Wireless earphone

Abstract

The wireless earphone comprises a mainboard, a first antenna assembly, a microphone and a second antenna assembly, the mainboard comprises a substrate, a radio frequency chip arranged on the substrate and a grounding end arranged on the substrate, the microphone is provided with a first conductive part and a second conductive part electrically connected with the first conductive part, the first conductive part is connected with the grounding end, and the second conductive part is connected with the first antenna assembly. The first antenna assembly is electrically connected with the radio frequency chip, and the second antenna assembly is electrically connected with the grounding end through the microphone, so that the microphone is equivalent to be used as a part of the antenna, that is, the arrangement of the microphone and the second antenna assembly is equivalent to increase of the length and the area of the original antenna, and the performance of the antenna can be improved; therefore, the probability that the problems of jamming, disconnection, poor interference resistance and the like are easy to occur when the wireless earphone is used for listening audio is reduced.

Description

Technical Field

[0001] This application relates to the field of headphone technology, and more particularly to a wireless headphone. Background Technology

[0002] In related technologies, wireless headphones often suffer from antenna radiation performance deviations due to physical limitations such as small size and compact structure, which can lead to problems such as stuttering, disconnection, and poor anti-interference when listening to audio. Utility Model Content

[0003] This application provides a wireless earphone that can reduce the probability of problems such as stuttering, disconnection, and poor anti-interference when listening to audio with a wireless earphone.

[0004] In a first aspect, embodiments of this application provide a wireless earphone, comprising:

[0005] A motherboard includes a substrate, an RF chip disposed on the substrate, and a ground terminal disposed on the substrate.

[0006] The first antenna assembly is electrically connected to the radio frequency chip;

[0007] A microphone having a first conductive portion and a second conductive portion electrically connected to the first conductive portion, the first conductive portion being connected to the ground terminal; and...

[0008] The second antenna assembly is electrically connected to the second conductive part, and the second antenna assembly is electrically connected to the ground terminal through the microphone.

[0009] In some embodiments, the first antenna assembly and the second antenna assembly are located on the same side of the substrate.

[0010] In some embodiments, the substrate has an inner side facing the user's ear and an outer side away from the user's ear, and both the first antenna assembly and the second antenna assembly are disposed on the outer side of the substrate.

[0011] In some embodiments, the first antenna assembly includes a first antenna and a first elastic conductive element, the first elastic conductive element being electrically connected to the radio frequency chip, and the first antenna elastically abutting against the first elastic conductive element; and / or

[0012] The second antenna assembly includes a second antenna and a second elastic conductive element, the second elastic conductive element being electrically connected to the ground terminal, and the second antenna abutting against the second elastic conductive element.

[0013] In some embodiments, the distance of the first antenna relative to the substrate is the same as the distance of the second antenna relative to the substrate.

[0014] In some embodiments, the first antenna has a first notch, and the second antenna has a first protrusion corresponding to the first notch, the first protrusion being embedded in the first notch and spaced apart from the first notch; the second antenna has a second notch, and the first antenna has a second protrusion corresponding to the second notch, the second protrusion being embedded in the second notch and spaced apart from the second notch.

[0015] In some embodiments, the radio frequency chip is disposed on the side of the substrate opposite to the first antenna assembly and the second antenna assembly.

[0016] In some embodiments, the wireless earphone includes a housing with an earphone cavity for sound generation and an earphone stem for gripping, wherein both the first antenna assembly and the second antenna assembly are disposed within the earphone stem.

[0017] In some embodiments, a positioning post is provided on the inner side of the earphone stem;

[0018] The first antenna assembly is provided with a first positioning groove, the first antenna assembly is fixedly connected to the earphone stem, and the first positioning groove is positioned and engaged with the positioning post; and / or

[0019] The second antenna assembly is provided with a second positioning groove, the second antenna assembly is fixedly connected to the earphone stem, and the second positioning groove is positioned and engaged with the positioning post.

[0020] In some embodiments, the earphone stem has a first end connected to the earphone cavity and a second end located away from the earphone cavity, with the microphone disposed at the second end.

[0021] The wireless earphone based on the embodiments of this application includes a motherboard, a first antenna assembly, a microphone, and a second antenna assembly. The first antenna assembly is electrically connected to the radio frequency chip, and the second antenna assembly is electrically connected to the ground terminal through the microphone. In this way, the microphone is equivalent to being used as part of the antenna. That is, the setting of the microphone and the second antenna assembly is equivalent to increasing the length and area of ​​the original antenna, so the performance of the antenna can be improved, thereby reducing the probability of problems such as stuttering, disconnection, and poor anti-interference when listening to audio in the wireless earphone. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the structure of a wireless earphone provided in an embodiment of this application;

[0024] Figure 2 This is a schematic diagram of the internal structure of the wireless earphone in the hidden state of the second outer shell, as provided in an embodiment of this application.

[0025] Figure 3 This is a schematic diagram of the internal structure of the wireless earphone in the disclosed state of the second outer shell, as provided in an embodiment of this application.

[0026] Figure 4 A schematic diagram of the structure of the first outer shell provided in an embodiment of this application;

[0027] Figure 5 This is a comparison chart of head mold efficiency in the embodiments of this application and related technologies;

[0028] Figure 6 This is a 3D orientation view of one angle of the embodiments of this application and related technologies;

[0029] Figure 7 These are 2D radiation patterns at Phi = 0° in the embodiments of this application and related technologies, respectively;

[0030] Figure 8 These are 2D radiation patterns at Phi = 90° in the embodiments of this application and related technologies, respectively;

[0031] Figure 9 These are 2D radiation patterns at Theta = 0° in the embodiments of this application and related technologies, respectively;

[0032] Figure 10 These are 2D radiation patterns at Theta = 90° in the embodiments of this application and related technologies, respectively.

[0033] Figure reference numerals:

[0034] 1. Wireless headphones;

[0035] 100. Motherboard; 110. Substrate; 120. RF chip; 130. Ground terminal;

[0036] 200, First antenna assembly; 210, First antenna; 211, First notch; 212, Second protrusion; 220, First elastic conductive element; 200a, First positioning groove;

[0037] 300. Microphone;

[0038] 400, Second antenna assembly; 410, Second antenna; 411, First protrusion; 412, Second notch; 420, Second elastic conductive element; 400a, Second positioning groove;

[0039] 500. Earphone cavity;

[0040] 600, Earphone stem; 610, Positioning post; 620, First outer shell; 630, Second outer shell. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0042] In the description of this application, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances. Furthermore, in the description of this application, unless otherwise stated, "multiple" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship.

[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0044] In related technologies, wireless headphones often suffer from antenna radiation performance deviations due to physical limitations such as small size and compact structure, which can lead to problems such as stuttering, disconnection, and poor anti-interference when listening to audio.

[0045] To resolve the above technical issues, please refer to [link / reference]. Figure 1 This application provides a wireless earphone. The wireless earphone 1 can be a Bluetooth earphone, an FM wireless earphone, a 2.4G wireless earphone, etc. This application uses a Bluetooth earphone as an example for description.

[0046] Specifically, please refer to Figures 2 to 3 The wireless earphone 1 includes a motherboard 100, a first antenna assembly 200, a microphone 300, and a second antenna assembly 400.

[0047] The motherboard 100 includes a substrate 110, an RF chip 120 disposed on the substrate 110, and a ground terminal 130 disposed on the substrate 110. The substrate 110 is a circuit board that houses various electronic components, such as charging pillars and BTB (Board-to-Board Connector) sockets. The RF chip 120 is responsible for receiving and transmitting wireless signals. It can convert audio signals into wireless signals for transmission, and can also receive wireless signals and convert them back into audio signals. In addition, it is responsible for handling communication protocols and data exchange with other wireless devices. The ground terminal 130 ensures the stability and safety of the circuit, preventing damage from electrostatic interference and lightning strikes. At the same time, the ground terminal 130 also improves the circuit's anti-interference capability and signal quality.

[0048] The microphone 300 is responsible for capturing the user's voice and converting it into an electrical signal for transmission. The microphone 300 has a first conductive part and a second conductive part electrically connected to the first conductive part. The first conductive part is connected to the ground terminal 130. The outer shell of the microphone 300 is usually made of conductive metal material, such as copper or aluminum alloy. Therefore, in some embodiments, the first conductive part and the second conductive part can be two opposite ends on the outer shell of the microphone 300.

[0049] Both the first antenna assembly 200 and the second antenna assembly 400 are primarily responsible for receiving and transmitting wireless signals. They can radiate the wireless signals generated by the RF chip 120 and also receive signals from other wireless devices. The second antenna 410 can work in conjunction with the first antenna 210 to improve the communication stability and signal quality of the wireless headset.

[0050] The first antenna assembly 200 is electrically connected to the radio frequency chip 120, and the second antenna assembly 400 is electrically connected to the second conductive part. The second antenna assembly 400 is electrically connected to the ground terminal 130 through the microphone 300, which means that the microphone 300 can be used as part of the overall antenna. The microphone 300 is also connected to the second antenna assembly 400. Compared with the single first antenna assembly 200, the configuration of the microphone 300 and the second antenna assembly 400 increases the length and area of ​​the overall antenna, improves the radiation performance of the antenna, and improves the problems of stuttering, disconnection and poor anti-interference when listening to audio with headphones.

[0051] Please see Figure 2 In some embodiments, the first antenna assembly 200 and the second antenna assembly 400 are located on the same side of the substrate 110. It should be understood that both the first antenna assembly 200 and the second antenna assembly 400 are spaced apart from the substrate 110. An appropriate distance can reduce the interference of the substrate 110 on the antenna signal, thereby improving the antenna's receiving and transmitting efficiency.

[0052] Therefore, the first antenna assembly 200 and the second antenna assembly 400 are located on the same side of the substrate 110, which frees up space on the other side of the substrate 110 for arranging other key components or increasing battery capacity, thereby improving the space utilization and performance of the entire device and ultimately enabling the miniaturization of the entire wireless headset design.

[0053] Based on the previous embodiment, when the earphone is worn on the user's ear, the earphone has a side facing the user's ear and a side away from the user's ear. Similarly, the substrate 110 has an inner side facing the user's ear and an outer side away from the user's ear. The first antenna assembly 200 and the second antenna assembly 400 are both disposed on the outer side of the substrate 110. In this way, the first antenna assembly 200 and the second antenna assembly 400 are closer to the external environment relative to the substrate 110, thereby reducing the obstruction and attenuation of signals by the substrate 110 or other components, thereby improving the signal reception and transmission strength.

[0054] Furthermore, please refer to Figure 2 The radio frequency chip 120 is disposed on the side of the substrate 110 away from the first antenna assembly 200 and the second antenna assembly 400. This ensures that both the first antenna assembly 200 and the second antenna assembly 400 have a suitable clearance height from the substrate 110. The radio frequency chip 120 is far away from the antenna area, which reduces the direct coupling of radio frequency signals between the chip and the antenna, reduces potential electromagnetic interference and radio frequency interference, and enables the antenna to receive and transmit signals more cleanly, thereby improving the radiation performance of the wireless headphones.

[0055] Please continue reading. Figure 2 In some embodiments, the first antenna assembly 200 includes a first antenna 210 and a first elastic conductive element 220. The first elastic conductive element 220 is electrically connected to the radio frequency chip 120. The first antenna 210 elastically abuts against the first elastic conductive element 220, and the first antenna 210 is also electrically connected to the first elastic conductive element 220. Thus, the first elastic conductive element 220 functions to electrically connect the first antenna 210 and the radio frequency chip 120. Since the first antenna 210 elastically abuts against the first elastic conductive element 220, it can ensure that the first antenna 210 can maintain good electrical contact with the first elastic conductive element 220. Even when affected by external factors such as vibration and temperature changes, the probability of poor contact problems can be reduced.

[0056] Similarly, the second antenna assembly 400 includes a second antenna 410 and a second elastic conductive element 420. The second elastic conductive element 420 is electrically connected to the ground terminal 130. Specifically, the second elastic conductive element is electrically connected to the ground terminal 130 through the microphone 300 housing. The second antenna 410 abuts against the second elastic conductive element, which also ensures that the second antenna 410 can maintain good electrical contact with the second elastic conductive element 420. Even when affected by external factors such as vibration and temperature changes, the probability of poor contact problems can be reduced.

[0057] The first elastic conductive element 220 and the second elastic conductive element 420 can be antenna springs or other conductive materials such as conductive foam, and are not limited in the embodiments of this application.

[0058] Following on from the above, please continue reading. Figure 2 The distance between the first antenna 210 and the substrate 110 is the same as the distance between the second antenna 410 and the substrate 110. That is, the electromagnetic environments of the first antenna 210 and the second antenna 410 are roughly the same, thereby ensuring that the two have similar performance in signal transmission and reception, which can help reduce signal distortion or attenuation caused by differences in antenna position and improve the overall communication quality.

[0059] In another embodiment, when the first antenna 210 and the second antenna 410 are located on the same side of the substrate 110, the space near the substrate 110 can be utilized more effectively, reducing the occupation of the first antenna 210 and the second antenna 410 on the overall size of the earphone, making the entire wireless earphone easier to miniaturize.

[0060] The first antenna 210 can contact the second antenna 410 and form a loop antenna with the substrate 110, microphone 300, etc. Alternatively, the first antenna 210 and the second antenna 410 can be spaced apart. Both of these methods can effectively improve the radiation capability of the entire wireless earphone antenna. In this embodiment, the first antenna 210 and the second antenna 410 being spaced apart is used as an example.

[0061] Please continue reading. Figure 2In some embodiments, the first antenna 210 has a first notch 211, and the second antenna 410 has a first protrusion 411 corresponding to the first notch 211. The first protrusion 411 is embedded in the first notch 211 and spaced apart from the first notch 211. The second antenna 410 has a second notch 412, and the first antenna 210 has a second protrusion 212 corresponding to the second notch 412. The second protrusion 212 is embedded in the second notch 412 and spaced apart from the second notch 412. That is, the first antenna 210 and the second antenna 410 can be staggered, which can make full use of the space of the wireless earphone, so that the length and area of ​​the first antenna 210 and the second antenna 410 are appropriate, thereby ensuring that the radiation performance of the wireless earphone can be improved.

[0062] Please return and refer to Figure 1 In some embodiments of this application, the wireless earphone 1 includes a housing. The housing, as the exterior component of the entire earphone, can be made of ceramic or plastic. The housing includes an earphone cavity 500 for sound generation and an earphone stem 600 for gripping. The earphone cavity 500 can be equipped with a battery, speaker, or other structures. The earphone stem 600 also has a mounting cavity. The safety cavity is connected to the earphone cavity 500. The electrical components in the earphone cavity 500 can be electrically connected to the main board 100 via an FPC (Flexible Printed Circuit Antenna) cable.

[0063] Please see Figure 3 Both the first antenna 210 and the second antenna 410 are located inside the mounting cavity of the earphone stem 600. The earphone stem 600, which is held by the user, is usually located on the outside of the ear. This position is relatively open, which reduces head obstruction and is conducive to the antenna receiving and transmitting wireless signals, thereby improving the stability and coverage of communication.

[0064] Please see Figure 2 as well as Figure 3 When the earphone stem 600 forms a mounting cavity, the microphone 300 is located inside the mounting cavity. The earphone stem 600 has a first end connected to the earphone cavity 500 and a second end away from the earphone cavity 500. The microphone 300 is located at the second end, that is, the microphone 300 is located at the end of the wireless earphone. In other words, compared to the earphone cavity 500 that goes into the ear, when the earphone is worn on the user's ear, the microphone 300 is closer to the user's mouth, which helps to capture the user's voice and reduces the pickup of ambient noise, thus improving the signal-to-noise ratio. In addition, the microphone 300 can be located away from the earphone cavity 500 and the internal speaker, reducing the echo and interference caused by the direct coupling of the speaker sound to the microphone 300, thus improving the clarity and quality of voice calls.

[0065] On the other hand, since the microphone 300 is part of the antenna, it can better receive and transmit signals when the microphone 300 is located at the end of the entire earphone, thereby improving the antenna radiation capability of the entire earphone.

[0066] In order to reduce the installation difficulty of the first antenna assembly 200 and the second antenna assembly 400, that is, to ensure the position of the first antenna assembly 200 and the second antenna assembly 400 relative to the substrate 110, in the embodiments of this application, please refer to Figure 4 A positioning post 610 is provided on the inner side of the earphone stem 600, and a first positioning groove 200a is provided on the first antenna assembly 200. The first antenna assembly 200 is fixedly connected to the earphone stem 600, and the first positioning groove 200a is positioned and engaged with the positioning post 610. A second positioning groove 400a is provided on the second antenna assembly 400. The second antenna assembly 400 is fixedly connected to the earphone stem 600, and the second positioning groove 400a is positioned and engaged with the positioning post 610. In this way, the positions of the first antenna assembly 200 and the second antenna assembly 400 relative to the earphone stem 600 are determined, which can reduce the probability of the first antenna assembly 200 and the second antenna assembly 400 being offset or misaligned during the installation process. Precise positioning and engagement help optimize the layout and orientation of the antenna assembly, reduce signal interference and loss, improve communication quality and efficiency, and thus maximize the performance of the antenna.

[0067] In this embodiment, to facilitate the positioning and installation of the first antenna assembly 200 and the second antenna assembly 400, the earphone stem 600 of the wireless earphone includes two outer shells that can be snapped together. The two outer shells are positioned as a first outer shell 620 and a second outer shell 630. The first outer shell 620 is equipped with a positioning post 610, and the main board 100 is installed on the second outer shell 630. When the first antenna assembly 200 and the second antenna assembly 400 are installed and positioned on the positioning post 610 of the first outer shell 620, the snapping between the first outer shell 620 and the second outer shell 630 ensures that the first antenna assembly 200 and the second antenna assembly 400 are installed in place relative to the main board 100.

[0068] It is understood that the first antenna assembly 200 and the second antenna assembly 400 can be fixed relative to the first outer shell 620 by means of screws or adhesive. In this embodiment, when the first antenna assembly 200 includes a first antenna 210 and the second antenna assembly 400 includes a second antenna 410, both the first antenna 210 and the second antenna 410 can be made of FPC board. The first antenna 210 is provided with a first positioning groove 200a and the second antenna 410 is provided with a second positioning groove 400a. Adhesive is provided on the FPC board. The first positioning groove 200a and the second positioning groove 400a can be positioned and engaged with the positioning post 610 on the first outer shell 620. In this way, the first antenna 210 and the second antenna 410 can be directly attached to the inner wall of the first outer shell 620 by adhesive without drilling, thereby improving installation efficiency.

[0069] It should also be noted that, Figure 5 The graph shown is a comparison of the efficiency of the wireless earphone 1 according to this application embodiment and earphones in related technologies. Figure 5 In the diagram, the horizontal axis represents frequency, and the vertical axis represents efficiency. Figure 5 The solid lines in the figure represent the efficiency of the headphones of this application at different frequencies, while the dashed lines represent the efficiency of headphones in related technologies at different frequencies. Specifically, the average radiation efficiency was calculated by taking the corresponding radiation efficiencies at 2.4GHz, 2.45GHz, and 2.5GHz, resulting in an average radiation efficiency of -12.91dB for the head-mounted sensor in the related technologies. For Bluetooth headphones, a head-mounted sensor efficiency below -12dB can easily lead to problems such as stuttering, disconnections, and poor anti-interference during audio playback. In this embodiment, the average radiation efficiency was calculated by taking the corresponding radiation efficiencies at 2.4GHz, 2.45GHz, and 2.5GHz, resulting in an average radiation efficiency of -10.41dB for the head-mounted sensor. Compared to headphones in related technologies, the average radiation performance of the head-mounted sensor in the wireless headphones 1 of this embodiment is improved by 2.5dB. For Bluetooth headsets, a head-mount efficiency better than -12dB will result in better radiation performance. In this embodiment, the head-mount efficiency of wireless headset 1 reaches -10.41dB, which has better antenna radiation performance and can significantly improve the problems of stuttering, disconnection and poor anti-interference when listening to audio in Bluetooth headsets.

[0070] Figure 6 This is a 3D orientation view of the wireless earphone 1 according to an embodiment of this application and an earphone in related technologies at one angle. From Figure 6 As can be seen in (b), the radiation pattern of the antenna head-mounted device is incomplete, the radiation is uneven, the coverage is narrow, and the gain is low when worn. Bluetooth headsets designed in this way suffer from problems such as stuttering, disconnections, and poor anti-interference when listening to audio. Figure 6The wireless earphone 1 in the embodiment of this application (a) has a more complete radiation pattern when the head model is worn, similar to an apple shape, with more uniform radiation, a wider coverage area, and improved gain, which can bring a good experience to Bluetooth earphones and improve the problems of stuttering, disconnection and poor anti-interference when listening to audio in Bluetooth earphones.

[0071] Please see Figure 7 as well as Figure 8 , Figure 7 and Figure 8 These are 2D radiation patterns of the wireless earphone 1 in this application embodiment and earphones in related technologies, respectively, at Phi = 0° and Phi = 90°. At 2.45 GHz, Figure 7 The middle right picture and Figure 8 The right-middle figure shows the main lobe gain of the relevant techniques, corresponding to -9.44 dBi and -11.3 dBi respectively; while Figure 7 Middle left image and Figure 8 The left and middle figures show the main lobe gain of the wireless earphone 1 in this embodiment, corresponding to -6.32 dBi and -6.12 dBi respectively. Compared with solutions in related technologies, the main lobe gain of the wireless earphone 1 in this embodiment is improved by 3.12 dB and 5.18 dB respectively, which is a significant improvement. Figure 7 and Figure 8 It can be concluded that the radiation pattern of the antenna head-mounted model in the related technology is incomplete, the radiation is uneven, the coverage is narrow, and the gain is low. In contrast, the radiation pattern of the antenna head-mounted model of this application is more complete, the radiation is more uniform, the coverage is wider, and the gain is also greatly improved. This can improve the problems of stuttering, disconnection and poor anti-interference when listening to audio with Bluetooth headphones.

[0072] Please see Figure 9 as well as Figure 10 , Figure 8 and Figure 9 This is a 2D radiation pattern of the wireless earphone 1 according to this application embodiment and the earphone in the related art at Theta = 0° and Theta = 90°. At 2.45GHz, Figure 9 The middle right picture and Figure 10 The right-middle figure shows the main lobe gain of the relevant techniques, corresponding to -20.5 dBi and -9.48 dBi respectively; while Figure 9 Middle left image and Figure 10 The left and middle figures show the main lobe gain of this application, corresponding to -6.54 dBi and -7.51 dBi respectively. Compared with related technologies, the main lobe gain of the wireless earphone 1 in this application embodiment is improved by 13.96 dB and 1.97 dB respectively. Figure 9 and Figure 10It can be concluded that the related technical solutions have low gain, poor directivity, and narrow radiation range when the antenna head-mount is worn; while the wireless earphone 1 of the present application embodiment has better gain, more uniform directional distribution, and wider radiation range when the head-mount is worn, which can improve the problems of stuttering, disconnection and poor anti-interference when listening to audio with Bluetooth earphones.

[0073] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this application, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the accompanying drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0074] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A wireless earphone, characterized in that, include: A motherboard includes a substrate, an RF chip disposed on the substrate, and a ground terminal disposed on the substrate. The first antenna assembly is electrically connected to the radio frequency chip; A microphone has a first conductive part and a second conductive part electrically connected to the first conductive part, wherein the first conductive part is connected to the grounding terminal; as well as, The second antenna assembly is electrically connected to the second conductive part, and the second antenna assembly is electrically connected to the ground terminal through the microphone.

2. The wireless earphone according to claim 1, characterized in that, The first antenna assembly and the second antenna assembly are located on the same side of the substrate.

3. The wireless earphone according to claim 2, characterized in that, The substrate has an inner side facing the user's ear and an outer side away from the user's ear, and both the first antenna assembly and the second antenna assembly are disposed on the outer side of the substrate.

4. The wireless earphone according to claim 1 or 2, characterized in that, The first antenna assembly includes a first antenna and a first elastic conductive element, wherein the first elastic conductive element is electrically connected to the radio frequency chip, and the first antenna elastically abuts against the first elastic conductive element; and / or The second antenna assembly includes a second antenna and a second elastic conductive element, the second elastic conductive element being electrically connected to the ground terminal, and the second antenna abutting against the second elastic conductive element.

5. The wireless earphone according to claim 4, characterized in that, The distance between the first antenna and the substrate is the same as the distance between the second antenna and the substrate.

6. The wireless earphone according to claim 4, characterized in that, The first antenna has a first notch, and the second antenna has a first protrusion corresponding to the first notch. The first protrusion is embedded in the first notch and spaced apart from the first notch. The second antenna has a second notch, and the first antenna has a second protrusion corresponding to the second notch. The second protrusion is embedded in the second notch and spaced apart from the second notch.

7. The wireless earphone according to claim 2, characterized in that, The radio frequency chip is disposed on the side of the substrate opposite to the first antenna assembly and the second antenna assembly.

8. The wireless earphone according to claim 1, characterized in that, The wireless earphone includes a housing, which includes an earphone cavity for sound generation and an earphone stem for gripping. The first antenna assembly and the second antenna assembly are both disposed within the earphone stem.

9. The wireless earphone according to claim 8, characterized in that, A positioning post is provided on the inner side of the earphone stem; The first antenna assembly is provided with a first positioning groove, the first antenna assembly is fixedly connected to the earphone stem, and the first positioning groove is positioned and engaged with the positioning post; and / or The second antenna assembly is provided with a second positioning groove, the second antenna assembly is fixedly connected to the earphone stem, and the second positioning groove is positioned and engaged with the positioning post.

10. The wireless earphone according to claim 8, characterized in that, The earphone stem has a first end connected to the earphone cavity and a second end away from the earphone cavity, and the microphone is disposed at the second end.

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