Backlight module structure

Abstract

The utility model discloses a backlight module structure which comprises a lamp panel, a lampshade plate and an optical film which are sequentially arranged in a stacked mode from bottom to top, a plurality of light guide covers are arranged on the lampshade plate in an array mode, a plurality of lamp beads are arranged on the lamp panel in an array mode, and the lamp beads are arranged in the light guide covers in a one-to-one correspondence mode to form light emitting areas. Each surface of each light guide cover is inclined, the width of each light guide cover is gradually increased from bottom to top, the bottom of each light guide cover abuts against the lamp panel, and a partition wall is formed between each light guide cover on the lampshade plate and the adjacent light guide cover around the light guide cover; the partition walls are made of materials with the light transmittance of 10%-50%. When individual lamp beads of the liquid crystal screen break down, the normal backlight effect of the partition where the lamp beads are located can still be guaranteed, the sufficient display effect can still be kept in the corresponding display area on an automobile instrument panel, a driver can normally read instrument information in real time and timely and accurately know the automobile condition, driving safety is guaranteed, and the driving safety is improved. And moreover, the provided illumination is more uniform, and the display effect can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to liquid crystal screen backlight display technical field, concretely is a backlight module structure. BACKGROUND

[0002] With the continuous development of liquid crystal display technology, at present, in the instrument panel, central control display screen of car etc. adopt liquid crystal display to display image and data to replace traditional mechanical type car instrument screen. Since the liquid crystal molecule on the liquid crystal panel does not have the light emitting ability, and the liquid crystal display device needs to be provided with the backlight module for providing the uniform backlight source for the liquid crystal panel. As one of the important components of the liquid crystal display device, the backlight module usually includes light source, back plate, light guide assembly, optical assembly etc., wherein the light source adopts LED backlight source technology, and the optical assembly mainly adopts various optical films such as diffusion plate, light enhancement plate etc. to diffuse, mix and process the stray light to form the uniformly distributed backlight. When using, the light emitted by the built-in LED light source of the backlight module is diffused and mixed through a space distance and other optical films, and then forms the surface light source to be emitted, which can provide sufficient brightness and uniformly distributed light source for the liquid crystal panel above; and the liquid crystal panel acts as a "switch", controls the light transmission degree of light by adjusting the electric field intensity and direction, allows or prevents the passing of light, creates image by the light passing through the liquid crystal panel to generate bright pixels, so that the liquid crystal display can normally display the required picture.

[0003] In order to guarantee the effect of backlight and improve energy efficiency, in the existing backlight module structure, the light guide cover for reflecting light is arranged around each LED lamp bead, and the light guide cover is usually provided as a full reflection surface similar to a mirror surface, so that the light of the lamp bead is reflected on the surface of the light guide cover and all shoots forward, so that the light is fully utilized. However, the backlight module may be damaged in the use process, at this time, the black area will appear above the damaged lamp bead partition, thereby affecting the real-time display of the instrument information at the corresponding position of the instrument panel of the car, and bringing safety hidden danger to driving.

[0004] Furthermore, in current mainstream automotive instrument panel designs, all light-emitting elements (such as LEDs) require individual drivers to illuminate. Each independently controlled light-emitting unit requires at least one chip channel for driving. When the number of elements to be controlled exceeds the number of channels on a single chip, more chips are needed. Introducing multiple chips not only increases costs but also inevitably leads to delays between chips. Additionally, due to differences in chip quality, the current supplied to different chips varies, resulting in inconsistent brightness, poorer performance, and higher power consumption. To overcome these shortcomings, time-division multiplexing technology is employed. This technology allows chip channels to illuminate LEDs in different areas at different times, simultaneously increasing the illumination frequency. Utilizing the persistence of vision, the human eye cannot perceive flicker, and from the perspective of the received information, it appears that all LEDs in all areas are illuminated simultaneously. With a limited number of chip channels, it can control several to tens of times more LEDs, ensuring uniform brightness while maintaining low cost. Utility Model Content

[0005] The purpose of this utility model is to provide a backlight module structure that can still ensure the normal backlight effect of the area where an individual LED bead in the LCD screen fails, so as to ensure driving safety.

[0006] The backlight module structure of this utility model includes a lamp plate, a lamp cover plate, and an optical film stacked sequentially from bottom to top. Multiple light guides are arranged in an array on the lamp cover plate, and multiple LEDs are arranged in an array on the lamp plate. The LEDs are arranged one-to-one in the light guides to form a light-emitting area. Each side of the light guide is inclined, and its width gradually increases from the bottom to the top. Its bottom abuts against the lamp plate. A partition wall is formed between each light guide on the lamp cover plate and the adjacent light guides around it. The partition wall has a certain light transmittance.

[0007] Preferably, the light transmittance of the spacer wall is 10% to 50%. More preferably, the light transmittance of the spacer wall is 20% to 30%.

[0008] Preferably, the light transmittance of the partition wall near the edge of the lampshade is greater than that of the partition wall at other locations.

[0009] Preferably, a gap is left between the top of the light guide cover and the optical film.

[0010] Preferably, a mounting groove is also provided, and the lamp panel is placed in the mounting groove.

[0011] Preferably, an outer frame is fitted onto the outer wall of the mounting groove, and a fixing strip is provided on the upper inner side of the outer frame to abut against the upper surface of the optical film. There is also a fixing member provided on the outer frame, the two ends of which are fixedly connected to the bottom of the mounting groove and the outer side of the outer frame, respectively.

[0012] Preferably, a thermally conductive adhesive layer is also provided between the lamp panel and the mounting groove.

[0013] When using the above-mentioned backlight module structure, the following steps are taken:

[0014] The driver chip controls the illumination of the LED beads in groups using a time-division multiplexing method, and monitors the working status of the LED beads to determine whether the LED beads are damaged; in particular, the driver chip determines whether the LED beads are damaged by monitoring whether the current / voltage of the LED beads is normal.

[0015] When a damaged LED is detected, the driver chip controls the surrounding LEDs instead of the damaged one, and uses time-division multiplexing to stagger the lighting time of the damaged LED from that of its surrounding LEDs.

[0016] The backlight module structure involves placing light guides on each LED chip of the lamp panel, with partitions between adjacent light guides. This separates the LED chips into multiple relatively independent light-emitting areas. Most of the light from the LED chips is reflected upwards by the surface of the light guides and, after optical film processing, provides illumination to the LCD panel display area corresponding to that light-emitting area. Simultaneously, due to the light transmittance of the partitions, a small portion of the light from the LED chips can penetrate the light guides to reach other adjacent light-emitting areas, providing illumination to those areas. Furthermore, the light transmittance of the partitions ensures continuous brightness between the light-emitting areas, reducing abrupt and discontinuous shadows between different sections. This results in more uniform illumination from the backlight module, better optical performance, and improved display quality. In use, the driver chip in the backlight module controls the illumination of each LED in groups using a time-division multiplexing method. Utilizing the persistence of vision, this creates the visual effect of all LEDs being lit simultaneously. The driver chip monitors the operating status of the LEDs to determine if any are damaged. When a damaged LED is detected, the driver chip controls the illumination of other adjacent LEDs to replace it. A portion of the light emitted from these surrounding LEDs is transmitted to the area emitting light from the damaged LED, ensuring sufficient illumination. The brightness of the LED is increased, and the corresponding LCD display area above it is illuminated, which can effectively prevent the appearance of a dark area above the light-emitting area where the damaged LED is located. In addition, the driver chip also uses time-division multiplexing to stagger the lighting time of the damaged LED from that of the surrounding LEDs. This ensures that the operation of lighting up other LEDs adjacent to the damaged LED due to LED damage will not conflict with the original lighting operation of these surrounding LEDs. This ensures that each light-emitting area that needs to be lit can emit light evenly, reduce the appearance of spots with uneven brightness, and ensure that it has a better display effect.

[0017] Therefore, through the aforementioned backlight module structure, even if individual LEDs are accidentally damaged during driving, the normal backlight effect of their respective zones can still be ensured, so that the corresponding display area on the car dashboard can still maintain sufficient display effect. The driver can read the instrument information normally in real time, understand the vehicle status in a timely and accurate manner, ensure driving safety, and make the illumination provided more uniform, which can improve the display effect. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the backlight module in this embodiment.

[0019] Figure 2 This is a three-dimensional exploded view of the backlight module structure in this embodiment.

[0020] Figure 3 for Figure 2 A magnified structural diagram of point A in the middle.

[0021] Figure 4 This is a schematic diagram of the structure of the lamp board and lamp cover in this embodiment.

[0022] Figure 5 This is a cross-sectional view of the backlight module structure (without the outer frame) in this embodiment.

[0023] Figure 6 This is a schematic diagram of the structure of the bottom side of the lamp panel in this embodiment.

[0024] Figure 7 This is an exploded structural diagram of the mounting slot, lamp plate, and lamp cover plate in this embodiment.

[0025] Figure 8 A schematic diagram illustrating an example of a backlight module structure.

[0026] In the diagram: 10 - Backlight module structure; 100 - Mounting slot; 200 - Lamp board; 210 - Lamp beads; 220 - Driver chip; 230 - Thermal conductive adhesive layer; 240 - Adhesive layer; 300 - Lamp cover plate; 310 - Light guide cover; 400 - Optical film; 500 - Outer frame; 510 - Fixing strip; 520 - Fixing component. Detailed Implementation

[0027] The technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this utility model.

[0028] It should be noted that if any directional indication (such as up, down, left, right, front, back, top, bottom, inside, outside, vertical, horizontal, longitudinal, counterclockwise, clockwise, circumferential, radial, axial, etc.) is involved in the embodiments of this utility model, the directional indication is only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0029] If the embodiments of this utility model involve descriptions such as "first" or "second," such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Furthermore, the technical features of each embodiment can be combined arbitrarily. For the sake of brevity, not all possible combinations of the technical features in the embodiments are described; however, as long as these combinations of technical features do not contradict each other, they should all be considered within the scope of this specification.

[0030] This embodiment provides a backlight module structure that ensures normal backlight performance in the corresponding area of ​​the LCD screen even when individual LEDs malfunction. For example... Figures 1 to 7 As shown, the backlight module structure 10 includes a lamp plate 200, a lamp cover plate 300, and an optical film 400 stacked sequentially from bottom to top. Multiple light guides 310 are arranged in an array on the lamp cover plate 300, and multiple LEDs 210 are arranged in an array on the lamp plate 200. Each LED 210 is correspondingly positioned within a light guide 310 to form a light-emitting area. Each surface of the light guide 310 is inclined, and its width gradually increases from bottom to top, with its bottom abutting against the lamp plate 200. A partition wall is formed between each light guide 310 on the lamp cover plate 300 and its adjacent light guides 310, and the partition wall has a certain light transmittance. Figure 6 As shown, a driver chip 220 electrically connected to each lamp bead 210 is also provided on the bottom side of the lamp board 200.

[0031] In this embodiment, the structure of the light guide cover 310 can be referred to Figure 4 As shown, the openings of each light guide 310 are rectangular, and the light guide 310s are distributed in a matrix on the lampshade plate 300 to ensure uniform light emission and facilitate control of the light source position. Of course, the light guide 310 can also be configured with other distribution structures. Figure 5As shown, the width of the light guide 310 gradually increases from bottom to top, which increases the light-emitting area of ​​the lamp beads 210 in each light-emitting area, allowing light to be effectively reflected through the light guide 310 to the upper optical film 400 for processing, ensuring the brightness of the upper display area. The bottom of the partition wall formed between adjacent light guides 310 can be set as a hollow structure, which can save the material required for manufacturing the lamp cover plate 300, facilitate the control of the light transmittance of the partition wall by setting different thicknesses, and make it more durable, more resistant to thermal expansion and contraction, and more adaptable.

[0032] The lamp beads 210 can be common LED lamp beads. Each lamp bead 210 can have a shielding cover with a light transmittance of less than 10% on its top to block the light from escaping from the top of the lamp bead 210, allowing only the periphery of the lamp bead 210 to emit light. This further reduces the interference of the light from the lamp bead 210 on other light-emitting areas, which is beneficial for forming a better light emission effect. The optical film 400 uses existing optical components such as diffuser plates and brightness enhancement plates to form a uniformly distributed backlight. This embodiment does not specifically limit this.

[0033] The number of the driver chips 220 is as follows: Figure 6 As shown, multiple LEDs can be configured, employing time-division multiplexing technology. This allows for the control of a greater number of LEDs 210 with a limited number of chip channels, and the brightness of each LED 210 can be adjusted according to the input signal to change the display effect. It should be understood that time-division multiplexing technology and the driver chip adjusting the brightness of each LED according to the input signal are technologies known to those skilled in the art and are achievable, and will not be elaborated upon in this embodiment.

[0034] For reference Figure 4 The backlight module structure 10 shown in the diagram covers each LED bead 210 on the lamp panel 200 with light guide covers 310 on the lamp cover plate 300. Spacers are formed between adjacent light guide covers 310, separating the LED beads 210 and creating multiple relatively independent light-emitting areas. Figure 5 As shown, most of the light from the LED 210 is reflected upwards after passing through the surface of the light guide 310 (see reference). Figure 5 The light path B), after being processed by the optical film 400, can provide illumination to the liquid crystal panel display area corresponding to the light-emitting area; at the same time, since the partition wall is provided with a certain light transmittance, a small part of the light from the lamp bead 210 can pass through the light guide cover 310 to other adjacent light-emitting areas (see reference). Figure 5 The light path C provides a certain amount of illumination to other adjacent light-emitting areas, and the light transmission effect of the partition wall can also keep the brightness between each light-emitting area continuous, which can reduce the abrupt and discontinuous shadow phenomenon in different partitions, making the illumination provided by the backlight module more uniform, with better optical effect, and helping to improve the display effect.

[0035] The partition wall is made of a material with a certain light transmittance, preferably PC plastic or ABS plastic. When the light transmittance of the partition wall is too high, it can easily lead to excessive light leakage from each light-emitting area of ​​the LED beads 210 under normal use, causing light from adjacent light-emitting areas to interfere with each other, resulting in poor optical performance. If the light transmittance is too low, it cannot supplement the transmitted light to adjacent light-emitting areas. Therefore, in a specific embodiment, the light transmittance of the partition wall is 10% to 50%, and its specific transmittance can be set according to the distribution structure and shape of the light guide 310. By setting the light transmittance as described above, it is ensured that most of the light from the LED beads 210 is reflected upwards after passing through the surface of the light guide cover 310, while a small portion of the light can penetrate the light guide cover 310 and reach other adjacent light-emitting areas, providing some illumination to these areas. Therefore, when an individual LED bead 210 fails, the other LED beads 210 surrounding the failed bead can still provide transmitted light. This combination of transmitted light ensures sufficient illumination for the failed light-emitting area, preventing black areas from appearing in the display area above it. Furthermore, under normal use, the brightness between each light-emitting area remains relatively continuous, reducing abrupt and discontinuous shadows that can occur between different zones due to each light-emitting area providing illumination independently. This results in more uniform illumination from the backlight module and a better display effect. As a further preferred embodiment, the light transmittance of the partition wall is 20%–30%, preferably 20%, which is compatible with the matrix-arranged light guide cover 310 structure, maximizing its performance.

[0036] In the above structure, since the light guide 310 located at the edge of the lampshade plate 300 has fewer adjacent light guides 310 compared to the light guide 310 located in the middle, the light transmittance of the partition wall near the edge of the lampshade plate 300 can be greater than that of the partition walls at other locations. In a specific embodiment, the light transmittance of the partition wall at the edge is set to 40% to 50%. This higher light transmittance allows its corresponding light-emitting area to receive more light from the surrounding light-emitting areas, ensuring sufficient brightness and not affecting the display effect even if it is damaged. Meanwhile, the light guide 310 located in the middle has more adjacent light guides 310, so the light transmittance of its partition wall can be set to 20% to 30%, ensuring its performance.

[0037] like Figure 2As shown, a certain gap is left between the top of the light guide cover 310 and the optical film 400. The specific size of the gap can be determined according to the actual structure of the light guide cover 310 and the lamp bead 210, so that there is a suitable gap between the top of the light guide cover 310 and the upper optical film 400, so as to avoid the formation of lamp shadows due to the gap being too small and affecting the visual effect, or the formation of halos due to the gap being too large and interfering with the illumination of other light-emitting areas, thereby forming a better display effect.

[0038] like Figure 2 As shown, the backlight module structure 10 is also provided with a mounting groove 100. The lamp plate 200 is placed in the mounting groove 100, and the lamp cover plate 300 and the optical film 400 are also stacked on the lamp plate 200. The lamp plate 200, the lamp cover plate 300 and the optical film 400 stacked therein can be limited by the side wall of the mounting groove 100, so as to reduce the displacement between the above components.

[0039] Furthermore, an outer frame 500 is fitted onto the outer side wall of the mounting groove 100, and a fixing strip 510 is provided on the upper inner side of the outer frame 500, which abuts against the upper surface of the optical film 400. The fixing strip 510 can be... Figure 2 The frame-shaped structure surrounding the inner side of the outer frame 500 presses the fixing strip 510 downward against the optical film 400. It cooperates with the mounting groove 100 to clamp the lamp plate 200, lampshade plate 300, and optical film 400, further reducing the possibility of detachment or displacement between these components. Additionally, a fixing member 520 is provided on the outer frame 500, which can be used as follows... Figure 7 As shown, it is L-shaped, with its two ends fixedly connected to the bottom of the mounting groove 100 and the outer side of the outer frame 500, respectively, to ensure that the outer frame 500 can be stably fitted onto the outer side wall of the mounting groove 100. With the above structure, the entire backlight module structure 10 can be stably installed, avoiding the backlight module from shaking and making abnormal noises due to loosening or jumping of internal components during operation.

[0040] like Figure 8The lamp board 200 and the mounting groove 100 are further provided with a thermally conductive adhesive layer 230, so that the upper side of the thermally conductive adhesive layer 230 is connected to the lower side of the lamp board 200, and the lower side of the thermally conductive adhesive layer 230 is connected to the mounting groove 100. Its material can be prepared by silicone grease and glue, and has good adhesion and heat dissipation performance. This structure helps to firmly secure the lamp board 200 to the mounting groove 100, and when the lamp board 200 is powered on, the heat generated can be transferred to the external environment in a timely manner through the thermally conductive adhesive layer 230, improving the reliability of the lamp board 200. In addition, an adhesive layer 240 for fixing can also be provided between the lamp board 200 and the lamp cover plate 300, so that the lamp cover plate 300 can be fixed above the lamp board 200. The light guide 310 on the lamp cover plate 300 can correspond one-to-one with the lamp beads 210 on the lamp board 200, avoiding dislocation and ensuring the effectiveness of the light guide 310.

[0041] This embodiment also provides a method for controlling the operation of the backlight module structure, which includes the following steps:

[0042] The driver chip 220 controls the lighting of the LED beads 210 in groups using a time-division multiplexing method, and monitors the working status of the LED beads 210 to determine whether the LED beads 210 are damaged.

[0043] When a damaged LED bead 210 is detected, the driver chip 220 controls the surrounding LED beads 210 to replace the control of the damaged LED bead 210, and the lighting time of the damaged LED bead 210 is staggered with the lighting time of the surrounding LED beads 210 by time-division multiplexing.

[0044] When monitoring the working status of the LED bead 210, the driver chip 220 can determine whether the LED bead 210 is damaged by monitoring whether the current / voltage of the LED bead 210 is normal. The driver chip 220 compares the current / voltage value detected on the chip channel of the driver chip 220 connected to the LED bead 210 with the normal range to determine the fault.

[0045] The above methods can be referred to ​ The example is a 3x3 LED matrix, with each grid corresponding to a light-emitting area. Under normal circumstances, only the LEDs in the central light-emitting area need to be lit to achieve the desired optical effect. In case of a fault, when an LED in the central light-emitting area is damaged, the driver chip 220 controls the lighting of the adjacent LEDs 210 around the damaged LED 210 to replace the lighting of the damaged LED 210. That is, the LEDs in other light-emitting areas adjacent to the faulty central light-emitting area are lit. Combined with the optical design provided by the backlight module structure of this utility model, the light from the adjacent light-emitting areas will leak into the central light-emitting area, so that the central light-emitting area maintains a certain brightness to approximate the original optical effect.

[0046] The backlight module structure of this utility model adopts the above-described method. In use, the driver chip 220 in the backlight module controls the lighting of each LED bead 210 in groups through time-division multiplexing. Utilizing the persistence of vision in the human eye, the LED beads 210 can appear to be lit simultaneously. The driver chip 220 monitors the working status of the LED beads 210 to determine if any LED bead 210 is damaged. When a damaged LED bead 210 is detected, the driver chip 220 can control the lighting of other adjacent LED beads 210 to replace the lighting of the damaged LED bead 210. A portion of the light emitted from the light-emitting areas of these surrounding LED beads 210 can be transmitted to the damaged LED bead 210. The light-emitting area where the damaged LED 210 is located is designed to maintain sufficient brightness and provide illumination to the corresponding liquid crystal display area above it, effectively preventing black areas from appearing above the light-emitting area where the damaged LED 210 is located. Furthermore, the driver chip 220 uses time-division multiplexing to stagger the lighting time of the damaged LED 210 from that of its surrounding LEDs 210. This ensures that the operation of lighting up other LEDs 210 adjacent to the damaged LED 210 due to the damage of the damaged LED 210 will not conflict with the original lighting operation of these surrounding LEDs 210. This ensures that each light-emitting area that needs to be lit can emit light uniformly, reducing the occurrence of spots with uneven brightness and ensuring a better display effect.

[0047] In addition, when several adjacent LED beads 210 are damaged, the above method can also illuminate other LED beads 210 around these LED beads 210, providing some illumination to the damaged area. It has a wide range of applications and ensures that it can provide sufficient emergency display function, so that the driver can still make effective readings when some LED beads 210 on the instrument panel display are faulty during driving. After driving, the faulty LED beads 210 can be repaired or replaced.

[0048] In summary, this utility model, through the aforementioned backlight module structure, ensures the normal backlight effect of its respective zone even when individual LED beads 210 malfunction during driving. This allows the corresponding display area on the car dashboard to maintain sufficient display effect, enabling the driver to read instrument information normally in real time, understand the vehicle condition accurately, ensure driving safety, and provide more uniform illumination, thus improving the display effect.

[0049] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the concept of the present utility model and using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included in the patent protection scope of the present utility model.

Claims

1. A backlight module structure, comprising a lamp panel (200), a lamp cover plate (300), and an optical film (400) stacked sequentially from bottom to top, characterized in that, Multiple light guides (310) are arranged in an array on the lamp cover plate (300), and multiple LED beads (210) are arranged in an array on the lamp plate (200). The LED beads (210) are arranged one-to-one in the light guides (310) to form a light-emitting area. Each side of the light guide (310) is inclined, and the width gradually increases from the bottom to the top. Its bottom abuts against the lamp plate (200). Each light guide (310) on the lamp cover plate (300) is separated from the adjacent light guides (310) around it by a partition wall. The partition wall has a certain light transmittance.

2. The backlight module structure according to claim 1, characterized in that, The light transmittance of the spacer is 10% to 50%.

3. The backlight module structure according to claim 2, characterized in that, The light transmittance of the spacer is 20% to 30%.

4. The backlight module structure according to any one of claims 1-3, characterized in that, The light transmittance of the partition wall near the edge of the lampshade plate (300) is greater than that of the partition wall at other positions.

5. The backlight module structure according to any one of claims 1-3, characterized in that, A gap is left between the top of the light guide cover (310) and the optical film (400).

6. The backlight module structure according to any one of claims 1-3, characterized in that, It is also provided with a mounting groove (100), in which the lamp plate (200) is placed.

7. The backlight module structure according to claim 6, characterized in that, An outer frame (500) is fitted onto the outer wall of the mounting groove (100). A fixing strip (510) is provided on the upper inner side of the outer frame (500) and abuts against the upper surface of the optical film (400). There is also a fixing member (520) on the outer frame, whose two ends are fixedly connected to the bottom of the mounting groove (100) and the outer side of the outer frame (500) respectively.

8. The backlight module structure according to claim 6, characterized in that, A thermally conductive adhesive layer (230) is also provided between the lamp panel (200) and the mounting groove (100).

Images