displacement of the vibration of the diaphragm group 722 and the sound insulation plate 8 is offset. The metal has a certain mass, which, under the action of the gravity of the metal, can not only coordinate the consistency of the vibration of the sound insulation plate 8 and the diaphragm group 722, but also offset the vibration displacement of the diaphragm group 722, and reduce the vibration amplitude of the sound insulation plate 8.

[0129] In some embodiments, the outer peripheral edge of the sound insulation board 8 is fixed to the surface of the back cover 3 facing the middle plate 21 by the fixing member 9. In other words, the sound insulation board 8 is separated from the back cover 3 by the fixing member 9.

[0130] In this way, when the sound-generating device 7 is working, the sound insulation board 8 is separated from the back cover 3 by the fixing member 9, which can prevent the sound insulation board 8 from contacting the back cover 3 when vibrating, thereby reducing the vibration of the back cover 3, improving the sound insulation and vibration reduction effect of the sound insulation board 8, and enhancing the user experience.

[0131] In some examples, the fixing member 9 can be integrally formed with the back cover 3; or integrally formed with the sound insulation board 8; or the fixing member 9 can be a separate structural member, fixedly connected to both the sound insulation board 8 and the back cover 3. Connection methods include, but are not limited to, gluing, threading, bolting, screwing, snap-fitting, or riveting. Furthermore, the fixing member 9 can be configured in the form of, but is not limited to, an annular structure, a cylinder, a rectangular parallelepiped, a cube, an angle bracket, or a special-shaped structure. The following description uses a cylindrical fixing member 9 as an example.

[0132] Under the premise of ensuring the stability of the sound insulation board 8 installed in the electronic device 100, the fixing member 9 can be provided at any position of the sound insulation board 8 facing the back cover 3. In addition, there can be one fixing member 9 or more.

[0133] For example, see Figure 10a , Figure 10b A schematic diagram shows a first connection position of the fixing member 9 and the sound insulation board 8, that is, the fixing members 9 can be arranged at the four corners of the sound insulation board 8. In order to achieve a balanced position of the fixing member 9 on the back cover 3, multiple fixing members 9 need to be arranged at this connection position.

[0134] For example, see Figure 10b , Figure 10b A schematic diagram shows a second connection position of the fixing member 9 and the sound insulation board 8, that is, the fixing member 9 is provided in the central area of ​​the sound insulation board 8 on the side facing the back cover 3. At this connection position, the fixing member 9 can be provided as one or more fixing members. Figure 10c The example in which a fixing member 9 is provided in the central area is used for illustration, but this does not constitute a special limitation on the connection position.

[0135] For example, see Figure 10c , Figure 10d A schematic diagram shows a third connection position of the fixing member 9 and the sound insulation board 8, that is, the fixing members 9 are distributed along one of the diagonals on the surface of the sound insulation board 8 facing the back cover 3. In this case, a plurality of fixing members 9 need to be provided.

[0136] For example, see Figure 10d , Figure 10dFig. 6 shows a schematic diagram of the fifth connection position of the fixing member 9 and the sound insulation plate 8, in which the fixing member 9 is arranged on the side of the sound insulation plate 8 facing the back cover 3 in a pattern (e.g., a circle, a rectangle, a square, an ellipse, a semicircle, or other irregular shapes, etc.) formed by the fixing member 9 to fix the sound insulation plate 8. Figure 10e Fig. 6 shows a schematic diagram of the fifth connection position of the fixing member 9 and the sound insulation plate 8, in which the fixing member 9 is arranged on the side of the sound insulation plate 8 facing the back cover 3 in a pattern (e.g., a circle, a rectangle, a square, an ellipse, a semicircle, or other irregular shapes, etc.) formed by the fixing member 9 to fix the sound insulation plate 8.

[0137] For example, referring to Fig. 7, Figure 10e Figure 10e Fig. 6 shows a schematic diagram of the fifth connection position of the fixing member 9 and the sound insulation plate 8, in which the fixing member 9 is arranged on the side of the sound insulation plate 8 facing the back cover 3 in a pattern (e.g., a circle, a rectangle, a square, an ellipse, a semicircle, or other irregular shapes, etc.) formed by the fixing member 9 to fix the sound insulation plate 8. Figure 10f Fig. 6 shows a schematic diagram of the fifth connection position of the fixing member 9 and the sound insulation plate 8, in which the fixing member 9 is arranged on the side of the sound insulation plate 8 facing the back cover 3 in a pattern (e.g., a circle, a rectangle, a square, an ellipse, a semicircle, or other irregular shapes, etc.) formed by the fixing member 9 to fix the sound insulation plate 8.

[0138] For example, referring to Fig. 7, Figure 10f Figure 7 Fig. 6 shows a schematic diagram of the fifth connection position of the fixing member 9 and the sound insulation plate 8, in which the fixing member 9 is arranged on the side of the sound insulation plate 8 facing the back cover 3 in a pattern (e.g., a circle, a rectangle, a square, an ellipse, a semicircle, or other irregular shapes, etc.) formed by the fixing member 9 to fix the sound insulation plate 8.

[0139] In some possible examples, the fixing member 9 and the back cover 3 can be arranged in an integrated structure, which has a structure strength of the fixing member 9.

[0140] In some embodiments of the present application, the side of the sound insulation plate 8 with the counterweight 812 can face the sound generating device 7, so as to realize a certain degree of offset of the vibration sound waves generated by the vibration of the diaphragm group 722. For example, the side of the sound insulation plate 8 with the counterweight 812 can face the sound source of the sound generating device 7, and the back cover 3 is connected to the side of the sound insulation plate 8 opposite to the first surface 8111 through the fixing member 9.

[0141] ​​The control factor for achieving the sound insulation and vibration reduction function of the sound insulation board 8 lies in the sound insulation amount of the sound insulation board 8, and the sound insulation amount is an important parameter for measuring the sound insulation effect. It can be understood that the higher the sound insulation amount, the better the sound insulation effect of the sound insulation board 8. In order to make the sound insulation board 8 achieve better sound insulation and vibration reduction effect, based on the structure of the sound insulation board 8 and the principle of local resonance, in the sound insulation board 8 of the present application, the sound insulation amount of the sound insulation unit 81 is the sound insulation amount of the sound insulation board 8. On the basis of any of the above embodiments, the sound insulation amount of the sound insulation unit 81 is greater than or equal to 40dB.

[0142] For example, the sound insulation amount of the sound insulation unit 81 can be 40dB, 50dB, 53dB, 55dB, 60dB, 65dB, 68dB, 70dB, 75dB, 78dB, 80dB, 85dB, 90dB, 95dB or 98dB.

[0143] In some embodiments, when the sound insulation board 8 includes a plurality of sound insulation units 81, the plurality of sound insulation units 81 can be arranged in the direction in which the first surface 8111 is located, and the first plate body 811 of any two adjacent sound insulation units 81 is connected together.

[0144] In this way, on the one hand, based on the sound insulation amount of the sound insulation board 8 being the sum of the sound insulation amounts of the sound insulation units 81, by arranging a plurality of sound insulation units 81 on the sound insulation board 8, the number of sound insulation units 81 is increased, thereby improving the sound insulation and vibration reduction effect of the sound insulation board 8; on the other hand, by connecting the first plate body 811 of the two adjacent sound insulation units 81 on the sound insulation board 8 together, the area of the first plate body 811 is increased, thereby improving the structural strength of the sound insulation board 8.

[0145] In some embodiments, the plurality of sound insulation units 81 can be arranged in a rectangular array. In this way, the sound insulation units 81 are uniformly distributed on the sound insulation board 8, facilitating the processing and manufacturing of the sound insulation board 8, and also enabling better sound insulation performance at each sound insulation unit 81 on the sound insulation board 8.

[0146] Of course, the present application is not limited thereto, and in other embodiments, the plurality of sound insulation units 81 can also be arranged in a circular array.

[0147] In some embodiments, the plurality of first plate bodies 811 can be connected as one, that is, the plurality of first plate bodies 811 are integrally formed. In this way, it is beneficial to improve the structural strength of the first plate body 811, simplify the processing technology of the first plate body 811, and reduce the manufacturing cost. For example, the plurality of first plate bodies 811 can be formed into an integrally formed piece by stamping, metal powder injection, etc.

[0148] Of course, in other embodiments, any two adjacent first plate bodies 811 in the plurality of first plate bodies 811 can also be fixed together by welding, gluing, clamping or screw connection, etc.

[0149] In some other embodiments, the first plate body 811 and the counterweight 812 are integrally formed. In this way, the integrally formed part avoids connection defects, is conducive to improving the structural strength of the sound insulation panel 8, simplifies the processing process of the sound insulation panel 8, and reduces the manufacturing cost.

[0150] The measurement method of the sound insulation amount of the sound insulation panel 8 includes, but is not limited to, the reverberation chamber method, the transfer chamber method, the sound impedance tube method, the sound insulation chamber method, the acoustic camera method, the sound transmission method, and the sensor measurement method, etc.

[0151] Taking the reverberation chamber method as an example, when measuring the sound insulation amount of the sound insulation panel 8, first, a standard reverberation chamber is selected to ensure that the acoustic characteristics of the room meet the standard requirements. Prepare the sound source, sound level meter, analyzer and other equipment, and calibrate the equipment. Then, install the sound insulation panel 8 at the test opening of the reverberation chamber, ensuring that it is firmly installed and has no gaps. Standardized white noise or pink noise is generated in the reverberation chamber to ensure that the noise signal covers the required frequency range. Then, the sound pressure level of the noise signal is measured at different positions in the reverberation chamber, and the data is recorded. Finally, according to the spectrum analysis result, the sound insulation amount of the sound insulation panel 8, i.e., the sum of the sound insulation amounts of each sound insulation unit 81, is calculated.

[0152] Taking the transfer chamber method as an example, when measuring the sound insulation amount of the sound insulation panel 8, first, two adjacent standard test chambers are selected, one as a sound source chamber and the other as a receiving chamber. Next, prepare the sound source, sound level meter, analyzer and other equipment, and calibrate the equipment. Then, install the sound insulation panel 8 at the opening between the two test chambers, ensuring that it is firmly installed and has no gaps. Standardized white noise or pink noise is generated in the sound source chamber to ensure that the noise signal covers the required frequency range. Then, the sound pressure level of the noise signal is measured at different positions in the sound source chamber and the receiving chamber, and the data is recorded. Finally, according to the spectrum analysis result, the sound insulation amount of the sound insulation panel 8, i.e., the sum of the sound insulation amounts of each sound insulation unit 81, is calculated.

[0153] According to the acoustic theory, the sound insulation amount of the sound insulation unit 81 satisfies the following formula (1):

[0154] STL = 10lg(1 / T) (Formula 1)

[0155] Wherein, 10lg(1 / T) is the sound insulation amount of the sound insulation unit 81, STL is the sound insulation amount of each sound insulation unit 81. T refers to the sound transmission coefficient obtained under different incidence angles when the sound wave is incident on the sound insulation unit 81. The sound transmission coefficient T (also known as the sound transmission coefficient, the transmission coefficient) is the sound transmission coefficient of the sound insulation unit 81, which refers to the ratio of the sound energy transmitted by the sound insulation unit 81 to the total sound energy incident on the sound insulation unit 81.

[0156] It is found that the size of the sound transmission coefficient T directly determines the size of the sound insulation amount STL of the sound insulation unit 81. The sound transmission coefficient T of the sound insulation unit 81 is negatively correlated with the sound insulation amount STL of the sound insulation unit 81. The smaller the sound transmission coefficient T, the larger the sound insulation amount STL of the sound insulation unit 81, and the better the sound insulation effect. In order to ensure that the sound insulation unit 81 has a good sound insulation and vibration reduction effect, the sound transmission coefficient T satisfies the following Formula Two:

[0157]

[0158] wherein ω = 2πf, ω is an angular frequency, f is a resonance frequency of the sound insulation unit 81, θ is an included angle between a line connecting a sound source to a center of the first plate body 811 and a direction perpendicular to the first plate body 811, Figure 6 is an incident direction marked with θ, ρ0 is a density of the sound insulation unit 81, c is a propagation speed of sound in the sound insulation unit 81, and m eff is a quotient of a mass m of the sound insulation unit 81 and an area s of a side surface of the sound insulation unit 81 facing the sound source.

[0159] Therefore, the sound insulation panel 8 can be designed by adjusting the angular frequency ω, the included angle θ, the density ρ0 of the sound insulation unit 81, the propagation speed c of sound in the sound insulation unit 81, and the equivalent surface mass density m eff of each parameter, so as to facilitate the purpose of optimizing the structural layout of the sound insulation panel 8 and improving the vibration reduction effect of the sound insulation panel 8.

[0160] It should be noted that the equivalent surface mass density m eff is determined according to the surface of the side of the sound insulation unit 81 facing the sound source. Taking the first plate body 811 as a square and the counterweight 812 as a cylinder as an example:

[0161] In the structure shown in Figure 11 , the side of the first plate body 811 with the counterweight 812 faces the sound source, and the formula of the equivalent surface mass density m eff is:

[0162] m eff = m / a·a + π·d0·h0 + 4a·hp (Formula Three)

[0163] wherein a is an equivalent diameter of the first plate body 811, hp is a thickness of the first plate body 811 in the Z-axis direction of the sound insulation panel 8, d0 is an equivalent diameter of a cross section of the counterweight 812, and h0 is a thickness of the counterweight 812 in the Z-axis direction of the sound insulation panel 8.

[0164] In some other examples, the first plate body 811 and the weight 812 can also be circular, rectangular or other structures, and the equivalent surface mass density m eff The sound transmission coefficient T is the quotient of the mass m of the sound insulation unit 81 and the area s of the side surface of the sound insulation unit 81 facing the sound source. The area s of the side surface of the sound insulation unit 81 facing the sound source can be calculated according to the corresponding area formula of the structure.

[0165] It can be found from Formula Two that the sound transmission coefficient T is related to the equivalent surface mass density m eff , the propagation speed c of sound in the sound insulation unit 81, the density p0 of the sound insulation unit 81, the resonance frequency f of the sound insulation unit 81, and the angle Q between the line connecting the sound source to the center of the first plate body 811 and the direction perpendicular to the first plate body 811. Among these parameters related to the sound transmission coefficient T, the equivalent surface mass density m eff , the propagation speed c of sound in the sound insulation unit 81, the density p0 of the sound insulation unit 81, the resonance frequency f of the sound insulation unit 81, and the angle Q between the line connecting the sound source to the center of the first plate body 811 and the direction perpendicular to the first plate body 811. Among these parameters related to the sound transmission coefficient T, the equivalent surface mass density m eff , the propagation speed c of sound in the sound insulation unit 81, the density p0 of the sound insulation unit 81, the resonance frequency f of the sound insulation unit 81, and the angle Q between the line connecting the sound source to the center of the first plate body 811 and the direction perpendicular to the first plate body 811. Among these parameters related to the sound transmission coefficient T, the equivalent surface mass density m

[0166] It can be found from Formula Two that the smaller the density p0 of the sound insulation unit 81 is, the smaller the sound transmission coefficient T is. Thus, the sound insulation amount STL is larger. However, at the same time, the smaller the density p0 of the sound insulation unit 81 is, the smaller the mass m of the sound insulation unit 81 is, and the equivalent surface mass density m eff is smaller, the sound transmission coefficient T is larger, and the sound insulation amount STL is smaller. Based on this, in order to reasonably optimize the structure of the sound insulation unit 81, improve the structural strength of the sound insulation unit 81, and improve the sound insulation amount STL of each sound insulation unit 81 to improve the vibration reduction effect, in some examples of the present application, the density p0 of the sound insulation unit 81 is greater than or equal to 1x10 -3 g / mm 3 and less than or equal to 1x10 -2 g / mm 3.

[0167] For example, the density p0 of the sound insulation unit 81 can be 1 x 10 -3 g / mm 3 , 2 x 10 -3 g / mm 3 , 3 3 x 10 -3 g / mm 3 , 4 x 10 -3 g / mm 3 , 5 x 10 -3 g / mm, 6 x 10 -3 g / mm 3 , 7 x 10 -3 g / mm 3 , 8 x 10 -3 g / mm 3 , 9 x 10 -3 g / mm -3 , 1 x 10 -2 g / mm 3 , and the like.

[0168] It can be found in combination with Equation Two that the greater the value of cos 0, the smaller the value of the sound transmission coefficient T, and the greater the sound insulation amount STL. In order to reasonably optimize the structure of the sound insulation unit 81, improve the structural strength of the sound insulation unit 81, and improve the sound insulation amount STL of each sound insulation unit 81 to improve the damping effect. In some embodiments of the present application, the sound insulation units 81 are arranged in an array, so the position of each sound insulation unit 81 on the sound insulation board 8 is different, so the angle 0 between the line of incidence of the sound source to the center of the first plate body 811 of each sound insulation unit 81 and the direction perpendicular to the first plate body 811 is not the same, but in general, the angle 0 between the line of incidence of the sound source to the center of the first plate body 811 of each sound insulation unit 81 and the direction perpendicular to the first plate body 811 is greater than 0° and less than or equal to 60°, which can achieve a sound insulation amount STL of the sound insulation unit 81 greater than 40 dB.

[0169] For example, the angle 0 between the line of incidence of the sound source to the center of the first plate body 811 of each sound insulation unit 81 and the direction perpendicular to the first plate body 811 can be 10°, 15°, 20°, 25°, 30°, 35°, 40°, 45°, 50°, 55°, or 60°, and the like.

[0170] In addition, c is the propagation speed of sound in the sound insulation unit 81. Specifically, the sound insulation unit 81 belongs to a propagation medium of sound waves, and the propagation speed c of sound in the sound insulation unit 81 belongs to the inherent property of the sound insulation unit 81. Therefore, the value of the propagation speed c of sound in the sound insulation unit 81 is related to the material of the sound insulation unit 81 and belongs to the inherent property of the material. For example, if the counterweight 812 and the first plate body 811 are made of the same material, the propagation speed of sound in the counterweight 812 and the first plate body 811 is the same. When the counterweight 812 and the first plate body 811 are made of different materials, the propagation speed c of sound in the sound insulation unit 81 can be the average of the propagation speeds of the two materials.

[0171] Generally, the sound generating device 7 of the electronic device 100 is a full-band sound generating unit, and the vibration frequency range of the sound generating device 7 is generally 100 Hz-20 KHz. The vibration sound waves generated by the vibration of the diaphragm group 722 are transmitted to the back cover 3, which is also a full-band. However, it has been verified in practice that, in terms of the perception of the human body, the human body has obvious perception of the vibration transmitted by the vibration frequency below 500 Hz, and is not sensitive to the vibration transmitted by the vibration frequency above 500 Hz. That is, the human body can obviously perceive the vibration caused by the frequency below 500 Hz. In this application, when the vibration frequency is below 500 Hz, the vibration sound waves generated by the vibration of the diaphragm group 722 transmitted to the back cover 3 can be obviously perceived by the human body. Based on this, in some embodiments of the application, the resonance frequency f of the sound insulation unit 81 is less than or equal to 500 Hz. In this way, the sound insulation plate 8 offsets the vibration sound waves below 500 Hz generated by the vibration of the diaphragm group 722 to a certain extent, which is beneficial to reduce the vibration sound waves transmitted to the shell, thereby weakening the vibration of the shell, realizing the vibration reduction function of the sound insulation plate 8 to the shell, and improving the user experience.

[0172] In actual testing, the resonance frequency of the sound insulation unit 81 and the sound generating device 7 can be tested by an electro-acoustic tester.

[0173] It is found from Formula Two that the equivalent surface mass density m eff The greater the equivalent surface mass density m eff The equivalent surface mass density m effAmong the related parameters, the equivalent diameter a of the first plate body 811, the equivalent diameter d0 of the cross section of the weight block 812, the thickness h0 of the weight block 812 in the Z-axis direction of the sound insulation plate 8, and the thickness hp of the first plate body 811 in the Z-axis direction of the sound insulation plate 8 directly determine the sound insulation effect of the sound insulation unit 81.

[0174] In order to be able to take into account the sound insulation amount STL of the sound insulation unit 81 and the sound insulation effect of the sound insulation unit 81 on low-frequency sound waves, in the actual research and development process, the sound insulation plate 8 with different values of the equivalent diameter a of the first plate body 811, the equivalent diameter d0 of the cross section of the weight block 812, the thickness h0 of the weight block 812 in the Z-axis direction of the sound insulation plate 8, and the thickness hp of the first plate body 811 in the Z-axis direction of the sound insulation plate 8 is simulated. In the simulation stage, a plurality of experimental data are simulated and verified to obtain the optimal values of the equivalent diameter a of the first plate body 811, the equivalent diameter d0 of the cross section of the weight block 812, the thickness h0 of the weight block 812 in the Z-axis direction of the sound insulation plate 8, and the thickness hp of the first plate body 811 in the Z-axis direction of the sound insulation plate 8.

[0175] Please refer to Figure 11 , Figure 11 is a sound insulation curve diagram simulating the relationship between the sound insulation amount STL and the frequency of the sound insulation unit 81 with different values of the thickness hp of the first plate body 811 in the Z-axis direction of the sound insulation plate 8. From Figure 11 , it can be known that when the resonance frequency f of the sound insulation unit 81 is less than or equal to 500 Hz (the double-dot-dashed line in Figure 12 is the 500 Hz boundary), the equivalent diameter a of the first plate body 811 is greater than or equal to 30 mm and less than or equal to 40 mm, and the sound insulation amount STL can be greater than 40 dB.

[0176] In this way, after simulating a plurality of different values of the equivalent diameter a of the first plate body 811, it is found that when the equivalent diameter a of the first plate body 811 is in the range of 30 mm to 40 mm, the greater the equivalent diameter a of the first plate body 811, the smaller the sound transmission coefficient T, and the greater the sound insulation amount STL. The equivalent diameter a of the first plate body 811 in this range is beneficial to the low-frequency sound insulation and vibration reduction function of the sound insulation unit 81.

[0177] For example, the value of the equivalent diameter a of the first plate body 811 can be 30 mm, 31 mm, 32 mm, 33 mm, 34 mm, 35 mm, 36 mm, 37 mm, 38 mm, 39 mm, or 40 mm, etc.

[0178] Please refer to Figure 12 , Figure 12 is a sound insulation curve diagram simulating the relationship between the sound insulation amount STL and the frequency of the sound insulation unit 81 with different values of the thickness hp of the first plate body 811 in the Z-axis direction of the sound insulation plate 8. From Figure 12It can be seen from the figure that when the resonance frequency f of the sound insulation unit 81 is less than or equal to 500 Hz ( Figure 13 The double-dotted line in the middle is the 500 Hz boundary), the thickness hp of the first plate 811 in the Z-axis direction of the sound insulation board 8 is less than or equal to 0.15 mm and greater than or equal to 0.08 mm, which can achieve a sound insulation level STL greater than 40 dB.

[0179] Thus, through simulations of multiple different thickness hp values ​​of the first plate 811 in the Z-axis direction of the sound insulation panel 8, it was found that when the thickness hp of the first plate 811 in the Z-axis direction of the sound insulation panel 8 ranges from 0.08 mm to 0.15 mm, the greater the thickness hp of the first plate 811 in the Z-axis direction of the sound insulation panel 8, the greater the sound insulation level STL, and the smaller the sound transmission coefficient T, which is conducive to the low-frequency sound insulation and vibration reduction function of the sound insulation unit 81.

[0180] For example, the thickness hp of the first plate body 811 in the Z-axis direction of the sound insulation board 8 may be 0.08 mm, 0.09 mm, 0.1 mm, 0.02 mm, 0.03 mm, 0.04 mm, 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, 0.1 mm, or 0.15 mm.

[0181] See also Figure 13 , Figure 13 The following is a sound insulation curve diagram showing the relationship between the sound insulation STL and the frequency of the sound insulation unit 81 with the equivalent diameter d0 of the cross section of the balancing weight 812. Figure 13 It can be seen from the above that when f is less than or equal to 500Hz ( Figure 14 The double-dotted line in the middle is the 500 Hz boundary), the equivalent diameter d0 of the cross section of the counterweight block 812 is less than or equal to 40 mm and greater than or equal to 11 mm, and the sound insulation value STL can be greater than 40 dB.

[0182] In this way, by simulating the equivalent diameters d0 of the cross sections of multiple different sets of counterweight blocks 812, it is found that when the equivalent diameter d0 of the cross section of the counterweight block 812 takes a value within the range of 11 mm to 40 mm, the larger the equivalent diameter d0 of the cross section of the counterweight block 812, the larger the sound insulation value STL, and the smaller the sound transmission coefficient T, which is conducive to exerting the low-frequency sound insulation and vibration reduction function of the sound insulation unit 81.

[0183] For example, the equivalent diameter d0 of the cross section of the counterweight 812 may be 11 mm, 15 mm, 20 mm, 25 mm, 30 mm, 35 mm, 38 mm, 38.5 mm, 39 mm, or 40 mm.

[0184] See also Figure 14 , Figure 14To simulate the sound insulation amount STL of the sound insulation unit 81 with different thickness h0 of the weight block 812 in the Z-axis direction of the sound insulation plate 8 and the frequency relationship of the sound insulation curve. From Figure 14 It can be known that when the resonance frequency f of the sound insulation unit 81 is less than or equal to 500Hz (the double-dot line at 500Hz in Figure 11 ), the thickness h0 of the weight block 812 in the Z-axis direction of the sound insulation plate 8 is less than or equal to 5mm and greater than or equal to 1mm, the sound insulation amount STL can be greater than 40dB.

[0185] In this way, after simulating a plurality of different thickness h0 of the weight block 812 in the Z-axis direction of the sound insulation plate 8, it is found that when the thickness h0 of the weight block 812 in the Z-axis direction of the sound insulation plate 8 is in the range of 1mm to 5mm, the greater the thickness h0 of the weight block 812 in the Z-axis direction of the sound insulation plate 8, the greater the sound insulation amount STL, and the smaller the sound transmission coefficient T, which is beneficial to the low-frequency sound insulation and damping function of the sound insulation unit 81.

[0186] For example, the thickness h0 of the weight block 812 in the Z-axis direction of the sound insulation plate 8 can be 1mm, 1.5mm, 2.0mm, 2.5mm, 3.0mm, 3.5mm, 4.0mm, 4.5mm or 5.0mm, etc.

[0187] When the equivalent diameter a of the first plate body 811, the equivalent diameter d0 of the cross section of the weight block 812, the thickness h0 of the weight block 812 in the Z-axis direction of the sound insulation plate 8 and the thickness hp of the first plate body 811 in the Z-axis direction of the sound insulation plate 8 are simulated and determined, the experimental reference value of the equivalent diameter a of the first plate body 811 needs to be selected in the Figure 12 value area where the resonance frequency f of the sound insulation unit 81 is less than or equal to 500Hz and the sound insulation amount STL is greater than 40dB, the experimental reference value of the thickness hp of the first plate body 811 in the Z-axis direction of the sound insulation plate 8 needs to be selected in the Figure 13 value area where the resonance frequency f of the sound insulation unit 81 is less than or equal to 500Hz and the sound insulation amount STL is greater than 40dB, and the experimental reference value of the equivalent diameter d0 of the cross section of the weight block 812 needs to be selected in the Figure 14 value area where the resonance frequency f of the sound insulation unit 81 is less than or equal to 500Hz and the sound insulation amount STL is greater than 40dB. Figure 15For the range where the resonant frequency f of the sound insulation unit 81 is less than or equal to 500 Hz and the sound insulation level STL is greater than 40 dB, an experimental reference value for the equivalent cross-sectional diameter h0 of the counterweight 812 is selected. Specifically, the equivalent diameter a of the first plate 811 can be 35 mm, the thickness hp of the first plate 811 in the Z-axis direction of the sound insulation board 8 can be 0.1 mm, the equivalent cross-sectional diameter d0 of the counterweight 812 can be 14.6 mm, and the thickness h0 of the counterweight 812 in the Z-axis direction of the sound insulation board 8 can be 4.2 mm.

[0188] The simulation experimental reference values ​​for the equivalent diameter a of the first plate 811, the equivalent diameter d0 of the cross section of the counterweight 812, the thickness h0 of the counterweight 812 in the Z-axis direction of the sound insulation panel 8, and the thickness hp of the first plate 811 in the Z-axis direction of the sound insulation panel 8 are not fixed. Any value can be selected within the range where the resonant frequency f of the sound insulation unit 81 is less than or equal to 500 Hz and the sound insulation level STL is greater than 40 dB. The parameters used in the above simulation are: the equivalent diameter a of the first plate 811 is 35 mm, the thickness hp of the first plate 811 in the Z-axis direction of the sound insulation panel 8 is 0.1 mm, the equivalent diameter d0 of the cross section of the counterweight 812 is 14.6 mm, and the thickness h0 of the counterweight 812 in the Z-axis direction of the sound insulation panel 8 is 4.2 mm. The above experimental parameters are for illustration only and do not constitute any special limitation on the simulation parameters of this application.

[0189] For example, when conducting simulation experiments on the range of values ​​of the equivalent diameter a of the first plate 811, the values ​​of the thickness hp of the first plate 811 in the Z-axis direction of the sound insulation board 8, the equivalent diameter d0 of the cross section of the counterweight 812, and the thickness h0 of the counterweight 812 in the Z-axis direction of the sound insulation board 8 can be 0.1 mm, 14.6 mm, and 4.2 mm, respectively. This set of experimental parameters is for illustrative purposes only and does not constitute a special limitation on the simulation parameters of this application.

[0190] For example, when conducting a simulation experiment on the range of values ​​of the thickness hp of the first plate 811 in the Z-axis direction of the sound insulation board 8, the equivalent diameter a of the first plate 811, the equivalent diameter d0 of the cross section of the counterweight 812, and the thickness h0 of the counterweight 812 in the Z-axis direction of the sound insulation board 8 can be 35 mm, 14.6 mm, and 4.2 mm, respectively. This set of experimental parameters is for illustrative purposes only and does not constitute a special limitation on the simulation parameters of this application.

[0191] Exemplarily, when the simulation experiment is performed on the value range of the equivalent diameter d0 of the cross section of the counterweight 812, the values of the equivalent diameter a of the first plate body 811, the thickness hp of the first plate body 811 in the Z-axis direction of the sound insulation plate 8, and the thickness h0 of the counterweight 812 in the Z-axis direction of the sound insulation plate 8 can be 35 mm, 0.1 mm, and 4.2 mm respectively. The experimental parameters in this group are only used for example illustration, and do not constitute a special limitation on the simulation parameters of the present application.

[0192] Exemplarily, when the simulation experiment is performed on the value range of the thickness h0 of the counterweight 812 in the Z-axis direction of the sound insulation plate 8, the values of the equivalent diameter a of the first plate body 811, the thickness hp of the first plate body 811 in the Z-axis direction of the sound insulation plate 8, and the equivalent diameter d0 of the cross section of the counterweight 812 can be 35 mm, 0.1 mm, and 14.6 mm respectively. The experimental parameters in this group are only used for example illustration, and do not constitute a special limitation on the simulation parameters of the present application.

[0193] In some other embodiments of the present application, the side of the sound insulation plate 8 opposite to the first surface 8111 can also face the sound source of the sound generating device 7. Please refer to Figure 15 , Figure 5 In order to make the sound insulation plate 8 face the sound source of the sound generating device 7, the first plate body 811 can be fixedly connected with the back cover 3 through the fixing member 9, and the thickness of the fixing member 9 in the Z-axis direction is greater than the thickness of the counterweight 812. Figure 15

[0194] Exemplarily, when the side of the sound insulation plate 8 opposite to the first surface 8111 faces the sound source of the sound generating device 7, the back cover 3 is fixedly connected with the first surface 8111 through the fixing member 9, and in order to separate the back cover 3 from the sound insulation plate 8, the thickness of the fixing member 9 in the Z-axis direction is greater than the thickness of the counterweight 812.

[0195] The value of the equivalent surface mass density m eff is determined according to the surface of the side of the sound insulation unit 81 facing the sound source. In the structure shown in ​ , the side of the first plate body 811 with the counterweight 812 faces away from the sound source, and the formula of the equivalent surface mass density m eff is:

[0196] m eff = m / a·a+4a·hp (Formula Four)

[0197] ​On the side of the sound insulation board 8 opposite to the first surface 8111, facing the sound source of the sound emitting device 7, compared with the side of the sound insulation board 8 with the counterweight 812, facing the sound source of the sound emitting device 7, the sound insulation amount STL, the density p0 of the sound insulation unit 81 are consistent in the range of values, the simulation mode and the parameter range and the structural effect of the equivalent diameter a of the first plate body 811, the equivalent diameter d0 of the cross section of the counterweight 812, the thickness h0 of the counterweight 812 in the Z-axis direction of the sound insulation board 8, and the thickness hp of the first plate body 811 in the Z-axis direction of the sound insulation board 8 are consistent, and here, the description is not repeated.

[0198] In the description of the present specification, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0199] Finally, it should be pointed out that: the above examples are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A soundproofing panel, characterised in that, The soundproofing panel comprises: at least one soundproofing unit; the soundproofing unit comprises a first plate body and a counterweight, one side surface of the first plate body in the thickness direction is a first surface, the counterweight is located at the center of the first surface and is fixed to the first plate body; the soundproofing amount of the soundproofing unit is greater than or equal to 40 dB.

2. The soundproofing panel of claim 1, wherein, The soundproofing panel comprises a plurality of soundproofing units arranged in the direction of the first surface, and the first plate bodies of any two adjacent soundproofing units are connected together.

3. The soundproofing panel of claim 2, wherein, The plurality of soundproofing units are distributed in a rectangular array.

4. Panel according to claim 2 or 3, characterized in that The first plate bodies of the plurality of soundproofing units are connected as an integral molded part; and / or, the first plate body and the counterweight are an integral molded part.

5. Panel according to any of claims 1-4, characterized in that The sound transmission coefficient of the soundproofing unit is T, and the T satisfies: where ω = 2πf, f is the resonance frequency of the soundproof unit, m eff is the quotient of the mass of the soundproof unit and the area of the side surface of the soundproof unit facing the sound source, θ is the included angle between the line connecting the sound source to the center of the first plate body and the direction perpendicular to the first plate body, ρ0 is the density of the soundproof unit, and c is the propagation speed of sound in the soundproof unit.

6. Panel according to any of claims 1-5, characterized in that The resonance frequency of the soundproofing unit is f, and the f is less than or equal to 500 Hz.

7. The soundproofing panel of claim 5, wherein, The included angle θ between the line connecting the sound source to the center of the first plate body and the direction perpendicular to the first plate body is greater than 0° and less than or equal to 60°.

8. Panel according to any of claims 1-7, characterized in that The thickness of the first plate body is hp, and the hp is less than or equal to 0.15 mm and greater than or equal to 0.08 mm.

9. Panel according to any of claims 1-8, characterized in that The equivalent diameter of the first plate body is a, and the a is less than or equal to 40 mm and greater than or equal to 30 mm.

10. Panel according to any of claims 1-9, characterized in that The equivalent diameter of the cross section of the counterweight is d0, and d0 is less than or equal to 40 mm and greater than or equal to 11 mm.

11. Panel according to any of claims 1-10, characterized in that The height of the counterweight is h0, and h0 is less than or equal to 5 mm and greater than or equal to 1 mm.

12. Panel according to any of claims 1-11, characterized in that The density of the soundproofing unit is p0, the p0 is greater than or equal to 1x10 3 kg / m 3 , and less than or equal to 1x10 4 kg / m 3 .

13. Panel according to any of claims 1-12, characterized in that The material of the counterweight and the first plate body is the same; and / or, the material of the counterweight and the first plate body is metal.

14. An electronic device, comprising: The electronic device comprises a screen; The shell comprises a back cover and a frame; the back cover and the screen are stacked, the frame surrounds the periphery of the back cover and the screen, a middle plate is arranged in the frame, the middle plate is stacked between the screen and the back cover, the sound generating device is fixed to the middle plate, the middle plate, the frame and the back cover enclose the first cavity, and the soundproofing panel is fixed to the surface of the back cover facing the middle plate through the fixing member. The vertical projection of the sound generating device on the back cover overlaps the vertical projection of the soundproofing panel on the back cover. ​ 15. The electronic device of claim 14, wherein, ​ ​ 16. The electronic device of claim 15, wherein, ​

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