Automatic polishing solution supply device

Abstract

The utility model discloses an automatic polishing solution supply device which comprises a tank body and a plurality of pipes arranged in the tank body, the pipes are spiral, the multiple pipes are sequentially and coaxially arranged from inside to outside, a plurality of positioning mechanisms are arranged between the adjacent pipes, and each positioning mechanism comprises a pair of first vertical plates and a plurality of first positioning rods; the multiple first positioning rods are sequentially arranged between every two adjacent pipes from top to bottom, the pair of first vertical plates are arranged on the inner sides and the outer sides of the two adjacent pipes respectively, and the two ends of each first positioning rod penetrate through the two adjacent pipes to be fixedly connected with the pair of first vertical plates. According to the liquid supply device, heat exchange is conducted through the multiple pipes which are spirally arranged from inside to outside, the effect is better, distance limiting between the pipes is achieved through cooperation of the first vertical plate and the first positioning rod and cooperation of the second vertical plate and the second positioning rod, and therefore the optimal heat exchange distance is guaranteed, the heat exchange effect is better, and temperature control is better, efficient and stable.

Description

Technical Field

[0001] This application relates to the field of silicon wafers, and in particular to an automatic polishing slurry supply device. Background Technology

[0002] Currently, the manufacturing process used for planarizing integrated circuit layers is chemical mechanical polishing (CMP). CMP combines chemical removal with mechanical polishing. It is used for wafer polishing and material removal, and can be used to planarize multi-material surfaces. During the polishing process, a polishing slurry is added to soften the polished surface.

[0003] Temperature control of polishing fluid is usually achieved using exchange tubes. Single-row exchange tubes have poor temperature control performance, while multi-row tubes have uncontrollable distances between them due to thermal expansion of cold water or the effects of stirring, thus affecting temperature control. Utility Model Content

[0004] The purpose of this invention is to provide an automatic polishing slurry supply device to overcome the shortcomings of the prior art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] This application discloses an automatic polishing fluid supply device, characterized in that it includes a tank and a plurality of tubes disposed within the tank. The tubes are spiral-shaped and are coaxially arranged sequentially from the inside to the outside. A plurality of positioning mechanisms are provided between adjacent tubes. Each positioning mechanism includes a pair of first vertical plates and a plurality of first positioning rods. The plurality of first positioning rods are arranged sequentially from top to bottom between two adjacent tubes. The pair of first vertical plates are respectively disposed on the inner and outer sides of two adjacent tubes. The two ends of the first positioning rods pass through the two adjacent tubes and are fixedly connected to the pair of first vertical plates.

[0007] Preferably, in the above-mentioned automatic polishing fluid supply device, a plurality of positioning mechanisms are evenly arranged.

[0008] Preferably, in the above-mentioned automatic polishing fluid supply device, there are two tubes.

[0009] Preferably, in the above-mentioned automatic polishing fluid supply device, the bottom ends of the two tubes are connected to each other.

[0010] Preferably, in the above-mentioned automatic polishing liquid supply device, each of the tubes is provided with multiple pairs of second vertical plates on both sides, and multiple second positioning posts are fixed between each pair of second vertical plates. The multiple second positioning posts are arranged sequentially from top to bottom between the spiral sections of the tube, and the bottom end of the second vertical plate is fixedly connected to the bottom surface of the tank.

[0011] Compared with the prior art, the advantages of this utility model are:

[0012] Heat exchange is carried out through multiple tubes arranged in a spiral shape from the inside out, which has a better effect. Moreover, the distance limit between the tubes is achieved through the cooperation of the first vertical plate, the first positioning rod, the second vertical plate, and the second positioning rod, so as to ensure the optimal heat exchange distance, with a better heat exchange effect and more efficient and stable temperature control. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings described below are only some embodiments recorded in the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0014] Figure 1 The figure shows a top view structural diagram of the polishing liquid automatic supply device in a specific embodiment of the present utility model. SPECIFIC EMBODIMENTS

[0015] The following will combine the drawings in the embodiments of the present utility model to describe the technical solutions in the embodiments of the present utility model in detail. Obviously, the described embodiments are only some embodiments of the present utility model, rather than all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present utility model.

[0016] Refer Figure 1 As shown, the polishing liquid automatic supply device in this embodiment includes a tank body 1 and multiple tubes 2 arranged inside the tank body 1. The tubes 2 are in a spiral shape, and multiple tubes 2 are coaxially arranged in sequence from the inside out. A plurality of positioning mechanisms 3 are provided between adjacent tubes 2. The positioning mechanism 3 includes a pair of first vertical plates 301 and multiple first positioning rods 302. The multiple first positioning rods 302 are arranged from top to bottom between two adjacent tubes 2. The pair of first vertical plates 301 are respectively arranged on the inner and outer sides of two adjacent tubes 2. The two ends of the first positioning rod 302 pass through two adjacent tubes 2 and are fixedly connected to the pair of first vertical plates 301.

[0017] Furthermore, the plurality of positioning mechanisms 3 are evenly arranged.

[0018] Furthermore, there are two tubes 2.

[0019] Furthermore, the bottoms of the two tubes 2 are interconnected.

[0020] Furthermore, each pipe 2 has multiple pairs of second vertical plates 4 on both sides, and multiple second positioning posts 5 are fixed between each pair of second vertical plates 4. The multiple second positioning posts 5 are arranged sequentially from top to bottom between the spiral sections of the pipe 2, and the bottom end of the second vertical plate 4 is fixedly connected to the bottom surface of the tank 1.

[0021] In this technical solution, heat exchange is achieved through multiple spiral tubes arranged from the inside out, resulting in better heat exchange performance. Furthermore, the distance between the tubes is limited by the cooperation of the first vertical plate, the first positioning rod, the second vertical plate, and the second positioning rod, thereby ensuring the optimal heat exchange distance, resulting in better heat exchange performance and more efficient and stable temperature control.

[0022] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes the element.

[0023] The above are merely specific embodiments of this application. It should be noted that those skilled in the art can make several improvements and modifications without departing from the principles of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. An automatic polishing slurry supply device, characterized in that: The device includes a tank body and multiple pipes disposed within the tank body. The pipes are spiral-shaped and are coaxially arranged sequentially from the inside out. Multiple positioning mechanisms are provided between adjacent pipes. Each positioning mechanism includes a pair of first vertical plates and multiple first positioning rods. The multiple first positioning rods are arranged sequentially from top to bottom between two adjacent pipes. The pair of first vertical plates are respectively disposed on the inner and outer sides of two adjacent pipes. The two ends of the first positioning rods pass through the two adjacent pipes and are fixedly connected to the pair of first vertical plates.

2. The automatic polishing slurry supply device according to claim 1, characterized in that: The multiple positioning mechanisms are evenly distributed.

3. The automatic polishing slurry supply device according to claim 1, characterized in that: There are two tubes.

4. The automatic polishing slurry supply device according to claim 3, characterized in that: The bottom ends of the two tubes are connected to each other.

5. The automatic polishing slurry supply device according to claim 1, characterized in that: Each of the tubes is provided with multiple pairs of second vertical plates on both sides. Multiple second positioning posts are fixed between each pair of second vertical plates. The multiple second positioning posts are arranged sequentially from top to bottom between the spiral sections of the tube. The bottom end of the second vertical plate is fixedly connected to the bottom surface of the tank.

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