Semiconductor chip transportation device
By designing limiting and clamping components, the problem of tilting and displacement of semiconductor chips during transportation is solved, achieving stable transportation of chips and preventing bumps and damage.
Patent Information
- Application Number
- CN202422835558.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-20
- Publication Date
- 2025-11-14
- Estimated Expiration
- 2034-11-20
AI Technical Summary
Existing semiconductor chips are prone to tilting and slight displacement during transportation, which can lead to bumps, unstable fixing, and easy scrapping.
The design employs limiting and clamping components, including the cooperation of components such as clamping plates, connecting rods, round blocks, tension springs, clamping plates, screws, and handles, to achieve stable limiting and clamping of semiconductor chips and prevent shaking.
This improves the stability of semiconductor chips during transportation, avoids bumps and damage, and ensures the safety of chips during transportation.
Smart Images
Figure CN223546329U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor chips, and in particular to a semiconductor chip transport device. Background Technology
[0002] Semiconductor chip: A semiconductor device that performs a certain function by etching and wiring on a semiconductor wafer. It is not only silicon chip, but also commonly includes semiconductor materials such as gallium arsenide and germanium. Semiconductors, like automobiles, have trends.
[0003] In today's electronic technology field, semiconductor chips, as core components, are becoming increasingly important. Ensuring the safety and stability of semiconductor chips during production, storage, and transportation is crucial. Existing semiconductor chips are prone to tilting left and right in the transportation device during transportation, and they are also prone to slight displacement during transportation, resulting in minor bumps and knocks. Semiconductor chips are easily scrapped due to unstable transportation. Therefore, a semiconductor chip transportation device is proposed to solve the above problems. Utility Model Content
[0004] To overcome the above shortcomings, this utility model provides a semiconductor chip transport device, which aims to improve the existing technology where semiconductor chips are prone to tilting left and right in the transport device during transportation, and chips are prone to slight displacement during transportation, resulting in minor bumps and knocks. The semiconductor chips are easily scrapped due to unstable transport.
[0005] To achieve the above objectives, the present invention adopts the following technical solution:
[0006] A semiconductor chip transport device includes a base plate, a placement frame fixedly mounted on the top of the base plate, three sets of adjusting plates inside the placement frame, a limiting component for limiting the semiconductor chip inside the placement frame, steering wheels rotatably mounted at the four corners of the bottom of the base plate, a clamping component for pressing the semiconductor chip inside the placement frame, and an adjusting component for adjusting the position of the adjusting plates on one side of the top of the placement frame.
[0007] As a further description of the above technical solution:
[0008] The limiting assembly includes six sets of clamping plates. A connecting rod is fixedly installed on the outer side of the clamping plates. The outer end of the connecting rod extends through to the outer side of the placement frame. A round block is fixedly installed on the surface of the connecting rod. A tension spring is sleeved on the surface of the connecting rod. The inner end of the tension spring is fixedly installed on both sides of the placement frame. The outer end of the tension spring is fixedly installed on the inner end of the round block.
[0009] As a further description of the above technical solution:
[0010] The clamping assembly includes a clamping plate, a screw is rotatably mounted on the front side of the clamping plate, the front end of the screw extends through to the front side of the placement frame and is threadedly installed with the placement frame, and a handle is fixedly mounted on the front end of the screw;
[0011] As a further description of the above technical solution:
[0012] The adjustment assembly includes three sets of connecting blocks. The bottom of the connecting blocks and the top of the adjustment plate are fixedly installed. A plug rod is slidably installed on the top of the connecting blocks. A slot is provided on the right side of the top of the placement frame. The plug rod and the slot are inserted into each other.
[0013] As a further description of the above technical solution:
[0014] A sliding block is fixedly installed on the left side of the top of the adjustment plate, and a sliding groove is provided on the left side of the top of the placement frame. The sliding block and the sliding groove are slidably installed.
[0015] As a further description of the above technical solution:
[0016] A handle is fixedly installed on the front side of the top of the base plate, and the handle is used in conjunction with the base plate.
[0017] As a further description of the above technical solution:
[0018] Protective pads are provided on the right side of the clamping plate and inside the clamping plate. One set of the protective pads can be detached and installed by bolts and the clamping plate, and six sets of the protective pads can be detached and installed by bolts and the clamping plate.
[0019] This utility model has the following beneficial effects:
[0020] 1. In this utility model, the cooperation of the clamping plate, connecting rod, round block and tension spring allows the round block, clamping plate and connecting rod to always bear the tension of the tension spring, thereby limiting the position of the semiconductor chip by the clamping plate, thus making the semiconductor chip more stable during transportation.
[0021] 2. In this utility model, the cooperation of the clamping plate, screw and handle can drive the screw to rotate when the handle is turned. The rotation of the screw drives the clamping plate to rotate. The rotation of the clamping plate will limit the semiconductor chip on the front side of the placement frame, preventing the semiconductor chip from shaking during transportation inside the placement frame. Attached Figure Description
[0022] Figure 1 A three-dimensional schematic diagram of the base plate is provided for this utility model;
[0023] Figure 2 This utility model provides a schematic diagram of the internal structure of the placement frame;
[0024] Figure 3 This utility model provides a structural schematic diagram of the clamping component and the limiting component;
[0025] Figure 4 This utility model Figure 2 Enlarged structural diagram at point A in the middle.
[0026] Legend:
[0027] 1. Base plate; 2. Placement frame; 3. Adjustment plate; 4. Limiting component; 41. Clamping plate; 42. Connecting rod; 43. Round block; 44. Tension spring; 5. Steering wheel; 6. Clamping component; 61. Clamping plate; 62. Screw; 63. Handle; 7. Adjustment component; 71. Connecting block; 72. Insert rod; 73. Slot; 8. Sliding block; 9. Sliding groove; 10. Handle; 11. Protective pad. Detailed Implementation
[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0029] Reference Figure 1-4 The present invention provides an embodiment comprising a base plate 1, a placement frame 2 fixedly mounted on the top of the base plate 1, three sets of adjusting plates 3 inside the placement frame 2, a limiting component 4 for limiting the position of a semiconductor chip inside the placement frame 2, four rotatable steering wheels 5 rotatably mounted at the bottom corners of the base plate 1, a clamping component 6 for pressing the semiconductor chip against the placement frame 2, and an adjusting component 7 for adjusting the position of the adjusting plates 3 on one side of the top of the placement frame 2. First, the semiconductor chip to be transported is placed inside the placement frame 2. Then, the adjusting plates 3 can be pushed to limit the semiconductor chip. The adjusting component 7 then limits the adjusting plates 3. When the adjusting plates 3 contact the semiconductor chip, the limiting component 4 can then further limit the semiconductor chip in contact with the adjusting plates 3. Finally, the adjusting component 7 can limit the semiconductor chip on the other side of the placement frame 2, thus achieving the advantage of limiting the position of the semiconductor chip.
[0030] Reference Figure 1-4The limiting component 4 includes six sets of clamping plates 41. Connecting rods 42 are fixedly installed on the outer sides of the clamping plates 41, with the outer ends of the connecting rods 42 extending through to the outer side of the placement frame 2. Circular blocks 43 are fixedly installed on the surface of the connecting rods 42, and tension springs 44 are sleeved on the surface of the connecting rods 42. The inner ends of the tension springs 44 are fixedly installed on both sides of the placement frame 2, and the outer ends of the tension springs 44 are fixedly installed on the inner ends of the circular blocks 43. Through the mutual cooperation of the clamping plates 41, connecting rods 42, circular blocks 43, and tension springs 44, the circular blocks 43, clamping plates 41, and connecting rods 42 can continuously bear the tension of the tension springs 44, thereby limiting the semiconductor chip position of the clamping plates 41. This will make the semiconductor chip more stable during transportation. The clamping component 6 includes a clamping plate 61. A screw 62 is rotatably mounted on the front side of the clamping plate 61. The front end of the screw 62 passes through the front side of the placement frame 2 and is threadedly installed with the placement frame 2. A handle 63 is fixedly mounted on the front end of the screw 62. Through the cooperation of the clamping plate 61, the screw 62 and the handle 63, the screw 62 can be rotated when the handle 63 is rotated. The rotation of the screw 62 drives the clamping plate 61 to rotate. The rotation of the clamping plate 61 will limit the semiconductor chip inside the front side of the placement frame 2 and prevent the semiconductor chip from shaking during transportation inside the placement frame 2.
[0031] Reference Figure 1-4 The adjustment assembly 7 includes three sets of connecting blocks 71. The bottom of the connecting blocks 71 and the top of the adjustment plate 3 are fixedly installed. A rod 72 is slidably installed on the top of the connecting blocks 71. A slot 73 is provided on the right side of the top of the placement frame 2. The rod 72 and the slot 73 are inserted into each other. Through the cooperation of the connecting blocks 71, the rod 72 and the slot 73, the connecting blocks 71 can be moved when the adjustment plate 3 is pulled. When the connecting blocks 71 contact the semiconductor chip, the rod 72 can be inserted to the bottom. The rod 72 moves to the bottom and enters the slot 73, thereby limiting the adjustment plate 3. A sliding block 8 is fixedly installed on the left side of the top of the adjustment plate 3. A sliding groove 9 is provided on the left side of the top of the placement frame 2. The sliding block 8 and the sliding groove 9 are slidably installed. Through the cooperation of the sliding block 8 and the sliding groove 9, the adjustment plate 3 can be moved. To improve the stability of the adjusting plate 3 during movement and prevent it from wobbling, a handle 10 is fixedly installed on the front side of the top of the base plate 1. The handle 10 works in conjunction with the base plate 1. By pulling the handle 10, the base plate 1 and the placement frame 2 can be moved. The movement of the placement frame 2 allows the semiconductor chip inside to be transported. Protective pads 11 are provided on the right side of the clamping plate 61 and inside the clamping plate 41. One set of protective pads 11 can be detached and installed by bolts to the clamping plate 61. All six sets of protective pads 11 can be detached and installed by bolts to the clamping plate 41. The protective pads 11 are made of soft rubber and can protect the semiconductor chip when it is in position, thereby preventing damage to the semiconductor chip during transportation.
[0032] Working principle: First, place the semiconductor chip to be transported into the placement frame 2. Then, push the adjustment plate 3 to adjust its position. When the rear side of the adjustment plate 3 is in contact with the semiconductor chip, push the insertion rod 72 to the bottom. The insertion rod 72 moves to the bottom and enters the slot 73, thus limiting the adjustment plate 3. Since the round block 43, clamping plate 41, connecting rod 42 and protective pad 11 are always under the tension of the tension spring 44, the protective pad 11 will limit the semiconductor chip, making the semiconductor chip more stable during transportation. Finally, turn the handle 63. The movement of the handle 63 drives the screw 62 to rotate. The rotation of the screw 62 drives the clamping plate 61 to rotate. The rotation of the clamping plate 61 will limit the semiconductor chip on the front side of the placement frame 2. Finally, push the handle 10. The movement of the handle 10 drives the main body placement frame 2, the base plate 1 and the semiconductor chip to move, thus enabling stable transportation of the semiconductor chip.
[0033] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A semiconductor chip transport device, comprising a base plate (1), characterized in that: A placement frame (2) is fixedly installed on the top of the base plate (1). Three sets of adjustment plates (3) are provided inside the placement frame (2). A limiting component (4) for limiting the semiconductor chip is provided inside the placement frame (2). Steering wheels (5) are rotatably installed at the four corners of the bottom of the base plate (1). A clamping component (6) for pressing the semiconductor chip is provided inside the placement frame (2). An adjustment component (7) for adjusting the position of the adjustment plate (3) is provided on one side of the top of the placement frame (2).
2. The semiconductor chip transport device according to claim 1, characterized in that: The limiting component (4) includes six sets of clamping plates (41). A connecting rod (42) is fixedly installed on the outer side of the clamping plate (41). The outer end of the connecting rod (42) extends through to the outer side of the placement frame (2). A round block (43) is fixedly installed on the surface of the connecting rod (42). A tension spring (44) is sleeved on the surface of the connecting rod (42). The inner end of the tension spring (44) is fixedly installed on both sides of the placement frame (2). The outer end of the tension spring (44) is fixedly installed on the inner end of the round block (43).
3. The semiconductor chip transport device according to claim 2, characterized in that: The clamping assembly (6) includes a clamping plate (61), a screw (62) is rotatably mounted on the front side of the clamping plate (61), the front end of the screw (62) extends through to the front side of the placement frame (2) and is threadedly mounted to the placement frame (2), and a handle (63) is fixedly mounted on the front end of the screw (62).
4. The semiconductor chip transport device according to claim 1, characterized in that: The adjustment component (7) includes three sets of connecting blocks (71). The bottom of the connecting block (71) and the top of the adjustment plate (3) are fixedly installed. A plug rod (72) is slidably installed on the top of the connecting block (71). A slot (73) is opened on the right side of the top of the placement frame (2). The plug rod (72) and the slot (73) are inserted into each other.
5. A semiconductor chip transport device according to claim 1, characterized in that: A sliding block (8) is fixedly installed on the left side of the top of the adjustment plate (3), and a sliding groove (9) is opened on the left side of the top of the placement frame (2). The sliding block (8) and the sliding groove (9) are slidably installed.
6. A semiconductor chip transport device according to claim 1, characterized in that: A handle (10) is fixedly installed on the front side of the top of the base plate (1), and the handle (10) and the base plate (1) are used together.
7. A semiconductor chip transport device according to claim 3, characterized in that: Protective pads (11) are provided on the right side of the clamping plate (61) and inside the clamping plate (41). One set of the protective pads (11) can be detached and installed by bolts and clamping plate (61), and six sets of the protective pads (11) can be detached and installed by bolts and clamping plate (41).