Anti-bubble PIN structure
By adjusting the width and spacing of the PIN structure and combining it with an inverted bucket design, the problem of bubble generation during the OCA bonding process was solved, achieving high-yield and low-cost touch screen production with electrostatic protection function.
Patent Information
- Application Number
- CN202422588362.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-25
- Publication Date
- 2025-10-28
- Estimated Expiration
- 2034-10-25
AI Technical Summary
During the OCA lamination process of GFF capacitive touch screens, bubbles that are difficult to remove are easily generated in the gaps in the PIN area, resulting in a high product defect rate and failure to meet production needs.
An anti-bubble PIN structure is designed, in which the width and spacing of the upper and lower PIN areas are quite different. The width of the lower PIN area is smaller than that of the upper PIN area, and the lower PIN spacing is larger than the upper PIN spacing. In addition, the PIN structure is in an inverted funnel shape to ensure that the OCA is fully filled and avoid the formation of vacuum space.
It effectively prevents the generation of bubbles, increases product yield to 99%, reduces production costs, meets the needs of batch processing, and has static dissipation function to improve product safety.
Smart Images
Figure CN223486490U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a PIN structure, and more particularly to a bubble-proof PIN structure. Background Technology
[0002] A conventional GFF capacitive touchscreen's touch sensor consists of an upper thin-film sensor and a lower thin-film sensor. The two thin-film sensors need to be integrated together through upper and lower OCAs. Then, pressure degassing is applied to remove the air bubbles generated during bonding, resulting in a touchscreen sensor with a bubble-free appearance.
[0003] However, the overlapping area between the upper and lower OCA and the sensor's PIN area is prone to producing air bubbles that are difficult to remove under pressure. This is mainly because there is a certain gap between the PINs in the PIN area. The width of the gap is called the PIN pitch. The width of a typical PIN is between 0.15mm and 0.35mm, with a common PIN width of 0.3mm. The PIN pitch is generally consistent with the PIN width, also between 0.15mm and 0.35mm, with a common PIN pitch of 0.3mm.
[0004] like Figure 1 As shown, during the OCA3 bonding process, the OCA3 is subjected to bonding pressure and gradually fills the gap between the pins. Because the gap between the first pin 1 and the second pin 2 is too small, the deformation generated by the OCA during the filling process is insufficient to fill the gap and step difference. Especially at the edge of the gap between the first pin and the second pin, it is easy to generate an unfillable vacuum space 4. The unfillable space will generate large OCA bubbles. Even through the pressure degassing process, the large OCA bubbles here cannot be completely removed, resulting in a high product defect rate and failing to meet the production and processing needs of enterprises. Utility Model Content
[0005] The purpose of this invention is to overcome the shortcomings of the prior art by providing a bubble-proof PIN structure, which results in no bubbles being generated in the bonded product, high product yield, and low cost.
[0006] To achieve the above objectives, the technical solution adopted by this utility model is: an anti-bubble PIN structure, comprising: an upper PIN area and a lower PIN area that are connected and overlapped.
[0007] The upper PIN region includes multiple arrayed upper PINs, and the multiple upper PINs have equidistant upper PIN widths and equidistant upper PIN spacings, wherein the upper PIN width is 0.15mm to 0.35mm and the upper PIN spacing is 0.15mm to 0.35mm.
[0008] The lower PIN region includes multiple arrayed lower PINs, and the multiple lower PINs have equidistant lower PIN widths and equidistant lower PIN spacings, wherein the lower PIN width is smaller than the upper PIN width, and the lower PIN spacing is larger than the upper PIN spacing.
[0009] OCA is applied from the overlap of the upper PIN area and the lower PIN area into the lower PIN area, so that the entire surface of the lower PIN in the lower PIN area is covered with OCA.
[0010] Furthermore, the PIN structure formed by the upper PIN region and the lower PIN region has an inverted bucket shape.
[0011] Furthermore, the width of the upper PIN is 0.3mm.
[0012] Furthermore, the spacing between the upper pins is 0.3mm.
[0013] Furthermore, the width of the lower PIN is 0.05mm to 0.15mm, and the spacing between the lower PINs is 0.25mm to 0.55mm.
[0014] Furthermore, the width of the lower PIN is 0.1 mm.
[0015] Furthermore, the spacing between the lower PINs is 0.5mm.
[0016] Due to the application of the above technical solution, this utility model has the following advantages compared with the prior art:
[0017] This invention features an anti-bubble PIN structure that shortens the width of the lower PIN in the overlapping OCA area while increasing the spacing between the lower PINs. This larger spacing allows the OCA to deform sufficiently during filling to fill the gaps and steps, effectively ensuring full contact and adhesion with the interface edges. It prevents the formation of vacuum spaces and thus avoids the generation of large bubbles. Small bubbles invisible to the naked eye can also be eliminated through pressure degassing, improving product yield, reducing processing costs, and meeting the needs of enterprises for mass production.
[0018] Secondly, the overall PIN structure is shaped like an inverted bucket, and the pointed structure is conducive to the dissipation of static electricity during the manufacturing process, preventing the PIN from being damaged by static electricity and causing wire breakage, making it safe and reliable. Attached Figure Description
[0019] The technical solution of this utility model will be further described below with reference to the accompanying drawings:
[0020] Figure 1 This is a partial schematic diagram of an OCA attached to a PIN in the prior art.
[0021] Figure 2 This is a schematic structural diagram of an embodiment of the present utility model;
[0022] Figure 3 This is a partial schematic diagram of the lower region PIN and OCA being attached in one embodiment of the present invention;
[0023] Wherein: 1, First PIN; 2, Second PIN; 3, OCA; 4, Vacuum space; 5, Upper PIN area; 6, Lower PIN area; 50, Upper PIN; 60, Lower PIN; S1, Upper PIN pitch; S2, Lower PIN pitch. Detailed Implementation
[0024] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.
[0025] This invention provides a bubble-proof PIN structure to solve the problem in the prior art where bubbles are generated during the OCA bonding process of touch sensors, resulting in low product yield.
[0026] For ease of understanding, the specific processes in the embodiments of this application are described below. Please refer to [link / reference]. Figures 2 to 3 An anti-bubble PIN structure in this embodiment includes an upper PIN region 5 and a lower PIN region 6 that are connected and overlapped. The upper PIN region 5 includes a plurality of arrayed upper PINs 50, and the plurality of upper PINs 50 have an upper PIN width and an upper PIN pitch S1 with the same distance between them. The upper PIN width ranges from 0.15mm to 0.35mm, and the upper PIN pitch S1 ranges from 0.15mm to 0.35mm. The lower PIN region 6 includes a plurality of arrayed lower PINs 60, and the plurality of lower PINs 60 have a lower PIN width and a lower PIN pitch S2 with the same distance between them. The lower PIN 60 width is smaller than the upper PIN 50 width, and the lower PIN pitch S2 is larger than the upper PIN pitch S1. At the same time, an OCA3 is attached from the overlap of the upper PIN region 5 and the lower PIN region 6 into the lower PIN region 6, so that the entire surface of the lower PIN 60 in the lower PIN region 6 is covered with OCA3.
[0027] Specifically, in this embodiment, the junction of the upper PIN region 5 and the lower PIN region 6 is the starting area of the OCA3 attachment area, and after attachment, OCA3 is attached to the entire surface of the lower PIN 60 of the lower PIN region 6.
[0028] Furthermore, in this embodiment, the width W1 of the upper PIN50 is 0.3mm, and the upper PIN spacing S1 is 0.3mm, which is a better choice. The number of lower PIN50 arrays is determined by the number of TX channels and RX channels of the touch screen.
[0029] Furthermore, in this embodiment, the width W2 of the lower PIN 60 is 0.05mm to 0.15mm, and the lower PIN spacing S2 is 0.25mm to 0.55mm. However, it must be ensured that the width W2 of the lower PIN is smaller than the width W1 of the upper PIN, and the lower PIN spacing S2 is larger than the upper PIN spacing S1. In this embodiment, the preferred method is that the width W2 of the lower PIN is 0.1mm, and the lower PIN spacing S2 is 0.5mm. Similarly, the number of lower PIN 60 arrays is determined by the number of TX channels and RX channels of the touch screen.
[0030] Furthermore, in this embodiment, the overall shape of the PIN structure formed by the upper PIN region 5 and the lower PIN region 6 forms an inverted bucket shape, which facilitates the connection between the upper PIN region 5 and the lower PIN region 6. At the same time, the pointed structure is conducive to the dissipation of static electricity during the manufacturing process, preventing the PIN from being damaged by static electricity and causing wire breakage.
[0031] In this embodiment, the main function of the upper PIN region 5 is to ensure full contact with the ACF, enabling electrical conduction of the TX and RX traces in the vertical direction. Therefore, the required PIN width is as large as possible to increase the overlap area of the ACF. The main function of the lower PIN region 6 is to connect all channels of the upper and lower thin-film sensors, i.e., to connect the TX and RX channels of the touchscreen.
[0032] based on Figure 3 As shown, since the entire surface of the lower PIN area 6 is covered with OCA3, the lower pin spacing S2 between the lower PINs 60 is relatively large, which is 1.67 times larger than the conventional PIN spacing. During the OCA attachment process, the deformation generated by the force on the OCA is sufficient to fill the gap at the edge of the lower pin spacing S2 between the lower pins, so there will be no residual vacuum space and no large vacuum bubbles will be generated. When the touch screen sensor is pressurized to degas, the smaller bubbles can be easily dissipated, thus preventing the generation of bubbles in the PIN area.
[0033] The bubble-proof PIN structure of this invention increases the width of the lower PIN and the gap between the lower PINs, so that there is no vacuum gap after OCA filling, thereby reducing the risk of bubble formation in the PIN area. This improves the appearance yield of the touch screen sensor from 95% to 99%, greatly improving the process yield, reducing production costs, and meeting the needs of enterprises for mass production.
[0034] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.
Claims
1. A bubble-proof PIN structure, characterized in that, include: The upper PIN area (5) and the lower PIN area (6) are connected vertically. The upper PIN region (5) includes multiple arrayed upper PINs (50), and the multiple upper PINs (50) have equidistant upper PIN widths and equidistant upper PIN spacings (S1), wherein the upper PIN width is 0.15mm~0.35mm and the upper PIN spacing (S1) is 0.15mm~0.35mm. The lower PIN region (6) includes a plurality of arrayed lower PINs (60), and the plurality of lower PINs (60) have equidistant lower PIN widths and equidistant lower PIN spacings (S2), wherein the lower PIN width is smaller than the upper PIN width, and the lower PIN spacing (S2) is larger than the upper PIN spacing (S1). OCA (3) is attached from the overlap of the upper PIN region (5) and the lower PIN region (6) into the lower PIN region (6), so that the entire surface of the lower PIN (60) in the lower PIN region (6) is covered with OCA (3).
2. The anti-bubble PIN structure as described in claim 1, characterized in that: The PIN structure formed by the upper PIN region (5) and the lower PIN region (6) has an inverted bucket shape.
3. The anti-bubble PIN structure as described in claim 1, characterized in that: The width of the upper PIN is 0.3mm.
4. The anti-bubble PIN structure as described in claim 1, characterized in that: The upper PIN spacing (S1) is 0.3 mm.
5. The anti-bubble PIN structure as described in claim 1, characterized in that: The width of the lower PIN (60) is 0.05mm to 0.15mm, and the spacing between the lower PINs (S2) is 0.25mm to 0.55mm.
6. The anti-bubble PIN structure as described in claim 5, characterized in that: The width of the lower PIN (60) is 0.1 mm.
7. The anti-bubble PIN structure as described in claim 5, characterized in that: The lower PIN pitch (S2) is 0.5 mm.