Display screen and mobile terminal

Abstract

The utility model relates to a display screen and a mobile terminal, and the display screen comprises a display substrate which is provided with a first direction and a second direction, and the straight line where the first direction is located is perpendicular to the straight line where the second direction is located; the circuit boards and the display substrate are arranged at intervals in the first direction, and the circuit boards are distributed at intervals in the second direction; and the at least one first chip-on-film chip is electrically connected between two adjacent circuit boards and is used for conducting the corresponding display substrate and the circuit board. According to the technical scheme, the technical problems that a traditional display screen is serious in signal attenuation, poor in transmission signal quality and poor in display effect are effectively solved.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a display screen and a mobile terminal. Background Technology

[0002] Traditional displays typically connect the TCON board (timing control board) and the display panel via XB (X-board) / S-PCB (source driver board) and COF (chip flip-flop). In a 4K / 2K 60Hz open cell (LCD panel), four XB segments are usually designed: XLL, XLR, XRL, and XRR. To ensure proper signal transmission, these four XB segments must be connected in a specific way. Specifically, XLR and XRL are generally connected via the TCON board, FFC (flexible cable), and connectors thereon. XLL and XLR, and XRL and XRR are connected via FCP (flexible circuit board) and connectors. While this signal connection method is flexible and applicable to various architectures, each FPC involves at least two connectors, and the signal attenuates significantly as it passes through these connectors. This results in a weak signal, poor eye diagram, and low resolution and refresh rate when the signal finally passes through the TCON board. Therefore, there is an urgent need to find a new connection method that can improve signal quality and display effect while realizing the signal connection between the TCON board and the display panel. Utility Model Content

[0003] This application provides a display screen and a mobile terminal to solve the technical problems of severe signal attenuation, poor signal transmission quality, and poor display effect of traditional display screens.

[0004] Therefore, in a first aspect, embodiments of this application provide a display screen, comprising: a display substrate having a first direction and a second direction, wherein the line containing the first direction is perpendicular to the line containing the second direction; a plurality of circuit boards, wherein the circuit boards are spaced apart from the display substrate along the first direction and the plurality of circuit boards are spaced apart along the second direction; and at least one first flip-chip, electrically connected between two adjacent circuit boards and conducting the corresponding display substrate and circuit boards.

[0005] In one possible implementation, the first flip-chip includes a first trace portion, a bridging portion, and a second trace portion. The first trace portion is electrically connected between a circuit board and a corresponding display substrate, the second trace portion is electrically connected between an adjacent circuit board and a corresponding display substrate, and the bridging portion is electrically connected between the first trace portion and the second trace portion.

[0006] In one possible implementation, the two ends of the bridging portion in the first direction are housed between the first and second trace portions and are located on the side of the two adjacent circuit boards facing the display substrate.

[0007] Alternatively, the two ends of the bridging portion are housed between the first and second trace portions in the first direction and are located on the side of the display substrate facing the circuit board.

[0008] In one possible implementation, the two ends of the bridging portion in the first direction are flush with the two ends of the first and second trace portions, respectively, and are electrically connected between the corresponding display substrate and two adjacent circuit boards.

[0009] In one possible implementation, the bridging portion protrudes from the side of the first and second trace portions facing the circuit board and is housed in the circuit board in a first direction.

[0010] In one possible implementation, the first flip-chip chip further includes a first driver and a second driver, the first driver being disposed in the first wiring section and the second driver being disposed in the second wiring section.

[0011] In one possible implementation, a plurality of second flip-chip chips are also included. The second flip-chip chips are electrically connected between the display substrate and the circuit board. The plurality of second flip-chip chips are spaced apart along a second direction, and at least one second flip-chip chip is provided on a circuit board.

[0012] In one possible implementation, a timing control board and a plurality of flexible cables are also included, the timing control board being electrically connected between two adjacent circuit boards via at least two flexible cables.

[0013] In one possible implementation, the display substrate includes a display area and a non-display area, the non-display area is disposed around the outer periphery of the display area, and a fan-out area is provided on the non-display area, and a first flip-chip is electrically connected to the fan-out area.

[0014] Secondly, embodiments of this application also provide a mobile terminal, including the display screen described above.

[0015] According to the embodiments of this application, the display screen and mobile terminal include: a display substrate having a first direction and a second direction, wherein the line of the first direction is perpendicular to the line of the second direction; a plurality of circuit boards, which are spaced apart from the display substrate along the first direction and distributed spaced apart along the second direction; and at least one first flip-chip, electrically connected between two adjacent circuit boards and conducting electricity between the corresponding display substrate and circuit boards. The technical solution of this application provides at least one first flip-chip between the display substrate and the plurality of circuit boards to achieve electrical connection between the display substrate and the circuit boards, thereby enabling the transmission of signals such as GOA between them; simultaneously, the first flip-chip also enables electrical connection between two adjacent circuit boards, thereby enabling the transmission of signals such as low-speed signals, increasing the signal transmission path, and reducing signal attenuation. Compared to traditional display panels that require FCP and connectors for signal connection, but connectors accelerate signal attenuation, resulting in weak signal transmission, poor eye diagram, and poor display effect, the display screen provided in this embodiment can achieve electrical connection and signal transmission between the circuit board and the display substrate, and between adjacent circuit boards, simply by designing the structure of the first flip-chip thin film. This results in less signal attenuation, high transmission quality, and excellent display effect. Attached Figure Description

[0016] The accompanying drawings, incorporated in and forming part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, those skilled in the art can obtain other drawings based on these drawings without creative effort. One or more embodiments are illustrated by way of example through the corresponding images in the accompanying drawings. These exemplary descriptions do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings represent similar elements. Unless otherwise stated, the figures in the drawings do not constitute a limitation on scale.

[0017] Figure 1 A schematic diagram of a four-segment connection structure of a display screen provided in the first embodiment of this application;

[0018] Figure 2 A schematic diagram of a four-segment connection structure of a display screen provided in the second embodiment of this application;

[0019] Figure 3 A schematic diagram of a four-segment connection structure of a display screen provided in the third embodiment of this application;

[0020] Figure 4A schematic diagram of a four-segment connection structure of a display screen provided in the fourth embodiment of this application;

[0021] Figure 5 A schematic diagram of the 8-segment connection structure of the display screen provided in the first embodiment of this application;

[0022] Figure 6 A schematic diagram of an 8-segment connection structure of a display screen provided in the second embodiment of this application;

[0023] Figure 7 A schematic diagram of an 8-segment connection structure of a display screen provided in the third embodiment of this application;

[0024] Figure 8 A schematic diagram of an 8-segment connection structure of a display screen provided in the fourth embodiment of this application;

[0025] Figure 9 and Figure 10 This is a schematic diagram of signal attenuation of the display screen provided in an embodiment of this application.

[0026] Explanation of reference numerals in the attached figures:

[0027] 100. Display substrate; 110. Display area; 120. Non-display area;

[0028] 200. Circuit board;

[0029] 300, First flip-chip thin-film chip; 310, First wiring section; 320, Bridging section; 330, Second wiring section; 340, First driver; 350, Second driver;

[0030] 400. Second flip-chip thin-film chip;

[0031] 500. Timing control board; 600. Flexible cable;

[0032] Y, the first direction; X, the second direction. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0034] The following disclosure provides numerous different embodiments or examples for implementing various structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, various specific examples of processes and materials are provided in this application; however, those skilled in the art will recognize the applicability of other processes and / or the use of other materials.

[0035] For ease of description, spatial relative terms may be used in the text to describe the relative position or movement of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "front," "back," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure undergoes a positional flip, orientation change, or change of motion, these directional indications will change accordingly. For instance, an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0036] See Figures 1 to 8 This application provides a display screen, which includes: a display substrate 100 having a first direction Y and a second direction X, wherein the line containing the first direction Y is perpendicular to the line containing the second direction X; a plurality of circuit boards 200, wherein the circuit boards 200 are spaced apart from the display substrate 100 along the first direction Y and the plurality of circuit boards 200 are spaced apart along the second direction X; and at least one first flip-chip 300, which is electrically connected between two adjacent circuit boards 200 and conducts power between the corresponding display substrate 100 and circuit boards 200.

[0037] In this embodiment, at least one first flip-chip thin-film chip 300 is disposed between the display substrate 100 and multiple circuit boards 200 to achieve electrical connection between the display substrate 100 and the circuit boards 200, thereby enabling the transmission of signals such as GOA between them. Simultaneously, the first flip-chip thin-film chip 300 also enables electrical connection between two adjacent circuit boards 200, thereby enabling the transmission of signals such as low-speed signals, increasing the signal transmission path, and reducing signal attenuation. Compared to traditional display panels that require FCP and connectors for signal connection, but where connectors accelerate signal attenuation, resulting in weak signal transmission, poor eye diagram, and poor display effect, the display provided in this embodiment can achieve electrical connection and signal transmission between the circuit boards 200 and the display substrate 100, and between two adjacent circuit boards 200, simply by designing the structure of the first flip-chip thin-film chip 300. This results in reduced signal attenuation, high transmission quality, and excellent display effect.

[0038] Specifically, the display screen is configured as a combination of at least a display substrate 100, multiple circuit boards 200, and at least one first flip-chip 300. The display substrate 100 consists of a series of small pixels, each capable of emitting light or changing color to form an image. The circuit board 200 can be an X-board (such as XLL, XLR, XRL, XRR) or an S-PCB (source driver board), serving as a signal transmission bridge between the TCON board and COF. The first flip-chip 300 can be a near-U-shaped structure or a large-volume square structure, used for electrically connecting the circuit boards 200 and the display substrate 100, as well as electrically connecting two adjacent circuit boards 200, to realize the transmission of GOA signals and low-speed signals within the display screen, reducing signal attenuation. For example, there can be N circuit boards 200, and in this case, there can be (N-2) first flip-chip 300s; one first flip-chip 300 is disposed between every two adjacent circuit boards 200 to achieve electrical connection and signal transmission between the two adjacent circuit boards 200.

[0039] Thus, taking a four-segment circuit board 200 as an example, the signal transmission between the various components of the display screen is illustrated: For example... Figures 1 to 4As shown, the four circuit boards 200 are XLL, XLR, XRL, and XRR, respectively. Two first flip-chip chips 300 are provided; one first flip-chip chip 300 is positioned between XLL and XLR, and the other is positioned between XRL and XRR. XLR and XRL can be electrically connected via the timing control board 500 mentioned later. Thus, signals from the timing control board 500 can enter XLR and XRL respectively. A portion of the signal entering XLR is transmitted to the display substrate 100 via the first flip-chip chip 300, and another portion is transmitted to XLL via the first flip-chip chip 300. Signals entering XLL can be transmitted to the display substrate 100 via the first flip-chip chip 300. The signal entering XRL follows the same propagation path, which will not be elaborated further here. In this way, the transmission signal is not attenuated as it is in traditional display panels because it has to pass through the connector between the circuit board 200 and the COF and the connector between the COF and the display substrate 100. This improves the strength and quality of the transmission signal and enhances the display effect.

[0040] In one example, the display panel can be any of the following: a TN panel (Twisted Nematic Panel), a VA panel (Vertical Alignment Panel), an IPS panel (In-Plane Conversion Panel), or an ADSDS panel (Advanced Hyper-Dimensional Field Conversion Panel). A TN panel is an entry-level LCD panel; a modified TN+film can achieve a 160° viewing angle. It can simulate over 16 million colors through dithering technology, has a short response time, and is suitable for fast-moving images. A VA panel is a high-end LCD panel, offering a wide viewing angle, typically up to 170°; it has high front-side contrast, reproduces true colors, and produces detailed images. IPS panels are manufactured by LG-Philips; the screen is relatively rigid and less prone to water ripple distortion; furthermore, IPS panels have high color fidelity and excellent viewing angles. ADSDS panels are a technological improvement on traditional IPS panels, using ITO transparent electrodes instead of traditional metal electrodes, increasing aperture ratio and transmittance, and improving the color performance of the LCD panel.

[0041] like Figures 1 to 4 As shown, in one possible implementation, the first flip-chip thin film chip 300 includes a first trace portion 310, a bridging portion 320, and a second trace portion 330. The first trace portion 310 is electrically connected between the circuit board 200 and the corresponding display substrate 100, the second trace portion 330 is electrically connected between adjacent circuit boards 200 and the corresponding display substrate 100, and the bridging portion 320 is electrically connected between the first trace portion 310 and the second trace portion 330.

[0042] In this embodiment, the specific configuration of the first flip-chip chip 300 is optimized. Specifically, the first flip-chip chip 300 is configured as a combination of at least a first trace portion 310, a bridging portion 320, and a second trace portion 330. The first trace portion 310 can be a polyimide film with dummy traces inside, connecting the display substrate 100 and the circuit board 200 respectively to realize GOA signal transmission between the circuit board 200 and the display substrate 100. The second trace portion 330 can be a polyimide film with dummy traces inside, connecting the display substrate 100 and adjacent circuit boards 200 respectively to realize GOA signal transmission between adjacent circuit boards 200 and the display substrate 100. The bridging portion 320 can be a polyimide film with traces inside to conduct the first trace portion 310 and the second trace portion 330, realizing PP signal transmission between two adjacent circuit boards 200. The first flip-chip thin-film chip 300 provided in this example has a simple structure, which can realize the signal transmission path between the circuit board 200 and the display substrate 100, as well as the signal transmission path between two adjacent circuit boards 200, thereby increasing the signal transmission path, reducing signal attenuation, and achieving high signal transmission quality.

[0043] like Figure 1 As shown, in one possible implementation, the two ends of the bridging portion 320 in the first direction Y are housed between the first trace portion 310 and the second trace portion 330, and are located on the side of the two adjacent circuit boards 200 facing the display substrate 100.

[0044] In this embodiment, a first flip-chip thin-film chip 300 with a U-shaped groove is provided. The first flip-chip thin-film chip 300 can be a single-piece structure, with its bridging portion 320 mounted on the side of the first wiring portion 310 and the second wiring portion 330 facing the circuit board 200, facilitating processing and reducing production costs. Alternatively, it can be a split structure, where the first wiring portion 310 and the second wiring portion 330 can be rectangular strips formed by the same mold, and the bridging portion 320 can be a relatively flat rectangular strip formed by another mold. The bridging portion 320 can be connected to the same side of the first wiring portion 310 and the second wiring portion 330 by pressing or welding, and is electrically connected to the circuit board 200. A gold finger is formed at the electrical connection between the circuit board 200 and the first flip-chip thin-film chip 300. The first flip-chip thin-film chip 300 provided in this example can realize signal transmission between two adjacent circuit boards 200 on the circuit board 200 side, with a short transmission path and reduced signal attenuation; furthermore, it can reduce material usage and lower costs.

[0045] like Figure 2As shown, in one possible implementation, the two ends of the bridging portion 320 in the first direction Y are housed between the first trace portion 310 and the second trace portion 330, and are located on the side of the display substrate 100 facing the circuit board 200.

[0046] In this embodiment, a first flip-chip thin-film chip 300 with a U-shaped groove is provided. The first flip-chip thin-film chip 300 can be a single-piece structure, with its bridging portion 320 mounted on the side of the first wiring portion 310 and the second wiring portion 330 facing the display substrate 100, facilitating processing and reducing production costs. Alternatively, it can be a separate structure, where the first wiring portion 310 and the second wiring portion 330 can be rectangular strips formed by the same mold, and the bridging portion 320 can be a relatively flat rectangular strip formed by another mold. The bridging portion 320 can be connected to the same side of the first wiring portion 310 and the second wiring portion 330 by pressing or welding, and is electrically connected to the display substrate 100. A gold finger is formed at the electrical connection between the display substrate 100 and the first flip-chip thin-film chip 300. The first flip-chip thin-film chip 300 provided in this example can realize signal transmission between two adjacent circuit boards 200 on the display substrate 100 side, requiring less material and resulting in low cost.

[0047] like Figure 4 As shown, in one possible implementation, the two ends of the bridging portion 320 in the first direction Y are flush with the two ends of the first trace portion 310 and the second trace portion 330, respectively, and are electrically connected between the corresponding display substrate 100 and the two adjacent circuit boards 200.

[0048] In this embodiment, a square-shaped first flip-chip thin-film chip 300 is provided. The first flip-chip thin-film chip 300 can be a single-piece structure. In this case, the first trace portion 310, the second trace portion 330, and the bridging portion 320 have the same length in the first direction Y and are enclosed to form a square. The process is simple, easy to process, and has low production cost. Furthermore, the bridging portion 320 has a large electrical contact area with the first trace portion 310 and the second trace portion 330, resulting in high signal transmission stability.

[0049] like Figure 3 As shown, in one possible implementation, the bridging portion 320 protrudes from the first trace portion 310 and the second trace portion 330 on the side facing the circuit board 200, and is housed in the circuit board 200 in the first direction Y.

[0050] In this embodiment, a first flip-chip thin-film chip 300 with a U-shaped concave arc groove is provided. The first flip-chip thin-film chip 300 can be a single-piece structure, with a bridging portion 320 mounted on the side of the first trace portion 310 and the second trace portion 330 facing the circuit board 200. The first trace portion 310 and the second trace portion 330 protrude from the side facing the circuit board 200, so that they are housed within two adjacent circuit boards 200, enhancing the protection of the bridging portion 320 and improving signal transmission strength. Alternatively, it can be a split structure, where the first trace portion 310 and the second trace portion 330 can be rectangular strips formed by the same mold, and the bridging portion 320 can be an arc-shaped strip formed by another mold. The bridging portion 320 can be connected to the same side of the first trace portion 310 and the second trace portion 330 by pressing or welding, and is electrically connected to the circuit board 200. A gold finger is formed at the electrical connection point between the circuit board 200 and the first flip-chip thin-film chip 300. The first flip-chip thin-film chip 300 provided in this example can realize signal transmission between two adjacent circuit boards 200 on the side of the circuit board 200. The transmission path is short, the signal attenuation is small, the transmission signal is strong, and the display effect is good.

[0051] like Figures 1 to 4 As shown, in one possible implementation, the first flip-chip thin film chip 300 further includes a first driver 340 and a second driver 350, the first driver 340 being disposed in the first wiring section 310 and the second driver 350 being disposed in the second wiring section 330.

[0052] In this embodiment, the specific configuration of the first flip-chip thin film chip 300 is further optimized. Specifically, the first flip-chip thin film chip 300 is configured as a combination of at least a first wiring portion 310, a bridging portion 320, a second wiring portion 330, a first driver 340, and a second driver 350. The first driver 340 and the second driver 350 can be source driver chips, which can be connected to the COF film by means of pressing or soldering. In this way, the voltage driving MOS (Metal-O-Metal Transistor) can be controlled by a current-type IC, thereby better controlling the display brightness of the display substrate 100 and improving the display effect.

[0053] like Figures 1 to 8 As shown, in one possible implementation, it also includes a plurality of second flip-chip thin film chips 400, which are electrically connected between the display substrate 100 and the circuit board 200. The plurality of second flip-chip thin film chips 400 are arranged at intervals along the second direction X, and at least one second flip-chip thin film chip 400 is correspondingly provided on a circuit board 200.

[0054] In this embodiment, the specific configuration of the display screen is further optimized. Specifically, the display screen is configured as a combination of at least a display substrate 100, multiple circuit boards 200, at least one first flip-chip 300, and multiple second flip-chip 400. The second flip-chip 400 can be a small-volume rectangular structure used to electrically connect the circuit boards 200 and the display substrate 100 to realize GOA signal transmission within the display screen and reduce signal attenuation.

[0055] Thus, taking a four-segment circuit board 200 as an example, the signal transmission between the various components of the display screen provided in this example is illustrated: the four circuit boards 200 are XLL, XLR, XRL, and XRR, respectively. In this case, two first flip-chip chips 300 are provided, and eight second flip-chip chips 400 can be provided, such as... Figures 1 to 4 As shown. One first flip-chip thin-film chip 300 is disposed between XLL and XLR, and another first flip-chip thin-film chip 300 is disposed between XRL and XRR. XLR and XRL can be electrically connected through the timing control board 500 mentioned later. At the same time, two second flip-chip thin-film chips 400 are also disposed at intervals in the second direction X between XXL and the corresponding display screen, two second flip-chip thin-film chips 400 are also disposed at intervals in the second direction X between XLR and the corresponding display screen, two second flip-chip thin-film chips 400 are also disposed at intervals in the second direction X between XRL and the corresponding display screen, and two second flip-chip thin-film chips 400 are also disposed at intervals in the second direction X between XRR and the corresponding display screen. Therefore, the signals transmitted from the timing control board 500 can enter the XLR and XRL respectively. A portion of the signal entering the XLR is transmitted to the display substrate 100 via the first flip-chip 300, and another portion is transmitted to the XLL via the same chip. The signal entering the XLL can be transmitted to the display substrate 100 via the first flip-chip 300, and the remaining portion is transmitted to the display substrate 100 via two second flip-chip chips 400. The signal entering the XRL follows the same propagation path, which will not be elaborated further here. This avoids the severe signal attenuation that occurs in traditional display panels where the transmitted signal must pass through the connectors between the circuit board 200 and the COF, and between the COF and the display substrate 100, thus improving signal strength, signal quality, and display effect.

[0056] like Figures 1 to 8 As shown, in one possible implementation, it also includes a timing control board 500 and a plurality of flexible cables 600, wherein the timing control board 500 is electrically connected between two adjacent circuit boards 200 via at least two flexible cables 600.

[0057] In this embodiment, the specific configuration of the display screen is further optimized. Specifically, the display screen is configured as a combination of at least a display substrate 100, multiple circuit boards 200, at least one first flip-chip 300, a timing control board 500, and multiple flexible cables 600. The timing control board 500 can be a TCON board or a TCON-less board, and can be electrically connected between two adjacent circuit boards 200 in the middle region of the circuit boards 200 for intelligent control of the operation of the circuit boards 200. The flexible cable 600 can be an FFC, and its two ends can be connected between the timing control board 500 and the corresponding circuit board 200 respectively by crimping, for signal transmission between the timing control board 500 and the circuit board 200. The display screen provided in this example can achieve automatic control without the need for operator supervision, resulting in low labor costs.

[0058] like Figure 9 and Figure 10 The diagram shows a signal attenuation profile of the display screen provided in this embodiment, featuring an 8-segment circuit board 200 in its bonding area. It can be understood that the 4K panel has 12 lane line data, from PTP0... + / PTP0 - →PTP11 + / PTP11 - The 8K panel has 24 lane line data points, from PTP0. + / PTP0 - →PTP23 + / PTP23 - As these signals extend along circuit board 200, each time they pass through a COF, one PTP signal is reduced. For example, when the data signal exits from connector CN-L on the left side of the TCON board / TCON-less board, it is PTP0. + / PTP0 - →PTP11 + / PTP11 - After the 12th COF (from left to right COF1→COF12), the data signal attenuates to PTP0. + / PTP0 - →PTP10 + / PTP10 - After the 10th COF, its data signal attenuates to PTP0. + / PTP0 - →PTP8 + / PTP8 - . refer to Figure 9 and Figure 10The diagram illustrates the changes in data signals as the traces pass through specific bonding areas. Some signals decrease with each COF (e.g., each COF consumes the PTP of one pair). DVDD1V8 and DVDD1V9 are used by the 12 COFs in the middle area, while the 12 COFs around the perimeter require power from DVDD1V9. Therefore, the connection method between the circuit boards 200 provided in this embodiment can enhance the signal transmission quality within the display screen, improve the display effect, and reduce the loss and cost of electronic components.

[0059] like Figures 1 to 8 As shown, in one possible implementation, the display substrate 100 includes a display area 110 and a non-display area 120. The non-display area 120 is disposed around the outer periphery of the display area 110, and a fan-out area is provided on the non-display area 120. The first flip-chip thin film chip 300 is electrically connected to the fan-out area.

[0060] In this embodiment, the specific configuration of the display substrate 100 is optimized. Specifically, the display substrate 100 is configured as a composite structure including at least a display area 110 and a non-display area 120. The display area 110 is provided with a series of small pixels that can emit light or change color to display images. The non-display area 120 can be made of glass and is arranged around the display area 110 to protect it. At the same time, a fan-out area is provided on the side of the non-display area 120 facing the circuit board 200 for electrical connection with the first flip-chip chip 300 and the second flip-chip chip 400. The first flip-chip chip 300 and the second flip-chip chip 400 can be pressed onto the non-display area 120 of the display substrate 100 using a pressing machine, resulting in a stable connection and enhanced reliability.

[0061] Furthermore, this application also provides a mobile terminal, including a display screen as described in any of the preceding embodiments. The specific structure of the display screen is the same as described in the above embodiments. Since this mobile terminal adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, and will not be described in detail here.

[0062] In this embodiment, the mobile terminal can be a smart bracelet, smartwatch, virtual reality device, etc., or it can be a smartphone, e-reader and e-newspaper, television set, or personal portable computer, etc. The applicable scenarios for the display screen provided in this embodiment are not limited thereto.

[0063] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “described” as used herein may also include the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not construed as requiring them to be performed in a particular order described or illustrated unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.

[0064] Although terms such as first, second, third, etc., may be used in this document to describe multiple elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence. Therefore, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments.

[0065] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A display screen, characterized in that, include: The display substrate has a first direction and a second direction, wherein the straight line containing the first direction is perpendicular to the straight line containing the second direction; Multiple circuit boards are disposed at intervals from the display substrate along the first direction, and the multiple circuit boards are distributed at intervals along the second direction; as well as At least one first flip-chip is electrically connected between two adjacent circuit boards and conducts power to the corresponding display substrate and the circuit board.

2. The display screen according to claim 1, characterized in that, The first flip-chip includes a first trace portion, a bridging portion, and a second trace portion. The first trace portion is electrically connected between the circuit board and the corresponding display substrate. The second trace portion is electrically connected between an adjacent circuit board and the corresponding display substrate. The bridging portion is electrically connected between the first trace portion and the second trace portion.

3. The display screen according to claim 2, characterized in that, The bridging portion is housed at both ends in the first direction between the first trace portion and the second trace portion, and is located on the side of the two adjacent circuit boards facing the display substrate. Alternatively, the bridging portion may be housed at both ends in the first direction between the first trace portion and the second trace portion, and located on the side of the display substrate facing the circuit board.

4. The display screen according to claim 2, characterized in that, The two ends of the bridging portion in the first direction are flush with the two ends of the first trace portion and the second trace portion, respectively, and are electrically connected between the corresponding display substrate and the two adjacent circuit boards.

5. The display screen according to claim 2, characterized in that, The bridging portion protrudes from the first trace portion and the second trace portion on the side facing the circuit board, and is housed in the circuit board in the first direction.

6. The display screen according to any one of claims 2 to 5, characterized in that, The first flip-chip chip further includes a first driver and a second driver, the first driver being disposed in the first wiring section and the second driver being disposed in the second wiring section.

7. The display screen according to claim 1, characterized in that, It also includes a plurality of second flip-chip thin film chips, which are electrically connected between the display substrate and the circuit board. The plurality of second flip-chip thin film chips are spaced apart along the second direction, and at least one second flip-chip thin film chip is provided on each circuit board.

8. The display screen according to claim 1, characterized in that, It also includes a timing control board and multiple flexible cables, wherein the timing control board is electrically connected between two adjacent circuit boards via at least two of the flexible cables.

9. The display screen according to claim 1, characterized in that, The display substrate includes a display area and a non-display area. The non-display area is arranged around the outer periphery of the display area. A fan-out area is provided on the non-display area. The first flip-chip is electrically connected to the fan-out area.

10. A mobile terminal, characterized in that, Includes the display screen as described in any one of claims 1 to 9.

Images