LED lamp bead device
By using a flip-chip all-in-one structure and a chipset parallel design, the problem of dark spots caused by chip short circuits is solved, improving the brightness and stability of LED beads and adapting to the pin structure and airtightness issues for outdoor use.
Patent Information
- Application Number
- CN202422386295.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-27
- Publication Date
- 2025-11-11
- Estimated Expiration
- 2034-09-27
AI Technical Summary
In existing technologies, when each chip is controlled individually, a short circuit can cause dark spots on the entire screen, affecting the overall brightness of the product. Furthermore, outdoor LED display products suffer from pin structure and airtightness issues.
It adopts a flip-chip all-in-one structure and a parallel chipset design. The pin assembly includes non-common electrode pins and common electrode pins. The chips in the chipset are connected in parallel, and the current can be transferred to other chips to avoid the appearance of dark spots. The hermeticity is improved by flip-chip structure and UV plastic packaging.
It improves the brightness and stability of the LED beads, reduces the impact of single chip failure on the overall brightness, solves the pin structure and airtightness issues, and is suitable for outdoor use scenarios.
Smart Images
Figure CN223540886U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of LED beads, and in particular to an LED bead device. Background Technology
[0002] For outdoor applications, LED display products require higher reliability and brightness. During the R&D process, since flip-chip products are more stable than conventionally packaged products, we considered using flip-chip technology to create high-reliability, high-brightness outdoor LED display products. Further consideration was given to using a multi-in-one packaging method to significantly improve the brightness of the LED chips. Currently, existing technology uses red-green-blue (RBBL) chips, with each chip controlled individually. When one chip short-circuits, dark spots appear on the entire screen, significantly impacting the overall brightness of the product. Furthermore, outdoor top-mounted LED products suffer from uneven brightness due to pin structure issues and also have airtightness problems. Utility Model Content
[0003] This application provides an LED lamp bead device that can solve the problem in related technologies where each chip is controlled individually, and when one chip short-circuits, dark spots appear on the entire screen, greatly affecting the overall brightness of the product.
[0004] This application provides an LED lamp bead device, which includes: a pad, a first surface of the pad having N chip groups, each chip group including n parallel chips with the same emitting color, and a second surface of the pad having a pin assembly; wherein, N≥1, n≥2, and N and n are positive integers, and the chips in the chip groups are electrically connected to the pin assembly.
[0005] In one embodiment, the pin assembly includes N non-common electrode pin groups, and one chip group is electrically connected to one non-common electrode pin group.
[0006] Each of the non-common electrode pin groups includes two non-common electrode pins, wherein the first electrode of the chip in each chip group is electrically connected to one of the non-common electrode pins and the second electrode is electrically connected to the other non-common electrode pin, wherein the polarities of the first electrode and the second electrode are opposite.
[0007] In one implementation, the first poles of the n chips in each chipset are electrically connected together to a non-common pole pin;
[0008] The second poles of the n chips in each chipset are electrically connected together to the non-common pole pin.
[0009] In one implementation, the first pole of each of the n chips in each chipset is individually electrically connected to the corresponding non-common pole pin;
[0010] In each of the chipsets, the second pole of each of the n chips is individually electrically connected to the corresponding non-common pole pin.
[0011] In one embodiment, the solder surface area of the non-common electrode pin is a set value.
[0012] In one implementation, N of the chipsets are connected in parallel.
[0013] In one embodiment, the pin assembly includes m non-common electrode pins and one common electrode pin, where m = N;
[0014] The first poles of all chips in the N chipsets are connected together to a common pole pin, and the second pole of each chip in the chipsets is individually connected to one of the non-common pole pins, wherein the polarities of the first pole and the second pole are opposite.
[0015] In one embodiment, the soldering surface area of both the non-common electrode pin and the common electrode pin is greater than a set value.
[0016] In one implementation, multiple chips with the same emitting color are connected in series on the same connection line in the same chipset.
[0017] In one embodiment, a first through hole is provided on the pad;
[0018] Alternatively, the pin assembly can be connected to the chip and pads via a second through-hole.
[0019] The beneficial effects of the technical solutions provided in this application include:
[0020] This application provides an LED lamp bead device that connects chips with the same light emission color in parallel, which can effectively increase the brightness of the lamp bead. When one of the chips fails, the current can be transferred to the other chips connected in parallel, which has little impact on the overall brightness of the device and will not cause dark spots in the lamp bead device. Attached Figure Description
[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0022] Figure 1 This is a schematic diagram of the first board surface structure of the pads when the first pin configuration method is provided in the embodiments of this application;
[0023] Figure 2 This is a schematic diagram of the second board surface structure of the pads in the first pin configuration method provided in the embodiments of this application;
[0024] Figure 3 This is a schematic diagram of the second through hole on the first board surface of the pad in the first pin configuration method provided in the embodiments of this application;
[0025] Figure 4 This is a schematic diagram of the second through hole on the second board surface of the pad in the first pin configuration method provided in the embodiments of this application;
[0026] Figure 5 This is a schematic diagram of the first board surface structure of the pads when the second pin setting method is provided in the embodiments of this application;
[0027] Figure 6 This is a schematic diagram of the second board surface structure of the pads when providing the second pin setting method in the embodiments of this application.
[0028] In the diagram: 1. Pad; 2. Chip; 3. Pin assembly; 30. Common pin; 31. Non-common pin; 4. First via; 5. Second via. Detailed Implementation
[0029] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.
[0030] This application provides an LED lamp bead device that can solve the problem in related technologies where each chip is controlled individually, and when one chip short-circuits, dark spots appear on the entire screen, greatly affecting the overall brightness of the product.
[0031] This application provides an LED lamp bead device, which includes: a pad 1, a first surface of the pad 1 having N chip groups, each chip group including n parallel chips 2 with the same emitting color, and a second surface of the pad 1 having a pin assembly 3; wherein, N≥1, n≥2, and N and n are positive integers, and the chips 2 in the chip groups are electrically connected to the pin assembly 3.
[0032] In this application, the chips 2 with the same light emission color are connected in parallel, which can effectively increase the brightness of the LED beads. When one of the chips 2 fails, the current can be transferred to the other chips 2 connected in parallel with it, which has little impact on the overall brightness of the device and will not cause dark spots in the LED bead device.
[0033] See Figure 1As shown, three chipsets are disposed on the first board surface of pad 1, namely chipset R, chipset G, and chipset B. The light emission colors of chipset R, chipset G, and chipset B are red, green, and blue, respectively. In this embodiment, each chipset includes two chips 2 with the same light emission color. It should be noted that the number of chipsets and the number of chips 2 in each chipset are not unique; other arrangements are also possible in other embodiments.
[0034] Furthermore, within the same chipset, multiple chips 2 with the same emitting color can be connected in series on the same connection line. That is, in n parallel connection lines, each connection line can have one chip 2 or multiple chips 2.
[0035] Depending on the specific needs, pin assembly 3 can also be configured in different ways:
[0036] In some possible embodiments, the pin assembly 3 includes N non-common electrode pin groups, and one chip group is electrically connected to one non-common electrode pin group.
[0037] by Figure 1 The following example illustrates a setup with three chipsets, each containing two chips with the same emitting color. In other words, when there are three chipsets, three non-common electrode pin groups also need to be set on the second board surface of pad 1, so that the three chipsets correspond to the three non-common electrode pin groups respectively.
[0038] In this embodiment, each non-common electrode pin group includes two non-common electrode pins 31. The first electrode of the chip 2 in each chip group is electrically connected to one of the non-common electrode pins 31, and the second electrode is electrically connected to the other non-common electrode pin 31. The polarities of the first electrode and the second electrode are opposite: when the first electrode is positive, the second electrode is negative; conversely, when the first electrode is negative, the second electrode is positive.
[0039] Furthermore, the connection methods of the n chips 2 in each chipset can also be different:
[0040] For example, the first connection method is: the first poles of the n chips 2 in each chipset can be combined and electrically connected to the non-common pole pin 31 (see...). Figure 1 (Connection method of chips 2 in the left and right chipsets): Select the option to merge the first poles of all chips 2 in the chipset to form a first pole connection terminal, and then connect the merged first pole connection terminal to one of the non-common pole pins 31. Connect the second poles of n chips 2 in each chipset to a non-common pole pin 31: Select the option to merge the second poles of all chips 2 in the chipset to form a second pole connection terminal, and then connect the merged second pole connection terminal to another non-common pole pin 31.
[0041] For example, the second connection method is (see...) Figure 1 (Connection method of chip 2 in the middle chipset): Alternatively, the first pole of each of the n chips 2 in each chipset can be individually electrically connected to the corresponding non-common pole pin 31, and the second pole of each of the n chips 2 in each chipset can be individually electrically connected to the corresponding non-common pole pin 31. That is, the first pole of each chip 2 is not connected together, but is directly connected to the non-common pole pin 31 connected to the first pole; the second pole of each chip 2 is not connected together, but is directly connected to the non-common pole pin 31 connected to the second pole.
[0042] In use, a suitable connection method can be selected as needed. In this application, there are no restrictions on the connection method of chip 2 in the chipset; all chipsets in the LED lamp bead device can use the first connection method; all chipsets in the LED lamp bead device can use the second connection method; or even... Figure 1 , Figure 3 As shown, both the first and second connection methods are used.
[0043] In this embodiment, since there are a large number of non-common electrode pins 31, the soldering surface area of the non-common electrode pins 31 is set to a predetermined value. The predetermined value can be set according to actual needs. Generally, the predetermined value of the soldering surface area of the non-common electrode pins 31 is related to the size of the pad 1 and the number of non-common electrode pins 31.
[0044] In this embodiment, the number of non-common electrode pins 31 is twice that of the chipset. The advantage of this arrangement is that it can increase the soldering push-pull force, prevent the lamp from falling off, and better adapt to outdoor use scenarios.
[0045] In some possible embodiments, N chipsets are connected in parallel.
[0046] In this embodiment, the pin assembly 3 is configured to include m non-common electrode pins 31 and one common electrode pin 30, and m = N is set to... Figure 1 The following example illustrates a setup with three chipsets, each containing two chips with the same emitting color. In other words, the number of non-common electrode pins 31 is the same as the number of chipsets. When there are three chipsets, the number of non-common electrode pins 31 is also three.
[0047] See Figure 5 As shown, the first terminals of chip 2 in all chipsets are connected together to form a first terminal connection, corresponding to a common terminal pin 30. Figure 5The pin in the lower right corner is the common electrode pin 30), and the first electrode connection terminal is connected to the common electrode pin 30; the second electrodes of all chips 2 in each chipset are connected together. At this time, the second electrodes of chips 2 in different chipsets are not connected together to form three second electrode connection terminals, corresponding to three non-common electrode pins 31. The three second electrode connection terminals are respectively connected to the three non-common electrode pins 31.
[0048] That is, the first poles of all chips 2 in the N chipsets are connected together to the common pole pin 30, and the second pole of each chip 2 in the chipset is connected to one of the non-common pole pins 31. The polarities of the first pole and the second pole are opposite: when the first pole is positive, the second pole is negative; conversely, when the first pole is negative, the second pole is positive.
[0049] Considering that setting the pin assembly 3 to include N non-common electrode pin groups, with one chip group corresponding to one non-common electrode pin group, although it can increase the soldering push-pull force, the wiring and manufacturing process are more complicated, and the overall manufacturing cost is higher. For cost reduction, the pin assembly 3 is set to include m non-common electrode pins 31 and one common electrode pin 30, where m = N, which can simplify the wiring and save manufacturing steps.
[0050] Meanwhile, in this embodiment, since the total number of non-common electrode pins 31 and common electrode pins 30 is less than the number of non-common electrode pins 31 in the previous method, under the condition of the same pad area 1, compared with the arrangement where each non-common electrode pin group includes two non-common electrode pins 31, and the first electrode of each chip 2 in each chip group is electrically connected to one of the non-common electrode pins 31 and the second electrode is electrically connected to the other non-common electrode pin 31, in this embodiment, the soldering surface area of both the non-common electrode pins 31 and the common electrode pins 30 is greater than the set value. That is, this arrangement can increase the soldering surface area of the non-common electrode pins 31 and the common electrode pins 30, making the connection between the non-common electrode pins 31 and the common electrode pins 30 and the pad 1 more secure.
[0051] Furthermore, in a configuration where pin assembly 3 includes N non-common electrode pin groups, with one chip group electrically connected to one non-common electrode pin group, if a lamp bead fails, troubleshooting requires lighting up the corresponding non-common electrode pin groups in pairs. For example, lighting up the first and second electrodes of the chip group with red light emission colors helps determine which of the two red chips 2 is faulty; lighting up the first and second electrodes of the chip group with green light emission colors helps determine which of the two green chips 2 is faulty; and lighting up the first and second electrodes of the chip group with blue light emission colors helps determine which of the two blue chips 2 is faulty. However, in a configuration where pin assembly 3 includes m non-common electrode pins 31 and one common electrode pin 30, since one pin is the common electrode pin 30, troubleshooting only requires lighting up the first or second electrodes of the remaining chips 2 connected to the three non-common electrode pins 31.
[0052] The above embodiments are merely various possible implementations of the embodiments of this application, and the embodiments of this application are not limited thereto. It should be noted that each setting method has its corresponding advantages, and the desired method can be selected according to its advantages during use.
[0053] Based on the above embodiments, in this embodiment, the pad 1 is provided with a first through hole 4, which can be filled with ink or resin, resulting in low manufacturing cost. Simultaneously, the pin assembly 3 is connected to the chip 2 and the pad 1 through a second through hole 5. Specifically, the second through hole is filled by electroplating. Regardless of the pin assembly 3's configuration, both the non-common electrode pin 31 and the common electrode pin 30 are connected to the chip 2 and the pad 1 by electroplating. Electroplating improves the hermeticity of the non-common electrode pin 31 and the common electrode pin 30. Combined with the flip-chip structure and the use of outdoor UV-resistant adhesive, the pins are kept flat, resolving the issue of uneven bonding.
[0054] In summary, this application employs a flip-chip multi-in-one structure to improve the stability and brightness of LEDs in outdoor applications; the flip-chip chip packaging solves the problem of uneven brightness and poor airtightness caused by the pin structure of TOP products; the parallel design of the two chips in the chipset ensures that the overall screen brightness does not change much when one chip is short-circuited, thus solving the problem of dim lighting when controlled by a single chip; and the application uses a special wiring design to significantly reduce wiring complexity.
[0055] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.
[0056] It should be noted that in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0057] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.
Claims
1. An LED lamp bead device, characterized in that, It includes: The pad (1) has N chip groups on its first surface, each chip group including n parallel chips (2) with the same light emission color, and the pad (1) has pin assembly (3) on its second surface. Where N≥1, n≥2, and N and n are positive integers, the chip (2) in the chipset is electrically connected to the pin assembly (3); The pin assembly (3) includes N non-common electrode pin groups, and one chip group is electrically connected to one non-common electrode pin group. Each of the non-common electrode pin groups includes two non-common electrode pins (31), wherein the first electrode of the chip (2) in each chip group is electrically connected to one of the non-common electrode pins (31) and the second electrode is electrically connected to the other non-common electrode pin (31), wherein the polarities of the first electrode and the second electrode are opposite; The first poles of the n chips (2) in each chipset are electrically connected to the non-common pole pin (31). The second poles of the n chips (2) in each chipset are electrically connected to the non-common pole pin (31). Alternatively, the first pole of each of the n chips (2) in each chipset is individually electrically connected to the corresponding non-common pole pin (31). The second pole of each of the n chips (2) in each chipset is individually electrically connected to the corresponding non-common pole pin (31).
2. The LED lamp bead device as described in claim 1, characterized in that: The welding surface area of the non-common electrode pin (31) is a set value.
3. The LED lamp bead device as described in claim 1, characterized in that: N chipsets are connected in parallel.
4. The LED lamp bead device as described in claim 3, characterized in that: The pin assembly (3) includes m non-common electrode pins (31) and one common electrode pin (30), where m = N; The first poles of all chips (2) in the N chipsets are connected together to a common pole pin (30), and the second pole of each chip (2) in each chipset is individually connected to one of the non-common pole pins (31), wherein the polarities of the first pole and the second pole are opposite.
5. The LED lamp bead device as described in claim 4, characterized in that: The welding surface area of the non-common electrode pin (31) and the welding surface area of the common electrode pin (30) are both greater than the set value.
6. The LED lamp bead device as described in claim 1, characterized in that: In the same chipset, multiple chips with the same light emission color are connected in series on the same connection line (2).
7. The LED lamp bead device as described in claim 1, characterized in that: The pad (1) is provided with a first through hole (4); Alternatively, the pin assembly (3) is connected to the chip (2) and the pad (1) through the second through hole (5).