Wavelength conversion assembly and lighting equipment

Abstract

The utility model discloses a wavelength conversion assembly and lighting equipment. The wavelength conversion assembly comprises a supporting piece, a first wavelength conversion layer and a second wavelength conversion layer. Wherein the first wavelength conversion layer is arranged on the supporting piece, and the side, away from the supporting piece, of the first wavelength conversion layer is provided with a first area and a second area which are adjacent. The second wavelength conversion layer is arranged in the second area, and the second wavelength conversion layer comprises red fluorescent particles. According to the invention, the second wavelength conversion layer is doped with the red fluorescent particles, so that the specified laser can be converted into red fluorescence under the excitation of the red fluorescent particles. Therefore, when the wavelength conversion assembly is configured in the lighting equipment, the lighting light generated by the lighting equipment can be mixed with the red light component, so that the color rendering index of the lighting light is improved, and the lighting equipment can meet the application scene with the high color rendering index.

Description

Technical Field

[0001] This application relates to the field of laser lighting technology, and more specifically, to a wavelength conversion component and a lighting device. Background Technology

[0002] In the field of existing laser lighting technology, the common lighting method is to use laser to excite fluorescence. For example, using a blue laser to excite yellow fluorescence can mix them to form white light.

[0003] However, the white light obtained in this way lacks the red light band, resulting in a low color rendering index, which makes the lighting equipment unable to meet the application scenarios with a high color rendering index. Utility Model Content

[0004] This application provides a wavelength conversion component and a lighting device.

[0005] According to a first aspect of this application, an embodiment of this application provides a wavelength conversion component, which includes a support member, a first wavelength conversion layer, and a second wavelength conversion layer. The first wavelength conversion layer is disposed on the support member, and has adjacent first and second regions on the side facing away from the support member. The second wavelength conversion layer is disposed in the second region, and includes red fluorescent particles.

[0006] In some possible embodiments, the second region is disposed around the outer periphery of the first region.

[0007] In some possible embodiments, the concentration of red fluorescent particles gradually increases in the direction from the inside of the second region to the outside of the second region.

[0008] In some possible embodiments, the second wavelength conversion layer is a fluorescent glass film that covers the second region.

[0009] In some possible embodiments, the second wavelength conversion layer further includes at least one of green fluorescent particles, cyan fluorescent particles, and yellow fluorescent particles.

[0010] In some possible embodiments, the first wavelength conversion layer is a yellow fluorescent ceramic.

[0011] In some possible embodiments, the wavelength conversion component further includes a reflective film disposed on the side of the first wavelength conversion layer opposite to the second wavelength conversion layer and connected to the support member. The reflective film is a metal reflective film or a dielectric reflective film.

[0012] In some possible embodiments, the support includes a substrate and a solder layer; the solder layer is connected between the substrate and the first wavelength conversion layer.

[0013] According to a second aspect of this application, embodiments of this application also provide a lighting device, which includes a laser source and the aforementioned wavelength conversion component, wherein the laser source is used to generate a specified laser. The wavelength conversion component is disposed in the optical path of the specified laser and is used to convert the specified laser into specified fluorescence, wherein the size of the first wavelength conversion layer is greater than or equal to the spot size corresponding to the specified laser.

[0014] In some possible embodiments, both the first region and the second region are located on the optical path of the specified laser, and the spot energy intensity of the specified laser in the first region is greater than that in the second region.

[0015] This application provides a wavelength conversion component and a lighting device. The wavelength conversion component includes a support member, a first wavelength conversion layer, and a second wavelength conversion layer. The first wavelength conversion layer is disposed on the support member, and the side of the first wavelength conversion layer opposite to the support member has an adjacent first region and a second region, both of which are located on the optical path of a specified laser.

[0016] It should be noted that both the first region and the second region are suitable for being positioned on the optical path of the specified laser, and the energy intensity of the specified laser spot in the first region is greater than that in the second region. Specifically, when the specified laser irradiates the first wavelength conversion layer, a laser spot is formed. In this application, the region with higher energy intensity of the laser spot on the first wavelength conversion layer is referred to as the "first region," and the region with lower energy intensity of the laser spot on the first wavelength conversion layer is referred to as the "second region."

[0017] A second wavelength conversion layer is disposed in the second region, and the second wavelength conversion layer includes red fluorescent particles. In one aspect, the second wavelength conversion layer is doped with red fluorescent particles so that a specified laser beam can be converted into red fluorescence upon excitation by the red fluorescent particles. Therefore, when this wavelength conversion component is configured in a lighting device, the lighting light produced by the device can contain a red light component, thereby improving the color rendering index (CRI) of the lighting light and enabling the lighting device to meet the requirements of high CRI applications.

[0018] On the other hand, the second wavelength conversion layer is set in the second region where the energy intensity of the laser spot is relatively low, which can avoid the situation where the high temperature of the specified laser affects the light efficiency of the red fluorescent particles, so as to ensure the excitation efficiency and thermal stability of the red fluorescence. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the structure of the lighting device provided in the embodiments of this application.

[0021] Figure 2 yes Figure 1 A schematic diagram of a wavelength conversion component in the lighting device shown.

[0022] Figure 3 yes Figure 1 The diagram shows another structural schematic of the wavelength conversion component in the lighting device shown.

[0023] Figure 4 yes Figure 3 A top view of the wavelength conversion component shown.

[0024] Figure 5 yes Figure 1 This is another structural schematic diagram of the wavelength conversion component in the lighting device shown. Detailed Implementation

[0025] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative effort are within the scope of protection of the present application.

[0026] Please see Figure 1 This application provides a wavelength conversion component 100 and a lighting device 200 configured with the wavelength conversion component 100. The lighting device 200 refers to a device used to generate illumination light. For example, the lighting device 200 can be a laser light, a stage light, a vehicle light, a searchlight, etc.

[0027] Specifically, the lighting device 200 may include a laser source 210 and a wavelength conversion component 100, wherein the laser source 210 is used to generate a specified laser L. The specified laser L is used as the excitation light for the wavelength conversion component 100. For example, the specified laser L may be a blue laser, and the center wavelength of the blue laser may be 450nm, 455nm, etc. Of course, in some other possible embodiments, the specified laser L may also be a violet laser, a deep blue laser, etc. Specifically, the laser source 210 may be a laser generator, such as a gas laser generator, a solid-state laser generator, a semiconductor laser generator, etc. The number of laser generators may be multiple to achieve high-power illumination of the lighting device 200.

[0028] The wavelength conversion component 100 is adapted to be disposed in the optical path of the specified laser L, and is used to convert the specified laser L into a specified fluorescence F so that the illumination device 200 generates illumination light. Specifically, in this embodiment, the wavelength conversion component 100 adopts a reflective structure, which can improve the excitation efficiency of the specified fluorescence F. In some possible embodiments, the wavelength conversion component 100 can be a fluorescence color wheel. Of course, in other possible embodiments, the wavelength conversion component 100 can also adopt a transmissive structure, and this embodiment does not specifically limit it.

[0029] In some embodiments of this application, the size of the first wavelength conversion layer 100 is greater than or equal to the spot size corresponding to the specified laser L. This is to effectively reduce the diffusion area of ​​the specified fluorescence F within the first wavelength conversion layer 100. Furthermore, it also ensures that the specified laser L is fully incident on the region where the first wavelength conversion layer 100 is located, thereby guaranteeing the efficiency of laser energy utilization.

[0030] It's easy to understand that during the process of a designated laser L passing through the wavelength conversion component 100, a portion of the laser light in the designated laser L may not be converted into fluorescence. This unconverted portion of the laser light will combine with the designated fluorescence F to form illumination light emitted to the outside world. For example, when a blue laser excites yellow fluorescence, a portion of the blue laser light will not be converted into yellow fluorescence. This portion of the blue laser light will combine with the excited yellow fluorescence to form white light (i.e., illumination light).

[0031] Please see Figure 2 The wavelength conversion component 100 may include a support member 10, a first wavelength conversion layer 30, and a second wavelength conversion layer 50. The first wavelength conversion layer 30 is disposed on the support member 10, and has adjacent first region 302 and second region 304 on its side opposite to the support member 10. Both the first region 302 and the second region 304 are located on the optical path of the designated laser L. The energy intensity of the designated laser L in the first region 302 is greater than the energy intensity of the designated laser L in the second region 304.

[0032] It is easy to understand here that when a designated laser L irradiates the first wavelength conversion layer 30, a laser spot is formed. This application refers to the region on the first wavelength conversion layer 30 with a higher energy intensity of the laser spot as "first region 302," and the region on the first wavelength conversion layer 30 with a lower energy intensity of the laser spot as "second region 304." Figure 2 In the illustrated embodiment, the first region 302 and the second region 304 can be two adjacent regions, for example, in Figure 2 The right region of the first wavelength conversion layer 30 is the first region 302, and the left region is the second region 304.

[0033] It should be noted that there may be no obvious boundary between the first region 302 and the second region 304. Researchers can determine the first region 302 and the second region 304 based on the specific energy distribution of the laser spot formed on the first wavelength conversion layer 30 by the specified laser L.

[0034] Please see Figure 3 and Figure 4 The energy distribution of the designated laser L spot can be a Gaussian distribution, that is, an energy distribution with strong energy in the center and weak energy around the edges. In this case, the second region 304 can be annular and surround the outer periphery of the first region 302. In this case, the first region 302 can be considered the main spot region of the designated laser L, and the second region 304 can be considered a non-main spot region of the designated laser L. In some possible embodiments, the first region 302 can be approximately circular, and the radius of this circular region can be greater than or equal to 3 mm and less than or equal to 5 mm. The second region 304 can be approximately an annular region.

[0035] In this embodiment, a second wavelength conversion layer 50 is disposed in the second region 304, which may include red fluorescent particles (not shown in the figure). On one hand, the second wavelength conversion layer 50 is doped with red fluorescent particles so that a specified laser L can be converted into red fluorescence under the excitation of the red fluorescent particles. Therefore, when the lighting device 200 is equipped with this wavelength conversion component 100, the illumination light generated by the lighting device 200 can contain a red light component to improve the color rendering index of the illumination light, enabling the lighting device 200 to meet the application scenarios requiring a high color rendering index.

[0036] On the other hand, the second wavelength conversion layer 50 is set in the second region 304 where the energy intensity of the laser spot is relatively low, which can avoid the situation where the high temperature of the specified laser L affects the light efficiency of the red fluorescent particles, so as to ensure the excitation efficiency and thermal stability of the red fluorescence.

[0037] The specific implementation of the wavelength conversion component 100 is explained below.

[0038] In this embodiment, the support member 10 is generally block-shaped and serves to fix and support the first wavelength conversion layer 30 and the second wavelength conversion layer 50. Please refer to... Figure 5 The support member 10 may include a substrate 120 and a solder layer 140, the solder layer 140 being connected between the substrate 120 and the first wavelength conversion layer 30.

[0039] In some possible embodiments, substrate 120 may be a heat dissipation substrate with high thermal conductivity to quickly dissipate heat generated by the irradiation of the designated laser L, thereby ensuring the lifespan of the wavelength conversion component 100. As one embodiment, substrate 120 may be a ceramic heat dissipation substrate, such as an aluminum nitride substrate, an alumina substrate, a boron nitride substrate, a silicon nitride substrate, etc. As another embodiment, substrate 120 may be a metal heat dissipation substrate, such as an aluminum alloy substrate, a copper alloy substrate, etc.

[0040] The solder layer 140 is used to fix the substrate 120 and the first wavelength conversion layer 30 together, thereby improving the overall connection reliability of the wavelength conversion component 100. Specifically, the solder layer 140 can be a sintered silver layer or a tin-based solder layer. In addition, since the material of the solder layer 140 is usually metal, the solder layer 140 can also play a certain role in heat dissipation, thereby improving the heat dissipation efficiency of the wavelength conversion component 100.

[0041] In this embodiment, the first wavelength conversion layer 30 is connected to the support member 10 and is used to convert a specified laser L into a specified fluorescence F. The wavelength range of the specified fluorescence F does not overlap with the wavelength range of red light. For example, the specified fluorescence F can be a single color fluorescence, such as yellow fluorescence, green fluorescence, etc. The specified fluorescence F can also be a mixed fluorescence of multiple colors, such as a mixture of yellow fluorescence and green fluorescence. Therefore, when the lighting device 200 is equipped with this wavelength conversion component 100, the illumination light generated by the lighting device 200 can contain a mixture of the specified laser L, the specified fluorescence F, and red fluorescence.

[0042] In some possible embodiments, the size of the first wavelength conversion layer 30 is greater than or equal to the spot size corresponding to the specified laser L, so that the specified laser L can be fully incident on the first wavelength conversion layer 30 to ensure the excitation efficiency of the specified fluorescence F.

[0043] Specifically, the first wavelength conversion layer 30 can be a yellow fluorescent ceramic, such as a YAG:Ce-Al2O3 multiphase yellow fluorescent ceramic, which has high thermal conductivity and stability. Therefore, when the specified laser L is a blue laser, the generated specified fluorescence F is yellow fluorescence.

[0044] exist Figure 5In the illustrated embodiment, the wavelength conversion component 100 may further include a reflective film 40, which is disposed on the side of the first wavelength conversion layer 30 facing away from the second wavelength conversion layer 50 and connected to the support member 10. The reflective film 40 is used to reflect light. That is, the wavelength conversion component 100 in this embodiment adopts a reflective structure.

[0045] On one hand, the reflective film 40 can reflect the designated laser L. Specifically, during the process of the designated laser L passing through the first wavelength conversion layer 30, some laser light may not be converted into fluorescence. At this time, this portion of laser light will be reflected back to the first wavelength conversion layer 30 by the reflective film 40 to achieve secondary excitation of the designated fluorescence F.

[0046] Therefore, compared to the transmissive wavelength conversion component 100, the reflective wavelength conversion component 100 has a higher fluorescence excitation efficiency. Of course, it is easy to understand that during the process of the specified laser L passing through the first wavelength conversion layer 30 twice, some laser light may still not be converted into fluorescence. This part of the laser light will be emitted to the outside to combine with the specified fluorescence F to generate illumination light.

[0047] On the other hand, the reflective film 40 can reflect a specific fluorescence F. Specifically, since the specific fluorescence F is Lambertian light, a portion of the fluorescence in the specific fluorescence F will be emitted toward one side of the reflective film 40. Therefore, the reflective film 40 in this embodiment is also used to reflect this portion of the fluorescence to improve the energy utilization efficiency of the specific fluorescence F.

[0048] Specifically, the reflective film 40 can be a metal reflective film or a dielectric reflective film. Figure 5 In the embodiment shown, the reflective film 40 is connected between the first wavelength conversion layer 30 and the solder layer 140.

[0049] In some other possible embodiments, the reflective film 40 may not be provided between the first wavelength conversion layer 30 and the support member 10. In this case, the support member 10 may be a transparent substrate (e.g., a glass substrate, a sapphire substrate, etc.). In this case, the wavelength conversion component 100 has a transmissive structure.

[0050] In this embodiment, a second wavelength conversion layer 50 is disposed in the second region 304, which may include red fluorescent particles to convert a specified laser L into red fluorescence. Specifically, the red fluorescent particles may be nitride fluorescent particles. For example, Si3N4 may be used as the raw material for the red fluorescent particles. It is easy to understand that, due to the poor thermal stability of Si3N4, this embodiment places the second wavelength conversion layer 50 in the second region 304 where the energy intensity of the laser spot is relatively low, which can ensure the thermal stability of the red fluorescent particles.

[0051] In some possible embodiments, the second wavelength conversion layer 50 is a fluorescent glass film covering the second region 304. Here, "fluorescent glass film" refers to a fluorescent film with fluorescent particles doped into a glass matrix. That is, in this application, the second wavelength conversion layer 50 uses an inorganic encapsulation method with a glass matrix. Compared to organic encapsulation methods such as silicone or resin, the fluorescent glass film has better thermal conductivity, thus preventing yellowing that may occur under prolonged irradiation by a high-power laser, thereby ensuring the excitation efficiency of the specified fluorescence F.

[0052] Furthermore, since red fluorescent particles primarily use Si3N4 as a raw material, and Si3N4 has a low diffusion coefficient, it is difficult to directly prepare high-performance fluorescent ceramic materials using this raw material. For example, the main raw materials for red fluorescent particles may include at least one of the following: CaAlSiN3:Eu 2+ (Ca,Sr)AlSiN3:Eu 2+ (Ca,Ba)AlSiN3:Eu 2+ Or (Ca,Sr,Ba)AlSiN3:Eu 2+ Therefore, this embodiment uses a glass matrix inorganic encapsulation method, which allows Si3N4 to be fully dispersed within the fluorescent glass film to ensure the excitation efficiency of red fluorescence.

[0053] In some possible embodiments, the second wavelength conversion layer 50 may further include at least one of green fluorescent particles, cyan fluorescent particles, and yellow fluorescent particles, which are also used to convert the specified laser L into at least one of green, cyan, and yellow fluorescence to improve the color rendering index of the illumination light. Specifically, the yellow fluorescent particles may be cerium-doped yttrium aluminum garnet (Ce:YAG) scintillation crystal particles, the cyan fluorescent particles may be polyaluminate particles, and the green fluorescent particles may be aluminate (LuAG) particles.

[0054] In some possible embodiments, the thickness of the second wavelength conversion layer 50 is greater than or equal to 30 μm and less than or equal to 100 μm. For example, the thickness of the second wavelength conversion layer 50 can be 30 μm, 50 μm, 80 μm, 100 μm, etc. Therefore, the relatively small thickness of the second wavelength conversion layer 50 in this embodiment is beneficial for achieving a small-size design of the wavelength conversion component 100, thereby saving installation space for the lighting device 200.

[0055] In some possible embodiments, the energy distribution of the laser L spot can be a Gaussian distribution, and the second region 304 can be arranged in a ring around the outer periphery of the first region 302. In this case, the second wavelength conversion layer 50 is ring-shaped, for example, annular. Furthermore, the concentration of red fluorescent particles gradually increases in the direction from the inner side of the second region 304 to the outer side of the second region 304. Here, "inner side of the second region 304" can be understood as the side of the second region 304 closer to the first region 302; and "outer side of the second region 304" can be understood as the side of the second region 304 farther from the first region 302.

[0056] Therefore, in this embodiment, the concentration of red fluorescent particles in the second wavelength conversion layer 50 is non-uniformly distributed. Researchers can adjust the overlap area between the specified laser L and the second region 304 by adjusting the spot size, so as to adjust the proportion of red fluorescence in the illumination light and achieve different color rendering indices to enrich the application scenarios of the lighting device 200.

[0057] This embodiment provides a wavelength conversion component 100 and a lighting device 200 configured with the wavelength conversion component 100. The wavelength conversion component 100 may include a support member 10, a first wavelength conversion layer 30, and a second wavelength conversion layer 50. The first wavelength conversion layer 30 is disposed on the support member 10, and has adjacent first region 302 and second region 304 on its side opposite to the support member 10. Both the first region 302 and the second region 304 are adapted to be located on the optical path of a specified laser L, and the spot energy intensity at the first region 302 is greater than the spot energy intensity at the second region 304. The second wavelength conversion layer 50 is disposed in the second region 304, and may include red fluorescent particles (not shown in the figure).

[0058] On one hand, red fluorescent particles are doped into the second wavelength conversion layer 50 so that the specified laser L can be converted into red fluorescence under the excitation of the red fluorescent particles. Therefore, when the lighting device 200 is equipped with this wavelength conversion component 100, the lighting light produced by the lighting device 200 can be mixed with a red light component to improve the color rendering index of the lighting light, so that the lighting device 200 can meet the application scenarios with high color rendering index.

[0059] On the other hand, the second wavelength conversion layer 50 is set in the second region 304 where the energy intensity of the laser spot is relatively low, which can avoid the situation where the high temperature of the specified laser L affects the light efficiency of the red fluorescent particles, so as to ensure the excitation efficiency and thermal stability of the red fluorescence.

[0060] In this application specification, certain terms are used to refer to specific components. Those skilled in the art will understand that hardware manufacturers may use different names to refer to the same component. The specification and claims do not distinguish components based on differences in name, but rather on differences in function. The term "comprising" throughout the specification and claims is an open-ended term and should be interpreted as "including but not limited to"; "generally" means that those skilled in the art can solve the technical problem within a certain margin of error and basically achieve the technical effect.

[0061] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "inside", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the purpose of simplifying the description of this application and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0062] In this application, unless otherwise expressly specified or limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or merely surface contact. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0063] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0064] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0065] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A wavelength conversion component, characterized in that, include: Support components; A first wavelength conversion layer is disposed on the support member; The first wavelength conversion layer has a first region and a second region adjacent to each other on the side opposite to the support member. as well as A second wavelength conversion layer is disposed in the second region; the second wavelength conversion layer includes red fluorescent particles.

2. The wavelength conversion component according to claim 1, characterized in that, The second region is disposed around the outer periphery of the first region.

3. The wavelength conversion component according to claim 2, characterized in that, The concentration of the red fluorescent particles gradually increases in the direction from the inside of the second region to the outside of the second region.

4. The wavelength conversion component according to claim 1, characterized in that, The second wavelength conversion layer is a fluorescent glass film, which covers the second region.

5. The wavelength conversion component according to claim 1, characterized in that, The second wavelength conversion layer also includes at least one of green fluorescent particles, cyan fluorescent particles, and yellow fluorescent particles.

6. The wavelength conversion component according to claim 1, characterized in that, The first wavelength conversion layer is a yellow fluorescent ceramic.

7. The wavelength conversion component according to claim 1, characterized in that, The wavelength conversion component further includes a reflective film, which is disposed on the side of the first wavelength conversion layer opposite to the second wavelength conversion layer and connected to the support member; The reflective film is a metal reflective film or a dielectric reflective film.

8. The wavelength conversion component according to any one of claims 1 to 7, characterized in that, The support component includes a substrate and a solder layer; The solder layer is connected between the substrate and the first wavelength conversion layer.

9. A lighting device, characterized in that, include: A laser source used to generate a specified laser beam; as well as The wavelength conversion component as described in any one of claims 1 to 8 is disposed in the optical path of the specified laser, and is used to convert the specified laser into specified fluorescence, wherein the size of the first wavelength conversion layer is greater than or equal to the spot size corresponding to the specified laser.

10. The lighting device according to claim 9, characterized in that, Both the first region and the second region are located on the optical path of the designated laser, and the spot energy intensity of the designated laser in the first region is greater than that in the second region.

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