Mould frame of multilayer circuit board tin spraying machine

Abstract

The utility model relates to the technical field of circuit board mold frames, and discloses a mold frame of a multilayer circuit board tin spraying machine, which comprises a bottom plate, two groups of support frames are symmetrically connected to the upper end of the bottom plate, a mold frame body is jointly mounted at the upper ends of the two groups of support frames, threaded pipes are rotatably connected to the symmetrical side walls of the two sides of the mold frame body, and threaded rods are in threaded connection with the interiors of the threaded pipes. The other end of the threaded rod penetrates through a pipe opening of the threaded pipe, extends outwards and is connected with a push plate, the push plate is slidably connected into the formwork body, the upper end of the bottom plate is rotationally connected with a transmission rod, the transmission rod is in transmission connection with the threaded pipe through a belt wheel, and a heat dissipation assembly used for heat dissipation of the formwork body is installed on the bottom plate. According to the technical scheme, through mutual cooperation of the bottom plate, the supporting frame, the mold frame body, the threaded pipe, the threaded rod, the push plate, the transmission rod and other structures, circuit boards of different sizes can be clamped and fixed, the circuit boards are not prone to shaking, the circuit boards are conveniently machined, and therefore the applicability of the device is improved.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of circuit board mold frames, in particular to a mold frame of a multilayer circuit board tin spraying machine. BACKGROUND

[0002] A circuit board is a basic material for supporting and connecting electronic components, which is usually composed of a non-conductive substrate material and a thin conductive material covering the substrate, and has a series of wires, electrical connections and pads of electrical components on the circuit board, through which electronic components can be connected and supported to realize the function of the circuit. According to the needs of electronic products, the circuit board can have various shapes, sizes and hierarchical structures. Tin spraying is the most common surface coating form of circuit board surface treatment, and the quality of tin spraying directly affects the quality of subsequent customer welding and soldering. Circuit board tin spraying requires a mold frame.

[0003] At present, the existing technology adopts a spring to push a top plate to realize the top resistance and fixation of the edges of the circuit board, but the reset spring has elastic potential, which can easily cause unstable clamping of the circuit board and offset during processing, and the applicability is poor. CONTENT OF THE INVENTION

[0004] The application aims to provide a mold frame of a multilayer circuit board tin spraying machine, which solves the problems in the background art.

[0005] The application provides a mold frame of a multilayer circuit board tin spraying machine, which comprises a bottom plate, two groups of support frames are symmetrically connected to the upper end of the bottom plate, a mold frame body is commonly installed at the upper end of the two groups of support frames, threaded pipes are rotatably connected to the symmetrically opposite side walls of the mold frame body, threaded rods are threadedly connected in the threaded pipes, the other ends of the threaded rods extend outward through the pipe openings of the threaded pipes and are connected with push plates, the push plates are slidably connected in the mold frame body, a transmission rod is rotatably connected to the upper end of the bottom plate, the transmission rod is drivingly connected with the threaded pipes through belt pulleys, and a heat dissipation assembly for heat dissipation of the mold frame body is installed on the bottom plate.

[0006] When in use, the circuit board to be processed is placed in the mold frame body, the transmission rod is rotated, the rotation of the transmission rod drives the threaded pipes to rotate through the belt pulleys, the rotation of the threaded pipes exerts force on the threaded rods through the threaded action, the threaded rods are driven to move the push plates when the two push plates abut against the end portions of the circuit board, and the push plates clamp and fix the circuit board. The above structure can clamp and fix circuit boards of different sizes, the circuit board is not easy to shake, the circuit board is convenient to process, and the applicability of the device is improved.

[0007] Optionally, the heat dissipation assembly comprises a motor fixedly installed at the upper end of the bottom plate, a rotating rod connected to the output end of the motor through a shaft coupling, and a fan blade connected to the upper end of the rotating rod.

[0008] By adopting the above technical scheme, the motor is started, the operation of the motor drives the rotating rod to rotate, the rotation of the rotating rod drives the fan blade to rotate, and the fan blade blows air through the heat dissipation hole to cool the mold frame body and the circuit board, thereby preventing the device from being damaged, and the service life of the device is improved.

[0009] Optionally, the cleaning assembly comprises a connecting rod rotatably connected to the upper end of the bottom plate, and a cleaning plate connected to the upper end of the connecting rod.

[0010] By adopting the above technical scheme, the rotation of the rotating rod drives the connecting rod to rotate through the belt pulley, and the rotation of the connecting rod drives the cleaning plate to rotate, and the rotation of the cleaning plate cleans the dust on the surface of the heat dissipation hole.

[0011] Optionally, the mold frame body is provided with a sliding groove on the inner side wall of each side, and two sliding blocks are symmetrically and slidably connected in the sliding groove.

[0012] By adopting the above technical scheme, the push plate is limited to prevent the push plate from rotating.

[0013] Optionally, a sliding rod is fixedly connected to the groove wall in the sliding groove, and the sliding rod penetrates through the sliding block.

[0014] By adopting the above technical scheme, the sliding block is prevented from being separated from the sliding groove.

[0015] Optionally, a rotating block is fixedly sleeved on the rod wall of the transmission rod.

[0016] By adopting the above technical scheme, the transmission rod is conveniently rotated by the staff.

[0017] Optionally, a buffer pad is installed on the side wall of each of the two push plates.

[0018] By adopting the above technical scheme, the pressure between the buffer push plate and the circuit board is buffered.

[0019] Compared with the prior art, the technical scheme of the present application has the following advantages:

[0020] (1) The technical scheme of the application can clamp and fix circuit boards of different sizes through the cooperation between the bottom plate, support frame, mold frame body, threaded pipe, threaded rod, push plate and transmission rod, and the circuit board is not easy to shake, facilitating the processing of the circuit board, thereby improving the applicability of the device.

[0021] (2) The technical scheme of the application is provided with a motor, a rotating rod, a fan blade, a connecting rod and a cleaning plate. The motor is started, and the operation of the motor drives the rotating rod to rotate, which in turn drives the fan blade to rotate. The fan blade blows air through the heat dissipation holes to cool the mold frame body and the circuit board, preventing the device from being damaged, thereby improving the service life of the device. BRIEF DESCRIPTION OF DRAWINGS

[0022] Other features, objects and advantages of the application will become more apparent after reading the detailed description of non-limiting embodiments with reference to the following drawings:

[0023] Fig. 1 FIG. 1 is a schematic view of the overall structure of a mold frame of a multi-layer circuit board tin spraying machine according to the application;

[0024] Fig. 2 FIG. 2 is a schematic view of a heat dissipation assembly in the mold frame of a multi-layer circuit board tin spraying machine according to the application;

[0025] Fig. 3 FIG. 3 is a schematic view of a sliding block structure in the mold frame of a multi-layer circuit board tin spraying machine according to the application.

[0026] In the drawings: 1, bottom plate; 2, support frame; 3, mold frame body; 4, threaded pipe; 5, threaded rod; 6, push plate; 7, transmission rod; 8, motor; 9, rotating rod; 10, fan blade; 11, connecting rod; 12, cleaning plate; 13, sliding block; 14, sliding rod; 15, buffer pad. DETAILED DESCRIPTION

[0027] Please refer to Figs. 1-3 The application provides a technical scheme: a mold frame of a multi-layer circuit board tin spraying machine, which comprises a bottom plate 1, two groups of support frames 2 are symmetrically connected to the upper end of the bottom plate 1, a mold frame body 3 is commonly installed on the upper ends of the two groups of support frames 2, threaded pipes 4 are rotationally connected to the symmetrical side walls on both sides of the mold frame body 3, threaded rods 5 are threadedly connected in the threaded pipes 4, the threaded rods 5 extend outward through the pipe openings of the threaded pipes 4 and are connected with push plates 6, the push plates 6 are slidingly connected in the mold frame body 3, a transmission rod 7 is rotationally connected to the upper end of the bottom plate 1, the transmission rod 7 is drivingly connected with the threaded pipes 4 through a belt pulley, and a heat dissipation assembly for the mold frame body 3 is installed on the bottom plate 1.

[0028] In the technical scheme of the present application, when in use, the circuit board to be processed is placed in the mold frame body 3, the transmission rod 7 is rotated, the rotation of the transmission rod 7 drives the threaded tube 4 to rotate through the belt pulley, the rotation of the threaded tube 4 applies force to the threaded rod 5 through the threaded action, the threaded rod 5 is subjected to the force and drives the push plate 6 to move, when the two push plates 6 abut against the ends of the circuit board, the push plate 6 clamps and fixes the circuit board, different sizes of circuit boards can be clamped and fixed through the above structure, and the circuit board is not easy to shake, which facilitates the processing of the circuit board, thereby improving the applicability of the device.

[0029] In the technical scheme of the present application, the heat dissipation assembly includes a motor 8 fixedly installed on the upper end of the bottom plate 1, a rotating rod 9 connected to the output end of the motor 8 through a shaft coupling, and a fan blade 10 connected to the upper end of the rotating rod 9. The bottom end of the mold frame body 3 is provided with a heat dissipation hole, and the fan blade 10 is located directly below the heat dissipation hole. A cleaning assembly for cleaning dust on the surface of the heat dissipation hole is installed on the bottom plate 1. The motor 8 is started, and the operation of the motor 8 drives the rotating rod 9 to rotate, and the rotation of the rotating rod 9 drives the fan blade 10 to rotate. The fan blade 10 blows air to the mold frame body 3 and the circuit board through the heat dissipation hole to cool them, preventing the device from being damaged, thereby prolonging the service life of the device.

[0030] In the technical scheme of the present application, the cleaning assembly includes a connecting rod 11 rotatably connected to the upper end of the bottom plate 1, and a cleaning plate 12 connected to the upper end of the connecting rod 11. The cleaning plate 12 abuts against the bottom end of the mold frame body 3 and is located at the position of the heat dissipation hole. The connecting rod 11 is drivingly connected to the rotating rod 9 through a belt pulley. The rotation of the rotating rod 9 drives the connecting rod 11 to rotate through the belt pulley. The rotation of the connecting rod 11 drives the cleaning plate 12 to rotate. The rotation of the cleaning plate 12 cleans the dust on the surface of the heat dissipation hole.

[0031] In the technical scheme of the present application, sliding grooves are formed in the inner side walls of the two sides of the mold frame body 3. Two sliding blocks 13 are symmetrically and slidably connected in the sliding grooves. One end of each sliding block 13 is connected to the corresponding push plate 6 to limit the push plate 6 and prevent the push plate 6 from rotating.

[0032] In the technical scheme of the present application, a sliding rod 14 is fixedly connected to the inner wall of the sliding groove, and the sliding block 13 is arranged to penetrate through the sliding rod 14 and is slidably connected to the sliding rod 14, preventing the sliding block 13 from being separated from the sliding groove.

[0033] In the technical scheme of the present application, a rotating block is fixedly sleeved on the rod wall of the transmission rod 7, facilitating the rotation of the transmission rod 7 by the worker.

[0034] In the technical scheme of the present application, a buffer pad 15 is installed on the side wall of each side of the two push plates 6, which buffers the pressure between the push plate 6 and the circuit board.

[0035] In use, the circuit board to be processed is placed in the mold body 3, the transmission rod 7 is rotated, the rotation of the transmission rod 7 drives the threaded tube 4 through the belt pulley, the rotation of the threaded tube 4 applies force to the threaded rod 5 through the threaded action, the threaded rod 5 is subjected to the force and drives the push plate 6 to move, when the two push plates 6 abut against the ends of the circuit board, the push plate 6 clamps and fixes the circuit board.

Claims

1. A mold frame of a multi-layer circuit board tin spraying machine comprising a base plate (1), characterized in that: The bottom plate (1) upper end is connected with two groups of support frames (2) symmetrically, two groups of support frames (2) upper end are provided with a mold frame body (3) in common, the both sides of the mold frame body (3) symmetry side wall are all rotatably connected with threaded pipes (4), the threaded pipe (4) is connected with threaded rods (5) in the thread, the threaded rod (5) other end passes through the pipe orifice of threaded pipe (4) and extends outward and is connected with a push plate (6), the push plate (6) is slidably connected in the mold frame body (3), the bottom plate (1) upper end is rotatably connected with a transmission rod (7), the transmission rod (7) is driven by belt pulley and is connected with the threaded pipe (4), the bottom plate (1) is provided with a heat dissipation assembly for heat dissipation of the mold frame body (3).

2. The mask of a tin spraying machine for a multi-layer circuit board according to claim 1, wherein The heat dissipation assembly includes a motor (8) fixedly installed on the upper end of the bottom plate (1), the motor (8) is connected with a rotating rod (9) through a shaft coupling, the rotating rod (9) is connected with a fan blade (10) at the upper end, the bottom end of the mold frame body (3) is provided with a heat dissipation hole, and the fan blade (10) is located at the position directly below the heat dissipation hole, the bottom plate (1) is provided with a cleaning assembly for cleaning the dust on the surface of the heat dissipation hole.

3. The die frame of a multi-layer circuit board tin jetting machine according to claim 2, wherein, The cleaning assembly includes a connecting rod (11) rotatably connected to the upper end of the bottom plate (1), the connecting rod (11) is connected with a cleaning plate (12) at the upper end, the cleaning plate (12) abuts against the bottom end of the mold frame body (3), and the cleaning plate (12) is located at the position of the heat dissipation hole, the connecting rod (11) is driven by belt pulley and is connected with the rotating rod (9).

4. The mask of claim 1, wherein the mask is made of a material selected from the group consisting of stainless steel, aluminum, and copper. The both sides of the mold frame body (3) symmetry inner side wall are all provided with a sliding groove, two sliding blocks (13) are symmetrically and slidably connected in the sliding groove, one end of the sliding block (13) is connected to the corresponding push plate (6).

5. The mask of claim 4, wherein the mask is made of a material selected from the group consisting of stainless steel, aluminum, and copper. The sliding groove is fixedly connected with a sliding rod (14), the sliding rod (14) penetrates the sliding block (13) and is arranged, and the sliding block (13) is slidably connected to the sliding rod (14).

6. The die frame of a multi-layer circuit board tin jetting machine according to claim 1, wherein, The rod wall of the transmission rod (7) is fixedly sleeved with a rotating block.

7. The die frame of a multi-layer circuit board tin jetting machine according to claim 1, wherein, The side wall of the opposite side of the two push plates (6) is provided with a buffer pad (15). The both sides of the mold frame body (3) symmetry inner side wall are all provided with a sliding groove, two sliding blocks (13) are symmetrically and slidably connected in the sliding groove, one end of the sliding block (13) is connected to the corresponding push plate (6).

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