Light-emitting device and SMD packaging structure
By placing the IC chip on the outside of the cup and protecting it with an insulating sealant layer, the problem of the IC chip blocking light is solved, thus achieving uniform light emission of the SMD packaging structure and improving the luminous effect of the light-emitting device.
Patent Information
- Application Number
- CN202423202961.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-24
- Publication Date
- 2025-12-05
- Estimated Expiration
- 2034-12-24
AI Technical Summary
In SMD packaging structures, the IC chip located inside the cup blocks the light from the light-emitting unit, resulting in reduced light output and affecting the uniformity of light output.
The IC chip is placed on the outside of the cup to maintain electrical connection with the light-emitting unit, and protected by an insulating sealant layer to prevent light blockage and improve light uniformity.
This reduces the reduction in light emission from the SMD package structure, improves light emission uniformity and the luminous effect of the light-emitting device, and extends the lifespan of the IC chip and the light-emitting unit.
Smart Images
Figure CN223639645U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of LED packaging, and in particular to a light emitting device and an SMD packaging structure. BACKGROUND
[0002] At present, in order to adjust the brightness of the light emitting unit in the SMD packaging structure, an IC chip (Integrated Circuit Chip) is embedded in the SMD packaging structure, and the functions of communication and driving the light emitting unit to emit light are realized simultaneously through the IC program. However, the setting of the IC chip causes the light output of part of the SMD packaging structure to be weakened, which affects the light output uniformity of the SMD packaging structure. SUMMARY
[0003] The embodiments of the present application provide a light emitting device and an SMD packaging structure with improved light output uniformity.
[0004] The present application provides an SMD packaging structure, which comprises:
[0005] a die bonding plate having a first surface;
[0006] a bowl cup arranged on the first surface of the die bonding plate; an inner side surface of the bowl cup is a reflecting surface, and the reflecting surface and the first surface of the die bonding plate form a light emitting cavity;
[0007] a light emitting unit arranged on a bottom wall of the light emitting cavity; and
[0008] an IC chip arranged on the first surface of the die bonding plate and located outside the bowl cup.
[0009] In some embodiments, the first surface of the die bonding plate is further provided with a plurality of lead wires; one end of the lead wires is connected to a terminal of the IC chip, and the other end is connected to the light emitting unit or used for connecting an external circuit.
[0010] In some embodiments, the SMD packaging structure further comprises an insulating sealing adhesive layer, which completely covers the IC chip.
[0011] In some embodiments, the first surface of the die bonding plate is further provided with a plurality of lead wires, and the other end of the lead wires is connected to the light emitting unit or used for connecting an external circuit; one end of the lead wires is connected to a terminal of the IC chip; and the insulating sealing adhesive layer completely covers the lead wires.
[0012] In some embodiments, the thickness of the insulating sealing adhesive layer is not higher than the height of the bowl cup; and the insulating sealing adhesive layer is a white adhesive layer.
[0013] In some embodiments, the distance between the IC chip and the bowl cup is less than or equal to 3mm in a direction parallel to the die bonding plate.
[0014] In some embodiments, the die bonding plate is square.
[0015] In some embodiments, the bowl cup is disposed along the edge of the die bonding plate and is located at a corner of the die bonding plate.
[0016] In some embodiments, the SMD package structure comprises a plurality of light emitting units, and the plurality of light emitting units comprise red light emitting units, green light emitting units and blue light emitting units.
[0017] In another aspect, the present application also provides a light emitting device comprising the SMD package structure provided by the present application.
[0018] In the plurality of embodiments provided by the present application, the IC chip is disposed outside the bowl cup, so as to avoid the occlusion of the light emitted by the light emitting units, thereby reducing the light weakening of the SMD package structure and improving the light uniformity. BRIEF DESCRIPTION OF DRAWINGS
[0019] Figure 1 The structural schematic diagram of the SMD package structure provided by one embodiment of the present application is shown.
[0020] REFERENCE SIGNS
[0021] 100, SMD package structure; 110, die bonding plate; 111, first surface; 120, bowl cup; 121, reflecting surface; 130, light emitting unit; 140, IC chip; 150, light emitting cavity; 160, lead wire; 10, first terminal; 20, second terminal; 30, third terminal; 40, fourth terminal; 50, fifth terminal; 60, sixth terminal; 70, seventh terminal; 80, eighth terminal; 90, ninth terminal. DETAILED DESCRIPTION
[0022] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application.
[0023] In the present application, the drawings are not necessarily drawn to scale, and local features can be enlarged or reduced to more clearly show the details of the local features.
[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. All publications, patent applications, patents, and other references mentioned herein are incorporated by reference in their entirety for the teachings relevant to the sentence and / or paragraph in which the reference is presented. The summary of the application does not necessarily describe all necessary features of the application. The terms "and / or" includes any and all combinations of one or more of the associated listed items. Singular herein, "a," "an," and "the" and "the above" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
[0025] In the description of the application, it should be understood that the terms "first", "second" are used only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the application, the meaning of "multiple" is two or more, unless otherwise specifically limited. In the description of the application, the meaning of "several" is one or more, unless otherwise specifically limited.
[0026] In the description of the application, the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "height", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate the orientation or positional relationship shown in the drawings, which is only for the convenience of the simplified description of the application, and does not indicate that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, that is, cannot be understood as limiting the application.
[0027] In the description of the application, unless otherwise specifically limited, the terms "mounting", "connection", "connection", "fixing", "setting" and the like should be broadly understood. For example, "connection" can be fixed connection, or detachable connection, or integral; can be mechanical connection, or electrical connection; can be directly connected, or indirectly connected through intermediate medium, or the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the application can be understood according to the specific circumstances.
[0028] In the description of the present application, unless otherwise explicitly defined, the first feature is "on", "over", "above" and "upper" the second feature, "under", "below" and "lower" the second feature can be the first feature and the second feature directly contact, or the first feature and the second feature indirectly contact through an intermediate medium. Moreover, the first feature is "over" and "above" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than the horizontal height of the second feature. The first feature is "under", "below" and "lower" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than the horizontal height of the second feature.
[0029] The researchers found that in the traditional SMD packaging structure, the IC chip is often placed in the bowl cup, that is, in the light-emitting cavity of the SMD packaging structure. The IC chip will block the light emitted by the light-emitting unit, thereby causing the light emission of part of the SMD packaging structure to be weakened, affecting the light emission uniformity of the SMD packaging structure.
[0030] Therefore, the researchers propose an SMD packaging structure, which places the IC chip outside the bowl cup, thereby avoiding blocking the light emitted by the light-emitting unit, thereby reducing the light emission weakening of part of the SMD packaging structure, and improving the light emission uniformity.
[0031] Referring to Figure 1 The SMD packaging structure 100 provided by an embodiment of the present application includes a die bonding plate 110, a bowl cup 120, a light-emitting unit 130, and an IC chip 140. The die bonding plate 110 has a first surface 111. The bowl cup 120 is arranged on the first surface 111 of the die bonding plate 110. The inner side surface of the bowl cup 120 is a reflecting surface 121, and the reflecting surface 121 and the first surface 111 of the die bonding plate 110 enclose a light-emitting cavity 150. The light-emitting unit 130 is arranged on the bottom wall of the light-emitting cavity 150. The IC chip 140 is arranged on the first surface 111 of the die bonding plate 110 and located outside the bowl cup 120.
[0032] The SMD packaging structure 100 described above places the IC chip 140 outside the bowl cup 120, thereby avoiding blocking the light emitted by the light-emitting unit 130, thereby reducing the light emission weakening of part of the SMD packaging structure 100, and improving the light emission uniformity.
[0033] It can be understood that there is still an electrical connection between the IC chip 140 and the light-emitting unit 130, so the light-emitting brightness of the light-emitting unit 130 can still be controlled through the IC chip 140.
[0034] In addition, the IC chip 140 is arranged outside the bowl cup 120, reducing the occupation of the position in the light emitting cavity 150, increasing the placeable area of the light emitting unit 130, so that the position of the light emitting unit 130 can be set more conveniently.
[0035] Furthermore, the IC chip 140 is arranged outside the bowl cup 120, the IC chip 140 is spaced from the light emitting unit 130 through the bowl cup 120, the heat generated by the operation of the IC chip 140 will not be directly dissipated into the light emitting cavity 150, reducing the influence of the higher temperature on the light emitting unit 130, and improving the service life of the light emitting unit 130. At the same time, it also avoids the heat emitted by the operation of the light emitting unit 130 from being dissipated to the IC chip 140, avoiding the influence of the higher temperature on the IC chip 140. The service life of the IC chip 140 is improved.
[0036] Furthermore, the IC chip 140 is arranged outside the bowl cup 120, the dissipation of the heat generated by the operation of the IC chip 140 is not affected by the light emitting chip, improving the heat dissipation efficiency.
[0037] Further, optionally, the die bonding plate 110 can be heat-conducting, so that the heat generated by the IC chip 140 can be dissipated through the die bonding plate 110, and the heat generated by the light emitting unit 130 can also be dissipated through the die bonding plate 110. Since the distance between the IC chip 140 and the light emitting unit 130 is far, the risk of local high temperature of the die bonding plate 110 is avoided.
[0038] In the embodiment, the first surface 111 of the die bonding plate 110 is further provided with a plurality of leads 160; one end of the lead 160 is connected to the terminal of the IC chip 140, and the other end is connected to the light emitting unit 130 or used for connecting an external circuit. It can be understood that the external circuit can be a power supply or a signal control unit, etc.
[0039] In the embodiment, the IC chip 140 is provided with nine terminals, which are a first terminal 10, a second terminal 20, a third terminal 30, a fourth terminal 40, a fifth terminal 50, a sixth terminal 60, a seventh terminal 70, an eighth terminal 80 and a ninth terminal 90. Among them, the first terminal 10, the second terminal 20 and the third terminal 30 are connected to the negative poles of the three light emitting units 130 as signal control terminals; the fourth terminal 40 is connected to the positive poles of the three chips as a signal control terminal and a positive input terminal; the fifth terminal 50 is a signal control terminal and a negative output terminal; the sixth terminal 60 is a clock signal input terminal; the seventh terminal 70 is a clock signal output terminal; the eighth terminal 80 is a signal input terminal; and the ninth terminal 90 is a signal output terminal.
[0040] The IC chip 140 controls the voltage across the light emitting unit 130 through the received signal, controls the brightness and switching of the light emitting unit 130, and further realizes the adjustment of the brightness and color of the SMD packaging structure 100.
[0041] It can be understood that in some other embodiments, the number of terminals on the IC chip, the arrangement and the function of the terminals, and the like can be adjusted adaptively according to the number of light-emitting units, the control mode, and the like, which are not limited herein.
[0042] In the embodiment, the SMD packaging structure 100 further comprises an insulating sealing adhesive layer (not shown) which completely covers the IC chip 140. On the one hand, the IC chip 140 can be protected from external environmental factors, and the IC chip 140 can be prevented from being damaged by dust, moisture, and the like, so as to improve the stability and the service life of the IC chip 140. On the other hand, the IC chip 140 can be firmly fixed on the die bonding plate 110, so as to avoid loosening and displacement of the IC chip 140 due to vibration, collision, and the like, and thus to avoid affecting the stability of the circuit connection and the normal operation of the SMD packaging structure 100.
[0043] It can be understood that the insulating sealing adhesive layer covers the surface of the IC chip 140 which is not attached to the die bonding plate 110. Further optionally, the insulating sealing adhesive layer further extends to cover the area around the IC chip 140, so as to better fix the IC chip 140.
[0044] It can be understood that the thickness of the insulating sealing adhesive layer can achieve the insulating sealing and fixing of the IC chip. Optionally, the thickness of the insulating sealing adhesive layer is not higher than the height of the bowl cup, so as to avoid affecting the light-emitting effect of the insulating sealing adhesive layer.
[0045] In the embodiment, the insulating sealing adhesive layer completely covers the lead wire 160. On the one hand, the lead wire 160 can be protected from external environmental factors, and the lead wire 160 can be prevented from being eroded by dust, moisture, and the like, so as to improve the stability and the service life of the lead wire 160. On the other hand, the lead wire 160 can be firmly fixed on the die bonding plate 110, so as to avoid loosening and displacement of the lead wire 160 due to vibration, collision, and the like, and thus to avoid affecting the stability of the circuit connection and the normal operation of the SMD packaging structure 100.
[0046] It can be understood that the insulating sealing adhesive layer covers the surface of the lead wire 160 which is not attached to the die bonding plate 110. Further optionally, the insulating sealing adhesive layer further extends to cover the area around the lead wire 160, so as to better fix the lead wire 160 and ensure the stability of the connection.
[0047] In addition, one end of the lead wire 160 is connected to the IC chip 140, and the other end of the lead wire 160 extends to be connected to the light emitting unit 130. Therefore, one end of the lead wire 160 is located outside the light emitting cavity 150, and the other end of the lead wire 160 is located inside the light emitting cavity 150. Alternatively, the lead wire 160 is arranged through the sidewall of the bowl cup 120, or the first surface 111 of the die bonding plate 110 is provided with a groove, and the lead wire 160 is arranged in the groove.
[0048] Alternatively, the insulating sealing adhesive layer is a white adhesive layer. The white adhesive layer has good insulation, sealing and adhesion, so that the insulation and sealing of the IC chip can be better realized.
[0049] Further, alternatively, the insulating sealing adhesive layer covers all areas of the die bonding plate 110 except the bowl cup 120. On the one hand, it is convenient to operate when forming the insulating sealing adhesive layer; on the other hand, it can further improve the sealing and insulation performance of the IC chip 140 and the lead wire 160, and the stability of the fixation.
[0050] In some embodiments, the distance between the IC chip 140 and the bowl cup 120 is less than or equal to 3 mm in the direction parallel to the die bonding plate 110. On the one hand, it is convenient to arrange the lead wire 160 between the IC chip 140 and the light emitting unit 130; on the other hand, the lead wire 160 between the IC chip 140 and the light emitting unit 130 is shorter, the signal transmission speed between the IC chip 140 and the light emitting unit 130 is faster, and the response speed of adjusting the luminous brightness of the light emitting unit 130 is improved.
[0051] Specifically, the distance between the IC chip 140 and the bowl cup 120 can be any value less than or equal to 3 mm, such as 1 mm, 1.5 mm / 2 mm, 2.5 mm or 3 mm.
[0052] In the embodiment, the die bonding plate 110 is square-shaped, which is convenient for the molding of the die bonding plate 110, and is also convenient for the arrangement of the lead wire 160 on the die bonding plate 110, reduces the waste of space, improves the space utilization rate of the die bonding plate 110, and is beneficial to realize the miniaturization and integration of the product. In addition, the die bonding plate 110 is square-shaped, which is convenient for the preparation of the die bonding plate 110, such as the photolithography, etching and other process steps in the preparation process of the die bonding plate 110, improves the preparation efficiency and yield of the die bonding plate 110, and reduces the preparation cost.
[0053] In addition, the die bonding plate 110 is square-shaped, which is convenient for the arrangement of multiple SMD packaging structures 100. For example, in some light emitting devices, multiple SMD packaging structures 100 are included. The die bonding plate 110 is square-shaped, which is convenient for the alignment and arrangement of multiple SMD packaging structures 100, improves the arrangement uniformity and operation efficiency of multiple SMD packaging structures 100.
[0054] Of course, it can be understood that in some other embodiments, the die bonding plate 110 is not limited to a square shape, but can also be a regular or irregular shape such as a circle, a diamond, a rectangle, or a trapezoid.
[0055] In this embodiment, the bowl cup 120 is arranged along the edge of the die bonding plate 110 and located at the corner of the die bonding plate 110. The area of the die bonding plate 110 not provided with the bowl cup 120 is more concentrated, facilitating the arrangement of the IC chip 140 and the lead 160 connecting the IC chip 140 and the light emitting unit 130. In addition, the IC chip 140 and the lead 160 are both located on the side of the bowl cup 120 away from the corner of the die bonding plate 110, reducing the bending angle of the lead 160 and the length of the lead 160, and improving the transmission efficiency.
[0056] Furthermore, the bowl cup 120 is arranged along the edge of the die bonding plate 110 and located at the corner of the die bonding plate 110, making full use of the area at the corner of the die bonding plate 110, improving the area utilization rate of the die bonding plate 110, facilitating the improvement of the integration level of the SMD packaging structure 100, and realizing the miniaturization design of the SMD packaging structure 100.
[0057] In this embodiment, the SMD packaging structure 100 includes a plurality of light emitting units 130, and the plurality of light emitting units 130 include red light emitting units, green light emitting units, and blue light emitting units. Therefore, by adjusting the light emitting brightness of different light emitting units 130, the overall light emitting brightness of the SMD packaging structure 100 can be adjusted, and the color of the light emitted by the SMD packaging structure 100 can also be adjusted.
[0058] It can be understood that the number of red light emitting units, green light emitting units, and blue light emitting units in the plurality of light emitting units 130 can be set as needed, and is not specifically limited here.
[0059] In addition, the arrangement of the plurality of light emitting units 130 can be set as needed, and is not specifically limited here.
[0060] It can be understood that in some other embodiments, the plurality of light emitting units 130 are not limited to including red light emitting units, green light emitting units, and blue light emitting units, but can also include at least one of red light emitting units, green light emitting units, and blue light emitting units, and / or other color light emitting units 130.
[0061] Specifically, in the embodiment, the red light emitting unit is a red light chip, the green light emitting unit is a green light chip, and the blue light emitting unit is a blue light chip. It can be understood that in some other embodiments, the red light emitting unit can also be formed by a light emitting chip of other color and a fluorescent layer covering the surface thereof, etc. to emit red light; and / or, the green light emitting unit can also be formed by a light emitting chip of other color and a fluorescent layer covering the surface thereof, etc. to emit green light; and / or, the blue light emitting unit can also be formed by a light emitting chip of other color and a fluorescent layer covering the surface thereof, etc. to emit blue light.
[0062] An embodiment of the present application further provides a light emitting device including the SMD packaging structure provided by any of the embodiments of the present application.
[0063] The light emitting device avoids the shielding of the light emitted by the light emitting unit by placing the IC chip outside the bowl cup, thereby reducing the light weakening of the SMD packaging structure, improving the light uniformity, and improving the light emitting effect of the light emitting device.
[0064] The light emitting device can be, but is not limited to, an atmosphere lamp, and can be used on a traffic device or other required device or scene.
[0065] It can be understood that in the various embodiments of the present application, the size of the serial number of each process does not mean the order of execution, and the execution order of each process should be determined according to its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.
[0066] It can be understood that the various embodiments described in the present application can be implemented alone or in combination, and the embodiments of the present application do not limit this.
[0067] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the system, device and unit described above can refer to the corresponding process in the foregoing method embodiments, which will not be repeated here.
[0068] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical range disclosed in the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.
Claims
1. An SMD package structure, characterized by, The SMD packaging structure comprises: a die bonding plate having a first surface; a bowl cup arranged on the first surface of the die bonding plate, an inner side of the bowl cup being a reflective surface, the reflective surface and the first surface of the die bonding plate forming a light emitting cavity; a light emitting unit arranged on a bottom wall of the light emitting cavity; and an IC chip arranged on the first surface of the die bonding plate and located outside the bowl cup.
2. The SMD package structure of claim 1, wherein, The first surface of the die bonding plate is further provided with a plurality of lead wires, one end of the lead wires being connected to terminals of the IC chip and the other end being connected to the light emitting unit or used for connecting external lines.
3. The SMD package structure of claim 1, wherein, The SMD packaging structure further comprises an insulating sealing adhesive layer, the insulating sealing adhesive layer completely covering the IC chip.
4. The SMD package structure of claim 3, wherein, The first surface of the die bonding plate is further provided with a plurality of lead wires, one end of the lead wires being connected to terminals of the IC chip and the other end being connected to the light emitting unit or used for connecting external lines; the insulating sealing adhesive layer completely covers the lead wires.
5. The SMD package structure of claim 3, wherein, The thickness of the insulating sealing adhesive layer is not higher than the height of the bowl cup; the insulating sealing adhesive layer is a white adhesive layer.
6. The SMD package structure of claim 1, wherein, In a direction parallel to the die bonding plate, the distance between the IC chip and the bowl cup is less than or equal to 3 mm.
7. The SMD package structure of claim 1, wherein, The die bonding plate is square.
8. The SMD package structure of claim 7, wherein, The bowl cup is arranged along the edge position of the die bonding plate and located at the corner of the die bonding plate.
9. The SMD package structure according to any one of claims 1 to 8, characterized in that, The SMD packaging structure comprises a plurality of light emitting units, the plurality of light emitting units comprising red light emitting units, green light emitting units and blue light emitting units.
10. A light-emitting device, characterized in that, The SMD packaging structure according to any one of claims 1 to 9.